1192results about "Fluid pressure measurement by electric/magnetic elements" patented technology

The invention discloses a temperature and pressure sensor for a new energy automobile, and belongs to the technical field of sensor equipment, the temperature and pressure sensor comprises a plug assembly, a shell and a protective sleeve, a support seat, a circuit board, a temperature sensing probe and a pressure sensing element are arranged in the shell, the protective sleeve is arranged at the lower waist part of the support seat, and the temperature sensing probe is located in the protective sleeve and is in electric signal connection with the circuit board; a square groove for containing the pressure sensing element and the circuit board is formed in the top of the support base, the pressure sensing element is arranged at the bottom of the circuit board and is in electric signal connection with the circuit board, and a pressure transmission channel is further arranged in the shell. The pressure transmission channel comprises a gap part defined by a protective sleeve and a shell and a special-shaped channel formed in the support base, a circular pressure groove is formed in the square groove, the circular pressure groove is matched with the pressure sensing element to form a pressure cavity which is eccentrically designed relative to the shell in the axial direction, and the special-shaped channel is formed in a medium leading-in area. Therefore, the medium entering surface area can be increased through the eccentric design, and the response speed of medium pressure measurement is ensured.

A system may include an array of sensor elements, the array of sensor elements each comprising a first type of passive reactive element, a second type of passive reactive element electrically coupled to the array of sensor elements, a driver configured to drive the array of sensor elements and the second type of passive reactive element, and control circuitry configured to control enabling and disabling of individual sensor elements of the array of sensor elements to ensure no more than one of the array of sensor elements is enabled at a time such that when one of the array of sensor elements is enabled, the one of the array of sensor elements and the second type of passive reactive element together operate as a resonant sensor.

In order to mechanically monitor a gas density of a greenhouse gas in a more climate-friendly and cost-effective manner, the invention provides a density monitoring method for monitoring the gas density of a noxious gas (10), comprising: a) providing a closed reference volume (26) with a partition wall (28) movably disposed between the reference volume (26) and the noxious gas (10) to be monitored, b) providing a reference gas (56) which has a lower global warming potential relative to the noxious gas (10) by at least a factor of two in the reference volume (26) at a reference gas pressure which is higher than the filling pressure of the noxious gas (10), c) compensating, by means of a spring device (32), for a force acting on the separation wall (28) due to the increased reference gas pressure in the reference volume (26), and d) detecting a deflection of the partition wall (28) for monitoring the gas density. A gas density monitor (14), its use in such a method and an electrical system provided therewith are also proposed.

A microelectromechanical sensor includes a supporting body, a sensing structure including a measuring chamber and a sensitive element, the sensitive element being partially in the supporting body and facing the measuring chamber; and a cap coupled to the supporting body. The cap includes a buried cavity, inlet holes communicating with the environment external to the sensor and with the buried cavity, and coupling holes communicating with the measuring chamber and with the buried cavity. The inlet holes is in fluidic communication with the coupling holes by the buried cavity, and the inlet holes are offset with respect to the coupling holes.

A demodulation system for optical fiber Fabry-Perot sensor, including: a light source; a Fabry-Perot sensor; a coupler; a first optical component configured to shape interference light into a linear first interference fringe pattern; a second optical assembly configured to form a second interference fringe pattern; a first detector configured to receive a first light signal to form a first light signal curve; a second detector configured to receive a second light signal to form a second light signal curve; a data collection device configured to receive the first light signal curve from the first detector to generate a first light intensity curve, and receive the second light signal curve from the second detector to generate a second light intensity curve; and a processor configured to calculate a cavity length variation of the Fabry-Perot sensor on the basis of the first light intensity curve and the second light intensity curve.

