24459 results about "Chip" patented technology

The invention relates to the technical field of integrated circuit test and calibration, and discloses a chip test and calibration method and a chip tester. The chip test calibration method is applied to a chip test module and specifically comprises the following steps that S101, a starting signal sent by a user terminal is received, environment initialization operation is executed, and after initialization is completed, a system automatically enters a standby mode and waits for an external trigger signal or a user instruction; and S102, synchronously capturing input and output signal waveforms of the tested chip at a preset sampling frequency through a high-precision current sensor and a voltage sampling circuit. Through a dynamic parameter acquisition and real-time compensation technology, a voltage reference error is effectively reduced, the temperature control precision is superior to + / -0.3 DEG C, signal distortion caused by environmental interference is effectively inhibited, a multi-dimensional calibration model is combined with time domain, frequency domain and statistical characteristic analysis, nonlinear errors and system drift can be dynamically corrected, and the system performance is improved. And the attenuation error of a test signal transmission path is lower than 0.02 dB.

The invention relates to the field of chip verification, and provides a chip verification method, device and equipment, a medium and a chip. The method comprises the following steps: establishing a dynamic simulation verification environment of a to-be-verified design, and generating a plurality of test scenes and corresponding test excitation according to a design specification definition; sending the test excitation to a driver through a sequencer, converting the test excitation into a signal conforming to a to-be-verified design interface protocol by the driver, and transmitting the signal to the to-be-verified design; the monitor collects an input signal and an output signal of a to-be-verified design in real time, converts the input signal and the output signal into transactions, and transmits the transactions to the scoreboard; comparing the reference model with an output signal of the to-be-verified design to generate a dynamic simulation verification result; according to the dynamic simulation result, the state space is reduced, state space traversal is carried out on a design part which is not covered by dynamic simulation in the design to be verified, and a formal verification analysis result is generated; and evaluating the to-be-verified design according to the formal verification analysis result.

The invention relates to the technical field of semiconductors, and discloses a full-temperature-zone polynomial digital temperature compensation method and system based on an SOI chip, and the method comprises the steps: obtaining the temperature frequency data of a preset temperature zone of a target SOI chip, fitting a full-temperature-zone curve, extracting a critical point of the temperature zone, dividing a segmented compensation interval according to the critical point, and obtaining the temperature frequency data of the preset temperature zone of the target SOI chip; the method comprises the following steps: calculating frequency drift amounts under different voltages to construct a full-automatic test framework, acquiring an environment temperature parameter and an instantaneous temperature value by using the framework, analyzing a temperature compensation vector of a segmented compensation interval, further monitoring a signal frequency interval output by a chip, extracting a phase noise parameter, calculating a frequency offset error amount with a preset value, and calculating the frequency offset error amount. And analyzing an error source, optimizing a polynomial compensation order, and collecting temperature drift suppression data to generate a full temperature region compensation report. According to the invention, the performance stability of the chip in a complex environment can be improved.

The invention relates to the technical field of synchronization in data communication, and provides a PTP protocol-based chip-level hardware timestamp generation method and system, and the method comprises the steps: 1, receiving a synchronization message and a delay request message from a main clock, carrying out the evaluation of a physical layer signal, and recording a first hardware timestamp; 2, responding to the received delay request message, generating and sending a delay response message, acquiring bidirectional transmission delay data by exchanging the delay request and the delay response message, and calculating clock skew in combination with the first hardware timestamp and the bidirectional transmission delay data; 3, adjusting the local clock frequency according to the clock skew; 4, after the synchronization is completed, associating the second hardware timestamp with the corresponding data message, and storing the associated data in a buffer area in the chip; and 5, generating standardized timestamp information, and outputting the standardized timestamp information through a chip interface. And high-precision time synchronization and timestamp generation are realized.

