15536 results about "Electronic component" patented technology

The invention relates to the technical field of precise geometric quantity measurement, and discloses an electronic component size and contour automatic metering method, which comprises the following steps: calculating a nominal truncation phase distribution diagram of a to-be-measured electronic component by using a virtual projection imaging model, controlling a projection unit to project a single-frequency sine stripe grating to the electronic component and collecting a deformed stripe image, calculating the gradient of the modulation degree distribution map and extracting edge contour features to solve the actual pose of the assembly; performing modulo 2pi differential operation on the nominal and actually measured truncated phase distribution maps, and eliminating high-gradient artifacts by using an edge mask to generate a phase residual map; and converting the phase residual image into a height deviation distribution diagram according to the phase height mapping relation, and by constructing a phase domain differential metering channel, the phase unwrapping ambiguity in discontinuous surface measurement is avoided.

The invention relates to an electronics module (102) for a ventricular assist device, wherein the ventricular assist device has a motor housing for accommodating a pump motor. The electronics module (102) comprises an electronics section (204) for accommodating at least one electronic component (206) and / or at least one electrically conductive contacting element (208), and a coupling section (202) designed as a joint between the motor housing (104) and the electronics section (204) or as a separate component to be joined, wherein the motor housing (104) and the electronics section (204) are combined or can be combined via the coupling section (202) with one another to form a fluid-tight module housing (104) to be arranged in a blood vessel.

The present invention discloses an integrated circuit chip with an address code, a key, and a mechanical keyboard. The integrated circuit chip contains a programmable address code, integrates a magnetic induction circuit, a GRB magic color drive circuit, and includes a power pin, a ground pin, and a data pin. The power pins of n integrated circuit chips are connected in parallel to share a power network VCC, the ground pins are connected in parallel to share a ground network GND, and the data pins are connected in parallel to share a data line network DIO connected to an MCU, and data information is transmitted on the data line network DIO. Another integrated circuit chip with an address code only requires a power network VCC and a ground network GND, and data information is modulated and transmitted on the power network, which greatly saves wiring space, reduces the difficulty of PCB design, and exponentially reduces the number of electronic components. In addition, a variety of different customized code sending methods and working modes are provided, making its application simpler, more efficient, and more reliable.

The invention relates to the technical field of electronic component detection, in particular to an IC (integrated circuit) carrier plate detection method based on surface state image extraction, which comprises the following steps: acquiring a gray image, analyzing structural parameters, extracting gradient features, detecting boundary disturbance, integrating the image, calculating an abnormal score, identifying a defect position area, extracting features and outputting an identification result. According to the invention, by analyzing the structure parameters of the bonding pad in the gray level image, calculating the edge line segment, the center coordinate and the spacing, and constructing the two-dimensional coordinate system, the regional positioning reference is enabled to have geometric consistency, the coordinate mapping is combined with the gradient direction change frequency and the continuous aggregation point, the boundary disturbance identification precision is improved, and the image division is executed based on the disturbance region. According to the method, non-functional region mixing is effectively avoided, a clustering and probability model is introduced after region gray level statistics, a deviation scoring mechanism is constructed, gray level feature abnormity is accurately recognized, the discrimination capability of small-amplitude and low-contrast defects is improved, and the selectivity and target focusing performance of feature detection are enhanced.

The invention relates to the technical field of electronic detection, and discloses an electronic component dispensing detection method. The method comprises the following steps: acquiring dispensing image data of the surface of the electronic component, and generating a standardized dispensing data matrix containing glue position, thickness and uniformity characteristics through standardized preprocessing; constructing a dispensing correction matrix based on an adaptive window frame, and performing spatial reference dynamic correction on the standardized data matrix to obtain a spatial correction dispensing data matrix; inputting the data into a multi-layer sensor fusion network for feature fusion, and outputting a multi-source fusion dispensing data set; constructing a multi-dimensional abnormal feature incidence matrix based on the data set, and identifying abnormal dispensing data nodes by using a dynamic threshold detection algorithm; performing parameter optimization iteration on the multi-source fusion data set by using a gradient descent optimization algorithm to generate an optimized dispensing parameter set; and finally, constructing a three-dimensional visual dispensing quality model, and establishing a dynamic mapping relationship between model parameters and glue physical characteristics. The method can more comprehensively detect the glue quality.

