3690 results about "Lead frame" patented technology

Semiconductor packages and, more particularly, semiconductor packages with increased power handling capabilities are disclosed. Semiconductor packages may include lead frame structures and corresponding housings that incorporate semiconductor die. To promote increased current and voltage capabilities, exemplary semiconductor packages include one or more arrangements of creepage extension structures, lead frame structures that may include integral thermal pads, additional thermal elements, and combinations thereof. Creepage extension structures may be arranged as part of top sides of semiconductor packages along with thermal pads of lead frame structures and additional thermal elements. Creepage extension structures may also be arranged as part of top sides and along on one or more peripheral edges of semiconductor packages to promote further increases in power handling.

The invention relates to the technical field of lead frame cleaning, in particular to a continuous ultrasonic cleaning device for a lead frame. Comprising an ultrasonic cleaning box, an ultrasonic generating device is arranged on the ultrasonic cleaning box, a cleaning basket is arranged above the ultrasonic cleaning box, material carrying frames which are distributed at equal intervals are detachably connected to the interior of the cleaning basket, and rotating blocks which are distributed at equal intervals in a mirror image mode are rotationally connected to the material carrying frames; an electric sliding rail is arranged on the rotating block, sliding blocks distributed in a mirror image mode are arranged in the electric sliding rail of the rotating block, a material clamping plate is jointly and fixedly connected between the sliding blocks with the same height in the electric sliding rail of the rotating block distributed in the mirror image mode, and the material clamping plate is slidably connected with a blocking plate distributed in a mirror image mode. According to the lead frame cleaning device, the lead frame is switched between the fixed state and the free state through cooperation of the plugging plate and the clamping plate, so that all parts of the lead frame can be uniformly cleaned, and the cleaning effect of the lead frame cleaning device on the lead frame is improved.

The utility model relates to the technical field of lead frame material receiving, in particular to an adjustable material receiving box of a high-density integrated circuit lead frame electroplating production line, which comprises a support plate and a clip limiting frame arranged on the support plate, and the clip limiting frame is used for placing material receiving clips for stacking lead frames. The cartridge clip limiting frame comprises two first limiting plates for limiting the two sides of the material receiving cartridge clip in the length direction and two second limiting plates for limiting the two sides of the material receiving cartridge clip in the width direction; the supporting plate is further provided with an electric length adjusting assembly used for adjusting the distance between the two first limiting plates and an electric width adjusting assembly used for adjusting the distance between the two second limiting plates. The efficiency of electric adjustment is higher than that of manual adjustment, and the adjustment accuracy is improved.

Techniques are disclosed herein for forming a dual flat no-leads semiconductor package. The techniques begin with a package assembly that includes multiple non-singulated packages. The semiconductor package assembly includes a lead frame assembly having dies coupled thereto. A mold encapsulation covers at least portions of the dies and exposes a plurality of leads. A first cutting step exposes sidewalls of leads of the lead frame. An electroplating step deposits a plating on the exposed leads. A second cutting step cuts through the mold encapsulation aligned with the step cut sidewalls. A third cutting step perpendicular to the step cuts and is made through the lead frame and mold encapsulation to singulate the dies into individual packages.

The present invention discloses a lead frame for chip packaging, a preparation method and a chip packaging structure. The lead frame includes a carrier sheet, a first solder resist ink layer and a plurality of unit circuits arranged in a matrix, the unit circuit includes a plurality of electrodes, the electrodes include a top electrode and a bottom electrode; the top electrode is arranged on the top surface of the first solder resist ink layer; corresponding to each unit circuit, the first solder resist ink layer includes a bottom electrode hole corresponding to the electrode, the bottom electrode is arranged in the bottom electrode hole, and the top of the bottom electrode is fixed on the bottom surface of the top electrode; the carrier sheet is peelably attached to the first solder resist ink layer and the bottom surface of the bottom electrode. The lead frame preparation process of the present invention has few steps, a simple process and low cost.

A described example includes: a leadframe having a high voltage section and a low voltage section spaced from and electrically isolated from the high voltage section, and a heat slug mounted to the high voltage section. The high voltage section includes an input portion connected to the heat slug at an interior end by a mount portion, and further includes an interior lead portion that is connected to the mount portion by a flexible connect portion. An insulating material mounted to the heat slug provides a die mount area for a semiconductor die having a Hall element that is positioned so that the Hall element is proximate to the heat slug. Mold compound covers the semiconductor die, portions of the leadframe, and portions of the heat slug while a board side surface of the heat slug is exposed forming a thermal pad for a semiconductor device package.

