Stiffener Structures for Reliable Semiconductor Packaging
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Summary
Problems
The mismatched coefficient of thermal expansion between semiconductor devices and their lids, leading to dimensional changes that can cause delamination of thermal interface materials and cracking of adhesives, resulting in reliability issues in semiconductor packaging.
Innovation solutions
Incorporating a stiffener structure with a ring and ribs made of metallic materials, such as copper or stainless steel, which are adhered to the substrate and lid, featuring a 'T-shaped' or 'L-shaped' rib design to enhance adhesion and mechanical strength, thereby reducing warpage and delamination risks.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a lid is attached to the semiconductor device through thermal interface material and adhesive, then heat dissipation is improved, but delamination and cracking occur due to thermal expansion mismatch
Why choose this principle:
The patent introduces a stiffener structure with specific geometric parameters (thickness, width, length) that can be optimized to control the thermal and mechanical properties of the package. By adjusting these parameters, the structure compensates for thermal expansion differences while maintaining heat dissipation pathways.
Principle concept:
If a lid is attached to the semiconductor device through thermal interface material and adhesive, then heat dissipation is improved, but delamination and cracking occur due to thermal expansion mismatch
Why choose this principle:
The patent employs a composite structure combining the stiffener (made of materials like copper, aluminum, or stainless steel) with the semiconductor device and lid. This composite design leverages the high thermal conductivity of metals for heat dissipation while the structural rigidity compensates for thermal expansion mismatch, preventing delamination.
Application Domain
Data Source
AI summary:
Incorporating a stiffener structure with a ring and ribs made of metallic materials, such as copper or stainless steel, which are adhered to the substrate and lid, featuring a 'T-shaped' or 'L-shaped' rib design to enhance adhesion and mechanical strength, thereby reducing warpage and delamination risks.
Abstract
A semiconductor package includes a chip package disposed on a substrate, a plurality of electronic components disposed aside the chip package on the substrate and a stiffener structure disposed on the substrate. The stiffener structure includes a stiffener ring surrounding the chip package and the plurality of electronic components, a stiffener rib between the chip package and the plurality of electronic components, wherein the stiffener rib includes a first portion and a second portion on the first portion, and a width of the second portion is greater than a width of the first portion. The semiconductor package further includes a lid attached to the stiffener structure, the chip package and the plurality of electronic components. A method of forming the semiconductor package is also provided.