To provide a stage unit and a processing system which are advantageous for accurately positioning an electronic component at a desired position.SOLUTION: The stage unit 10 includes the base 11, the stage 12 on which the electronic component is placed, the stage moving mechanism 13 that moves the stage 12 with respect to the base 11, the movement measuring sensor 37 capable of directly or indirectly measuring the movement amount of the stage 12, and the control unit that controls the stage moving mechanism 13 based on the movement instruction command signal and moves the stage 12 so as to be arranged at the adjustment position indicated by the movement instruction command signal. The control unit controls the stage moving mechanism 13 based on the movement amount of the stage 12 indicated by the measurement result of the movement measuring sensor 37 and the adjustment position.SELECTED DRAWING: Figure 1

The invention relates to the technical field of defect detection, and particularly discloses an electronic component defect detection method, system and device, and the method comprises the steps: collecting a multiband original image set based on multispectral imaging, inhibiting batch material difference and surface reflection through orthogonal complementary space projection, and obtaining a de-noised image set; performing feature extraction on the de-noised image set, and identifying and marking all fragmented defect areas; based on a graph neural network space attention mechanism, establishing an association relationship between fragmented defect areas to form a complete defect feature chain; gray frequency value sequences of the to-be-detected image and the standard sample image are constructed respectively, and a first fitting curve and a second fitting curve are obtained through fitting of a skewed distribution function; and finally, comprehensively judging whether the electronic component has defects or not by combining the defect characteristic chain and the difference characteristics of the two fitting curves. According to the method, interference can be effectively suppressed, fragmented defects can be accurately identified, and the detection accuracy and reliability are remarkably improved through multi-dimensional feature fusion.

To provide a technique advantageous for moving a stage on which an electronic component is placed.SOLUTION: A stage moving mechanism 13 for moving a stage 12 with respect to a base 11 comprises: a first direction driving unit having a first direction driving source 20 and a first direction movable portion 21 that is moved in a first direction dX together with the stage by a driving force output from the first direction driving source; a second direction driving unit having a second direction driving source 30 and a second direction movable portion 31 that is moved in a second direction together with the stage by a driving force output from the second direction driving source; a first direction guide unit 15 that allows the stage to move in the first direction with respect to the base; and a second direction guide unit 16 that allows the stage to move in the second direction with respect to the base.SELECTED DRAWING: Figure 1

To provide a technique advantageous for moving a stage on which an electronic component is placed.SOLUTION: A stage moving mechanism 13 for moving a stage 12 with respect to a base 11 comprises: XY moving devices 20 and 30 for moving the stage with respect to a base in XY directions dX and dY forming a right angle with respect to a rotation axis A; and a rotation moving device for rotating the stage with respect to the base in a rotation direction about the rotation axis. The rotation moving device includes: a rotation direction driving source 70; a rotation support portion 71 rotated in a rotation direction dR together with the stage by a driving force output from the rotation direction driving source; and a rotation relay portion 72 for transmitting the driving force output from the rotation direction driving source to the rotation support portion while allowing the rotation support portion to move in the XY directions with respect to the rotation direction driving source.SELECTED DRAWING: Figure 1

The invention relates to an electrical / electronic component (10) for a motor vehicle, comprising a housing (12) enclosing a receiving space (14), at least one electrical or electronic component (16) which is received in the receiving space (14), a heat conducting element (18) which is arranged on a surface of the component (16) to be cooled and is designed to conduct heat away from the component (16), and a coolant guide device (20) which is configured to guide a dielectric coolant (22) to the heat conducting element (18), whereby the heat conducting element (18) can be exposed to and surrounded by the coolant (22), whereby heat can be transferred from the heat conducting element (18) to the coolant (22).

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention relates to the technical field of automobile material temperature simulation analysis, in particular to an automobile cabin temperature field simulation analysis method and system based on multi-physics field coupling. According to the method, high-precision and high-efficiency simulation is realized through thermal-solid-fluid-electric coupling modeling in combination with the genetic algorithm, the neural network and reinforcement learning AI dynamic optimization, and the problems that the multi-physical field coupling effect cannot be comprehensively reflected and the parameter optimization efficiency is low in the prior art are solved. Time sequence analysis and dynamic boundary condition adjustment are introduced, transient working condition simulation is supported, and temperature field changes in actual driving can be better predicted. Through simultaneous solution of the Maxwell equation and the heat conduction equation, the temperature rise risk of the electronic component is accurately predicted, and the method is suitable for heat management optimization of key components such as a battery pack and a motor controller of a new energy automobile. Cloud high-performance calculation and edge end lightweight model cooperation are adopted, efficient simulation and real-time early warning are achieved, and rapid analysis and design optimization of extreme working conditions are supported.