The invention discloses a miniaturized superhigh-temperature water-cooled high-temperature pressure sensor, which belongs to the technical field of pressure sensors and comprises a lead column, a shell, a conduction beam, a ceramic circuit board and a pressure-sensitive unit, and the conduction beam, the ceramic circuit board and the pressure-sensitive unit are arranged in the shell. The shell comprises a pressure sensing metal diaphragm, a threaded base, a protective sleeve and a packaging bottom cover which are fixedly connected in sequence; the pressure sensitive beam comprises a conduction beam base, the two sides of the conduction beam base are fixedly connected with a supporting beam base through beam island structures, pressure sensitive units are arranged on the beam island structures, and a supporting beam is fixedly connected with a threaded base. The pressure sensing metal diaphragm is fixedly connected with the conduction beam base through the conduction beam; the voltage-sensitive unit is electrically connected with the ceramic circuit board; the lead columns penetrate through the packaging bottom cover and the ceramic circuit board and are fixedly connected with the ceramic circuit board. The temperature tolerance of the pressure sensor is improved, and the defects that a high-temperature pressure sensor is poor in anti-interference capacity, low in response frequency, low in measurement sensitivity and the like are overcome.

Dual loop strain gauge architectures (or other multiple loop strain gauge architectures) are used to sense an amount of force applied to an electronic device. The force may be applied by a transverse, uneven pressure field, such as a force that is applied by an amorphous object and / or a force that is applied non-uniformly, over a large area and / or to multiple points or areas. In some embodiments, a dual loop (or other multiple loop) strain gauge architecture is used to sense a pressure distribution on an electronic device. In some embodiments, a single loop strain gauge architecture is used to sense an amount of force applied to an electronic device.

A flexible plant sensor comprising at least one sensor or an array of sensors that are capable of continuous in situ measurement without the use of bioagents and a method of using and making the plant sensor. The plant sensor includes a flexible polymer substrate and one or more sensors disposed on the substrate. The plant sensor includes real time measurement and multipara-metric-correction capabilities.

Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

The invention discloses a linear beam double-island structure high-pressure pressure sensor chip with stress holes and a preparation method. The linear beam double-island structure high-pressure pressure sensor chip comprises a supporting layer, an insulating layer and a device layer which are arranged from bottom to top, a cavity is etched on the back of the supporting layer, a sensitive film is arranged right above the cavity, and a linear beam double-island structure is arranged on the sensitive film; the edge and the center of the straight beam double-island structure are respectively provided with four piezoresistor strips, the four piezoresistor strips are connected into a semi-open-loop Wheatstone bridge through five P-type heavily-doped silicon leads, five metal point electrodes are arranged at the center of the five P-type heavily-doped silicon lead areas, sealing rings are arranged on the outer sides of the peripheries of the five metal point electrodes, and the metal point electrodes are connected with the metal point electrodes through the P-type heavily-doped silicon leads. The adjacent P-type heavily-doped silicon leads and the sealing rings are separated by fine slits; according to the invention, the pressure bearing limit is effectively improved, the high range is ensured, excellent sensitivity and linearity performance are realized, the high pressure measuring capability of dozens of to hundreds of MPa is realized, the tolerable temperature is up to 400 DEG C, and the sensor is widely applied to the fields of petroleum, natural gas, chemical engineering, high-pressure equipment monitoring and the like.

Systems and methods for calibrating deformable sensors are disclosed. In one embodiment, a method of calibrating a deformable sensor includes capturing image data of the deformable sensor using an external image sensor, wherein the deformable sensor comprises a deformable membrane defining an enclosure that is configured to be filled with a medium. The method further includes comparing the image data of the deformable sensor to a metric. When the image data does not satisfy the metric, the method includes adjusting a pressure within the enclosure.

The invention relates to the field of pressure sensors, in particular to a triboelectric pressure sensor and a sleep monitoring method and system. The triboelectric pressure sensor comprises a positive friction layer, a negative friction layer, a deformation electrode connected to the negative friction layer and a flexible electrode connected to the positive friction layer. The contact ends of the tips of the multiple micro-cone structures of the positive friction layer all face the negative friction layer, and gaps are formed between the contact ends and the negative friction layer. The Young modulus of the negative friction layer is smaller than that of the micro-cone structure, so that when the negative friction layer approaches the deformed electrode, the negative friction layer sinks and makes contact with the side face of the micro-cone structure. The change amplitude of the contact surface along with the pressure is large, so that the sensitivity of the sensor is improved. Respiration and pulse frequencies are respectively detected by a triboelectric pressure sensor to obtain electric signals, the electric signals are segmented and enhanced into waves, then the waves are classified by a big data method, a learning model for identifying sleep state categories corresponding to the waves is obtained, the categories are further rapidly and accurately identified, and an alarm is given according to the number of abnormal times. The method and the system have high reliability.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).