The invention relates to the technical field of chip heat management, and discloses a chip heat distribution prediction modeling method and device, and the method comprises the steps: obtaining chip design information, carrying out the three-dimensional grid division through a pre-training transfer learning neural network, and constructing an electricity-heat-force multi-physics field coupling model; the method comprises the following steps: monitoring operation load data in real time, carrying out thermal simulation and generating a temperature distribution characteristic matrix, collecting data through a temperature sensor array, simulating thermal diffusion by using particle filtering and Bayesian inference, compressing and reconstructing the temperature distribution characteristic matrix by using a variational auto-encoder, generating a digital twinborn body, and optimizing a heat dissipation strategy by using deep reinforcement learning. The temperature control strategy is generated, the chip heat management precision is improved, the heat dissipation strategy is optimized, the performance and stability are improved, and the problem of insufficient prediction of temperature distribution in a traditional heat management scheme in the prior art is solved.

The invention relates to a water quality real-time detection system which comprises the following modules: a multi-source sensing module which is based on a multi-parameter sensing array, adopts a self-adaptive sampling strategy, realizes sensor time sequence synchronization through a state estimation algorithm, completes water body multi-dimensional parameter acquisition in combination with a micro-fluidic chip, generates a multi-modal sensing data set, and transmits the multi-modal sensing data set to a data processing module; the multi-source sensing module comprises a multi-source sensing sub-module, a signal conditioning sub-module, a time sequence synchronization sub-module and an anomaly capture sub-module. The method has the advantages that through the synergistic effect of the adaptive sampling strategy and the state estimation algorithm, the multi-sensor time sequence synchronization precision is remarkably improved, the phase deviation problem caused by traditional fixed frequency sampling is effectively eliminated, the sliding window polynomial fitting is combined with the wavelet threshold de-noising technology, and the multi-sensor time sequence synchronization precision is improved. High-frequency noise interference is greatly suppressed on the premise that effective components of the signals are reserved, and meanwhile, the abnormal value detection accuracy is improved through a dynamic threshold mechanism.

The invention relates to the technical field of chip development, and discloses a chip post-simulation verification acceleration method, system and device and a storage medium, and the method comprises the steps: collecting multi-dimensional data of a large-scale chip; collecting all module names of a given chip; establishing a mapping relation between a redundant module RTL and a corresponding gate-level netlist, ensuring that interfaces before and after replacement are completely consistent, and designing an automatic script identification and processing parameterization module; establishing a post-simulation verification environment, verifying the consistency of output responses before and after replacement, analyzing the time delay change of a key path, calculating the dynamic power consumption and static power consumption of each functional module before and after replacement, and generating a simulation verification result. According to the method, the hybrid simulation model is constructed, and part of the gate-level netlist irrelevant to the current simulation function is replaced with the RTL, so that the actual simulation scale of a chip is reduced, the problem of overlong simulation time after a large-scale integrated circuit is remarkably solved, and the simulation efficiency is effectively improved.

The invention discloses a clock tree synthesis method and related equipment, and the method comprises the steps: dividing a plurality of time sequence units which need to receive clock signals from a clock source into clustering clusters of different levels, and enabling the load capacitance of each clustering cluster of the same level to be balanced; according to a hierarchical sequence of clusters starting from the clock source, taking each cluster as a node of a clock tree, recursively constructing the clock tree, and inserting a target buffer at the position of each node for driving the corresponding node; analyzing the delay and offset of the constructed clock tree to obtain an analysis result; and if the analysis result indicates that the delay and offset of the clock tree do not meet the preset constraint condition, adjusting the clock tree until the adjusted delay and offset of the clock tree meet the preset constraint condition. According to the technical scheme, power consumption and offset can be effectively reduced, calculation efficiency and design reliability are improved, and the method is suitable for high-performance chip design under the advanced technology.