A smart busy board is provided utilizing a technology driven timer which can be set to predetermined time intervals for each of a plurality of interactive components disposed on the smart busy board. The timer mechanism and some of the interactive components are connected to electrical elements hidden within the interior housing of the smart busy board. Each of the interactive components engage the infant or toddler with some type of sensory output, such as movement, sound, light, and touch for a predetermined time interval. The busy board is designed to stimulate frontal lobe and cognitive development and improve motor skills.

The invention discloses an electronic component early fault detection method based on infrared thermal imaging, and the method comprises the following steps: collecting an infrared thermal imaging image, synchronously collecting current and voltage data, and obtaining an infrared thermal imaging sequence; distortion correction, noise suppression and radiance correction are carried out on the sequence, and metal reflection false high-temperature points are removed; executing time sequence difference to extract a continuous heating area, and generating a time sequence temperature feature vector; inputting the feature vector into an improved Times Net model, and outputting time sequence feature representation; calculating a reconstruction error, a prediction residual error and a frequency spectrum deviation, and fusing into an abnormal score; comparing the abnormal score with a dynamic threshold value, and outputting an electronic component identifier, a potential fault type and an abnormal type; and an early fault trend report is generated by combining historical data comparison. The method realizes early detection and trend prediction of electronic component faults, and is suitable for state monitoring and reliability guarantee of a complex circuit system.

The invention discloses a temperature compensation method and system, and the method comprises the steps: receiving a valve block temperature signal collected by a temperature sensor integrated with a pressure sensor in a closed gas supply unit, and an electronic element temperature and environment temperature signal collected by a temperature sensor on a control unit PCB, generating an initial temperature-working condition data set by combining the power of the air pump and the working duration of the electromagnetic valve; performing thermal resistance network modeling on the initial temperature-working condition data set, constructing a multi-node thermal characteristic matrix, and decomposing the matrix into a plurality of sub-matrixes; performing real-time operation on the sub-matrix by using a dynamic heat balance algorithm to generate a temperature estimation result of the key component; and generating a temperature compensation control instruction according to the temperature estimation result of the key component. According to the embodiment of the invention, the temperature of the key component can be accurately estimated, dynamic compensation is realized, and the control precision and stability of the closed gas supply unit are improved.

The present disclosure involves a medical device. The medical device includes an elongate cable assembly having a distal connector, a proximal connector, and a cable body coupling the proximal and distal connectors. The distal connector is configured for coupling with a diagnostic medical device. The proximal connector is configured for coupling with a medical measurement system. An electronic component is located inside the distal connector or the associated cable housing. The electronic component includes an analog-to-digital converter (ADC) and a microprocessor. The ADC is configured to receive medical data gathered by the diagnostic medical device and convert the medical data into digital signals. The microprocessor is coupled to an output of the ADC and configured to process the digital signals into a format that is readable by the medical measurement system.

The invention provides an analog integrated circuit layout method, device and equipment, a medium and an integrated circuit, and the method comprises the steps: obtaining an original layout diagram corresponding to the ith iteration based on the netlist information and a strategy network model of each electronic element needing to be arranged; when it is determined that i does not reach the first preset value, obtaining a value parameter of the original layout diagram corresponding to the ith iteration, updating a model parameter of the strategy network model based on the value parameter of the original layout diagram corresponding to the ith iteration, increasing i by 1, returning to execute the ith iteration calculation, and when it is determined that i reaches the first preset value, updating the model parameter of the strategy network model based on the value parameter of the original layout diagram corresponding to the ith iteration. Determining the original layout diagram corresponding to the ith iteration as a first intermediate layout diagram of each electronic component; and based on the netlist information of each electronic component, correcting the first intermediate layout diagram to obtain a target layout diagram of each electronic component. According to the invention, the reasonability and efficiency of the analog integrated circuit layout are effectively improved, and an automatic solution is provided for the analog integrated circuit layout.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

The invention relates to the technical field of electronic component testing for investigating or analyzing internal microstructures and physical properties of materials by utilizing an electrical means, and discloses an online testing and analyzing method for physical properties of electronic component materials, which comprises the following steps of: constructing a composite excitation signal formed by linearly superposing a main carrier voltage and a perturbation wave voltage; applying the signal to a to-be-tested electronic component and acquiring response current; and extracting an intermodulation current amplitude at an intermodulation frequency point in the frequency spectrum of which the linear response interval is excluded, calculating a nonlinear response coefficient of the material in combination with the excitation amplitude, and comparing the nonlinear response coefficient with a preset degradation threshold so as to judge whether the nonlinear response coefficient is qualified or not. By extracting intermodulation components which cannot be generated by linear contact resistance, physical isolation of external contact noise in a frequency domain is realized, and the problem that contact resistance fluctuation and material intrinsic aging cannot be distinguished in a traditional linear impedance test is solved.