The invention relates to the technical field of lead frame slitting devices, in particular to a lead frame slitting device and method. Comprising a mounting plate, the mounting plate is fixedly connected with a cutting table, the mounting plate is fixedly connected with symmetrically-distributed fixing columns, the mounting plate is provided with a winding roll, a lead frame roll is wound on the winding roll, the symmetrically-distributed fixing columns are jointly connected with a cutting knife in a sliding mode, one fixing column is connected with a first motor in a sliding mode, and the other fixing column is connected with a second motor in a sliding mode. And an output shaft of the first motor is fixedly connected with a cam, the fixing column is rotationally connected with a connecting rod, and the end, away from the cutting knife, of the connecting rod is fixedly connected with a transmission wheel. The thickness of the lead frame is detected, then the position of the first motor is adjusted, the transmission ratio between the cam and the transmission wheel is changed, the downward moving speed of the cutting knife can be adjusted along with the thickness of the lead frame, and abrasion of the cutting knife in the cutting process is reduced.

A lead frame transferring and stacking device relates to the field of semiconductor production, and comprises a support frame, two ends of which are provided with support rings in the length direction; the turnover mechanism comprises two gear rings which are rotatably mounted on the inner sides of the supporting rings respectively, two bearing plates which are symmetrically arranged and are parallel to the supporting frame in the length direction are arranged between the gear rings, the turnover mechanism is used for placing a transfer frame, and a plurality of lead frames are arranged on the transfer frame in a rectangular array mode; two stop levers which are symmetrically arranged and reciprocate in the width direction of the bearing plate are arranged on the bearing plate, the length direction of the stop levers is parallel to the axis of the gear ring, and the stop levers are used for limiting the lead frame; the bearing mechanism comprises two supporting plates which are arranged on the two sides of the supporting frame in the length direction respectively and move in the width direction and the vertical direction of the supporting frame, a plurality of material frames arranged at intervals are arranged on the top faces of the supporting plates in the length direction of the supporting plates, and during application, the upper ends of the material frames abut against the transfer frame and are used for collecting the lead frames. According to the device, the lead frames can be automatically stacked in the material frame, and the efficiency is improved.

The utility model discloses a photoelectric coupler lead frame and a photoelectric coupler. The photoelectric coupler lead frame comprises a first lead frame and a second lead frame. The first lead frame comprises a plurality of first frame units which are arranged at intervals, each first frame unit comprises a first chip bonding part, and the area of each first chip bonding part can be used for die bonding of a light-emitting chip; the second lead frame comprises a plurality of second frame units which are arranged at intervals, each second frame unit comprises a second chip bonding part, and the area of each second chip bonding part can be used for die bonding of a photosensitive chip; a first positioning mark and a range measuring mark are arranged on the first chip bonding part; the second chip bonding part is provided with a second positioning mark and an etching mark. According to the photoelectric coupler lead frame provided by the utility model, the regulation and control efficiency of output grading of photoelectric coupler products can be improved, and the production efficiency of the products can be improved.

Solid-state lighting devices, and more particularly, symmetrical lead frame structures for two-pin light emitting diode (LED) packages and methods for making the same are disclosed. The symmetrical lead frame structure can include a pair of leads that include symmetrical split cup portions that collectively, when placed next to each other, form a cup, across which an LED flip-chip can be placed. Each of the leads can be a respective electrode powering the LED flip-chip, which together with the symmetrical structure, provides a more even light emission profile and far-field pattern. A molded lens can be formed around the lead frame to protect the chip, as well as maintain a gap between the pair of leads of the lead frame structure. In some embodiments, a fill material can be added in the gap between the pair of leads.

The invention provides a photosensitive resin composition, a photosensitive dry film and application thereof. The photosensitive resin composition comprises alkali-soluble resin, a photopolymerization monomer, a photoinitiator and a modified anthracene sensitizer. By introducing the modified anthracene sensitizer into a resin system, on one hand, the photosensitivity of the obtained photosensitive resin composition can be greatly improved; on the other hand, compared with the related technology, the obtained photosensitive resin composition has the advantages that the performance in the aspects of resolution, adhesive force performance, flexibility grade, initiator migration, development precipitation and the like is improved, so that the photosensitive resin composition is suitable for manufacturing high-order PCBs (Printed Circuit Boards) such as support plates and similar support plates, and can meet the performance requirements of special use scenes such as long copper columns and mSAP thick copper plating; the production yield can be remarkably improved, the production efficiency of manufacturing parts such as ITO in the fields of PCB manufacturing, lead frame manufacturing, semiconductor packaging and flat panel displays is remarkably improved, and the production cost is reduced.

