Thermal Management in Semiconductor Packaging: Patent-Based Solutions
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Summary
Problems
Integrated chip packaging faces challenges in heat dissipation due to the housing of high-power chips, which is critical for achieving higher performance and reliability in semiconductor technology.
Innovation solutions
A thermally conductive semiconductor packaging structure is developed by patterning a wafer to form grooves, filling them with thermally conductive materials, and cutting it into dies with exposed conductive members, which are then packaged with electrically conductive connectors and a heat dissipating cover to enhance thermal conductivity and heat dissipation.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If traditional packaging methods are used for high-power chips, then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Why choose this principle:
The wafer is divided into multiple sub-regions with different structures. Some sub-regions have grooves filled with thermally conductive material while others remain as reference structures, allowing thermal management to be segmented and integrated into the packaging process without requiring complete structural overhaul
Principle concept:
If traditional packaging methods are used for high-power chips, then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Why choose this principle:
The packaging structure serves multiple functions: electrical interconnection through pads and connectors, mechanical support through the substrate, and thermal management through thermally conductive members. This multi-functionality resolves the contradiction by integrating thermal management into the existing packaging structure rather than adding separate complex systems
Application Domain
Data Source
AI summary:
A thermally conductive semiconductor packaging structure is developed by patterning a wafer to form grooves, filling them with thermally conductive materials, and cutting it into dies with exposed conductive members, which are then packaged with electrically conductive connectors and a heat dissipating cover to enhance thermal conductivity and heat dissipation.
Abstract
A thermally conductive semiconductor packaging structure includes a cooling component exposed on one surface and an electrical interconnecting component on the other surface. The cooling component has a thermally conductive die, its back side is provided with thermally conductive members extending away from the back side, and a front side is provided with pads to connect to the electrical interconnecting component. The electrical interconnecting component includes electrically conductive connectors to connect to the thermally conductive die, a rewiring layer, and metal bumps connecting to the rewiring layer. A substrate, electrically connected to the metal bumps and a heat dissipating cover over the substrate and in contact with the thermally conductive members. The package is applicable to a wide range of packages.