2498 results about "Lead frame" patented technology

A described example includes: a leadframe having a high voltage section and a low voltage section spaced from and electrically isolated from the high voltage section, and a heat slug mounted to the high voltage section. The high voltage section includes an input portion connected to the heat slug at an interior end by a mount portion, and further includes an interior lead portion that is connected to the mount portion by a flexible connect portion. An insulating material mounted to the heat slug provides a die mount area for a semiconductor die having a Hall element that is positioned so that the Hall element is proximate to the heat slug. Mold compound covers the semiconductor die, portions of the leadframe, and portions of the heat slug while a board side surface of the heat slug is exposed forming a thermal pad for a semiconductor device package.

A lead frame transferring and stacking device relates to the field of semiconductor production, and comprises a support frame, two ends of which are provided with support rings in the length direction; the turnover mechanism comprises two gear rings which are rotatably mounted on the inner sides of the supporting rings respectively, two bearing plates which are symmetrically arranged and are parallel to the supporting frame in the length direction are arranged between the gear rings, the turnover mechanism is used for placing a transfer frame, and a plurality of lead frames are arranged on the transfer frame in a rectangular array mode; two stop levers which are symmetrically arranged and reciprocate in the width direction of the bearing plate are arranged on the bearing plate, the length direction of the stop levers is parallel to the axis of the gear ring, and the stop levers are used for limiting the lead frame; the bearing mechanism comprises two supporting plates which are arranged on the two sides of the supporting frame in the length direction respectively and move in the width direction and the vertical direction of the supporting frame, a plurality of material frames arranged at intervals are arranged on the top faces of the supporting plates in the length direction of the supporting plates, and during application, the upper ends of the material frames abut against the transfer frame and are used for collecting the lead frames. According to the device, the lead frames can be automatically stacked in the material frame, and the efficiency is improved.

Solid-state lighting devices, and more particularly, symmetrical lead frame structures for two-pin light emitting diode (LED) packages and methods for making the same are disclosed. The symmetrical lead frame structure can include a pair of leads that include symmetrical split cup portions that collectively, when placed next to each other, form a cup, across which an LED flip-chip can be placed. Each of the leads can be a respective electrode powering the LED flip-chip, which together with the symmetrical structure, provides a more even light emission profile and far-field pattern. A molded lens can be formed around the lead frame to protect the chip, as well as maintain a gap between the pair of leads of the lead frame structure. In some embodiments, a fill material can be added in the gap between the pair of leads.

The utility model relates to the technical field of lead frame stamping, and discloses a stamping die for lead frame production, which comprises an upper die and a lower die, a driving part is arranged between a lower die base and an upper die base, a plurality of stamping heads are arranged at the bottom of the upper die side by side, the heights of the plurality of stamping heads are sequentially reduced from the middle to the outside, and the stamping heads are arranged on the lower die base. Two positioning pieces used for flexibly fixing the lead frame are symmetrically arranged at the two ends of the bottom of the upper die, the driving piece comprises a base, and the lower die base is fixedly arranged on the base. The stamping head at the bottom of the upper die base is changed into a form that the middle is high and the two sides are gradually reduced, so that the influence of deformation of the die on the local pressure height of the upper die in the stamping process is counteracted, and the local pressure borne by pins of each row of products during stamping is improved from the original small middle pressure and large two-side pressure to the same middle pressure and two-side pressure; therefore, the lead frame stamping quality is improved.

The utility model discloses a high-precision cylindrical grinder for a lead frame. The high-precision cylindrical grinder comprises a lathe bed, and a power device, a grinding wheel assembly, a diamond grinding wheel repairing cutter, a cooling assembly, an air pump, a negative pressure pump, a dust removal box, a main shaft and a driven shaft which are arranged in the lathe bed. In the grinding wheel trimming process, compressed air generated by the air pump enters the air blowing cavity along the pipeline and the air pipe connector and then enters the blowing groove through the communicating groove, airflow is blown out after the flow speed is increased through the closing opening in the tail end of the blowing groove, and a complete annular air curtain is formed on the outer wall of a part located between the chuck and the ejector pin; high-speed moving sand particles generated during grinding wheel repairing can be effectively prevented from falling on the surface of a part, the product machining quality is improved, and then smooth production of a lead frame is guaranteed.

