1914 results about "Lead frame" patented technology

A described example includes: a leadframe having a high voltage section and a low voltage section spaced from and electrically isolated from the high voltage section, and a heat slug mounted to the high voltage section. The high voltage section includes an input portion connected to the heat slug at an interior end by a mount portion, and further includes an interior lead portion that is connected to the mount portion by a flexible connect portion. An insulating material mounted to the heat slug provides a die mount area for a semiconductor die having a Hall element that is positioned so that the Hall element is proximate to the heat slug. Mold compound covers the semiconductor die, portions of the leadframe, and portions of the heat slug while a board side surface of the heat slug is exposed forming a thermal pad for a semiconductor device package.

A lead frame transferring and stacking device relates to the field of semiconductor production, and comprises a support frame, two ends of which are provided with support rings in the length direction; the turnover mechanism comprises two gear rings which are rotatably mounted on the inner sides of the supporting rings respectively, two bearing plates which are symmetrically arranged and are parallel to the supporting frame in the length direction are arranged between the gear rings, the turnover mechanism is used for placing a transfer frame, and a plurality of lead frames are arranged on the transfer frame in a rectangular array mode; two stop levers which are symmetrically arranged and reciprocate in the width direction of the bearing plate are arranged on the bearing plate, the length direction of the stop levers is parallel to the axis of the gear ring, and the stop levers are used for limiting the lead frame; the bearing mechanism comprises two supporting plates which are arranged on the two sides of the supporting frame in the length direction respectively and move in the width direction and the vertical direction of the supporting frame, a plurality of material frames arranged at intervals are arranged on the top faces of the supporting plates in the length direction of the supporting plates, and during application, the upper ends of the material frames abut against the transfer frame and are used for collecting the lead frames. According to the device, the lead frames can be automatically stacked in the material frame, and the efficiency is improved.

The invention relates to a matrix type semiconductor lead frame linear full-automatic magazine loading machine, and belongs to the technical field of semiconductor frame lead automatic magazine loading. Comprising a bottom plate, and a graphite boat strip carrying table, a lead frame conveying carrying table and a magazine carrying table are sequentially arranged on the bottom plate. The graphite boat carrying platform is provided with an ejector rod used for unlocking the graphite boat and the lead frame, and the lead frame conveying platform is provided with conveying belts corresponding to the magazine platforms one to one. A first horizontal linear module is erected on the bottom plate, a sliding part of the first horizontal linear module is provided with a second vertical linear module, and the lower part of a sliding part of the second vertical linear module is connected with a lead frame suction plate. Compared with manual operation, the production efficiency can be effectively improved, and the problems of misloading of the magazine, damage to the magazine or a chip and the like caused by manual operation are avoided.

The present invention discloses a lead frame flipping and loading device for an automatic production line, comprising a frame material conveying mechanism, a frame material flipping mechanism, and a steel strip material clamping frame. The frame material conveying mechanism is provided with a lifting and lowering feeding plate that can slide back and forth to convey the frame material to the position of the frame material flipping mechanism. The frame material flipping mechanism is provided with an openable and closable frame material clamping mouth for clamping the frame material. The upper portion of the steel strip material clamping frame is provided with an openable and closable steel strip material clamping mouth for clamping the steel strip material. The frame material clamping mouth can flip toward the steel strip material clamping mouth and slide outward. The lead frame flipping and loading device for an automatic production line provided by the present invention has a feeding mechanism that realizes efficient positioning and feeding through a feeding bolt that can be lifted and lowered back and forth. The flipping mechanism can adjust the flipping radius while realizing flipping, ensuring that the frame material reaches the lower edge of the large steel strip material after flipping. The steel strip material clamping mechanism can ensure that the entire steel strip material remains stable at all times.

