Enhanced Wiring Substrate Manufacturing for Reliable Semiconductor Packages
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Summary
Problems
The existing methods for forming electrode pads on wiring substrates limit the flexibility and reliability of semiconductor packages due to the use of pads made from the same material, which restricts the mounting of components with different sizes and materials, leading to deteriorated electrical characteristics and reliability.
Innovation solutions
A method involving multiple electrolytic plating steps with different resist layers and support plates to form electrode pads of varying materials, such as Cu and Au, allowing for distinct surface treatments and depths, enabling better compatibility with diverse components.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If electrode pads are formed using the same material for all pads, then the manufacturing process is simple, but the adaptability to mount different components is poor
Why choose this principle:
The patent applies local quality by forming electrode pads with different materials at different locations on the wiring substrate. Specifically, first electrode pads are formed with a first material while second electrode pads are formed with a second material, allowing each pad to be optimized for its specific component mounting requirements. This resolves the contradiction by maintaining manufacturing simplicity through a systematic process while achieving component-level material diversity for enhanced adaptability.
Principle concept:
If electrode pads are formed using the same material for all pads, then the manufacturing process is simple, but the adaptability to mount different components is poor
Why choose this principle:
The patent segments the electrode pad formation process into distinct stages: forming a first plated film in first openings, then forming a second plated film in second openings. This segmentation allows different materials to be applied to different pad locations, resolving the contradiction between manufacturing simplicity and mounting flexibility by organizing the complex material diversity into manageable, sequential steps.
Application Domain
Data Source
AI summary:
A method involving multiple electrolytic plating steps with different resist layers and support plates to form electrode pads of varying materials, such as Cu and Au, allowing for distinct surface treatments and depths, enabling better compatibility with diverse components.
Abstract
There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films.