720 results about "Hermetic packaging" patented technology

A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature. However, control is maintained such that the channel spectral spacing between channels across multiple signal channels, whether such spacing is periodic or aperiodic, between adjacent laser sources in the thermally floating wavelength grid are maintained in a fixed relationship. Means are then provided at an optical receiver to discover and lock onto floating wavelength grid of transmitted WDM signals and thereafter demultiplex the transmitted WDM signals for OE conversion.

A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.

A thermally-sealable multilayer film, for packages which may be resealed after opening, includes an outer layer and a support layer, with a thermally-sealable layer on the side facing the packaged material. A self-adhesive layer made from pressure sensitive adhesive is provided between the support layer and the outer layer. The support layer has weakening lines, which define an opening for the removal of packaged material. For resealing a container, by using the thermally-sealable multilayer film, the user may simply open the defined opening for removal of the contents of the container, by application of an opening force and then reseal the container, by pressing the opened outer layer on to the self-adhesive layer. The above process may be repeated several times, until all the contents of the container are used, whereby the above are protected from possible contamination.

The present invention relates to a process for detecting a leak in a package. The process comprises preparing a package by covering at least a portion of an O₂-sensitive product with a multilayer film comprising (i) a leak-indicator layer in which a O₂-sensitive indicator is present throughout the leak-indicator layer; and (ii) an O₂-barrier layer outward of the leak-indicator layer. A low O₂-environment is provided within the package. The leak-indicator layer is then illuminated with light containing a wavelength absorbed by the O₂-sensitive indicator, so that the O₂-sensitive indicator produces an emission of radiation in an amount inversely proportional to a level of O₂ present with the O₂-sensitive indicator. Then the multilayer film is scanned while the O₂-sensitive indicator is emitting radiation, the scanning being carried out by sensing and comparing the amount of radiation emitted from at least two different regions of the multilayer film.

Two side cut reseal with pressure sensitive adhesive. A flexible package having a reseal integrated within the opposite layers of its film is constructed using existing vertical form fill and seal packaging machines. The invention involves a single sheet of flexible packaging film web having at least three layers. In a preferred embodiment, the reseal is comprised of two offsetting score lines on interior and exterior sides of the film and spaced apart by 0.5 to 1 inch. The scoring creates lines of weakness, which define an opening in the package. Upon opening, a pressure sensitive adhesive layer, which is pattern applied in between the offsetting score lines, is exposed from an interior side of the film. The adhesive releasably adheres the inner and outer layers of the film back together once separated by a consumer.

A stick-on, flexible peel and seal, wet wipes package includes a flexible package body having a front surface, a rear surface, and an internal space sized to contain a plurality of removable wet wipes. An elongated opening extends through the package body to the internal space for accessing and permitting dispensing of the removable wet wipes. A substantially self-closing, resealable label flap is positioned on the front surface of the package body to cover the opening formed therein. The label flap has a bottom surface provided with a sealing adhesive that creates a seal entirely around the periphery of the opening and permits repeated application and removal of the label flap relative to the package body. The label flap further has a starting tab non-adhesively positionable in contact with the front surface of the package body. An adhesive layer structure is provided on the rear surface of the package body for adhering the package body to a support surface. A removable peel-off release layer structure covers and protects the adhesive layer structure prior to use thereof. The package body and the adhesive layer structure are removable from the support surface following emptying of the wet wipes from the package body.

An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

A sealed package's transmission of oxygen, water vapor, carbon dioxide, or other gas or vapor that is of interest because of its potential adverse effects on the package contents is determined indirectly, based upon the package's transmission of a different gas selected as a test gas. Helium is preferred as a test gas. The package's total transmission of the test gas is separated into its components of leakage through the package seals and permeation through the packaging material itself. The package's leakage of the gas of interest is determined based on its leakage of the test gas, in accordance with the molecular weights of the gases. The package's permeation of the gas of interest is determined based on its permeation of the test gas, in accordance with data correlating the permeation of the gas of interest and permeation of the test gas for the materials from which the package is made, and with package structure data relating to the size, shape, and disposition of the materials from which the package is made. The package's total transmission of the gas of interest is determined by adding its leakage and permeation components so determined. Such data may be used with other data to determine a packaged product's shelf life or its sensitivity to a gas of interest.