The invention provides a power management chip high-low side driving signal time sequence optimization method and system. The method comprises the following steps: acquiring temperature data of a power management chip under a switch switching transient working condition through an infrared thermal imaging technology, and synchronously acquiring three-dimensional temperature field distribution of junction temperatures on the surface and inside a packaging layer; based on the space continuity of a temperature field, extracting the temperature change characteristics of a power device area, converting the temperature gradient into Seebeck voltage by using a thermoelectric material embedded in a hot spot area, and constructing a dynamic thermoelectric feedback network; according to Seebeck voltage data, a coupling relation between hot carrier concentration and driving signal phase deviation is established, and disturbance of hot carrier mobility change on MOSFET switching delay is quantified; the rising / falling edge slope of the grid voltage is adjusted based on the coupling relation, the phase deviation caused by the hot carrier effect is eliminated through dynamic compensation, and the switching performance is optimized. The dynamic response precision of the power management chip is improved.

The invention discloses a chip surface defect visual detection method and system, and the method comprises the steps: carrying out the high-sensitivity imaging through the dynamic adaptation of a quantum imaging enhancement module to the surface reflectivity, and achieving the sparse efficient processing of a defect signal through the combination of event-driven vision and a pulse neural network; based on a risk thermodynamic diagram generated in real time, intelligently scheduling detection precision and speed resources, and utilizing multi-modal feature decoupling and a federal knowledge graph to accurately associate defects and process roots; the digital twinning module synchronously predicts a defect evolution path and drives online adjustment and optimization of process parameters, and meanwhile the dynamic compensation module corrects optical defocus in real time. According to the invention, full-detection coverage of nanoscale defects is realized, a defect transfer chain is actively blocked while the detection efficiency is improved, and the chip manufacturing yield and reliability are remarkably improved.

The invention provides a power chip packaging detection method and device, and the method comprises the steps: obtaining a structure image, an infrared thermal imaging frame sequence and a working electrical parameter data set of a target power chip after packaging, and carrying out the layering and regional peak analysis, so as to construct a morphology feature parameter set and a thermal anomaly feature set; inputting the morphology feature parameter set, the thermal anomaly feature set and the working electrical parameter data set into a preset defect identification model to obtain a chip packaging anomaly identification map; and performing hierarchical division and node aggregation on the chip packaging abnormity identification map to obtain a packaging defect type result. By constructing a multi-modal packaging detection system taking a structural image, an infrared thermal imaging frame sequence and a working electrical parameter data set as input, accurate identification of the power chip is realized, the accuracy of packaging defect detection is effectively improved, and the problems of low identification precision and information isolation of an existing detection method are improved.

The invention relates to the technical field of chip temperature control, and discloses a chip temperature regulation and control system and method, and the method comprises the steps: building a thermal field dynamic model, integrating real-time power consumption data and environment heat dissipation parameters, and generating a thermal resistance adjustment coefficient and a power consumption correction coefficient; establishing a temperature prediction network to perform multi-source temperature field prediction; a dynamic regulation and control strategy is set according to a prediction result, and heat dissipation control parameters are optimized to achieve thermal field balance control; and executing feedback calibration and model iteration. The system comprises a thermal field dynamic modeling module, a multi-source temperature field prediction module, a dynamic regulation and control strategy execution module, a feedback calibration module and an iteration module. The method can accurately predict the heat distribution of the chip, realizes real-time and intelligent temperature regulation and control, improves the performance and reliability of the chip, reduces the energy consumption, and has good adaptability and universality.

The invention relates to the technical field of artificial intelligence, can be applied to service scenes of pension service, financial science and technology, medical health and the like, and discloses a multi-level heterogeneous integrated chip task processing method, device, equipment and medium, and the method comprises the steps: constructing a multi-level heterogeneous integrated chip composed of a perception processing layer, an intelligent decision-making layer and a driving control layer, the layers are connected through a vertical interconnection structure; receiving multi-modal task data and extracting features to generate feature vectors; inputting the feature vector into a neuromorphic processing unit to determine a task decision result; converting the decision result into a driving signal to control an execution device; adjusting synaptic weights based on the feedback signal; and monitoring chip operation state parameters and dynamically adjusting processing frequency and structure parameters. By integrating multi-modal sensing, neuromorphic decision and a dynamic feedback mechanism, data sensing, decision and execution processing are completed in a chip, and the real-time performance and the calculation efficiency are improved by combining operation state monitoring and adjusting frequency and structure.