The invention belongs to the technical field of image analysis, and particularly relates to an electronic component defect detection method and system based on machine vision, and the method comprises the following steps: S1, obtaining visible light, X-ray and three-dimensional structured light images of an electronic component to be detected, and generating respective multi-scale feature pyramids through independent feature extraction networks; s2, generating a multi-modal fusion feature pyramid; s3, applying a candidate region generation network to propose a candidate defect region; s4, processing the spatial topological relation graph through a graph neural network, and embedding spatial context information into candidate defect region features; and S5, if the minimum distance between the candidate region features and all the pre-stored prototypes is greater than a set discrimination threshold, determining that the candidate region is a potential defect of an unknown type. According to the method, the detection range is widened, the robustness of feature expression is improved, the limitation of insufficient information of a single data source is overcome, and the accuracy, comprehensiveness and perspectiveness of detection are improved.

The invention provides a biofeedback type electrical stimulation regulation and control device based on multi-mode physiological signal monitoring and a control method, the regulation and control device comprises an electronic component layer, a circuit layer, a man-machine interaction part and an adhesion layer, physiological signal acquisition and electrical stimulation regulation technologies are utilized, and a multi-source biosensor and an intelligent processing module are integrated, so that the regulation and control of the biofeedback type electrical stimulation regulation and control device is realized. Dynamic monitoring and real-time analysis of physiological signals are achieved, self-adaptive adjustment of personalized parameters is conducted based on signal characteristics, and a non-invasive biological feedback regulation and control system is formed. Through integrated multi-mode detection and intelligent regulation and control functions, a non-invasive and convenient regulation and control means is provided for wearers with abnormal nerve or physiological states; a portable and comfortable attached structure is adopted, the device can be worn at the Neiguan point for a long time, physiological signal continuous monitoring and electrical stimulation closed-loop feedback adjustment are achieved, and the personalized health management requirement of a user is met.

A battery pack for an electric vehicle, the battery pack including a battery housing including: a housing body, at least one heat transfer channel defined in the housing body, the at least one heat transfer channel extending generally through a center portion of the housing body, the at least one heat transfer channel being operative to convey a heat transfer fluid; a plurality of battery cells disposed in the housing body, the plurality of battery cells being disposed in direct thermal communication with the at least one heat transfer channel; and at least one electronic component disposed in the battery housing, the at least one electronic component being in direct thermal communication with the at least one heat transfer channel.

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The flexible film can comprise a window or aperture configured to permit fluid communication between the absorbent material and the negative pressure source. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. A portion of the cover layer overlying the one or more apertures in the absorbent layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus. The compressed cover layer can indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer and a cover layer configured to cover and form a seal over the wound contact layer and the indicator material layer. The indicator material layer can be configured to protrude relative to a surrounding surface of an upper surface of the wound dressing apparatus when negative pressure is applied to the wound dressing apparatus and the protruding indicator material layer indicates a level of negative pressure below the cover layer.

The invention discloses a crystal resonator sputter coating device and a preparation method of a crystal resonator, and belongs to the field of electronic components, the crystal resonator sputter coating device comprises a bottom plate, a lower electrode mask plate, a positioning plate, an upper electrode mask plate and a magnetic cover plate in sequence, the positioning plate is provided with a wafer positioning groove, a wafer is installed in the wafer positioning groove, and the magnetic cover plate is provided with a magnet. The upper electrode mask plate and the lower electrode mask plate are both provided with electrode holes, the thickness of the positioning plate is recorded as h < definite >, and one surface of at least one of the upper electrode mask plate and the lower electrode mask plate, which faces a wafer, is provided with a diffusion prevention bulge for preventing diffusion of electrode particles during film coating, and the thickness of the diffusion prevention bulge is recorded as h < definite >. The size of the dispersion preventing protrusion is matched with the size of the wafer positioning groove, the dispersion preventing protrusion is located in the wafer positioning groove during assembly, the thickness of the wafer is recorded as h wafer, and h wafer lt is smaller than or equal to 0.017 mm; and h, setting. The sputtering coating device solves the problem of electrode diffusion of the high-frequency crystal resonator in the existing sputtering coating device for the crystal resonator due to too small wafer thickness.