A pressure sensor structure includes a sensor body including a diaphragm plate that functions as a sense electrode, a base electrode that faces the diaphragm plate, and a sidewall layer maintaining a gap between the diaphragm plate and the base electrode, and a conductive guard substrate to support the sensor body. The sidewall layer includes a guard electrode layer and upper and lower electrically insulating layers to electrically insulate the guard electrode layer. An electrically insulating layer is between the guard substrate and the sensor body to electrically insulate the guard substrate. The guard substrate is electrically connected to the guard electrode layer to function as a guard electrode together with the guard electrode layer.

The invention discloses a quick response capability detection device for a high-precision electromagnetic valve, and relates to the technical field of electromagnetic valve detection, the quick response capability detection device comprises a positioning frame and a transmission table, a sliding rod arranged on the positioning frame is sleeved with the transmission table in a sliding connection mode, and valve body positioning tools are fixed to the side wall of the transmission table at equal intervals through bolts; the miniature optical fiber sensing module and the high-frequency response pressure sensor are integrated, synchronous measurement of valve element displacement and outlet pressure is achieved, the limitation of single parameter measurement is overcome, meanwhile, the miniature optical fiber probe is adopted for detecting the valve element displacement through the miniature mounting hole in the valve body, the influence on valve element movement is reduced, and the measurement precision is improved. The problem that the structure of the electromagnetic valve needs to be greatly changed in a traditional direct detection method is avoided, the drift diameter of a flow channel is adjusted through rotation of a layer sleeve block in the phase change regulation and control mechanism in the initial detection stage, multi-working-condition simulation from low-pressure large flow to high-pressure small flow is achieved, and the detection condition is closer to the actual working environment of the electromagnetic valve.

MEMS pressure transducer (1) including: a semiconductor body (2); a lower dielectric region (4,6), arranged above the semiconductor body (2); a fixed electrode region (12) and a lower anchoring region (14), which are formed by conductive material, are arranged on the lower dielectric region (4,6) and are laterally separated from each other; a membrane (55) of conductive material, which is suspended above the fixed electrode region (12), so as to delimit a cavity (39) upwardly, the fixed electrode region (12) facing the cavity, the membrane (55) being deformable as a function of pressure and forming a variable capacitor together with the fixed electrode region (12); and an upper anchoring region (37") of conductive material, which laterally delimits the cavity (39) and is interposed, in direct contact, between the membrane (55) and the lower anchoring region (14).

An integrated temperature and pressure sensor, relating to the technical field of sensors. The integrated sensor comprises: a connecting member (1); a metal tube (2) having a cavity (21), wherein an open end of the cavity (21) of the metal tube (2) is connected to the connecting member (1), and the other end of the metal tube (2) away from the open end of the cavity (21) is provided with a first channel (22) and a second channel (23); a carrier member (4) having an accommodating cavity (41), wherein the carrier member (4) is arranged in the cavity (21), and the bottom of the carrier member (4) is provided with a third channel (43) communicated with the second channel (23); a protective tube (3), wherein the protective tube (3) has one end located in the first channel (22) and the other end extending out of the first channel (22); a temperature sensing member (5) disposed in the protective tube (3); a pressure sensing member (6) disposed in the accommodating cavity (41), wherein the pressure sensing member (6) is located on the third channel (43); and a circuit board (7).