The invention provides a hybrid parallel and dynamic scheduling method of a hybrid expert model based on 3D near-memory processing. The method comprises the following steps: establishing a joint performance analysis model; performing off-line linear programming optimization expert distribution; performing Bayesian optimization on physical node mapping; performing online reasoning; carrying out online dynamic priority detection; and an expert pre-broadcast and communication-friendly lexical element distribution strategy with optimal efficiency is provided. According to the method, node balancing optimization is realized through offline linear programming, and the problem of load imbalance of 3D NMP calculation is remarkably improved; in combination with a Bayesian optimization mapping strategy of link balance, the communication speed-up ratio is increased, and NoC link congestion is reduced; a dynamic scheduling strategy adapts to dynamic changes of expert activation in real-time reasoning through calculation load prediction and a pre-broadcast mechanism. Through cooperation of the offline automatic hybrid parallel mapping algorithm and the online dynamic scheduling strategy, the calculation load and the communication overhead are effectively balanced, and the reasoning efficiency of the hybrid expert model MoE on the 3D near-memory processing architecture is remarkably improved.

The invention discloses a dynamic flow control method for a two-phase cold plate liquid cooling system based on multi-modal sensing, and relates to the technical field of equipment cooling. Comprising the following steps: S1, collecting liquid cooling monitoring data in real time, and performing data preprocessing; s2, judging the state risk of the cold plate, carrying out signal cross validation, and taking an abnormal regulation and control measure; s3, cooling liquid flow regulation and control are carried out, and the matching degree of flow regulation and control and chip thermal load is evaluated, so that flow regulation and control correction is carried out; and S4, constructing a big data modeling and simulation feedback platform, evaluating a flow regulation and control self-healing effect, optimizing each parameter and strategy, and carrying out self-learning evolution. The problems that an existing two-phase cold plate liquid cooling system generally only depends on a single temperature signal, lacks a multi-source redundancy check mechanism, has the problems of response lag, weak local reflection capacity, high risk during failure and the like, consequently, the cooling capacity distribution and adjustment precision is insufficient, and the actual requirement of a high-heat-density data center for heat dissipation is difficult to meet are solved.

The invention relates to the technical field of wireless communication, and provides a radio frequency power amplifier and a radio frequency chip, the radio frequency power amplifier comprises an input matching circuit, a first-stage amplifier, a first inter-stage matching circuit, a second-stage amplifier, a second inter-stage matching circuit, a third-stage amplifier and an output matching circuit which are electrically connected in sequence; the radio frequency power amplifier further comprises a control module, a direct current power supply module, a first bias circuit, a second bias circuit and a third bias circuit. The first biasing circuit comprises a power detection network and a switch control circuit; the first input end of the power detection network serves as the first input end of the first bias circuit, the second input end of the power detection network serves as the second input end of the first bias circuit, and the power detection network is used for receiving a radio frequency signal, converting the radio frequency signal into a control voltage in a detection mode and outputting the control voltage to the input end of the switch control circuit. The control switch controls connection or disconnection of the circuit. According to the invention, the robustness of power can be improved.

The present invention discloses an integrated circuit chip with an address code, a key, and a mechanical keyboard. The integrated circuit chip contains a programmable address code, integrates a magnetic induction circuit, a GRB magic color drive circuit, and includes a power pin, a ground pin, and a data pin. The power pins of n integrated circuit chips are connected in parallel to share a power network VCC, the ground pins are connected in parallel to share a ground network GND, and the data pins are connected in parallel to share a data line network DIO connected to an MCU, and data information is transmitted on the data line network DIO. Another integrated circuit chip with an address code only requires a power network VCC and a ground network GND, and data information is modulated and transmitted on the power network, which greatly saves wiring space, reduces the difficulty of PCB design, and exponentially reduces the number of electronic components. In addition, a variety of different customized code sending methods and working modes are provided, making its application simpler, more efficient, and more reliable.

