425results about "Insulating substrate metal adhesion improvement" patented technology

The invention discloses a copper surface micro-etching coarsening solution for a fine circuit as well as a preparation method and application of the copper surface micro-etching coarsening solution, and relates to the technical field of printed circuit board manufacturing. The copper surface micro-etching coarsening solution for the fine circuit is prepared from, by mass concentration, 60 g / L to 100 g / L of sulfuric acid, 40 g / L to 60 g / L of hydrogen peroxide, 0.5 g / L to 2 g / L of zinc sulfate, 10 g / L to 30 g / L of copper ions, 0.5 g / L to 1 g / L of pyridine heterocycle-containing Schiff base, 10 g / L to 100 g / L of ethyl alcohol, 1 g / L to 3 g / L of 2-mercaptobenzothiazole, 1 g / L to 5 g / L of methionine and 1 g / L to 5 g / L of polyacrylamide. According to the copper surface micro-etching coarsening solution, the 2-mercaptobenzothiazole and the methionine in the copper surface micro-etching coarsening solution can enable the copper surface to form a honeycomb structure under the low micro-etching amount, the zinc sulfate and the pyridine heterocyclic ring-containing Schiff base can form a composite film layer with copper ions on the surface of the honeycomb structure, and the interlayer binding force is improved.

This application relates to the field of printed circuit board processing technology, and more specifically, to a low-electrical-loss copper bonding compound, its preparation method, and its application. The compound has the following structural formula: a polythiourea molecule with a nitrazole structure, wherein the degree of polymerization n is 3-10. This application benefits from the compound's special structure (C=S and -NH2), effectively achieving bonding under copper-free etching conditions, and the smooth copper surface meets the requirements for high-frequency signal transmission.

A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.

The invention discloses a composite browning liquid for a printed circuit board and a preparation method of the composite browning liquid. The composite browning liquid comprises the following components: 60-85 g / L of 98 wt% concentrated sulfuric acid, 12-20 g / L of 30 wt% hydrogen peroxide, 1-2 g / L of a modified corrosion inhibitor, 8-14 g / L of a silane coupling agent, 1.5-3 g / L of 1-butyl-3-methylimidazolium hydrogen sulfate, 4-8 g / L of an impregnating compound, 5-8 g / L of a dispersing agent and the balance of deionized water. The modified corrosion inhibitor prepared by a specific method, the silane coupling agent, the ionic liquid and the compound surfactant are scientifically compounded, so that the copper surface treatment effect is remarkably improved, and the inherent contradiction between binding force improvement and over-etching prevention of a traditional browning liquid is solved; the browning liquid has the advantages of stable treatment effect, long service life, reduction of waste liquid output and the like, and is suitable for industrial production requirements of high-density printed circuit boards.

The invention relates to a manufacturing method of a high-heat-dissipation circuit board. The manufacturing method comprises the following steps of manufacturing a first multi-layer board and a second multi-layer board; anti-etching photosensitive dry films are attached to the single faces of the first multilayer board and the second multilayer board; etching the exposed copper foil layers of the first multilayer board and the second multilayer board; semi-grooves are machined in the exposed film layers of the first multilayer board and the second multilayer board; the capillary copper pipe is subjected to blocking and browning treatment, and semi-cured resin coating is carried out; the first multi-layer plate and the second multi-layer plate are stacked, and the capillary copper pipe is horizontally arranged in the containing groove; riveting the first multi-layer plate and the second multi-layer plate which are pre-embedded with the capillary copper pipes by using a rivet through electromagnetic hot melting; laminating the riveted first and second multi-layer boards, the outer layer prepreg and the outer copper foil layer by using a vacuum laminating machine to form a semi-finished board; performing ultrasonic nondestructive testing on the semi-finished plate; and post-processing the semi-finished board to obtain the circuit board. According to the manufacturing method, the circuit board with the horizontally-embedded capillary copper pipe is obtained through the processes of film drying, single-face etching, groove milling and the like, and the heat dissipating capacity is increased.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

A copper block browning auxiliary jig for a copper block embedded circuit board is suitable for the field of copper block embedded PCB processing and comprises a board frame, the board frame comprises a whole-face covering screen cloth and a movable hinge with a one-way 90-degree bending position, the covering screen cloth is provided with a plurality of net bags, the net bags can be opened along with the one-way 90-degree bending of the board frame, and the movable hinge is provided with a plurality of clamping grooves. And a to-be-browned copper block is placed in the straight plate frame behind the net bag. According to the utility model, the problems of poor browning, scratches and the like caused by overlapping of ultra-small copper blocks through liquid medicine stamping during browning can be solved on the basis of the original production equipment, and the device can be applied to copper blocks in different shapes and can be repeatedly used, so that the cost input is saved, the production efficiency is improved, and the yield is improved.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