This internal inspection device is for determining a length and inner diameter of a tubular good. The internal inspection device includes a first positioning sensor, a second positioning sensor spaced axially from the first positioning sensor, a displacement sensor the displacement of the internal inspection device inside the tubular good between two positions sensed by the respective positioning sensors, the internal inspection device further including a electronic arranged to computing the length of the tubular good by adding a distance measured by the displacement sensor and a predetermined length.

The present disclosure generally relates to a monitoring device (100) for remotely monitoring health of a young livestock animal (10), the device (100) comprising: an elongated body (110) within predefined dimensional limits; and a set of electronic components housed within the elongated body (110), the electronic components comprising: a temperature sensor for measuring body temperature of the young livestock animal (10); a computer processor for processing the measured temperature into temperature data; and a wireless communications component for transmitting the temperature data to a remote computer device (210) for processing to monitor the health of the young livestock animal (10), wherein the predefined dimensional limits of the elongated body (110) enable the monitoring device (100) to be orally administrable into the young livestock animal (10) and to remain inside its stomach (12) without being excreted.

The invention relates to the technical field of electronic component rain test, and discloses electronic product waterproof test equipment, which comprises a test box body, a cylinder and a water pipe, a turntable is arranged in the test box body, a rotating shaft is mounted on the turntable, a cavity is formed in the test box body, and a servo motor is fixedly mounted in the cavity. An electric push rod is fixedly mounted at the output end of the servo motor, and an electronic component is further arranged on the turntable; a support is fixedly installed in the test box body, a water storage frame rotationally connected with the support is installed on the support, and a wave making mechanism is further arranged in the water storage frame. According to the electronic product waterproof test equipment, through the collaborative design of a triangular arc-shaped protruding block and a wave making floating body, a soaking test is upgraded from static water level simulation to dynamic wave impact; the arc-shaped protruding blocks intermittently impact the rolling wheels, rapid resetting of the floating body is achieved through the spring mechanism, the dynamic hydraulic action of water fluctuation on electronic components in the natural environment can be reproduced, and the limitation that traditional equipment can only achieve static soaking is overcome.

The invention relates to the technical field of intelligent inventory management, and discloses an intelligent inventory management method and system for electronic components, and the method comprises the steps: creating block chain identities of the electronic components; performing cryptographic operation on a tag ID of an RFID tag in a built-in encryption chip and the block chain identity identifier to obtain an encryption tag; a challenge code sent by the RFID reader-writer is received, the encryption tag uses a built-in encryption chip to carry out AES encryption operation on the challenge code and a pre-stored secret key, and a secure communication link is established; and reading the price and material number information of the components passing through the secure communication link, and executing consistency verification to obtain a verification result, the security strength and anti-clone capability of the anti-counterfeit label are improved, and efficient verification of large-scale component inventory is realized.

An example band structure is provided which includes a first portion having an embedded structural member for holding one or more signal-processing components in fixed positions within the first portion of the band structure. The first portion also includes the one or more signal-processing components, which are coupled to the embedded structural member, and the one or more signal-processing components are configured to at least partially process neuromuscular signals. And the first portion includes one or more neuromuscular-signal-sensing electrodes attached to the first portion of the band structure and electrically coupled to the one or more signal-processing components. The band structure also includes a second portion that does not include any electrical components, where the first portion of the band structure and the second portion of the band structure are each configured to couple directly to one another to form a loop sized to accommodate a wrist of a user.

The invention provides a spirocyclic expansion monomer, a preparation method thereof and a resin composition. The structural formula of the spirocyclic expansion monomer is as shown in formula I in the specification. The spiro expansion monomer has the advantages of high reaction activity, low shrinkage rate, good compatibility and the like, and the curing volume shrinkage rate of epoxy resin can be reduced through the ring opening effect of the spiro monomer after the spiro expansion monomer is added into an epoxy resin system, so that the curing shrinkage stress is reduced. The invention also provides a resin composition. The resin composition comprises epoxy resin and the spiro-expansive monomer and / or the oligomer of the spiro-expansive monomer. The spiro expansion monomer is applied to an epoxy resin system to prepare a precise fixing adhesive, the shrinkage rate of the adhesive in the curing process can be effectively reduced, so that the curing shrinkage stress is reduced, the coupling precision is improved, and the spiro expansion monomer is mainly applied to the fields of electronic component bonding, optical device bonding and fixing and the like.