The invention discloses an ultrasonic transducer characteristic parameter test system, which belongs to the technical field of ultrasonic detection and comprises an excitation signal generation module, an impedance matching adjustment module, a resonance characteristic extraction module, a signal acquisition and processing module, a temperature control loading module, a physical vibration isolation module and a frequency spectrum calibration module. The excitation signal generation module is combined with an off-chip frequency locking feedback loop through an on-chip oscillator to generate a multi-frequency-point sweep frequency pulse array, the multi-frequency-point sweep frequency pulse array is connected to the resonance characteristic extraction module after passing through the impedance matching adjustment module, the multi-frequency-point sweep frequency pulse array and the frequency spectrum calibration module construct a bidirectional feedback path and share harmonic node synchronous calibration logic, and coupling offset compensation is achieved; the frequency spectrum calibration module performs bidirectional real-time error correction on the excitation output frequency and the resonance input phase; and the transducer is arranged in the thermal convection temperature equalizing cabin of the temperature control loading module and is overlapped with the physical vibration isolation module. The method has the advantages that high-precision, low-interference and full-frequency-domain dynamic testing of characteristic parameters of the ultrasonic transducer is achieved, and testing stability is improved.

The invention relates to a chip surface defect detection method, system and equipment based on an improved YOLOv10 model and a medium. The method comprises the following steps: constructing a hierarchical detection model; inputting the chip surface image into a feature extraction network to obtain an initial feature map; embedding a coordinate attention module into a predetermined node of the feature fusion network, performing orthogonal direction convolutional coding on the initial feature map to generate a space attention weight, and outputting an enhanced feature map through weighted fusion; constructing a central point prediction branch in a middle layer of the feature extraction network, and outputting a defect thermodynamic diagram, a size parameter and category probability distribution in parallel based on the initial feature map; and inputting the enhanced feature map into a detection head, carrying out space alignment processing in combination with the defect thermodynamic diagram to generate a preliminary detection frame, and carrying out redundancy suppression processing to generate a detection result. According to the invention, the coordinate attention module and the central point prediction branch are introduced to carry out collaborative improvement on the YOLOv10 model, and the problem of pain points in chip surface defect identification is solved.

The invention relates to a stacking packaging method and system for AI-DSP mixed audio processing chips, and the method comprises the following steps: employing a first bonding machine to carry out the flip-chip bonding of an AI chip and a DSP chip, and obtaining a flip-chip bonding chip; the flip-chip bonding chips are interconnected, and an interconnected chip structure is obtained; vertically stacking the interconnected chip structures to obtain a stacked chip structure; packaging the stacked chip structure by adopting a second bonding machine to obtain a packaging body; according to the AI-DSP mixed audio processing chip and the packaging method thereof, the packaging body is subjected to heat dissipation treatment through the preset heat dissipation substrate, the packaged AI-DSP mixed audio processing chip is obtained, and the technical problems that in a traditional packaging scheme, an AI chip and a DSP chip generally adopt different process nodes and manufacturing processes, and thermal expansion coefficients are not matched and stress distribution is uneven during direct integration are solved.

The invention relates to the technical field of integrated circuits and computer networks, and particularly discloses a transmission control and intelligent scheduling system for an integrated chip, and the system sets a dual-mode decision and dynamic switching mechanism for each routing node. Calculating dynamic characteristic parameters including an instantaneous value, a first-order trend and a second-order acceleration; when the parameter is matched with a pre-stored abnormal feature set and the load exceeds a threshold value, the node is immediately atomized and switched to a predefined security scheduling strategy loaded from a shared storage area, and otherwise, the node generates a scheduling decision according to self-adaptive decision logic continuously optimized based on historical performance feedback; all the nodes carry out data packet forwarding control according to the current execution strategy; and the system also periodically realizes federated global knowledge evolution according to the quality evaluation result of the self-adaptive decision of each node.