The invention relates to a matrix type semiconductor lead frame linear full-automatic magazine loading machine, and belongs to the technical field of semiconductor frame lead automatic magazine loading. Comprising a bottom plate, and a graphite boat strip carrying table, a lead frame conveying carrying table and a magazine carrying table are sequentially arranged on the bottom plate. The graphite boat carrying platform is provided with an ejector rod used for unlocking the graphite boat and the lead frame, and the lead frame conveying platform is provided with conveying belts corresponding to the magazine platforms one to one. A first horizontal linear module is erected on the bottom plate, a sliding part of the first horizontal linear module is provided with a second vertical linear module, and the lower part of a sliding part of the second vertical linear module is connected with a lead frame suction plate. Compared with manual operation, the production efficiency can be effectively improved, and the problems of misloading of the magazine, damage to the magazine or a chip and the like caused by manual operation are avoided.

The present invention discloses a lead frame flipping and loading device for an automatic production line, comprising a frame material conveying mechanism, a frame material flipping mechanism, and a steel strip material clamping frame. The frame material conveying mechanism is provided with a lifting and lowering feeding plate that can slide back and forth to convey the frame material to the position of the frame material flipping mechanism. The frame material flipping mechanism is provided with an openable and closable frame material clamping mouth for clamping the frame material. The upper portion of the steel strip material clamping frame is provided with an openable and closable steel strip material clamping mouth for clamping the steel strip material. The frame material clamping mouth can flip toward the steel strip material clamping mouth and slide outward. The lead frame flipping and loading device for an automatic production line provided by the present invention has a feeding mechanism that realizes efficient positioning and feeding through a feeding bolt that can be lifted and lowered back and forth. The flipping mechanism can adjust the flipping radius while realizing flipping, ensuring that the frame material reaches the lower edge of the large steel strip material after flipping. The steel strip material clamping mechanism can ensure that the entire steel strip material remains stable at all times.

According to the electronic cigarette sensor with the partition wall structure, a partition wall, a step and a Z-shaped air inlet channel are formed in an injection molding cavity of a lead frame, the high step is provided with an air inlet channel penetrating through the high step and the bottom wall of the lead frame, the air inlet channel is in an inverted Z shape, the high step is further provided with a micro-electro-mechanical sensor, and the micro-electro-mechanical sensor is arranged on the bottom wall of the lead frame. A low step is arranged at the position, away from the high step, in the cavity, and protective nets are arranged on the upper cover and the lower cover. The lead frame is provided with a circular cavity, the height of the bottom of the circular cavity is slightly higher than that of the star-shaped bonding pad, the circular cavity is in a concave semi-wrapping state, and good sealing performance and good mounting welding performance during mounting of the formed electronic cigarette sensor are facilitated. A partition wall is further arranged in the cavity, the ASIC chip and the micro-electro-mechanical sensor are isolated through the partition wall, the micro-electro-mechanical sensor is protected from being polluted by manufacturing procedures, tobacco tar and the like, and a sealed oil-proof air channel is provided for the oil-proof cotton.

The invention discloses integrated functional lead frame production equipment and a lead frame thereof, and relates to the technical field of lead frame production, and the integrated functional lead frame production equipment comprises a first-stage straightening unit, a pre-forming unit, a pre-stamping unit, a second-stage straightening unit and a processing unit which are sequentially arranged in the feeding direction of a material plate; through the technological processes of primary straightening, pre-stamping and secondary straightening, plate residual stress concentration in the middle of the material plate is effectively reduced. In the pre-stamping process, the middle of the material plate is pressed downwards to form a height difference, so that leakage of lubricating oil is reduced, and the material plate is attached to the limitation of the supporting frame and the supporting plate. In addition, the side portion of the material plate is punched to form protruding clamping grooves, the protruding clamping grooves are connected to the surface of the supporting frame in a clamped mode, the supporting frame supports the protruding clamping grooves, the rigidity and the torque resistance of the material plate are further enhanced, the two protruding clamping grooves in the side portion of the material plate can effectively isolate vibration in the transportation process, and therefore the material plate is prevented from being damaged. And the overall stability of the material plate after pre-stamping is further improved.

