Disclosed herein is a method and apparatus for manufacturing an electronic device, which is intended to economically manufacture an electronic circuit device, such as an IC chip, using functional ink and a roll-to-roll rotary pressing process. The method includes a first step of injecting functional ink into a forming groove of a forming roll, a second step of removing ink covering a surface of the forming roll, a third step of drying a surface of the functional ink injected into the forming groove, a fourth step of transferring the dried surface of the functional ink to a printing roll, a fifth step of drying another surface of the functional ink transferred to the printing roll, a sixth step of transferring the functional ink from the printing roll to flexible printing paper which is unwound from a winding roll, and a seventh step of winding the printing paper, on which an electronic circuit is printed, around a rewinding roll.