A power module includes: a lead frame having a base region and leads; a plurality of substrates each having a first metallized side attached to the base region of the lead frame, a second metallized side opposite the first metallized side, and an insulating body that electrically isolates the first and second metallized sides from one another; at least one semiconductor die attached to the second metallized side of each substrate; and a mold compound encapsulating the semiconductor dies and part of the lead frame. The semiconductor dies are electrically interconnected within the power module to form part of a power electronics circuit. The base region of the lead frame is electrically isolated from the power electronics circuit by the insulating body of the substrates. The leads of the lead frame protrude from one or more side faces of the mold compound and form terminals of the power module.

The invention relates to the technical field of stamping, and provides an automatic blanking stamping die for semiconductor lead frame processing, which comprises a lower die main body, a rack, a first conveying belt, an upper die main body, a copper strip conveying roller, an overturning assembly, a conveying assembly and a deburring assembly, and further comprises a cover cylinder, a longitudinal channel and a horizontal guide rail which are arranged on the surface of the rack, according to the invention, not only can the stamped semiconductor lead frame be automatically adjusted from a horizontal state to a vertical state, but also the semiconductor lead frame in the vertical state can be automatically moved to the surface of the second conveying belt; on one hand, the two sets of grinding layers rotating reversely can be automatically controlled to remove burrs and flashes on the surface of a stamping hole or a notch of a workpiece, on the other hand, the machined workpiece can enter a discharging port more smoothly and rapidly, and the automatic turning device has the beneficial effects of being capable of achieving automatic turning, conveying double faces to be ground at the same time and achieving automatic discharging.

The utility model relates to the technical field of lead frame stamping, and discloses a stamping die for lead frame production, which comprises an upper die and a lower die, a driving part is arranged between a lower die base and an upper die base, a plurality of stamping heads are arranged at the bottom of the upper die side by side, the heights of the plurality of stamping heads are sequentially reduced from the middle to the outside, and the stamping heads are arranged on the lower die base. Two positioning pieces used for flexibly fixing the lead frame are symmetrically arranged at the two ends of the bottom of the upper die, the driving piece comprises a base, and the lower die base is fixedly arranged on the base. The stamping head at the bottom of the upper die base is changed into a form that the middle is high and the two sides are gradually reduced, so that the influence of deformation of the die on the local pressure height of the upper die in the stamping process is counteracted, and the local pressure borne by pins of each row of products during stamping is improved from the original small middle pressure and large two-side pressure to the same middle pressure and two-side pressure; therefore, the lead frame stamping quality is improved.

The utility model discloses a high-precision cylindrical grinder for a lead frame. The high-precision cylindrical grinder comprises a lathe bed, and a power device, a grinding wheel assembly, a diamond grinding wheel repairing cutter, a cooling assembly, an air pump, a negative pressure pump, a dust removal box, a main shaft and a driven shaft which are arranged in the lathe bed. In the grinding wheel trimming process, compressed air generated by the air pump enters the air blowing cavity along the pipeline and the air pipe connector and then enters the blowing groove through the communicating groove, airflow is blown out after the flow speed is increased through the closing opening in the tail end of the blowing groove, and a complete annular air curtain is formed on the outer wall of a part located between the chuck and the ejector pin; high-speed moving sand particles generated during grinding wheel repairing can be effectively prevented from falling on the surface of a part, the product machining quality is improved, and then smooth production of a lead frame is guaranteed.