The invention provides a semiconductor lead frame material box conveying device, and belongs to the technical field of semiconductor device production, the semiconductor lead frame material box conveying device comprises a bearing mechanism which comprises a connecting column and a circular bottom plate sleeving the bottom of the peripheral side of the connecting column, the peripheral side of the connecting column is provided with an even number of pairs of vertical first baffles in a circumferential array mode, and a second baffle is arranged between each pair of first baffles; the connecting column is rotationally connected to a rotating shaft, the top of the rotating shaft penetrates out of the top of the connecting column, and the connecting column is driven by a rotating mechanism to rotate; the two pushing ends of the two-way pushing mechanism are connected with the two pushing plates correspondingly, and the top of the two-way pushing mechanism is connected with the telescopic end of a lifting mechanism; the conveying belt is arranged on one side of the circular bottom plate, and the conveying direction of the conveying belt is parallel to the diameter of the circular bottom plate; the horizontal linear mechanisms are arranged below the circular bottom plate at intervals, and the movable ends are connected with the bottom of the rotating shaft. The device can automatically convey the lead frame material boxes to the material box bearing areas of a plurality of core bonding devices in the core bonding process, and the core bonding and feeding efficiency is improved.

The invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method. The adjustable electrolysis device comprises an electroplating mold, and the electroplating mold comprises an outer cylinder and an inner cylinder arranged in the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet communicated with the outer outlet through a channel. According to the method, the internal cylinder and external cylinder structures of the electroplating mold are determined, so that the uniformity of the local coating film thickness of a semiconductor electronic element and the accuracy of a plating area can be quickly obtained, and the requirement of a high-end semiconductor lead frame in the metal coating electroplating process can be met; and the requirement for the screening accuracy of the optimal condition of the selective adjustable electroplating mold is met. The invention further provides an electroplating mold combination of a disposable adjustable electrolysis device as an update, and a rapid and accurate electroplating method for local plating areas of various semiconductor electronic elements is realized through the adjustable function of the through opening width of a cylinder in the electroplating mold.

The present disclosure relates to package, manufacturing method, and electrical system. The package comprises: a mounting substrate with at least one power die having a power device and attached to a first surface of the mounting substrate; and a lead frame comprising a first die attachment portion and at least one first lead, wherein at least one cooperation device die having a cooperation device for cooperating with the power device is attached to the first die attachment portion, and wherein during a normal operation an amount of heat generated by the cooperation device is less than an amount of heat generated by the power device, wherein the at least one first lead is coupled to the first surface of the mounting substrate to be electrically coupled to the power die.

A semiconductor device is provided. The semiconductor device includes a leadframe having a plurality of leads. A first lead of the plurality of leads has a lead pad formed between a distal portion and a proximal portion of the first lead. A semiconductor die includes a plurality of bond pads located at an active side. Each bond pad of the plurality is connected to a respective lead of the plurality of leads. An encapsulant encapsulates the semiconductor die and at least a portion of the leadframe. A distal portion of each lead is exposed through the encapsulant at a first major side. The lead pad is exposed through the encapsulant at a second major side opposite of the first major side.