Provided are an apparatus and a method for measuring gas transmission rates and nanoleaks of deformable and brittle materials. The apparatus includes a test chamber having an upper and lower diffusion cells that when closed form a chamber wall seal, a gas inlet and a gas outlet in fluid communication with the lower diffusion cell, the upper diffusion cell being fluidly connected to a high-vacuum mass spectrometer. The method of measuring gas transmission rates and nanoleaks includes placing a sealed package containing the test gas in the lower diffusion cell, closing the upper and lower diffusion cells, flushing the lower diffusion cell with a source of a second gas other than the test gas, closing off the source of the second gas; and measuring the leak rate of the sealed package.

A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

A resealable and disposable package assembly is described. The assembly includes a container and a multilayer cover laminate that are bonded to one another to initially seal the contents of the package. The package can then be easily opened by at least partially separating the cover laminate along a predesignated interface. The package can be reliably and effectively sealed by recontacting the previously separated cover portions to one another.

A sealed package for an article of personal use. The package includes a plastic container that defines a storage region and has a sealing surface around an entrance to the region. The package also includes a plastic, multi-layer laminate film sealed to the sealing surface of the container. The film is removable away from the sealing surface in one piece and has deadfold characteristics.

A seal for a package includes a circuit having electrical characteristics that change under mechanical deformation and an attaching material coupled to the circuit and for attaching the circuit to the package. The seal is attached to the package and processed prior to shipping to establish an untampered state for the seal. This includes identifying a circuit on the sealed package according to a seal type associated with the seal, recording one or more characteristics associated with the circuit from the seal and storing the seal type and one or more characteristics associated with the circuit from the seal for later comparison. To detect tampering to the package, the seal type and corresponding seal and circuit for the seal is identified, the characteristics associated with a circuit from the seal are determined and compared with the previous characteristics recorded when the seal was initially applied to the package. If the comparison indicates that a mechanical deformation of the seal occurred, it is possible the seal and package were tampered with during shipment or delivery.

A process for hermetically packaging a microscopic structure including a MEMS device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure supported on a substrate, depositing a support layer of a dielectric material patterned by lithography over the capping layer, providing a plurality of vias through the support layer by lithography, removing the capping layer via wet etching to leave the support layer intact in the form of a shell having a cavity occupied by the microscopic structure, depositing a metal layer over the capping layer that is thick enough to provide a barrier against gas permeation, but thin enough to leave the vias open, and selectively applying under high vacuum a laser beam to the metal proximate each via for a sufficient period of time to melt the metal for sealing the via.

A thermoformed clamshell package with a pair of closing flanges and a double-sided adhesive for joining the closing flanges to seal the package. The package includes a carrier flange that carries the double-sided adhesive prior to sealing and a sealing flange that is brought into contact with the double-sided adhesive to seal the package. The package may include a frangible portion in the flange region for gaining access to the contents of the package after it has been sealed without breaking the adhesive seal created by the double-sided adhesive. The carrier flange may include a channel for seating the double-sided adhesive and for denesting adjacent packages when nested together for shipping and/or storage. The package may include one or more display strips disposed in the flange region. The present invention also provides a method for packaging articles in a package with a tamper-evident seal, and a method for manufacturing a package with a tamper-evident seal.

The invention discloses a ceramic substrate for three-dimensional packaging of a multi-chip system, which comprises laminated ceramic, wherein a first cavity for containing a first chip is formed in a horizontal plane of the laminated ceramic; a cover plate is arranged above the first cavity and seals the first cavity and the first chip; a second cavity for containing a second chip, which is vertical to the first cavity, is arranged on the side wall of the laminated ceramic; and a bonding pad interconnected with the second chip is arranged in the second cavity and is electrically interconnected with the first cavity. The invention can provide hermetic packaging for a multi-chip module and simultaneously can provide vertical surface attaching for chips, thereby realizing vertical attaching of IC chips or MEMS chips, forming a three-dimensional packaged system module with high reliability, and enabling the chips to be capable of detecting variations of physical quantities in X, Y and Z directions.

A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.