5647results about "Line/current collector details" patented technology

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

A method of manufacturing a device for brain stimulation includes forming a lead body having a distal end section and coupling at least one pre-electrode to the distal end section of the lead body. The pre-electrode defines a divider with a plurality of partitioning arms, and has a plurality of fixing lumens. A portion of the pre-electrode aligned with the portioning arms is removed to divide the pre-electrode into a plurality of segmented electrodes. Each of the plurality of segmented electrodes defines at least one of the plurality of fixing lumens at least partially disposed through the segmented electrode. A material is introduced through the at least one fixing lumen to couple the plurality of segmented electrodes to the lead body.

A method of making a lead for a stimulation device includes forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions; disposing the at least one pre-electrode near a distal end of a lead body; joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form segmented electrodes from the thick-walled portions of the at least one pre-electrode.

One embodiment is a method of making a stimulation lead that includes providing a pre-electrode assembly comprising a plurality of segmented electrodes and a plurality of raised connectors. Each of the segmented electrodes is coupled to at least one other of the segmented electrodes by at least one of the raised connectors. The method further includes forming the pre-electrode assembly into a tube with the tube defining a longitudinal axis. Each of the raised connectors is disposed at a radius with respect to the longitudinal axis that is greater than a radius of any of the segmented electrodes with respect to the longitudinal axis. The method also includes forming at least a portion of a lead body around the segmented electrodes of the pre-electrode assembly; and grinding the tube comprising the pre-electrode assembly and portion of the lead body to remove the plurality of raised connectors leaving the plurality of segmented electrodes and the portion of the lead body.

A method of making a biosensor is provided. The biosensor includes an electrically conductive material on a base and electrode patterns formed on the base, the patterns having different feature sizes. The conductive material is partially removed from the base using broad field laser ablation so that less than 90% of the conductive material remains on the base and that the electrode pattern has an edge extending between two points. A standard deviation of the edge from a line extending between two points is less than about 6 μm.

RF/MRI compatible leads include at least one conductor that turns back on itself at least twice in a lengthwise direction, and can turn back on itself at least twice at multiple locations along its length. The at least one electrical lead can be configured so that the lead heats local tissue less than about 10 degrees Celsius (typically about 5 degrees Celsius or less) or does not heat local tissue when a patient is exposed to target RF frequencies at a peak input SAR of at least about 4 W/kg and/or a whole body average SAR of at least about 2 W/kg. Related devices and methods of fabricating leads are also described.

An automated assembly sensor cable has a generally wide and flat elongated body and a registration feature generally traversing the length of the body so as to identify the relative locations of conductors within the body. This cable configuration facilitates the automated attachment of the cable to an optical sensor circuit and corresponding connector. In various embodiments, the automated assembly sensor cable has a conductor set of insulated wires, a conductive inner jacket generally surrounding the conductor set, an outer jacket generally surrounding the inner jacket and a registration feature disposed along the surface of the outer jacket and a conductive drain line is embedded within the inner jacket. A strength member may be embedded within the inner jacket.

A method of preparing a surgical system for surgery includes inserting a battery assembly into an inner chamber of an aseptic bag through an open end of the aseptic bag, positioning a portion of a housing of a surgical instrument through the open end of the aseptic bag, coupling the battery assembly to the surgical instrument, and sealing the open end of the aseptic bag. The battery assembly is coupled to the surgical instrument while the battery assembly is within the inner chamber of the aseptic bag. When the open end of the aseptic bag is sealed the battery assembly is encapsulated within the inner chamber of the aseptic bag. A generator of the surgical system may additionally or alternatively be encapsulated similarly.

Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

A method for manufacturing a lead includes forming an elongated multi-lumen conductor guide defining a central stylet lumen and a plurality of conductor lumens arranged around the stylet lumen. The multi-lumen conductor guide is twisted to form at least one helical section where the plurality of conductor lumens each forms a helical pathway around the stylet lumen. Each of the helical pathways of the at least one helical section has a pitch that is no less than 0.04 turns per centimeter.

