The invention relates to a tin-base leadless solder without silver, and relative production. Wherein, it comprises Bi at 7.5-60% (without 7.5%), Cu at 0.1-3.0%, and the left is tin; and it also can contain Zn, Ni, P, Ge, Ga, In, Al, La, Ce, Sb, Cr, Fe, Mn, or Co while the total amount of micro alloy element is not higher than 1.0%. And the production comprises that in protective gas or vacuum, smelting middle alloy Sn-Cu10; then smelting into leadless solder alloy ingot which can be used as solder directly or be made into bar band, wire plate or powder. The inventive solder has low cost while its fusion point can be controlled between 140 and 230Deg. C. And it has strong anti-oxidization and anti-corrosion properties.