Method for automatically placing and fixing an inlay with an electronic chip on a fingernail and robot for this purpose

CH721124B1Undetermined Publication Date: 2026-08-31YVES SWISS AG
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Patent Information

Application Number
CH2023001005
Authority / Receiving Office
CH · CH
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-09-12
Publication Date
2026-08-31
Estimated Expiration
2043-09-12
Patent Text Reader

Abstract

The invention relates to a method for placing and fixing an inlay (26) with an electronic chip onto a fingernail (27), wherein the finger (22) with the fingernail (27) to be treated is placed on a platform (20) and the finger (22) is secured in its position with a securing strap in the form of a hook and loop fastener (31), and then the fingernail (27) is treated by a robot (1) which performs the following steps in sequence: a) roughening the fingernail (27) with a rotating grinding stone, an elastic and flexible grinding disc (17) or a brush, b) spraying the fingernail (27) with a primer via a primer nozzle (8), c) spraying the fingernail (27) with a bonder as an adhesive via a bonder nozzle (10), d) attaching an inlay (26) with a chip to the fingernail suspended from a section of adhesive tape (28). (27) place and tension, e) cure the bonder using a UV LED light (12),f) Removal of the adhesive tape section (28) after curing of the bonder, g) systematically applying gel (33) to the fingernail (27) via a gel nozzle (15) with a gel stream, covering and enclosing the inlay (26), h) curing of the applied gel (33) using UV light (13) from a UV LED lamp (12).
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