Electrical supply apparatus (201) for providing electrical power to a first type of socket and a second type of socket (410). The apparatus comprises an electrical power source (420) for providing electrical power, a first mains circuit (204) for conveying electrical power to the first type of socket, a second mains circuit (208) for conveying electrical power to the second type of socket, and a control unit (210) configured to interrupt the supply of electrical power through the second mains circuit, and thus to the second type of socket. The interruption of electrical power through the second mains circuit does not interrupt the supply of electrical power to the first type of socket.

A stimulation lead includes a lead body having a longitudinal length, a distal portion, and a proximal portion; terminals disposed along the proximal portion of the lead body; an electrode carrier coupled to, or disposed along, the distal portion of the lead body; segmented electrodes disposed along the electrode carrier; and conductors extending along the lead body and coupling the segmented electrodes to the terminals. The electrode carrier includes a lattice region defining segmented electrode receiving openings. Each of the segmented electrodes extends around no more than 75% of a circumference of the lead and is disposed in a different one of the segmented electrode receiving openings of the electrode carrier.

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.

Garments having one or more stretchable conductive ink patterns thereon. Described herein are garments (including compression garments) having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.

A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

A method of making an electrical stimulation lead includes attaching segmented electrodes to an interior of a ring in a circumferentially spaced-apart arrangement; attaching a conductor wire to each of the segmented electrodes; coupling the ring with the segmented electrodes to a lead body; and, after coupling to the lead body, removing at least those portions of the ring between the segmented electrodes to separate the plurality of segmented electrodes from each other.

An object of one embodiment of the present invention is to provide a more convenient highly reliable light-emitting device which can be used for a variety of applications. Another object of one embodiment of the present invention is to manufacture, without complicating the process, a highly reliable light-emitting device having a shape suitable for its intended purpose. In a manufacturing process of a light-emitting device, a light-emitting panel is manufactured which is at least partly curved by processing the shape to be molded after the manufacture of an electrode layer and/or an element layer, and a protective film covering a surface of the light-emitting panel which is at least partly curved is formed, so that a light-emitting device using the light-emitting panel has a more useful function and higher reliability.

An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in place, the shield acts to address electromagnetic interference (EMI) concerns associated with the electronic module. An electronic module having a ring of conductive material embedded about its peripheral edge is formed. The electronic module is then sub-diced so as to expose the ring of conductive material. After sub-dicing, a conductive material may be applied through an electroless plating process followed by an electrolytic plating process. Alternatively, a conductive epoxy may be sprayed or painted onto the surface of the electronic module.

A conducting thin-film nanoprobe card fabrication method includes the steps of: (a) arranging nanotubes on a substrate in vertical; (b) covering the nanotubes with a liquid polymeric resin and then hardening the polymeric resin to form a conducting nanomembrane; (c) removing a part of the polymeric resin from the conducting nanomembrane to expose one end of each nanotube to outside; (d) removing the substrate and preparing a ceramic substrate having contacts at one side and metal bumps at the other side and plated through holes electrically respectively connected with the contacts and the metal bumps; (e) mounting the nanomembrane on the ceramic substrate to hold the nanotubes in contact with the contacts of the ceramic substrate, and (f) forming recessed holes in the nanomembrane by etching and inserting a metal rod in each recessed hole to form a respective probe.

A pre-electrode for a stimulation lead includes a generally cylindrical body having an exterior surface, an interior surface, a proximal end, and a distal end. The body includes segmented electrodes disposed along the body in a spaced-apart configuration, connecting material coupling each of the segmented electrodes to one another and forming the exterior surface of the body, and cutouts defined between adjacent segmented electrodes. In some instances, the pre-electrode includes at least one depression in the exterior surface of the pre-electrode over one of the segmented electrode so that the pre-electrode is thinner at the depression than at immediately adjacent portions of the pre-electrode. In some instances, the pre-electrode includes at least one aperture extending into the body from the exterior surface and between two of the segmented electrodes with portions of the connecting material forming borders between the aperture and the proximal and distal ends of the pre-electrode.