The invention discloses a power grid material sampling inspection management method for realizing whole-course tracing based on intelligent sample sealing, and relates to the technical field of electric power material management and intelligent perception, and the method comprises the following steps: S1, an initialization stage: executing a sample sealing coding segmentation pre-configuration process, distributing independent numbered segments to each sample sealing terminal, and the central control module synchronizes the use state of the terminal code to realize distributed isolation of code generation. According to the invention, coding uniqueness is realized through segmented pre-configuration and global duplicate checking, identity information security is guaranteed by adopting chip one-time write protection and tamper-proof technologies, and sample packet switching and data counterfeiting are effectively prevented by combining automatic acquisition and multi-round consistency comparison. Abnormal recognition and closed-loop processing ensure that abnormal events are frozen in time and responsibility is traced, and irregular samples are prevented from flowing into subsequent links. The whole-process auditing and dynamic optimization enable the management process to be self-perfected, and the intelligence, standardization and reliability of sampling inspection of the power grid materials are remarkably improved.

The invention discloses an IGBT junction temperature real-time decoupling modeling method and system based on dynamic electric heating compensation, and relates to the technical field of state monitoring of power electronic devices. At present, junction temperature estimation is not accurate due to IGBT on-state voltage drop measurement distortion and chip internal thermal gradient in a high-voltage environment. The method comprises the following steps: in an offline stage, constructing an ideal electrothermal characteristic database of an IGBT, a dynamic temperature gradient compensation database in a chip and Foster thermal network model parameters; in the on-line stage, synchronous sampling and preprocessing are carried out on IGBT module operation parameters; combining online real-time parameters with an offline database by using an adaptive Kalman filter, and iteratively and cooperatively estimating the real-time junction temperature and loss of the IGBT; and finally, outputting and applying the estimated accurate junction temperature and loss data. According to the technical scheme, the hot spot effect in the chip is accurately decoupled, the junction temperature estimation precision and the robustness of online monitoring are improved, and core data support is provided for fine thermal management and early fault early warning of the flexible direct current converter valve.

The invention provides a DCU-based high-performance sparse stiffness matrix vector multiplication method, which comprises the following steps of: according to a sparse stiffness matrix, dividing a non-zero element into a plurality of calculation unit blocks by rows, pre-loading non-zero element data to an L1 shared memory or a register file through an on-chip shared memory controller of the DCU, a high-bandwidth crossbar switch of the DCU is used for realizing data copying and transmission; starting multi-row fusion execution for a short row of which the row non-zero element is lower than a DCU single-instruction multi-data width threshold value; constructing a wavefront scheduler based on a DCU asynchronous computing engine: binding an independent instruction cache region for each wavefront, and loading a multiply-add operation instruction set in advance through a prefetch instruction queue; a calculation unit state register is established, and when a wavefront scheduler ready signal is triggered, a scalar unit of the DCU is activated to execute calculation; and realizing cross-thread block reduction by adopting a DCU atomic operation accelerator. According to the method, the calculation throughput and the memory bandwidth utilization rate of large-scale structural mechanics stiffness matrix vector multiplication are effectively improved.

The invention discloses a high-voltage circuit for an electric flame stove. The high-voltage circuit comprises a PFC circuit, a high-frequency conversion circuit, a boosting transformer, an energy coupling circuit and a voltage doubling circuit which are electrically connected in sequence. According to the EMI filter circuit, common-mode interference and differential-mode interference are filtered out, and pure alternating current input is provided for a back-end PFC circuit; two chips are adopted in the PFC circuit, so that the PFC circuit 300 finally realizes the consistency of the current waveform and the voltage phase; in the other embodiment of the invention, double chips are adopted, so that'fault linkage protection 'is realized; stable discharging of multiple groups of positive and negative electrodes is achieved through multiple groups of single energy coupling capacitors and independent voltage doubling rectifier bridges which are connected in parallel.

The invention discloses a data processing chip based on a heterogeneous computing architecture, and relates to the technical field. The data processing chip based on the heterogeneous computing architecture comprises a data processing unit for receiving and preprocessing data to be transmitted; the clustering compression engine is used for carrying out clustering compression processing on the preprocessed data to be transmitted; the modulation and coding control unit is used for carrying out modulation and coding processing on the data to be transmitted after clustering compression processing; the redundant coding unit is used for carrying out redundant coding processing on the modulated and coded data to be transmitted; and outputting the to-be-transmitted data subjected to redundant coding processing to a protocol stack and interface unit of external equipment according to a set communication protocol. Through collaborative design of a clustering compression engine in a chip and a modulation coding control unit, clustering compression aiming at data structure characteristics and modulation strategy matching in a dynamic channel state are realized; the problems of fixed compression and modulation modes and lack of cooperation in the prior art are solved.