The invention belongs to the technical field of semiconductors, and discloses a semiconductor circuit, the semiconductor circuit comprises a substrate, an insulating layer, a chip function layer and a packaging body, two sides of the substrate are respectively provided with a plurality of first installation parts, one surface of the substrate is used as an arrangement surface, and the insulating layer is arranged on the arrangement surface; the external pin is connected with the extension end of the first installation part, and the external pin is electrically connected with the first installation part. According to the semiconductor circuit disclosed by the invention, through the design of the first mounting part extending out of the packaging body and the external pin, the external pin can be mounted after the semiconductor circuit is packaged; even if the ejector pin is adopted for pressing to prevent glue overflow, the condition that stress between the substrate and the pins causes cracks on the insulating layer is avoided. In addition, the external pins can be installed after being independently formed, the lead frame does not need to be introduced in a mode of being matched with rib cutting forming, the equipment and production cost can be reduced, and the production efficiency is improved.

Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead frame therebetween, where the RDL comprises a plurality of terminals, and where one or more of the plurality of pads are wire bonded to a corresponding one or more of the plurality of terminals.

Provided are a semiconductor device package and / or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.

A method for manufacturing a semiconductor device (10), comprising: - a resin preparation step (S1) - for providing a tappet plate (32) in a hole (30a) formed in a recessed part (30A) of a lower mold (30), - for providing a first resin (20a) on the tappet plate (32), and - for providing a second resin (22a) having a lower thermal conductivity than the first resin (20a) on the first resin (20a); - a mounting step (S2) for placing a lead frame (12) on an upper surface of which a semiconductor chip (14) is mounted on an upper surface of the recessed part (30A); - a mold clamping step (S3) for placing an upper mold (40) on the lower mold (30), and for performing mold clamping in a state in which the semiconductor chip (14) is housed in a cavity formed by the lower mold (30) and the upper mold (40); - an injection step (S4) for lifting the plunger plate (32) after the first resin (20) and the second resin (22) have been melted to provide the second resin (22) in the cavity, and by subsequently introducing the first resin (20), the first resin (20) is brought into contact with a lower surface of the lead frame (12); and - a pressure maintaining step (S5, S7) for exerting a pressure on the first resin (20) and the second resin (22) through the plunger plate (32), and for maintaining the pressure.

The invention discloses a double-pressing-wheel film pressing device for a copper strip of a lead frame, and relates to the technical field of lead frame film pressing, and the double-pressing-wheel film pressing device comprises two groups of hot pressing wheels which are used for carrying out hot pressing lamination on the copper strip and a film; the winding equipment is used for winding the copper strip subjected to film pressing; the two scraping mechanisms are arranged between the hot pressing wheel and the winding equipment and are symmetrical up and down; the scraping mechanism comprises two horizontally-arranged pressing rollers and a driving assembly, wherein the driving assembly drives the pressing rollers to move in a reciprocating mode in the direction perpendicular to the copper strip conveying direction. And the lifting control part is used for realizing alternate lifting of the compression rollers through cooperation of the guide grooves and the guide wheels. The problems that in the prior art, in the lead frame copper strip film pressing process, gas cannot be completely exhausted, bubbles are formed, and then electric conduction is affected are solved. The device has the advantages that by arranging the scraping device, bubbles are removed through the scraping device after film pressing is completed, and the like.

The utility model discloses a packaging structure of a quasi-monolithic power multiplication amplifier. The packaging structure comprises a frame base island, the lead frame is arranged on the periphery of the frame base island; the four tube core chips are respectively bonded on the front face of the frame base island through bonding materials, two of the tube core chips are connected through a lead to form a common-gate amplification structure, the other two tube core chips are connected through a lead to form a common-source amplification structure, and the four tube core chips are further connected with the lead frame through leads. The four tube core chips jointly form an amplifying circuit of a push-pull structure; and the frame base island, the lead frame, the four tube core chips and the leads are coated with the plastic package material to form a whole through plastic package. The heat dissipation of the power amplifier is facilitated.

A method of manufacturing a semiconductor die package is provided. The method includes providing a lead frame having a substructure and at least one tie bar, the substructure including a terminal forming portion in electrical communication with the at least one tie bar. The method includes bonding a die to the substructure. The method includes encapsulating the substructure and the die within an encapsulation layer. The method includes performing a first cut through the terminal forming portion and the encapsulation layer to form side terminals while maintaining all tie bars substantially intact. The method includes electroplating the side terminal. The method includes performing a second cut through the tie bar and the encapsulation layer to singulate a semiconductor die package from the lead frame.