According to the electronic cigarette sensor with the partition wall structure, a partition wall, a step and a Z-shaped air inlet channel are formed in an injection molding cavity of a lead frame, the high step is provided with an air inlet channel penetrating through the high step and the bottom wall of the lead frame, the air inlet channel is in an inverted Z shape, the high step is further provided with a micro-electro-mechanical sensor, and the micro-electro-mechanical sensor is arranged on the bottom wall of the lead frame. A low step is arranged at the position, away from the high step, in the cavity, and protective nets are arranged on the upper cover and the lower cover. The lead frame is provided with a circular cavity, the height of the bottom of the circular cavity is slightly higher than that of the star-shaped bonding pad, the circular cavity is in a concave semi-wrapping state, and good sealing performance and good mounting welding performance during mounting of the formed electronic cigarette sensor are facilitated. A partition wall is further arranged in the cavity, the ASIC chip and the micro-electro-mechanical sensor are isolated through the partition wall, the micro-electro-mechanical sensor is protected from being polluted by manufacturing procedures, tobacco tar and the like, and a sealed oil-proof air channel is provided for the oil-proof cotton.

The invention discloses integrated functional lead frame production equipment and a lead frame thereof, and relates to the technical field of lead frame production, and the integrated functional lead frame production equipment comprises a first-stage straightening unit, a pre-forming unit, a pre-stamping unit, a second-stage straightening unit and a processing unit which are sequentially arranged in the feeding direction of a material plate; through the technological processes of primary straightening, pre-stamping and secondary straightening, plate residual stress concentration in the middle of the material plate is effectively reduced. In the pre-stamping process, the middle of the material plate is pressed downwards to form a height difference, so that leakage of lubricating oil is reduced, and the material plate is attached to the limitation of the supporting frame and the supporting plate. In addition, the side portion of the material plate is punched to form protruding clamping grooves, the protruding clamping grooves are connected to the surface of the supporting frame in a clamped mode, the supporting frame supports the protruding clamping grooves, the rigidity and the torque resistance of the material plate are further enhanced, the two protruding clamping grooves in the side portion of the material plate can effectively isolate vibration in the transportation process, and therefore the material plate is prevented from being damaged. And the overall stability of the material plate after pre-stamping is further improved.

The invention provides a semiconductor lead frame material box conveying device, and belongs to the technical field of semiconductor device production, the semiconductor lead frame material box conveying device comprises a bearing mechanism which comprises a connecting column and a circular bottom plate sleeving the bottom of the peripheral side of the connecting column, the peripheral side of the connecting column is provided with an even number of pairs of vertical first baffles in a circumferential array mode, and a second baffle is arranged between each pair of first baffles; the connecting column is rotationally connected to a rotating shaft, the top of the rotating shaft penetrates out of the top of the connecting column, and the connecting column is driven by a rotating mechanism to rotate; the two pushing ends of the two-way pushing mechanism are connected with the two pushing plates correspondingly, and the top of the two-way pushing mechanism is connected with the telescopic end of a lifting mechanism; the conveying belt is arranged on one side of the circular bottom plate, and the conveying direction of the conveying belt is parallel to the diameter of the circular bottom plate; the horizontal linear mechanisms are arranged below the circular bottom plate at intervals, and the movable ends are connected with the bottom of the rotating shaft. The device can automatically convey the lead frame material boxes to the material box bearing areas of a plurality of core bonding devices in the core bonding process, and the core bonding and feeding efficiency is improved.

The invention belongs to the technical field of semiconductors, and discloses a semiconductor circuit, the semiconductor circuit comprises a substrate, an insulating layer, a chip function layer and a packaging body, two sides of the substrate are respectively provided with a plurality of first installation parts, one surface of the substrate is used as an arrangement surface, and the insulating layer is arranged on the arrangement surface; the external pin is connected with the extension end of the first installation part, and the external pin is electrically connected with the first installation part. According to the semiconductor circuit disclosed by the invention, through the design of the first mounting part extending out of the packaging body and the external pin, the external pin can be mounted after the semiconductor circuit is packaged; even if the ejector pin is adopted for pressing to prevent glue overflow, the condition that stress between the substrate and the pins causes cracks on the insulating layer is avoided. In addition, the external pins can be installed after being independently formed, the lead frame does not need to be introduced in a mode of being matched with rib cutting forming, the equipment and production cost can be reduced, and the production efficiency is improved.