The invention discloses a high-strength and high-conductivity copper-nickel-silicon alloy for a lead frame and a preparation method of the high-strength and high-conductivity copper-nickel-silicon alloy. The high-strength and high-conductivity copper-nickel-silicon alloy comprises the following components in percentage by mass: 1.75-1.86 wt% of Ni, 1.02-1.1 wt% of Co, 0.54-0.62 wt% of Si, 0.12-0.13 wt% of Mg, less than or equal to 1.0 wt% of Ag and the balance of Cu. The preparation method comprises the following steps: 1) preparing the raw materials according to the alloy components and the mass percentage content, and carrying out alloy casting by using a vacuum melting furnace; (2) the cast ingot is subjected to solution treatment and then rapidly water-cooled to the room temperature, so that the solid solution state of the alloy is reserved; the method comprises the following steps of (1) carrying out primary cold rolling on a cast ingot, (2) carrying out secondary cold rolling on the cast ingot, (3) carrying out hot rolling on the cast ingot after surface defects of the cast ingot are milled off, (4) carrying out primary cold rolling, annealing for 4 hours at the temperature of 420-440 DEG C, carrying out secondary cold rolling, annealing for 4 hours at the temperature of 310-330 DEG C, carrying out aging treatment until the thickness is 0.2 mm, carrying out tertiary aging treatment at the temperature of 100-400 DEG C for 2-20 hours, and carrying out air cooling to the room temperature. The highest tensile strength of the obtained copper alloy strip is 825 MPa, the highest yield strength is 790 MPa, the highest hardness is 252.9 HV, the highest electric conductivity is 46.17% IACS, and the highest elongation is 3.16%.

The invention relates to a matrix type semiconductor lead frame linear full-automatic magazine loading machine, and belongs to the technical field of semiconductor frame lead automatic magazine loading. Comprising a bottom plate, and a graphite boat strip carrying table, a lead frame conveying carrying table and a magazine carrying table are sequentially arranged on the bottom plate. The graphite boat carrying platform is provided with an ejector rod used for unlocking the graphite boat and the lead frame, and the lead frame conveying platform is provided with conveying belts corresponding to the magazine platforms one to one. A first horizontal linear module is erected on the bottom plate, a sliding part of the first horizontal linear module is provided with a second vertical linear module, and the lower part of a sliding part of the second vertical linear module is connected with a lead frame suction plate. Compared with manual operation, the production efficiency can be effectively improved, and the problems of misloading of the magazine, damage to the magazine or a chip and the like caused by manual operation are avoided.

The utility model provides a material receiving device for lead frame processing, and belongs to the technical field of electronic component processing. The platen is arranged behind the outlet of the punching machine, the upper counting assembly is arranged on the platen, the supports on the two sides of the upper counting assembly are arranged on the two sides of the outlet of the punching machine respectively, the supporting frames capable of stretching out or drawing back are arranged on the supports, and the counting sensor is installed on the support on one side. A lower collecting and feeding assembly comprising a plurality of conveying belts is arranged below an upper counting assembly, so that lead frames sent out from an outlet of a punching machine can be supported by a bearing frame firstly and are counted independently through a counting sensor, and the counted lead frames fall onto the conveying belts and are stacked under the guiding effect of a side support. And after being stacked to the preset number, the materials are conveyed out through the conveying belt, the collecting and arranging requirements are met, manual participation is not needed, the workload is lower, the machining efficiency is higher, meanwhile, the safety risk existing in manual arranging can be avoided, and the machining safety is improved.

The present invention discloses a lead frame flipping and loading device for an automatic production line, comprising a frame material conveying mechanism, a frame material flipping mechanism, and a steel strip material clamping frame. The frame material conveying mechanism is provided with a lifting and lowering feeding plate that can slide back and forth to convey the frame material to the position of the frame material flipping mechanism. The frame material flipping mechanism is provided with an openable and closable frame material clamping mouth for clamping the frame material. The upper portion of the steel strip material clamping frame is provided with an openable and closable steel strip material clamping mouth for clamping the steel strip material. The frame material clamping mouth can flip toward the steel strip material clamping mouth and slide outward. The lead frame flipping and loading device for an automatic production line provided by the present invention has a feeding mechanism that realizes efficient positioning and feeding through a feeding bolt that can be lifted and lowered back and forth. The flipping mechanism can adjust the flipping radius while realizing flipping, ensuring that the frame material reaches the lower edge of the large steel strip material after flipping. The steel strip material clamping mechanism can ensure that the entire steel strip material remains stable at all times.