The invention provides a resonant pressure sensor with adjustable measuring range and sensitivity, and relates to the technical field of sensors, and the resonant pressure sensor comprises a pressure sensitive film which is used for detecting external pressure; the resonator layer comprises a double-end clamped resonant beam, the double-end clamped resonant beam is arranged above the pressure sensitive film, a movable part of the double-end clamped resonant beam is suspended, one side of the double-end clamped resonant beam is provided with two driving electrodes for applying an alternating current driving signal and a parameter pumping alternating current signal respectively, and the other side of the double-end clamped resonant beam is provided with two detection electrodes; the silicon sealing cover layer is provided with a resonant cavity, and the resonant cavity is located above the pressure sensitive film and the double-end clamped resonant beam and used for providing a deformation space for the pressure sensitive film and providing a vibration space for the double-end clamped resonant beam; in the first working mode, the first-order mode of the resonant beam is split into two amplitude peak values by applying a parameter pumping alternating current signal, and the sensitivity of the output amplitude ratio is adjusted by adjusting the amplitude of the parameter pumping alternating current signal; the measurement range is adjusted by adjusting the frequency of the parameter pumping alternating current signal.

Apparatus and associated methods relate to measuring pressure of an external environment using a graded index (GRIN) lens and first and second Fabry-Perot interferometers, each axially aligned with one another. The GRIN lens collimates a beam diverging from a face of an optical fiber so as to direct the collimated beam to the first and second Fabry-Perot interferometers. The first Fabry-Perot interferometer is pressure isolated from the external environment but not temperature isolated. Therefore, the resonant frequency of the first Fabry-Perot interferometer is indicative of temperature. The second Fabry-Perot interferometer has a cavity that changes dimension in response to changes in pressure and temperature of the external atmosphere. The second Fabry-Perot interferometers has a second resonant frequency that is not integer multiple of the first resonant frequency. Pressure is determined based on the first and second resonant frequencies.

The invention relates to the technical field of flexible sensors, in particular to a wireless passive multi-mode flexible LC sensor and a manufacturing method and application thereof. The invention provides a wireless passive multi-mode flexible LC sensor. The wireless passive multi-mode flexible LC sensor comprises a flexible substrate, an LC resonant sensing array arranged on the surface of the flexible substrate and a reading coil used for multi-mode signal wireless receiving. Wherein the LC resonant sensing array comprises LC resonant humidity, gas and pressure sensing units which can work independently; and the capacitive humidity, gas and pressure sensitive layers are respectively arranged on the capacitive end interdigital electrode of each sensing unit. The sensor provided by the invention is based on the LC resonant sensing array, can realize multi-channel signal synchronous detection and decoupling of pressure, humidity and gas, has the characteristics of no external power supply, wireless data transmission, ultrahigh sensitivity and multi-parameter independent identification, remarkably improves the sensing capability of wearable equipment in a complex environment, and is suitable for popularization and application. The method has high sensitivity and good repeatability.

A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor and a resistor lead on the first base substrate; a second base substrate on a side of the piezoresistor and the resistor lead away from the first base substrate; a metal wire bond extending through the second base substrate and connected to the resistor lead; a redistribution layer on a side of the second base substrate away from the first base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber. The metal wire bond is connected to the resistor lead, and is connected to the redistribution layer. The resistor lead is connected to the piezoresistor.

The invention provides a sensor and an electronic device, the sensor comprises a substrate and a housing covering the substrate, the substrate and the housing enclose to form an accommodating cavity, the accommodating cavity is internally provided with a vibration assembly, an MEMS chip and an integrated chip assembly, the MEMS chip and the integrated chip assembly are in signal connection, and the integrated chip assembly is in signal connection with the substrate; the MEMS chip is installed on the substrate, the MEMS chip and the substrate define a rear cavity, the vibration assembly comprises a supporting piece and a sensing film installed on the supporting piece, the supporting piece is installed on the substrate, the supporting piece, the sensing film and the substrate define a vibration cavity, a channel is formed in the substrate, and the two ends of the channel are communicated with the rear cavity and the vibration cavity respectively. According to the sensor, the MEMS chip and the vibration assembly can be horizontally arranged on the substrate, and compared with the mode that the MEMS chip and the vibration assembly are stacked in the vertical direction, the height of the sensor is reduced, and the light and thin design is achieved.

The invention provides a resonant pressure sensor digital measurement and control circuit, which comprises a sensor core body, a first chip unit, a second chip unit, a third chip unit and a fourth chip unit, and is characterized in that the first chip unit comprises an automatic gain control module AGC, a phase-locked loop control module PLL, an SPI and an I2S, the AGC comprises an amplitude resolving module, a controller 1 and an amplitude control switch S2 which are connected in sequence; the PLL comprises a phase resolving module, a controller 2, a phase control switch S1 and a DDS which are connected in sequence; the sensor core body is respectively connected with the second chip unit and the third chip unit, the first chip unit runs embedded control software to realize sweep frequency control and AGC (Automatic Gain Control) phase-locked driving control on the core body, a control signal is obtained through digital operation, and the first chip unit controls the third chip unit to generate an analog signal as the input of the sensor core body. According to the scheme, the locking and output of the resonant frequency are realized.

The invention discloses a flexible substrate material doped with a two-dimensional material and a preparation method of a sensor of the flexible substrate material, and belongs to the technical field of array sensors. The electrode material comprises a two-dimensional material substrate, a composite doping atom layer and an insulation isolation layer, high-density defect sites are formed through H2 plasma processing, uniform distribution of doping atoms is achieved in combination with atomic layer deposition, and an electrode and a temperature-sensitive layer are precisely integrated through the self-alignment photoetching technology. According to the scheme, the electronic structure of the two-dimensional material is optimized through the composite doping synergistic effect, the multi-layer heterojunction design and the high-precision preparation process are combined, the response capacity of the electrode to weak pressure signals is remarkably improved, and high resolution and stability of the sensor in pressure and temperature detection are achieved. The method has a wide application prospect in the fields of wearable equipment, medical monitoring, robot tactile perception and the like.

The present invention provides a compensation method for a silicon resonant pressure sensor, which relates to the technical field of pressure measurement and includes: collecting the frequency signal timing output by the silicon resonant pressure sensor and analyzing to obtain the real-time pressure value; obtaining a predetermined compensation item, collecting multi-dimensional compensation features, and obtaining multi-dimensional compensation information; traversing and screening a historical compensation database with the multi-dimensional compensation information as a screening constraint to obtain a target sensor; normalizing and comparing the pressure value deviation obtained from the detected pressure value of the target sensor and a preset pressure value to obtain a multi-dimensional compensation coefficient; performing compensation adjustment to obtain an effective pressure value. The present invention solves the technical problem that most of the existing compensation methods only adjust for a single influencing factor, ignoring the comprehensive influence of multi-dimensional factors, resulting in the inability to effectively cope with multiple error sources under complex environmental conditions, and further leading to insufficient accuracy and reliability of the silicon resonant pressure sensor.

Methods and apparatuses for discriminating between user blowing and drawing (sucking) in an electronic vaporization device. Described herein are electronic aerosol devices and methods of controlling or operating them which can accurately differentiate between blowing and drawing (sucking) through the mouthpiece and adjust the control of the vaporizer accordingly.

The invention relates to a method for offset compensation (22) of a signal offset (42) in a measurement signal (26) of a pressure sensor (10), comprising the steps of providing (24) the pressure sensor (10), which provides the measurement signal (26) as a function of a deflection of the sensor element (12) that is dependent on a pressure at the pressure sensor (10) and which has an insulating mass (18) on the sensor element (12) for protection against environmental influences, detecting (28) a total acceleration (30) acting on the pressure sensor (10), comprising a gravitational acceleration component (32) and / or an acceleration (33), accessing calculation parameters (35) stored in a memory unit (34),Calculating (36) an offset pressure (38) acting on the sensor element (12) at least via the mass of the insulating compound (18) and the total acceleration (30) acting thereon, depending on at least one of the calculation parameters (35) and the total acceleration (30), and compensating (40) at least the signal offset (42) corresponding to the calculated offset pressure (38) in the measurement signal (26). Furthermore, the invention relates to a method for operating (58) a pressure sensor (10) and a pressure sensor (10).

A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor on the first base substrate; a second base substrate on a side of the piezoresistor away from the first base substrate; a metal wire bond extending through the second base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber.