21846 results about "Electronic component" patented technology

An artificial intelligence based Offensive Cybersecurity Appliance or OCA for launching a cyber-offensive countermeasure aimed at effectively mitigating sophisticated cyber threats such as real-time Ransomware as a Service (RaaS) directives and emergent killware instigated by malicious-threat actors or cyber attackers. The system covertly uses a vast array of penetrative counter cyber attacks, based on an Advanced Persistent Threat or APT model, to circumvent encountered information security controls instituted by security-based components of a cyber attacker's Local Area Network or LAN. Intrinsically, the penetrative counter cyber attacks are constituted of multiple blended artificial intelligence based cyber attacks. The OCA subsequently uses these blended artificial intelligence based cyber attacks to render the hardware (including the cyber attacker's computer system used to instigate the cyber attack, discovered peripheral smart devices, and network-edge device such as a modem-router) interconnected to the cyber attacker's LAN inoperable by destroying the electronic components associated with that hardware.

An electronic device for long-term adhesion to a mammal includes a housing with an electronic component. The electronic device may include a first wing and a second wing, each being integrally formed with the housing. An electrode is positioned on a bottom surface of each of the wings, the electrodes electrically connected to the electronic component. An adhesive layer is provided for adhesion to a surface of the mammal. The adhesive layer may cover a portion of the bottom surfaces of the wings but generally does not cover the electrode or a bottom surface of the housing. A method of applying an electronic device to a mammal includes removing first and second adhesive covers from first and second wings of the electronic device to expose an electrode and an adhesive coated on a bottom surface of each wing.

The electronic apparatus includes a first chassis equipped with a first electronic component, a second chassis equipped with a second electronic component, a hinge device that relatively rotatably connects the first chassis and the second chassis, and a flexible board provided over the first chassis and the second chassis and connecting the first electronic component and the second electronic component. The flexible board has a first folded portion and a second folded portion that are disposed in order and curved in opposite directions to each other in the first chassis.

The invention discloses a multi-AGV cooperative path planning and scheduling method for chip intelligent storage, and belongs to the field of high-precision electronic component intelligent storage. The method comprises the following steps: running according to a highway guide strategy, and pre-allocating tasks of each robot by using an MTSP problem according to different task types before path planning; an improved A * algorithm is provided, a global thermodynamic diagram congestion prediction and turning waiting heuristic method is introduced to establish a space-time joint search model, and a transportation path is optimized by greatly reducing the number of nodes needing to be searched and the turning and waiting times of the AGV, so that the efficiency is improved; in addition, a series of priority rules are also provided, and appearing conflicts are eliminated. Experiments verify the effectiveness of the method, high-reliability and low-vibration dust-free workshop AGV collaborative scheduling can be realized, and an efficient and safe warehousing automation solution is provided for semiconductor manufacturing.

The invention discloses a carbon composite ceramic linear resistor and a preparation method thereof, and belongs to the technical field of power electronic components. The invention provides a preparation method of a carbon composite ceramic linear resistor, which comprises the following steps: uniformly mixing bentonite, silicon carbide and nano carbon black to obtain powder, uniformly mixing the powder and ethanol, drying, adding a binder solution, and carrying out green body forming to obtain a green body; carrying out heat preservation on the green body at 1150-1300 DEG C in a nitrogen-containing gas atmosphere to obtain a sample; and polishing the sample, and spraying aluminum to obtain the carbon composite ceramic linear resistor. According to the method for preparing the carbon composite ceramic linear resistor, the resistivity of the material can be reduced, and the thermal shock resistance of the ceramic resistor can be improved.

The invention relates to the technical field of precise geometric quantity measurement, and discloses an electronic component size and contour automatic metering method, which comprises the following steps: calculating a nominal truncation phase distribution diagram of a to-be-measured electronic component by using a virtual projection imaging model, controlling a projection unit to project a single-frequency sine stripe grating to the electronic component and collecting a deformed stripe image, calculating the gradient of the modulation degree distribution map and extracting edge contour features to solve the actual pose of the assembly; performing modulo 2pi differential operation on the nominal and actually measured truncated phase distribution maps, and eliminating high-gradient artifacts by using an edge mask to generate a phase residual map; and converting the phase residual image into a height deviation distribution diagram according to the phase height mapping relation, and by constructing a phase domain differential metering channel, the phase unwrapping ambiguity in discontinuous surface measurement is avoided.

