Copper alloy plate strip for multi-component synergistically reinforced lead frame and preparation method of copper alloy plate strip

Through the multi-component collaborative strengthening process method, copper alloy plate and tape were prepared, which solved the shortcomings of domestic Cu-Ni-Si alloys in heat treatment technology, and achieved high-performance copper alloy plate and tape, meeting the needs of mid-to-high-end lead frame materials.

CN119876689AActive Publication Date: 2025-04-25INSTITUTE OF MATERIALS & INTELLIGENT MANUFACTURING JIANGXI ACADEMY OF SCIENCES
6 Cites 1 Cited by

Patent Information

Application Number
CN202510108677.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-23
Publication Date
2025-04-25
Estimated Expiration
2045-01-23

AI Technical Summary

Technical Problem

Domestic Cu-Ni-Si alloys have shortcomings in the control of the composition uniformity of large-scale ingot components, continuous high-temperature online solution and complete sets of heat treatment technologies, resulting in poor surface quality, high surface roughness, unstable plate accuracy, and low quality grade, which cannot meet the needs of mid-to-high-end lead frame materials.

Method used

The process method of multi-component collaborative strengthening is adopted to prepare copper alloy plate strips, including ingredients, smelting, solid solution, hot rolling and cold rolling. By controlling elemental composition and process parameters, the mechanical properties and conductive properties of the alloy are improved.

Benefits of technology

The tensile strength, conductivity and yield strength of the copper alloy plate strip are achieved at 850Mpa, 48% IACS and 750MPa or above. The strip is uniform in chemical composition, excellent mechanical properties and conductive properties, simple preparation process and low operation difficulty.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention provides a copper alloy plate strip for a multi-component synergistically strengthened lead frame and a preparation method of the copper alloy plate strip, and relates to the technical field of alloys. The copper alloy plate strip for the multi-component synergistically strengthened lead frame comprises the following components in percentage by mass: 0.9-3.0% of Ni; 0.3% to 1.3% of Si; 0.06% to 0.18% of Mg; 0.5% to 1.5% of Co; 0.02% to 0.1% of Ti; 0.05%-0.15% of Y, and the balance copper and inevitable impurities. The prepared copper alloy plate strip has excellent mechanical performance and conductivity, the tensile strength sigma b is larger than or equal to 850 Mpa, the conductivity is larger than or equal to 48% IACS, and the yield strength sigma 0.2 is larger than or equal to 750 MPa. The preparation method is simple in process and low in operation difficulty, and has a wide market application prospect.
Need to check novelty before this filing date? Find Prior Art