According to the electronic cigarette sensor with the partition wall structure, a partition wall, a step and a Z-shaped air inlet channel are formed in an injection molding cavity of a lead frame, the high step is provided with an air inlet channel penetrating through the high step and the bottom wall of the lead frame, the air inlet channel is in an inverted Z shape, the high step is further provided with a micro-electro-mechanical sensor, and the micro-electro-mechanical sensor is arranged on the bottom wall of the lead frame. A low step is arranged at the position, away from the high step, in the cavity, and protective nets are arranged on the upper cover and the lower cover. The lead frame is provided with a circular cavity, the height of the bottom of the circular cavity is slightly higher than that of the star-shaped bonding pad, the circular cavity is in a concave semi-wrapping state, and good sealing performance and good mounting welding performance during mounting of the formed electronic cigarette sensor are facilitated. A partition wall is further arranged in the cavity, the ASIC chip and the micro-electro-mechanical sensor are isolated through the partition wall, the micro-electro-mechanical sensor is protected from being polluted by manufacturing procedures, tobacco tar and the like, and a sealed oil-proof air channel is provided for the oil-proof cotton.

The invention discloses integrated functional lead frame production equipment and a lead frame thereof, and relates to the technical field of lead frame production, and the integrated functional lead frame production equipment comprises a first-stage straightening unit, a pre-forming unit, a pre-stamping unit, a second-stage straightening unit and a processing unit which are sequentially arranged in the feeding direction of a material plate; through the technological processes of primary straightening, pre-stamping and secondary straightening, plate residual stress concentration in the middle of the material plate is effectively reduced. In the pre-stamping process, the middle of the material plate is pressed downwards to form a height difference, so that leakage of lubricating oil is reduced, and the material plate is attached to the limitation of the supporting frame and the supporting plate. In addition, the side portion of the material plate is punched to form protruding clamping grooves, the protruding clamping grooves are connected to the surface of the supporting frame in a clamped mode, the supporting frame supports the protruding clamping grooves, the rigidity and the torque resistance of the material plate are further enhanced, the two protruding clamping grooves in the side portion of the material plate can effectively isolate vibration in the transportation process, and therefore the material plate is prevented from being damaged. And the overall stability of the material plate after pre-stamping is further improved.

The invention provides a semiconductor lead frame material box conveying device, and belongs to the technical field of semiconductor device production, the semiconductor lead frame material box conveying device comprises a bearing mechanism which comprises a connecting column and a circular bottom plate sleeving the bottom of the peripheral side of the connecting column, the peripheral side of the connecting column is provided with an even number of pairs of vertical first baffles in a circumferential array mode, and a second baffle is arranged between each pair of first baffles; the connecting column is rotationally connected to a rotating shaft, the top of the rotating shaft penetrates out of the top of the connecting column, and the connecting column is driven by a rotating mechanism to rotate; the two pushing ends of the two-way pushing mechanism are connected with the two pushing plates correspondingly, and the top of the two-way pushing mechanism is connected with the telescopic end of a lifting mechanism; the conveying belt is arranged on one side of the circular bottom plate, and the conveying direction of the conveying belt is parallel to the diameter of the circular bottom plate; the horizontal linear mechanisms are arranged below the circular bottom plate at intervals, and the movable ends are connected with the bottom of the rotating shaft. The device can automatically convey the lead frame material boxes to the material box bearing areas of a plurality of core bonding devices in the core bonding process, and the core bonding and feeding efficiency is improved.

The invention discloses an asynchronous step-down chip single-base-island packaging structure and method.The asynchronous step-down chip single-base-island packaging structure comprises a lead frame, a single base island, an integrated control circuit wafer, a silicon wafer, a ceramic chip capacitor, a laminated chip inductor and a Schottky diode, the lead frame is provided with the single base island and a plurality of pins, the single base island is divided into a first chip area and a second chip area, and the first chip area and the second chip area are integrated; an integrated control circuit wafer is placed on a first chip area, a silicon wafer is placed on a second chip area, a ceramic chip capacitor and a laminated chip inductor are mutually bonded and connected and are respectively placed on the silicon wafer, and a Schottky diode is placed on the silicon wafer, so that the number of elements on a circuit board is reduced, the area of the circuit board is reduced, and the cost is reduced. And the manufacturing cost and the debugging difficulty of the PCB are reduced.

The invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method. The adjustable electrolysis device comprises an electroplating mold, and the electroplating mold comprises an outer cylinder and an inner cylinder arranged in the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet communicated with the outer outlet through a channel. According to the method, the internal cylinder and external cylinder structures of the electroplating mold are determined, so that the uniformity of the local coating film thickness of a semiconductor electronic element and the accuracy of a plating area can be quickly obtained, and the requirement of a high-end semiconductor lead frame in the metal coating electroplating process can be met; and the requirement for the screening accuracy of the optimal condition of the selective adjustable electroplating mold is met. The invention further provides an electroplating mold combination of a disposable adjustable electrolysis device as an update, and a rapid and accurate electroplating method for local plating areas of various semiconductor electronic elements is realized through the adjustable function of the through opening width of a cylinder in the electroplating mold.

The present disclosure relates to package, manufacturing method, and electrical system. The package comprises: a mounting substrate with at least one power die having a power device and attached to a first surface of the mounting substrate; and a lead frame comprising a first die attachment portion and at least one first lead, wherein at least one cooperation device die having a cooperation device for cooperating with the power device is attached to the first die attachment portion, and wherein during a normal operation an amount of heat generated by the cooperation device is less than an amount of heat generated by the power device, wherein the at least one first lead is coupled to the first surface of the mounting substrate to be electrically coupled to the power die.

A semiconductor device is provided. The semiconductor device includes a leadframe having a plurality of leads. A first lead of the plurality of leads has a lead pad formed between a distal portion and a proximal portion of the first lead. A semiconductor die includes a plurality of bond pads located at an active side. Each bond pad of the plurality is connected to a respective lead of the plurality of leads. An encapsulant encapsulates the semiconductor die and at least a portion of the leadframe. A distal portion of each lead is exposed through the encapsulant at a first major side. The lead pad is exposed through the encapsulant at a second major side opposite of the first major side.

The invention discloses a chip tantalum capacitor and a packaging method thereof, the capacitor comprises a lead frame and a tantalum core, and the lead frame is connected with the tantalum core through a connecting part. The packaging method comprises the following steps: correspondingly connecting a lead frame, a connecting part and a tantalum core, and then coating a water-soluble polymer material on the connecting part; putting into a mold for mold pressing; soaking in water after mould pressing, taking out, washing and drying; and carrying out electroplating treatment to finish packaging of the tantalum capacitor. According to the invention, a layer of water-soluble polymeric membrane material is coated on the positive and negative electrode lead wire areas of the lead wire frame; the water-soluble polymer material has good adhesion and peelability, so that the epoxy mould pressing flash material can be effectively prevented from being tightly attached to the lead frame in the mould pressing process, the epoxy mould pressing flash material is effectively removed, particularly the flash material is prevented from being tightly attached to the lead frame, the production quality and the product performance are improved, and the production cost is reduced. And the step of treating the flash is omitted.

The invention belongs to the technical field of semiconductors, and discloses a semiconductor circuit, the semiconductor circuit comprises a substrate, an insulating layer, a chip function layer and a packaging body, two sides of the substrate are respectively provided with a plurality of first installation parts, one surface of the substrate is used as an arrangement surface, and the insulating layer is arranged on the arrangement surface; the external pin is connected with the extension end of the first installation part, and the external pin is electrically connected with the first installation part. According to the semiconductor circuit disclosed by the invention, through the design of the first mounting part extending out of the packaging body and the external pin, the external pin can be mounted after the semiconductor circuit is packaged; even if the ejector pin is adopted for pressing to prevent glue overflow, the condition that stress between the substrate and the pins causes cracks on the insulating layer is avoided. In addition, the external pins can be installed after being independently formed, the lead frame does not need to be introduced in a mode of being matched with rib cutting forming, the equipment and production cost can be reduced, and the production efficiency is improved.

Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead frame therebetween, where the RDL comprises a plurality of terminals, and where one or more of the plurality of pads are wire bonded to a corresponding one or more of the plurality of terminals.

In a described example, an example no-lead semiconductor device package includes: a die pad in a central portion of a partially etched leadframe and terminals. The terminals include a device side surface formed in an upper layer of the partially etched leadframe, and a first exterior end in the upper layer; a board side surface formed in a lower layer of the partially etched leadframe extending from the upper layer; a second exterior end in the lower layer, the second exterior end inset from the first exterior end, and an inset portion extending from the first exterior end to the second exterior end. A semiconductor die is mounted to the die pad. Mold compound covers the semiconductor die, the second exterior end of the terminals and the inset portion of the terminals are exposed from the mold compound, with the mold compound extending along sides of the terminals.