A coaxial transmission medium connector is provided for connecting to a coaxial transmission medium to form a coaxial conduction path, wherein the coaxial transmission medium has an inner conductor and an outer conductor. The coaxial transmission medium connector includes an outer conductor portion for electrically coupling to the outer conductor of the coaxial transmission medium. The outer conductor portion includes a base portion, a plurality of cantilevered beams, and a plurality of slots extending substantially circumferentially about a substantially non-conductive cavity and substantially about a longitudinal axis extending through the cavity. Each of the cantilevered beams is coupled to the base portion at a transition portion and terminates at a distal end. Each of the cantilevered beams has a respective tapering profile with respect to the longitudinal axis that tapers in a direction away from the base portion. A center conductor portion is disposed within the cavity for electrically coupling to the inner conductor of the coaxial transmission medium. Related apparatus and methods are provided.

A semiconductor device typified by a wireless tag, which has improved mechanical strength, can be formed by a more simple process at a low cost and prevent radio waves from being shielded, and a manufacturing method of the semiconductor device. According to the invention, a wireless tag includes a thin film integrated circuit formed of an isolated TFT having a thin film semiconductor film. The wireless tag may be attached directly to an object, or attached to a flexible support such as plastic and paper before being attached to an object. The wireless tag of the invention may include an antenna as well as the thin film integrated circuit. The antenna allows to communicate signals between a reader/writer and the thin film integrated circuit, and to supply a power source voltage from the reader/writer to the thin film integrated circuit.

A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a number of through holes are provided. The opening and the through holes connect the first surface and the second surface. A chip is then disposed in the opening. Next, a dielectric layer is formed in the opening and the through holes to fix the chip in the opening. Thereafter, a number of conductive vias are respectively formed in the through holes and insulated from the metal core layer by a portion of the dielectric layer located in the through holes. A circuit structure is then formed on the first surface of the metal core layer by performing a build-up process, and the circuit structure electrically connects the chip and the conductive vias.

System for providing an open-cavity semiconductor package. The system includes a method for wire bonding a finger sensor die to an external circuit. The finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire, forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height, and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

A neural probe includes at least one shaft, at least one first electrode disposed on a first side of the at least one shaft, and at least one second electrode disposed on a second side of the at least one shaft. The at least one second electrode is separately addressable from the at least first electrode.

In one aspect, the invention relates to a configurable thermostat including a thermostat core having a user interface. The user interface includes a plurality of user interface keys, a display, a temperature sensor, and a temperature control. The configurable thermostat also includes a universal thermostat expansion port. The universal thermostat expansion port is disposed on the thermostat core. The universal thermostat expansion port includes at least one electrical connector. The electrical connector electrically couples a daughter board to the thermostat core, wherein the daughter board is communicately coupled to the thermostat core by an ASCII communications protocol. According to another aspect of the invention, a method for configuring a thermostat uses a personal computer with a thermostat having a user removable memory. Yet another aspect of the invention is a method for rapidly producing a thermostat having new features without needing to redesign the entire thermostat.

An adapter assembly selectively interconnects a surgical device with a surgical attachment that is configured to perform at least one function. The adapter assembly includes a proximal end that includes at least one mating part adapted to be detachably connected to a surgical device and configured to permit coupling of the adapter assembly to a surgical device in at least a first connection orientation and a second connection orientation.

Articles, systems, and methods related to the configuration of electrically non-conductive materials and related components in electrochemical cells are generally described. Some inventive electrochemical cell configurations include an electrically non-conductive material (e.g., as part of the electrolyte) that is configured to wrap around the edge of an electrode to prevent short circuiting of the electrochemical cell. In some embodiments, the electrically non-conductive material layer can be arranged such that it includes first and second portions (one on either side of an electrode) as well as a third portion adjacent the edge of the electrode that directly connects (and, in some cases, is substantially continuous with) the first and second portions. The electrically non-conductive material layer can be relatively thin while maintaining relatively high electrical insulation between the anode and the cathode, allowing one to produce an electrochemical cell with a relatively low mass and/or volume. The arrangements described above can be formed, for example, by forming a multi-layer structure comprising an electrode and an electrically non-conductive material layer (e.g., as a coating), and folding the multi-layer structure such that the electrically non-conductive material covers the convex surface portion of the resulting crease.