83results about How to "Good solder wettability" patented technology

This invention provides an Ag electrode paste for light receiving face-side electrode formation, which can provide a solar battery cell with a high conversion efficiency and provided with a light receiving face-side electrode having low line resistance, and a solar battery cell having good characteristics producing using the Ag electrode paste, and a process for producing the solar battery cell. The Ag electrode paste for use in the formation of a light receiving face-side electrode (10) comprises (a) Ag particles, (b) an organic vehicle, and (c) a lead-free glass frit comprising SiO2: 13 to 17% by weight, B2O3; 0 to 6% by weight, Bi2O3: 65 to 75% by weight, Al2O3: 5% by weight, TiO2: 1 to 3% by weight, and CuO: 0.5 to 2% by weight. The Ag electrode paste is used in the formation of a second electrode in a light receiving face-side electrode (10) comprising a first electrode (11) and a second electrode (12) provided on the first electrode.

The invention provides a tin-plated copper-alloy material for terminal and a method for producing the same with an excellent insertion / extraction performance and has an object of reducing dynamic friction coefficient to 0.3 or less with an excellent electrical-connection characteristic. A Cusn alloy layer / a NiSn alloy layer / a Ni or Ni alloy layer are formed between a Sn-based surface layer and a substrate made of Cu or Cu alloy; the Cusn alloy layer is a compound-alloy layer containing Cu 6 Sn 5 as a major proportion and a part of Cu in the Cu 6 Sn 5 is displaced by Ni; the Nisn alloy layer is a compound-alloy layer containing Ni 3 Sn 4 as a major proportion and a part of Ni in the Ni 3 Sn 4 is displaced by Cu; an average interval S of point peaks of the Cusn alloy layer is not less than 0.8 [mu]m and not more than 2.0 [mu]m; an average thickness of the Sn-based surface layer is not less than 0.2 [mu]m and not more than 0.6 [mu]m; an exposed-area rate of the CuSn alloy layer exposed at a surface of the Sn-based surface layer is not less than 1% and not more than 40%; an average of equivalent-circle diameter of the exposed portions of the Cusn alloy layer exposed at the surface of the Sn-based surface layer is not less than 0.1 [mu]m and not more than 1.5 [mu]m; and dynamic friction coefficient is not more than 0.3.

Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 μm and not more than 0.6 μm, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes.