343results about How to "High stress" patented technology

Classes of liquid aminosilanes have been found which allow for the production of silicon carbo-nitride films of the general formula SixCyNz. These aminosilanes, in contrast, to some of the precursors employed heretofore, are liquid at room temperature and pressure allowing for convenient handling. In addition, the invention relates to a process for producing such films. The classes of compounds are generally represented by the formulas: and mixtures thereof, wherein R and R1 in the formulas represent aliphatic groups typically having from 2 to about 10 carbon atoms, e.g., alkyl, cycloalkyl with R and R1 in formula A also being combinable into a cyclic group, and R2 representing a single bond, (CH2)n, a ring, or SiH2.

A facet joint fixation system that provides initial rigidity for stabilizing the facet joint, is sufficiently strong to withstand facet joint shear stresses, and (after supporting a successful fusion) can be resorbed by the body.

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and / or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

A method of making a glass sheet (10) comprises laminating a high CTE core glass (11) to a low CTE clad glass (12) at high temperatures and allowing the laminate (10) to cool creating compressive stress in the clad glass (12), and then ion exchanging the laminate (10) to increase the compressive stress in the outer near surface regions of the clad glass (12). The core glass (11) may include ions that exchange with ion in the clad glass (12) to increase the compressive stress in inner surface regions of the clad glass (12) adjacent to the clad glass / core glass interfaces. The glass laminate (10) may be formed and laminated using a fusion forming and laminating process and fusion formable and ion exchangeable glass compositions.

An apparatus is provided for removing matter from within a conduit. The apparatus generally comprises a separation edge attached to a wire at its proximal end, a frame attached to the distal end of the separation edge, and a membrane attached to the wire and disposed over the frame enclosing its interior. The membrane generally comprises a net constructed from a vaporized metal deposited on a mandrel. Alternatively, the membrane may comprise a braided tube constructed from wire. The apparatus may be employed as a filter or as a means for actively dislodging matter from the wall of a conduit. When employed as a filter, the apparatus is positioned downstream of the matter where it ensures that matter does not escape downstream as it is being removed. When employed to actively remover matter from a conduit, the apparatus is positioned downstream of the matter. The apparatus is then pulled proximally whereby it engages the matter and dislodges it from the wall of the conduit

A vessel electrode line (10) for pacemaker stimulation and / or for sensing cardiac actions in the region of the atrium has an oblong base body (11) that receives at least one electrode supply line, and at least one electrode (13, 14) that is mounted on the base body, with the effective diameter of the electrode(s) being nearly identical to the diameter of the base body, and with fixing elements (11a) that essentially do not act as an electrode, and particularly have at least a partial insulating surface, being provided for fixedly positioning the electrode(s) with respect to the vessel wall.

An angioplasty balloon having an elastic constraining structure that partially expands with the balloon so that, at maximum balloon inflation, the constraining structure forms a pattern of channels or “pillows” on the balloon.

A valve body and seal assembly comprising a valve body having one or more peripheral integral seal retention grooves and one or more peripheral single-durometer and / or dual-durometer elastomeric seals, each seal being cast-in-place in an integral seal retention groove having adhesion-inhibiting surfaces and offset circular serrations of predetermined height on opposing groove walls. Adhesion-inhibiting surfaces reduce or eliminate internal elastomer stress due to curing of cast-in-place elastomeric seals. Serrations on each of the opposing groove walls are offset to accommodate differing stress concentrations in the walls. Opposing groove walls diverge peripherally. Offset serrations result in decreased metal fatigue from impact and bending stress. Offset serrations also improve valve sealing and increase valve service life by maintaining correct seal position on the valve body while minimizing background stress in the seal elastomer(s). Valve service life is also increased by appropriate choice of differing elastomer compositions for dual-durometer seals.

The invention relates to a single- or multilayer, oriented, film coated with an aminosilane compound and composed of polyester which comprises an additive which, on irradiation with electromagnetic radiation, forms metal nuclei on which further metal can be deposited in further steps of the process. The invention further relates to a process for producing this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits of any type.

A high strength Al-Mg alloy in plate or extrusion form having significantly improved strength in both soft and work-hardened tempers as compared with AA5083 is provided. The materials have ductility, pitting, stress and exfoliation corrosion resistances equivalent to those of the AA5083. The materials have improved long term stress and exfoliation corrosion resistances at temperatures above 80° C. The composition is 5-6% Mg, >0.6-1.2% Mn, 0.4-1.5% Zn, 0.05-0.25% Zr, up to 0.3% Cr, up to 0.2% Ti, up to 0.5% each Fe and Si, up to 0.4% each Cu and Ag, remainder Al and inevitable impurities. Manufacture of plate of this alloy is by homogenizing an ingot, hot rolling the ingot into plate in the range 400-530° C., cold rolling the plate with or without inter-annealing, final and optionally inter-annealing of the cold rolled material at temperatures in the range 200-550° C.

A method of fabricating an electrostatic actuator with an intrinsic stress gradient is provided. An electrode is formed on a substrate and a support layer is formed over the electrode. A metal layer is deposited onto the support layer via a deposition process. Deposition process conditions are varied in order to induce a stress gradient into the metal layer. The intrinsic stress in the metal layer increases in the direction from the bottom to the top of the metal layer. The support layer under the electrode is removed to release the electrostatic actuator.

A sheath and method of forming is disclosed for a bi-axial oriented made of high molecular weight polymers. The high molecular weight polymers provide a bi-axial oriented sheath with a high hoop stress and a thin wall thickness. A device and method of use is also disclosed for a device for delivery of a self-expanding prosthesis covered by a bi-axial oriented sheath made of high molecular weight polymers. The bi-axial oriented sheath may be moved from a first position constraining the self-expanding prosthesis to a second position releasing the self-expanding prosthesis. During delivery, the device is inserted into the vascular system of the patient, with the self-expanding prosthesis positioned at the location to be treated. The self-expanding prosthesis is then released by moving the bi-axial oriented sheath from the first to second positions, releasing the self-expanding prosthesis.

By using an implantation mask having a high intrinsic stress, SMT sequences may be provided in which additional lithography steps may be avoided. Consequently, a strain source may be provided without significantly contributing to the overall process complexity.

Non-pneumatic resilient wheel (10), that is supported structurally and defines three perpendicular directions, circumferential (X), axial (Y) and radial (Z), this wheel comprising: a hub (11); an annular band referred to as a shear band (13) comprising at least one inner circumferential membrane (14) and one outer circumferential membrane (16) that are oriented in the circumferential direction X; and a plurality of support elements (12) that connect the hub (11) to the inner circumferential membrane (14)U. The two membranes (14, 16) are connected to one another by means of a series, that extends in the circumferential direction (X), of cylinders (15) referred to as connection cylinders, said connection cylinders (15) being non-touching in the circumferential direction X and having their generatrix oriented in the axial direction Y. The connection cylinders (15) are composite cylinders comprising fibres embedded in a resin matrix.

Apparatus for holding semiconductor wafers during semiconductor manufacturing processes are disclosed. In one embodiment, the apparatus comprises a heat-conductive layer disposed on a supporting base. The apparatus also comprises a plurality of holes formed through the heat-conductive layer and the supporting base. The apparatus further comprises a plurality of heat-conductive lift pins that extend through the holes over the heat-conductive layer at the top end, and make a direct contact with a wafer substrate. The heat-conductive layer and the lift pins are connected to a heating circuit.

A reinforced arthroscope comprising external ribs to provide for a number of separate fluid channels, such as inflow, outflow and interstitial tissue drainage, when the arthroscope is slipped into a disposable external sheath. The arthroscope is constructed to be sufficiently rigid so as to penetrate and move within a joint without damaging the rod optics inside. The externality of the arthroscope channels allow for cleaning and sterilizing the scope between uses.

A rolling member excellent in pitting strength, spalling strength and bending strength of dedendum has a first quench hardened layer 1 which is formed on a surface layer of the rolling member and has a parent phase taking the form of martensite phase which forms a solid solution with carbon of 0.35 to 0.8 wt %, and a second quench hardened layer 2 which is formed at a deeper layer under the first quench hardened layer and has a parent phase containing at least either one of martensite phase or bainite phase which forms a solid solution with carbon of 0.07 to 0.3 wt % and contains cementite dispersed therein in a content of 2 to 20% by volume.

Certain example embodiments of this invention relate to vacuum insulated glass (VIG) units. The VIG unit may comprise first and second substrates with inner and outer substantially planar surfaces. For either or both of the first and second substrates, when considered along a side cross-section, a portion of the inner planar surface is removed proximate to an outer edge of the glass substrate so as to form a shoulder portion. An inner surface of the shoulder portion is angled (a negative number of degrees, zero degrees, or a positive number of degrees) relative to the inner and outer planar surfaces. The shoulder portion at its smallest height is at least about 50% of the glass substrate at its largest height. A side portion of the step proximate the edge also may be angled, e.g., so that it is or is not perpendicular to the planar surfaces.

An MEMS transducer is constituted of a diaphragm, a plate, a support structure for supporting the diaphragm and the plate with a gap layer surrounded by an interior wall, an electrode film (e.g. a pad conductive film) for covering a contact hole formed in the support structure, and a protective film (e.g. a pad protective film) which is formed on the support structure externally of the interior wall so as to cover the side surface of the electrode film having low chemical stability. The protective film is formed in the limited area including a part of the surface of the electrode film except for its center portion and the surrounding area of the electrode film. This allows the protective film to use materials having high membrane stress such as silicon nitride or silicon nitride oxide.

The invention relates to a single-layer, oriented polyester film where the polyester comprises an additive which on irradiation with electromagnetic radiation forms metal nuclei on which further metal can be accumulated during further steps of the process. The invention further relates to a process for producing this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits, of any type.

A method of varying the temperature of a tube bundle reactor for catalytic gas phase reactions upon start-up and shut-down, the tube bundle reactor comprising a major reactor portion which includes a bundle of vertically disposed reactor tubes, upper and lower tubesheets tightly connected to the upper and lower ends, respectively, of the reactor tubes, and a reactor shell enclosing the tube bundle, a heat transfer medium having a melting temperature in the range of from 100° C. to 450° C. flowing around the outer surfaces of the reactor tubes during normal operation and being circulated in at least one circuit through the major reactor portion, comprising the steps: (a) varying the heat transfer medium temperature during circulation of the heat transfer medium; and (b) passing a temperature gas through the reactor tubes at least when the heat transfer medium is not yet or no longer circulated.

The invention relates to aluminum silicate glass. The toughness of the ultrathin glass is increased by adopting an ion exchange chemical reinforcing method in a subsequent process. The aluminum silicate glass comprises the following components in percentage by weight: 55 to 70 percent of SiO2, 10 to 20 percent of Al2O3, 8 to 25 percent of at least one alkali metal oxide and the balance of additive, wherein ions of chemical reinforcing ion exchange are from alkali metal ions in the alkali metal oxide. After ion exchange chemical reinforcing, the surface pressure value of the aluminum silicate glass can reach over 700MPa, and the depth of the pressure stress layer can reach over 50 microns, so cracks on the surface of the glass can be totally covered, and the safety of the glass in application is greatly promoted. The invention also relates to a method for preparing the aluminum silicate glass.

A valve seal assembly comprising a valve body having one or more peripheral integral seal retention grooves and one or more peripheral elastomeric seals, each seal being cast-in-place in an integral seal retention groove having adhesion-inhibiting surfaces and offset circular serrations of predetermined height on opposing groove walls. Adhesion-inhibiting surfaces reduce or eliminate internal elastomer stress due to curing of cast-in-place elastomeric seals. Serrations on each of the opposing groove walls are offset to accommodate differing stress concentrations in the walls. Opposing groove walls preferably diverge peripherally. Offset serrations result in decreased metal fatigue from impact and bending stress. Offset serrations also improve valve sealing and increase valve service life by maintaining correct seal position on the valve body while minimizing background stress in the seal elastomer. In representative valve applications, serration height is preferably predetermined so that the cured elastomeric seal remains interdigitated with the serrations for greater than half of the predetermined serration height.

A mainspring used as a power source for a driving mechanism is made of an amorphous metal sheet, and has an S-shaped free-exploded shape. The curvature changing point where the curving direction of the free-exploded shape changes is formed on the inner end side of a middle point between the inner end on the winding side and the outer end serving as the other end of the inner end. Because of the high tensile stress and a low Young's modulus, the amorphous metal permits increase in mechanical energy stored in the mainspring.

The present invention provides a semiconductor structure that includes a high performance field effect transistor (FET) on a semiconductor-on-insulator (SOI) in which the insulator thereof is a stress-inducing material of a preselected geometry. Such a structure achieves performance enhancement from uniaxial stress, and the stress in the channel is not dependent on the layout design of the local contacts. In broad terms, the present invention relates to a semiconductor structure that comprises an upper semiconductor layer and a bottom semiconductor layer, wherein said upper semiconductor layer is separated from said bottom semiconductor layer in at least one region by a stress-inducing insulator having a preselected geometric shape, said stress-inducing insulator exerting a strain on the upper semiconductor layer.