The invention relates to the technical field of electronic component detection, and discloses an electronic component detection data processing method and system.The electronic component detection data processing method comprises the steps that detection data of multiple electronic components are collected and preprocessed, and high-quality component detection data and system topological structure information are obtained; calculating multi-dimensional similarity among a plurality of electronic components, and establishing a component similarity network; performing multi-scale time sequence feature extraction, identifying an abnormal mode and calculating an abnormal degree score of the component; constructing a time sequence heterogeneous graph network; according to the time sequence heterogeneous graph network, applying a graph attention network model to predict a propagation path of the electronic component fault; electronic component detection is expanded from traditional single-point analysis to system-level analysis, a propagation path of a fault in a system can be predicted, and potential system fault risks can be warned in advance.

To provide a game machine with further technical improvements. [Solution] The board for controlling the game is provided with a printed circuit board on which multiple electronic components are mounted, the printed circuit board having a multi-layer structure in which one or more insulating layers and one or more conductor layers are stacked, and on the board surface, outside the mounting area in which the multiple electronic components are mounted, there is a peripheral area having a different color from the mounting area due to a stacking structure different from that of the mounting area.

The invention relates to an electronics module (102) for a ventricular assist device, wherein the ventricular assist device has a motor housing for accommodating a pump motor. The electronics module (102) comprises an electronics section (204) for accommodating at least one electronic component (206) and / or at least one electrically conductive contacting element (208), and a coupling section (202) designed as a joint between the motor housing (104) and the electronics section (204) or as a separate component to be joined, wherein the motor housing (104) and the electronics section (204) are combined or can be combined via the coupling section (202) with one another to form a fluid-tight module housing (104) to be arranged in a blood vessel.

The present invention discloses an integrated circuit chip with an address code, a key, and a mechanical keyboard. The integrated circuit chip contains a programmable address code, integrates a magnetic induction circuit, a GRB magic color drive circuit, and includes a power pin, a ground pin, and a data pin. The power pins of n integrated circuit chips are connected in parallel to share a power network VCC, the ground pins are connected in parallel to share a ground network GND, and the data pins are connected in parallel to share a data line network DIO connected to an MCU, and data information is transmitted on the data line network DIO. Another integrated circuit chip with an address code only requires a power network VCC and a ground network GND, and data information is modulated and transmitted on the power network, which greatly saves wiring space, reduces the difficulty of PCB design, and exponentially reduces the number of electronic components. In addition, a variety of different customized code sending methods and working modes are provided, making its application simpler, more efficient, and more reliable.

The present invention discloses an integrated circuit chip with a data line, a key and a mechanical keyboard, wherein the integrated circuit chip integrates a magnetic induction integrated circuit and an RGB magic color driving circuit; the integrated circuit chip includes a power pin, a ground pin, a data information input pin and a data information output pin, and the connection between the data information input pin and the data information output pin of a plurality of integrated circuit chips forms a data line and is connected to the MCU; an integrated circuit chip cooperates with a key with a magnetic element to obtain a key information, and according to different communication protocols, the RGB magic color driving circuit and the magnetic induction integrated circuit share the data line, and transmit the RGB color grayscale information and the key information in a time-sharing manner. The present invention cascades all the key information through the data line, saves a lot of wiring space, reduces the design difficulty of the PCB, reduces the number of electronic components by multiples, and provides a variety of different code sending methods and working methods, making its application simpler and more efficient.

The invention relates to the technical field of electronic component detection, in particular to an IC (integrated circuit) carrier plate detection method based on surface state image extraction, which comprises the following steps: acquiring a gray image, analyzing structural parameters, extracting gradient features, detecting boundary disturbance, integrating the image, calculating an abnormal score, identifying a defect position area, extracting features and outputting an identification result. According to the invention, by analyzing the structure parameters of the bonding pad in the gray level image, calculating the edge line segment, the center coordinate and the spacing, and constructing the two-dimensional coordinate system, the regional positioning reference is enabled to have geometric consistency, the coordinate mapping is combined with the gradient direction change frequency and the continuous aggregation point, the boundary disturbance identification precision is improved, and the image division is executed based on the disturbance region. According to the method, non-functional region mixing is effectively avoided, a clustering and probability model is introduced after region gray level statistics, a deviation scoring mechanism is constructed, gray level feature abnormity is accurately recognized, the discrimination capability of small-amplitude and low-contrast defects is improved, and the selectivity and target focusing performance of feature detection are enhanced.

The invention relates to the technical field of electronic detection, and discloses an electronic component dispensing detection method. The method comprises the following steps: acquiring dispensing image data of the surface of the electronic component, and generating a standardized dispensing data matrix containing glue position, thickness and uniformity characteristics through standardized preprocessing; constructing a dispensing correction matrix based on an adaptive window frame, and performing spatial reference dynamic correction on the standardized data matrix to obtain a spatial correction dispensing data matrix; inputting the data into a multi-layer sensor fusion network for feature fusion, and outputting a multi-source fusion dispensing data set; constructing a multi-dimensional abnormal feature incidence matrix based on the data set, and identifying abnormal dispensing data nodes by using a dynamic threshold detection algorithm; performing parameter optimization iteration on the multi-source fusion data set by using a gradient descent optimization algorithm to generate an optimized dispensing parameter set; and finally, constructing a three-dimensional visual dispensing quality model, and establishing a dynamic mapping relationship between model parameters and glue physical characteristics. The method can more comprehensively detect the glue quality.

The invention provides an all-silicon carbide double-sided heat dissipation module packaging method based on gradient thermal resistance optimization, and belongs to the technical field of electronic component packaging. Establishing a thermal resistance characteristic curve, and calculating a gradient thermal resistance vector to determine a heat flow path; constructing a heat dissipation temperature distribution matrix; obtaining thermal diffusion data; heat dissipation path thermal resistance is calculated by combining the thermal diffusion matrix and the temperature distribution matrix, and a thermal resistance sparse matrix is established and is dimensionally reduced into a thermal resistance low-dimensional matrix; calculating an optimal heat dissipation path parameter set; inputting the parameter set into a thermal resistance prediction deep attention network model for verification and fine tuning, and generating a final thermal resistance distribution scheme; a module structure and a material ratio are designed according to the scheme to form a sandwich structure; a silver paste sintering process is adopted to realize low thermal resistance connection and complete packaging, and the technical problems of non-uniform thermal resistance distribution and difficulty in optimizing a heat flow path in a double-sided heat dissipation structure of a silicon carbide power module in the prior art are solved.

The invention discloses a low-voltage cable branch box with protection structures at wire inlets, and belongs to the technical field of cable branch boxes, the low-voltage cable branch box comprises a box body, the interior of the box body is fixedly connected with a mounting rack for mounting electrical appliance elements through bolts, the bottom of the box body is provided with a plurality of wire inlets distributed in a linear array, and the wire inlets are arranged in the box body. The bottom of the inner wall of the box body is fixedly connected with a fixing frame corresponding to each wire inlet, and the front and back surfaces of the fixing frame are movably provided with plugging plates in a penetrating manner. The plugging plate is arranged to plug the wire inlet, and the gap sealing mechanism is arranged to fill and seal the gap between the cable and the plugging plate, so that external humid gas cannot enter the box body from the wire inlet, and when the sealing door of the box body is in a closed state, the whole branch box can be in a totally closed state; dust or humid gas in external air is prevented from entering the branch box, and electronic components in the branch box are well protected.

To provide a stage unit and a processing system which are advantageous for accurately positioning an electronic component at a desired position.SOLUTION: The stage unit 10 includes the base 11, the stage 12 on which the electronic component is placed, the stage moving mechanism 13 that moves the stage 12 with respect to the base 11, the movement measuring sensor 37 capable of directly or indirectly measuring the movement amount of the stage 12, and the control unit that controls the stage moving mechanism 13 based on the movement instruction command signal and moves the stage 12 so as to be arranged at the adjustment position indicated by the movement instruction command signal. The control unit controls the stage moving mechanism 13 based on the movement amount of the stage 12 indicated by the measurement result of the movement measuring sensor 37 and the adjustment position.SELECTED DRAWING: Figure 1

A power tool device (102) is controlled to emit sounds that can identify the power tool device and / or be used to encode data for acoustic data transmission. Modulating the switching frequency of electronic components (370) (e.g., transistors, semiconductor switched devices) of the power tool device (102) can create an acoustic signature detectable by a microphone-equipped device (104), such as a cell phone, tablet, security camera, or the like. In this way, power tool identification and / or acoustic data transmission can be realized with existing power tool device circuitry and hardware components.