The invention provides a QFN lead frame, a preparation method thereof and a QFN packaging structure, in the QFN lead frame, planar pins are arranged at four corners of the front surface of a frame unit, empennage pins are bent to be perpendicular to the front surface of the frame unit, and the planar pins and the empennage pins form a semi-surrounding structure for each corner of the frame unit. According to the QFN lead frame disclosed by the invention, the stress is dispersed through the semi-surrounding structure, and the cracking and collapse risks are reduced. The planar pin also provides an additional solderable surface, so that the molten solder is easier to wet and attach, and the risk of pseudo soldering or refusing soldering is reduced. According to the QFN packaging structure, by using the QFN lead frame with the semi-surrounding structure on the periphery, the packaging structural strength is enhanced, the packaging four-corner structure is effectively prevented from being broken, and the overall stability of the packaging structure is improved. Because the plane pin and the empennage pin are not wrapped by the molding compound, the QFN packaging structure can dissipate heat through the plane pin and the empennage pin.

The invention relates to the technical field of design and manufacturing of precision dies, in particular to a design method for a progressive die of an LQFP144pin high-precision lead frame. The method comprises the following steps that firstly, a material lifting part lifts materials; 2, lettering; 3, punching base island pocking marks; 4, punching a guide nail positioning hole and a round hole; 5, positioning the guide nail; 6, punching an outer pin; 7, punching an inner pin; 8, correcting the plane of the inner pin; 9, punching a stress groove; tenthly, the base island is cut; eleventhly, edge cutting is conducted; 12, inner pin coining is carried out; (13) adjusting the flatness of the pins; fourteenthly, the flatness of the base island is adjusted; fifteenthly, adjusting the transverse bend of the lead frame; sixteenthly, the step pitch of the lead frame is adjusted. Through a series of layout station optimization, the pin deviation phenomenon caused by accumulated step pitch in the blanking process can be reduced, stress release of materials is better facilitated, and the risk of product deformation is fully reduced.

A stacked I / O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and / or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I / O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

The invention discloses a lead frame packaging structure and a packaging method thereof, and relates to the technical field of semiconductors, the lead frame packaging structure comprises a base island and a plurality of pin bodies arranged along the peripheral side of the base island, a first chip is mounted on the top surface of the base island, the first chip is connected with the pin bodies, and the first chip is connected with the pin bodies. An open slot is formed in the end part of the pin body so as to divide the end part of the pin body into a first pin and a second pin which are arranged at an interval along the mounting direction, the first pin is suspended, the second pin is bent towards one side far away from the first pin, and the second pin is used for being connected with a circuit board. According to the lead frame packaging structure and the packaging method thereof, the heat dissipation effect can be improved through the first pin, so that the reliability of connection between the second pin and the circuit board is ensured.

The invention provides lead frame cleaning equipment which comprises a material taking table and further comprises a cleaning cabinet on one side of the material taking table, a transverse plate is arranged in the cleaning cabinet, a material taking mechanism is arranged on the material taking table, and a conveying mechanism, a wind power mechanism and an adsorption mechanism are arranged in the cleaning cabinet. An electric pulse signal is converted into mechanical motion through the stepping single machine to drive a compression part in the compression base to vibrate rapidly so as to generate high-speed airflow, the airflow enters the ion air knife through the compression air outlet, the ion air knife generates positive and negative ions through high-voltage ionization, and ions are conveyed to a target area through the high-speed airflow. Static electricity and dust of the square frame body moving to the position below the ion air knife are eliminated through the static electricity neutralization effect, air in the negative pressure box and the negative pressure hopper is pumped out through the air pump so that negative pressure can be generated, negative pressure openings are formed in the upper portion and the two sides of the conveying belt, and therefore dust collection can be conducted on the upper portion and the lower portion of the frame body and the two sides of the conveying belt, and the cleaning effect is improved.

The invention relates to the technical field of lead frame folding, in particular to a folding transfer device for lead frame production, which comprises a first conveying assembly positioned at the discharge end of a lead frame, working platforms positioned on the two sides of the first conveying assembly and a second conveying assembly positioned below the working platforms, and clamping blocks are mounted on the working platforms on the two sides through electric push rods; an intercepting assembly used for intercepting the lead frame is installed on one side of the clamping block and comprises a telescopic intercepting plate, and a plurality of receding grooves are formed in the telescopic intercepting plate. In the upward sliding process of the longitudinal stacking assembly, the synchronous pushing blocks on the two sides extrude the longitudinal racks at the same time, so that the multiple inclined racks are synchronously shrunk into the clamping blocks, the lead frame falls into the position above the guide supporting blocks, it is ensured that the supporting end faces on the two sides can release the lead frame at the same time, and the lead frame can synchronously fall off; and the condition of stacking failure caused by first inclination of one side due to asynchronous release in the falling process is avoided.

The invention provides a copper alloy plate strip for a multi-component synergistically strengthened lead frame and a preparation method of the copper alloy plate strip, and relates to the technical field of alloys. The copper alloy plate strip for the multi-component synergistically strengthened lead frame comprises the following components in percentage by mass: 0.9-3.0% of Ni; 0.3% to 1.3% of Si; 0.06% to 0.18% of Mg; 0.5% to 1.5% of Co; 0.02% to 0.1% of Ti; 0.05%-0.15% of Y, and the balance copper and inevitable impurities. The prepared copper alloy plate strip has excellent mechanical performance and conductivity, the tensile strength sigma b is larger than or equal to 850 Mpa, the conductivity is larger than or equal to 48% IACS, and the yield strength sigma 0.2 is larger than or equal to 750 MPa. The preparation method is simple in process and low in operation difficulty, and has a wide market application prospect.

Packaged electronic device with integrated antenna and locking structure. A packaged electronic device includes an integrated antenna as part of a conductive lead frame. The conductive lead frame includes a die pad having an elongated conductive beam structure configured as a transmission line; and a ground plane structure disposed around the die pad. The ground plane includes a gap in which the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the lead frame are configured with conductive connection structures to function as ground pins, feed pins and / or waveguides. In an alternative embodiment, a portion of the integrated antenna is embedded within the body of the packaged electronic device and is partially exposed.

A broadband filter plate type tantalum capacitor comprises a lead frame, a tantalum core and a ceramic capacitor, a positive electrode and a negative electrode of the tantalum core are connected with a positive electrode frame and a negative electrode frame of the lead frame respectively, the positive electrode frame and the negative electrode frame are connected through the ceramic capacitor, and the tantalum core and the ceramic capacitor are of a parallel structure. According to the utility model, through the design of the lead frame and the parallel combination mode of the ceramic capacitor and the tantalum capacitor, the volume efficiency maximization of the tantalum capacitor and the volume maximization of the tantalum core are realized, the reliability and the stability of the tantalum capacitor are improved, the use is simple, and the effect is obvious.

The utility model provides a lead frame, a packaging structure and an intelligent power module. The lead frame comprises at least two exposed base islands, at least one built-in base island, at least two first type pins and a plurality of second type pins; each exposed base island is partially exposed out of the plastic package body, and the plastic package body completely wraps the built-in base island; one first type pin is connected with one exposed base island, and the second type pin is separated from the exposed base island; wherein the width of the first type of pins is greater than that of the second type of pins, and the at least two first type of pins extend out of the same side of the plastic package body, so that a chip mounted on the exposed base island can dissipate heat by utilizing the wide pins and the exposed base island, and the heat dissipation effect can be improved; and the wide pins are positioned on the same side, so that the problem of high wiring difficulty of a substrate connected with the lead frame can be solved. The packaging structure comprises the lead frame. The intelligent power module comprises the packaging structure.