The invention relates to the technical field of resistor chips, in particular to a method and a system for optimizing a manufacturing process of a thermistor chip. According to the method, multi-scale process entropy analysis is carried out on a process parameter dynamic flow, the coupling strength between key processes is analyzed, and a process parameter cluster with strong non-monotonic correlation and a process system entropy increase path of the process parameter cluster are identified, so that a collaborative stability domain boundary model is constructed; according to transient fluctuation characteristics extracted from a process parameter dynamic flow obtained in real time, in combination with the collaborative stability domain boundary model, determining a parameter subset exceeding a collaborative stability operation interval as a drift parameter cluster, executing an optimization instruction set to perform trial production, synchronously collecting collaborative trajectory data of a process parameter cluster, and performing collaborative trajectory prediction; and the collaborative stability is verified by calculating the entropy change rate of the process system and is fed back to the collaborative stability domain boundary model for boundary toughness strengthening, dynamic collaborative convergence of relevant parameters such as the sintering gradient and the electrode pressure is achieved, and the product consistency and the yield stability are improved.

The invention provides an engineering test method and system for a storage chip and a medium, and belongs to the technical field of semiconductor packaging. The method comprises the following steps: acquiring read-write operation data, temperature data and voltage data of a storage chip in real time through a distributed sensor network, performing dimension reduction and segmentation processing on test data by using a multi-dimensional feature extraction algorithm, extracting statistical features and correlation features, inputting a fault prediction model constructed based on a deep learning algorithm, and performing fault prediction. Fault type and probability prediction is realized; and judging whether the chip has a fault by combining a preset threshold value, if the chip has the fault, accurately positioning a fault area by adopting a dynamic probe test technology, determining a fault time point and a trigger condition through time sequence analysis, and finally generating a fault diagnosis report and providing a repair suggestion. According to the invention, the accuracy and efficiency of fault detection of the storage chip can be effectively improved.

The invention relates to the technical field of Bluetooth communication, and discloses an optimization method for secure communication of Bluetooth chip equipment. The method comprises the following steps: identifying a device type identifier and a protocol version feature, extracting a hardware capability parameter and generating an initial security policy set; collecting channel data, and calculating a stability index and a dynamic noise baseline; then, screening and sorting security policies to generate an execution queue, adjusting an encryption strength threshold according to a noise baseline to perform iterative optimization, and outputting final policy configuration; and when the target Bluetooth chip establishes the communication connection, loading the final security policy configuration and monitoring the channel state in real time, and triggering a policy dynamic switching mechanism when the channel state change exceeds the preset tolerance so as to optimize the security communication effect of the Bluetooth chip equipment. According to the method, the security policy can be accurately matched with the device and the channel state, the policy is dynamically adjusted, and the security and the stability of communication of the Bluetooth chip device are effectively improved.

The invention discloses a fault analysis method and device for a switch chip, and relates to the field of computers, and the method comprises the steps: monitoring an error event, and instantly generating an error log containing an error code and a port number when a target link is abnormal; then, through accurate fault mapping, based on an error code mapping table pre-stored in a nonvolatile medium, dynamically converting an original error code into a readable fault description, and in combination with a data packet associated physical position captured by a trigger, realizing fault tracing; through structured storage management, the fault description and the original log are stored in a partitioned mode according to port numbers, and a traceable historical database is formed; and finally, real-time alarm and deep diagnosis are triggered through system collaborative optimization. Therefore, the technical effects of operation and maintenance efficiency rising, fault tracing enhancement and system reliability enhancement are realized, and the technical problem of low fault analysis efficiency of the switch chip in the related technology can be solved.