The invention relates to the technical field of defect detection, and particularly discloses an electronic component defect detection method, system and device, and the method comprises the steps: collecting a multiband original image set based on multispectral imaging, inhibiting batch material difference and surface reflection through orthogonal complementary space projection, and obtaining a de-noised image set; performing feature extraction on the de-noised image set, and identifying and marking all fragmented defect areas; based on a graph neural network space attention mechanism, establishing an association relationship between fragmented defect areas to form a complete defect feature chain; gray frequency value sequences of the to-be-detected image and the standard sample image are constructed respectively, and a first fitting curve and a second fitting curve are obtained through fitting of a skewed distribution function; and finally, comprehensively judging whether the electronic component has defects or not by combining the defect characteristic chain and the difference characteristics of the two fitting curves. According to the method, interference can be effectively suppressed, fragmented defects can be accurately identified, and the detection accuracy and reliability are remarkably improved through multi-dimensional feature fusion.

To provide a technique advantageous for moving a stage on which an electronic component is placed.SOLUTION: A stage moving mechanism 13 for moving a stage 12 with respect to a base 11 comprises: a first direction driving unit having a first direction driving source 20 and a first direction movable portion 21 that is moved in a first direction dX together with the stage by a driving force output from the first direction driving source; a second direction driving unit having a second direction driving source 30 and a second direction movable portion 31 that is moved in a second direction together with the stage by a driving force output from the second direction driving source; a first direction guide unit 15 that allows the stage to move in the first direction with respect to the base; and a second direction guide unit 16 that allows the stage to move in the second direction with respect to the base.SELECTED DRAWING: Figure 1

A doorbell device includes a housing, an optical module, a circuit board, and a button assembly disposed in an opening of the housing. The optical module is disposed in the housing and is controllable to power up to photograph an environmental image and outputs an image signal; the circuit board is disposed in the housing and has several electronic components, a thermally conductive circuit, and a sensing switch on an outer surface of the circuit board; the electronic components includes an auxiliary function component and a primary function component electrically connected to the sensing switch, the optical module, and the auxiliary function component; the thermally conductive circuit is laid out on the outer surface, is electrically connected to the electronic components, and has an extending segment located in a sensing area of the circuit board; a pressing board corresponds to the sensing area and the sensing switch.

To provide a technique advantageous for moving a stage on which an electronic component is placed.SOLUTION: A stage moving mechanism 13 for moving a stage 12 with respect to a base 11 comprises: XY moving devices 20 and 30 for moving the stage with respect to a base in XY directions dX and dY forming a right angle with respect to a rotation axis A; and a rotation moving device for rotating the stage with respect to the base in a rotation direction about the rotation axis. The rotation moving device includes: a rotation direction driving source 70; a rotation support portion 71 rotated in a rotation direction dR together with the stage by a driving force output from the rotation direction driving source; and a rotation relay portion 72 for transmitting the driving force output from the rotation direction driving source to the rotation support portion while allowing the rotation support portion to move in the XY directions with respect to the rotation direction driving source.SELECTED DRAWING: Figure 1

An electronic device for long-term adhesion to a mammal includes a housing with an electronic component. The electronic device may include a first wing and a second wing, each being integrally formed with the housing. An electrode is positioned on a bottom surface of each of the wings, the electrodes electrically connected to the electronic component. An adhesive layer is provided for adhesion to a surface of the mammal. The adhesive layer may cover a portion of the bottom surfaces of the wings but generally does not cover the electrode or a bottom surface of the housing. A method of applying an electronic device to a mammal includes removing first and second adhesive covers from first and second wings of the electronic device to expose an electrode and an adhesive coated on a bottom surface of each wing.

The invention relates to an electrical / electronic component (10) for a motor vehicle, comprising a housing (12) enclosing a receiving space (14), at least one electrical or electronic component (16) which is received in the receiving space (14), a heat conducting element (18) which is arranged on a surface of the component (16) to be cooled and is designed to conduct heat away from the component (16), and a coolant guide device (20) which is configured to guide a dielectric coolant (22) to the heat conducting element (18), whereby the heat conducting element (18) can be exposed to and surrounded by the coolant (22), whereby heat can be transferred from the heat conducting element (18) to the coolant (22).

The invention provides an intelligent ring and an intelligent system with the same. The intelligent ring is of an annular structure and is provided with an opening, and the intelligent ring comprises a shell part arranged on the annular outer side of the annular structure, a first contact part arranged on the annular inner side of the annular structure and a second contact part arranged on the annular opening side of the annular structure; the first contact piece is arranged on the main body part of the annular structure, a gap space is formed between the shell piece and the first contact piece, and a plurality of electronic elements are contained in the gap space. According to the scheme provided by the invention, the shape of the ring can be more adjustable through the design of the annular opening of the intelligent ring, so that the ring is more in line with human engineering, dynamic adjustment is realized through the design of the movable opening, the wearing flexibility is improved, the ring can adapt to fingers of various different sizes, a user can wear the ring conveniently, and the user experience is improved. Meanwhile, damage caused by extrusion or collision is effectively avoided in an exquisite electronic element integration mode, and comfort, intelligence and adaptability of the intelligent ring are guaranteed.

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention relates to the technical field of automobile material temperature simulation analysis, in particular to an automobile cabin temperature field simulation analysis method and system based on multi-physics field coupling. According to the method, high-precision and high-efficiency simulation is realized through thermal-solid-fluid-electric coupling modeling in combination with the genetic algorithm, the neural network and reinforcement learning AI dynamic optimization, and the problems that the multi-physical field coupling effect cannot be comprehensively reflected and the parameter optimization efficiency is low in the prior art are solved. Time sequence analysis and dynamic boundary condition adjustment are introduced, transient working condition simulation is supported, and temperature field changes in actual driving can be better predicted. Through simultaneous solution of the Maxwell equation and the heat conduction equation, the temperature rise risk of the electronic component is accurately predicted, and the method is suitable for heat management optimization of key components such as a battery pack and a motor controller of a new energy automobile. Cloud high-performance calculation and edge end lightweight model cooperation are adopted, efficient simulation and real-time early warning are achieved, and rapid analysis and design optimization of extreme working conditions are supported.

The invention relates to the technical field of electricity meters, and particularly discloses a relay and an electricity meter thereof, comprising a mounting plate: a clamping frame is fixedly mounted on the front surface of the mounting plate, sliding grooves are formed in the upper and lower ends of the clamping frame, sliding plates are slidably connected to the inner sides of the sliding grooves, and heat dissipation fins of a heat conduction aluminum plate are attached to electronic components in the electricity meter. The n-pentane heat-conducting medium in the liquid storage box is heated and vaporized, the heat is absorbed, the heat dissipation capability is improved, the heat pushes the air cylinder to open the heat dissipation window, the air velocity in the electric meter is improved, the heat dissipation is enhanced, the temperature is continuously increased, and the heat-conducting medium is further vaporized, so that the inner current-conducting plate and the outer current-conducting plate are attached; and after the temperature is reduced, the heat-conducting medium is condensed, the air cylinder shrinks to block the heat dissipation window, the heat dissipation fan does not need to be automatically triggered by a temperature sensor, the consumption is reduced, the stability is improved, the cost is reduced, and the protection and moisture-proof performance is improved by the blocking window when the heat dissipation device is not used.

A smart busy board is provided utilizing a technology driven timer which can be set to predetermined time intervals for each of a plurality of interactive components disposed on the smart busy board. The timer mechanism and some of the interactive components are connected to electrical elements hidden within the interior housing of the smart busy board. Each of the interactive components engage the infant or toddler with some type of sensory output, such as movement, sound, light, and touch for a predetermined time interval. The busy board is designed to stimulate frontal lobe and cognitive development and improve motor skills.

Smart glasses and an electronic device are provided. The smart glasses include a glasses frame, a glasses temple, and an electronic component. The glasses frame is connected to the glasses temple, and the electronic component is disposed in the glasses temple. The glasses temple may include a bending adjustment portion, and the bending adjustment portion includes a flexible housing and a flexible metal member. The flexible housing is of a low-pressure integrated structure and is provided with a hollow accommodation cavity. The flexible metal member is embedded in the accommodation cavity. The bending adjustment portion in the smart glasses is bendable.

To provide a multilayer ceramic electronic component capable of suppressing structural defects in a capacitance portion.SOLUTION: A multilayer ceramic electronic component includes a laminated structure in which a plurality of internal electrode layers and a plurality of dielectric layers are laminated, and a pair of cover layers provided outside an outermost internal electrode layer among the plurality of internal electrode layers, and the pair of cover layers has ceramic as a main component, and at least one of the pair of cover layers has an average grain number in the stacking direction in the laminated structure that is smaller than the average grain number in at least one dielectric layer among the plurality of dielectric layers.SELECTED DRAWING: Figure 5