The invention provides a QFN lead frame, a preparation method thereof and a QFN packaging structure, in the QFN lead frame, planar pins are arranged at four corners of the front surface of a frame unit, empennage pins are bent to be perpendicular to the front surface of the frame unit, and the planar pins and the empennage pins form a semi-surrounding structure for each corner of the frame unit. According to the QFN lead frame disclosed by the invention, the stress is dispersed through the semi-surrounding structure, and the cracking and collapse risks are reduced. The planar pin also provides an additional solderable surface, so that the molten solder is easier to wet and attach, and the risk of pseudo soldering or refusing soldering is reduced. According to the QFN packaging structure, by using the QFN lead frame with the semi-surrounding structure on the periphery, the packaging structural strength is enhanced, the packaging four-corner structure is effectively prevented from being broken, and the overall stability of the packaging structure is improved. Because the plane pin and the empennage pin are not wrapped by the molding compound, the QFN packaging structure can dissipate heat through the plane pin and the empennage pin.

The invention relates to the technical field of design and manufacturing of precision dies, in particular to a design method for a progressive die of an LQFP144pin high-precision lead frame. The method comprises the following steps that firstly, a material lifting part lifts materials; 2, lettering; 3, punching base island pocking marks; 4, punching a guide nail positioning hole and a round hole; 5, positioning the guide nail; 6, punching an outer pin; 7, punching an inner pin; 8, correcting the plane of the inner pin; 9, punching a stress groove; tenthly, the base island is cut; eleventhly, edge cutting is conducted; 12, inner pin coining is carried out; (13) adjusting the flatness of the pins; fourteenthly, the flatness of the base island is adjusted; fifteenthly, adjusting the transverse bend of the lead frame; sixteenthly, the step pitch of the lead frame is adjusted. Through a series of layout station optimization, the pin deviation phenomenon caused by accumulated step pitch in the blanking process can be reduced, stress release of materials is better facilitated, and the risk of product deformation is fully reduced.

The invention provides lead frame cleaning equipment which comprises a material taking table and further comprises a cleaning cabinet on one side of the material taking table, a transverse plate is arranged in the cleaning cabinet, a material taking mechanism is arranged on the material taking table, and a conveying mechanism, a wind power mechanism and an adsorption mechanism are arranged in the cleaning cabinet. An electric pulse signal is converted into mechanical motion through the stepping single machine to drive a compression part in the compression base to vibrate rapidly so as to generate high-speed airflow, the airflow enters the ion air knife through the compression air outlet, the ion air knife generates positive and negative ions through high-voltage ionization, and ions are conveyed to a target area through the high-speed airflow. Static electricity and dust of the square frame body moving to the position below the ion air knife are eliminated through the static electricity neutralization effect, air in the negative pressure box and the negative pressure hopper is pumped out through the air pump so that negative pressure can be generated, negative pressure openings are formed in the upper portion and the two sides of the conveying belt, and therefore dust collection can be conducted on the upper portion and the lower portion of the frame body and the two sides of the conveying belt, and the cleaning effect is improved.

The invention relates to the technical field of lead frame folding, in particular to a folding transfer device for lead frame production, which comprises a first conveying assembly positioned at the discharge end of a lead frame, working platforms positioned on the two sides of the first conveying assembly and a second conveying assembly positioned below the working platforms, and clamping blocks are mounted on the working platforms on the two sides through electric push rods; an intercepting assembly used for intercepting the lead frame is installed on one side of the clamping block and comprises a telescopic intercepting plate, and a plurality of receding grooves are formed in the telescopic intercepting plate. In the upward sliding process of the longitudinal stacking assembly, the synchronous pushing blocks on the two sides extrude the longitudinal racks at the same time, so that the multiple inclined racks are synchronously shrunk into the clamping blocks, the lead frame falls into the position above the guide supporting blocks, it is ensured that the supporting end faces on the two sides can release the lead frame at the same time, and the lead frame can synchronously fall off; and the condition of stacking failure caused by first inclination of one side due to asynchronous release in the falling process is avoided.

Packaged electronic device with integrated antenna and locking structure. A packaged electronic device includes an integrated antenna as part of a conductive lead frame. The conductive lead frame includes a die pad having an elongated conductive beam structure configured as a transmission line; and a ground plane structure disposed around the die pad. The ground plane includes a gap in which the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the lead frame are configured with conductive connection structures to function as ground pins, feed pins and / or waveguides. In an alternative embodiment, a portion of the integrated antenna is embedded within the body of the packaged electronic device and is partially exposed.

A broadband filter plate type tantalum capacitor comprises a lead frame, a tantalum core and a ceramic capacitor, a positive electrode and a negative electrode of the tantalum core are connected with a positive electrode frame and a negative electrode frame of the lead frame respectively, the positive electrode frame and the negative electrode frame are connected through the ceramic capacitor, and the tantalum core and the ceramic capacitor are of a parallel structure. According to the utility model, through the design of the lead frame and the parallel combination mode of the ceramic capacitor and the tantalum capacitor, the volume efficiency maximization of the tantalum capacitor and the volume maximization of the tantalum core are realized, the reliability and the stability of the tantalum capacitor are improved, the use is simple, and the effect is obvious.

To provide a semiconductor light-emitting device having high adhesion between a lead frame and a sealing resin and high reliability, and a manufacturing method thereof.SOLUTION: A resin frame is placed on the top of a first lead electrode and a second lead electrode, which are arranged on the same plane with a gap between them, to form a housing. The upper surfaces of the first lead electrode and the second lead electrode form the bottom surface of a recess surrounded by the frame. The light-emitting element is bonded onto the second lead electrode within the recess. A first sealing member is in contact with the bottom surface of the recess around the light-emitting element and the inner wall surface of the frame. The second sealing member covers the light-emitting element and the first sealing member, filling the recess. The resin that forms the frame extends into the gap between the first lead electrode and the second lead electrode, filling the gap. The upper surface of the resin filling the gap is covered with the first sealing member.SELECTED DRAWING: Figure 1

An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

The invention belongs to but not limited to the technical field of power semiconductor packaging, and discloses a packaging structure of a power semiconductor device. The power module comprises a lead frame, a plastic package body, a base island, a bonding wire and a semiconductor chip assembly, a first power unit and a second power unit are integrated, the first unit comprises two driving ICs, six IGBTs and six FRD chips, the second unit comprises two driving ICs and six MOS chips, 46 pins are provided, and functions are clearly divided. All the IC chips and the FRD chips are arranged on the same base island, the back faces of the chips are welded to the base island, and the front faces of the chips are connected with pins in a standard mode through bonding wires. The structure solves the problems of complex packaging layout, disordered connection and the like in the prior art, can drive the compressor and the fan respectively, realizes high integration level and compact layout, shortens an electric connection path, reduces parasitic parameters, reduces the overall size and cost, and improves reliability and engineering compatibility.

Provided are a semiconductor light emitting apparatus and a method for manufacturing the semiconductor light emitting apparatus, which result in high adhesion between a lead frame and sealing resin and high reliability. A resin frame is disposed on a first lead electrode and a second lead electrode disposed on an identical plane with a gap therebetween, thereby forming a housing. The upper surfaces of the first lead electrode and the second lead electrode form the bottom surface of a recess surrounded by the frame. A light emitting device is bonded onto the second lead electrode in the recess. A first sealing member contacts the bottom surface of the recess around the light emitting device and an inner wall surface of the frame. A second sealing member covers the light emitting device and the first sealing member, and fills the recess. Resin forming the frame extends into the gap between the first lead electrode and the second lead electrode to fill the gap. The upper surface of the resin filling the gap is covered with the first sealing member.

An electrical connector assembly includes a housing having a mating interface configured to be mated with a mating electrical connector assembly. Wafer assemblies are received in a cavity of the housing arranged in a wafer stack. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, cables coupled to the leadframe, a ground frames coupled to the wafer body to provide electrical shielding for the leadframe, and ferrules surrounding the ends of the cables and electrically connected to the ground frames. Each ferrule has a solder layer along an interior of the ferrule coupled to a cable shield. Each ferrule includes shield connecting elements terminated to the ground frames to electrically connect the ferrule to the ground frames.

The invention provides a copper-nickel-tin alloy strip and a preparation method thereof, and relates to the technical field of copper alloys. The copper-nickel-tin alloy strip provided by the invention comprises the following components in percentage by mass: 8.5%-10% of Ni, 1.5%-3% of Sn, 0.5%-1.5% of Al, 0.3%-0.6% of Si, 0.19%-0.21% of Cr, 0.05%-0.30% of Mn and the balance of Cu. The tensile strength of the copper-nickel-tin alloy strip ranges from 580 MPa to 770 MPa, the percentage elongation after fracture A50 is larger than or equal to 8%, the hardness ranges from 170 HV to 240 HV, the electric conductivity is larger than or equal to 10% IACS, and the grain size is smaller than or equal to 0.015 mm. And the material can be stably applied to elastic sensitive elements of electronic industrial relays, potentiometers, switches, connectors, lead frames, control and instrument sensors and the like.

Single switch power module (114) comprising: - A molded body (130), wherein the molded body (130) at least partially encloses one or more semiconductor components (106) arranged on a substrate (128), and - A lead frame (108), the lead frame (108) having a first part (110) and a second part (112), the first part (110) having a gate (118), a source (120) and a power source (122) and the second part (112) having a power drain (124), wherein the substrate (128) can be placed asymmetrically to the longitudinal direction (104) and / or the one or more semiconductor components (106) are placed parallel to the longitudinal direction (104), wherein a connection for electrically contacting the power source (122) to a semiconductor component source is effected via a fork-shaped embodiment (140) of the power source (122), wherein the fork-shaped embodiment (140) is designed such that universal electrical contacting for semiconductor components (106) of a different semiconductor component size is ensured.

The invention relates to an IPM module lead frame, and relates to the technical field of lead frames, and the IPM module lead frame comprises a base island which is used for connecting a bare chip and providing mechanical support for the bare chip; the conductive substrate is arranged in the base island, and the front surface of the conductive substrate is used as a welding surface welded with a bare chip; the pin is connected with the substrate, so that a path can be formed between the pin and the bare chip; the material guiding groove is formed in the welding face of the conductive substrate, the material guiding groove is formed in a flowing path where welding flux flows from a welding area to the edge of the conductive substrate, and the material guiding groove can receive the welding flux and guide the welding flux to flow in the extending direction of the material guiding groove. According to the invention, the welding flux is effectively prevented from overflowing to the back surface of the conductive substrate, the production qualified rate of the IPM module is improved, the waste of resources is reduced, and better economical efficiency is achieved.

The invention provides a dual-chip die-bonding chip mounter, and relates to the technical field of semiconductor packaging, and the dual-chip die-bonding chip mounter comprises a chip mounter main body, a lead frame feeding mechanism is hung on the left side of the chip mounter main body, and a lead frame receiving mechanism is hung on the right side of the chip mounter main body; the lead frame conveying mechanism is installed in a working area inside the chip mounter main body, the left end of the lead frame conveying mechanism is attached to a discharging port of the lead frame feeding mechanism, and the right end of the lead frame conveying mechanism is attached to a feeding port of the lead frame receiving mechanism; the whole process is automatically circulated from empty frame feeding, conveying to finished product receiving, manual frequent intervention and turnover are not needed, the labor intensity is reduced, the automation level and operation continuity of a production line are improved, and the problems that manual intervention or cooperative operation of multiple sets of manipulators is often needed, the automation degree is limited, high integration of feeding and discharging mechanisms cannot be achieved, and the production efficiency is high are solved. The overall coordination of the equipment is insufficient; and the time consumption of the die bonding and surface mounting process is long.

The utility model discloses a semiconductor packaging lead placing frame jig, which comprises a jig main body, the front surface of the jig main body is provided with a mold end limiting stand foot and a mold equipment positioning block, and the back surface of the jig main body is provided with a heating platform end stand foot; the front face of the jig body is provided with a discharging area where a lead frame is placed, coarse positioning columns abutting against the edge of the lead frame are arranged in the discharging area, fine positioning columns embedded into positioning holes of the lead frame are arranged in the discharging area, one side of the discharging area is provided with a pressing plate, and the other side of the discharging area is provided with a positioning hole. The pressing plate is connected with a driving device arranged on the back face of the jig body, and the pressing plate is driven by the driving device to have a first state in which the pressing plate is pressed on the lead frame and a second state in which the pressing plate is separated from the lead frame. The uncontrollable factors of the lead frame in the transferring and clamping process are reduced, the undesirable factors are caused by collision in the up-down process due to the fact that the force used by people in the taking process is too large, and the undesirable risk is reduced.

The invention discloses a photoelectric integrated semiconductor packaging structure with a lead frame and a preparation method thereof, the front surface of the lead frame is divided into an electrical connecting part and a chip accommodating part through a limiting structure, the surface of the chip accommodating part is lower than the surface of the electrical connecting part, and the limiting structure comprises a first step and a second step which are arranged in a stepped manner; the first step is provided with a first groove, the second step is provided with a second groove, the chip accommodating part is used for being electrically connected with an electric chip, an optical chip is stacked above the electric chip, the first groove is used for clamping the end part of the electric chip, and the second groove is used for clamping the end part of the optical chip. The optical chip and the electric chip are supported through the lead frame, the chips are prevented from deviating, and stable performance of the packaging structure is guaranteed; the chip can also assist in heat dissipation through the lead frame, so that the problem of serious heat accumulation in the chip is solved; the whole packaging structure is simple in preparation method, the cost is reduced, and large-scale production is facilitated.

Disclosed in the present application are a power module and an electronic apparatus. The power module comprises: a plastic package body; a plurality of power chips; a frame; and a plurality of driving chips, wherein a high-voltage driving chip is integrated with a bootstrap boost module, a bootstrap pad is reserved on each of a first high-side driving floating power supply voltage pin, a second high-side driving floating power supply voltage pin and a third high-side driving floating power supply voltage pin, at least some high-side driving chip power supply voltage pins are arranged at intervals in a first direction between a high-voltage driving pad and the plurality of high-side driving floating power supply voltage pins, and in a plane perpendicular to the thickness direction of the plastic package body, the length of the orthographic projection of a control-side lead frame in the first direction is L1, L1 satisfying: 5.4 mm≤L1≤ 7 mm. Thus, on the premise of ensuring the universality of the power module for external bootstrap chips, not only can the heat dissipation performance of the power module be improved, but also the through-current capability of the power module can be improved.

The invention discloses an electrode assembly for a high-power pulse xenon lamp and a preparation method of the electrode assembly, and aims to overcome the technical defects that a traditional electrode is large in mass and poor in reliability and stability. The electrode assembly is mainly composed of an electrode tip, an electrode stem and a lead seat which are made of cerium-tungsten alloy, niobium and stainless steel. The electrode tip and the electrode rod are stably connected in a mode of combining brazing with interference connection, and the electrode rod and the lead seat adopt a multi-connection structure of brazing, threaded mechanical connection and micro interference connection; the assembled electrode assembly is subjected to degassing, brazing connection and electrode activation treatment at a time in a high-temperature and high-vacuum environment, and the problem of electrode material pollution caused by repeated heating is effectively avoided. The electrode assembly is simple in overall structure, reliable in preparation, excellent in current passing ability, capable of bearing impact force under extreme working conditions and outstanding in burning loss resistance, reliability and stability are remarkably improved, and the long-term stable working requirement and large-scale mass production of the high-power pulse xenon lamp are met.

A multi-member frame assembly for a track system includes a pivot pin defining a pivot axis, a leading frame member pivotally connected to the pivot pin for pivoting about the pivot axis, and a trailing frame member pivotally connected to the pivot pin for pivoting about the pivot axis, the trailing frame member pivoting independently from the leading frame member. A resilient member is pivotally connected to the leading frame member and to the trailing frame member. The resilient member extends generally vertically between the leading frame member and the trailing frame member. A track system having a multi-member frame assembly is also described.

The utility model discloses a lead frame resistant to stacking inclination, and belongs to the technical field of lead frames. Comprising a frame main body on which a plurality of chip mounting units are arranged in an array; the chip mounting unit comprises a slide holder and a pin structure, and the slide holder is connected with the frame main body through the pin structure; the pin structure is formed by integrally connecting an inner pin and an outer pin, and the outer pin is arranged on the frame main body; the inner pin comprises an inclined connecting section extending from the outer pin to the slide holder, and a linear supporting section vertically extending from the tail end of the inclined connecting section to the slide holder; when the frame main bodies are stacked in a multi-layer stacking mode, the upper surface of the lower-layer slide holder and the lower end of the upper-layer linear supporting section form vertical bearing fit, the lower-layer inclined connecting section and the upper-layer outer pins form transverse limiting fit, stacking stability is achieved through composite contact constraint in the vertical direction and the horizontal direction, and it is ensured that stacking is not inclined; and the situation that the position of the vacuum suction nozzle needs to be frequently adjusted when a packaging mold manufacturer grabs is avoided.