This invention proposes a multilayer circuit structure and its fabrication method. The multilayer circuit structure includes a substrate and integrated circuits disposed on both sides of the substrate. Each integrated circuit includes a flexible insulating layer and two flexible conductive layers disposed on both sides of the flexible insulating layer. Each flexible conductive layer has a rough surface and a smooth surface, with each rough surface in contact with the flexible insulating layer. One side of the flexible conductive layer has a rough surface that contacts the flexible insulating layer, significantly increasing the contact area and improving the adhesion between the flexible conductive layer and the flexible insulating layer. This design helps reduce the risk of delamination and peeling, enhances the mechanical stability of the circuit structure, and maintains stable performance, especially when subjected to thermal cycling and mechanical stress during manufacturing. The multilayer circuit structure uses a material with a certain degree of flexibility, enabling it to withstand stress from mechanical operations during manufacturing. The combination of these two factors improves the manufacturing yield of the multilayer circuit structure.

To improve the connection reliability.SOLUTION: A wiring board includes a wiring layer, an insulating layer laminated on the wiring layer, an opening that penetrates the insulating layer to the wiring layer, and a conductor film formed in the opening of the insulating layer. The surface of the insulating layer includes a smooth portion exposed from the conductor film, and a roughened portion including an inner wall surface of the opening covered with the conductor film and having a surface roughness larger than that of the smooth portion.SELECTED DRAWING: Figure 2

This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

This invention discloses a selective roughening method for ceramic copper-clad laminates, comprising the following preparation steps: S1 printing an active solder layer between ceramic and copper foil; S2 preparing the ceramic copper-clad laminate; S3 etching copper onto the sintered ceramic copper-clad laminate; S4 removing unwanted solder layers; S5 cleaning, roughening, cleaning, acid washing, cleaning, immersion, and drying the patterned ceramic copper-clad laminate according to the following process, and filling it with nano-silicon and organosilane; S6 printing a thermosetting wet film to expose the area to be surface treated; S7 removing the surface roughening structure; S8 finally, subjecting the ceramic copper-clad laminate to nickel plating, chemical silvering, and then stripping to form the final structure. Compared with the prior art, this invention has the following beneficial effects: effectively avoiding the problem of solder voids caused by surface roughening pits, good surface weldability, and the concave structure of the welding area effectively prevents solder overflow during the welding process and reduces micropores in the chemical silver plating layer.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

The present invention provides a laminated structure which is suitable for the manufacture of a printed board and which can suppress peeling of a wiring pattern when a bending stress is applied to the printed board. A laminated structure includes a resin base material and a metal layer provided on a first surface of the resin base material, the resin base material having a recessed portion which opens on the first surface and an inner surface of the recessed portion having a stress relaxation structure, a portion of the metal layer extending into the recessed portion.

A rigid-flex printed circuit board with blind holes made of different materials and in the same layer comprises single-face flexible base materials arranged on the upper side surface and the lower side surface, and semi-solidified layers and double-face flexible base materials which are sequentially and alternately stacked between the single-face flexible base materials. The rigid-flex board comprises a rigid area and a flexible area, and the flexible area can be bent relative to the rigid area; the semi-cured layer comprises at least one mixed layer, the mixed layer comprises a semi-cured part located in a rigid area, and the rest part is a pure glue part; the mixed layer is arranged between the single-sided flexible base material and the double-sided flexible base material, and the single-sided flexible base material is communicated with the double-sided flexible base material through a blind hole; the blind holes comprise rigid blind holes located in the rigid area and flexible blind holes located in the flexible area. The rigid blind holes and the flexible blind holes are arranged, so that the problem that excessive glue removal or glue residue is easy to occur in blind hole processing due to the fact that prepreg glue and pure glue exist in the same dielectric layer of an existing rigid-flexible combined board is solved.

Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the surface texture aspect ratio Str is 0.02-0.24, and the load area ratio Smr1 separating protruding peaks from a core portion is 1.0-15.0%. Str and Smr1 are values measured in compliance with ISO 25178 at a cutoff wavelength of 0.251 μm using an S-filter and at a cutoff wavelength of 4.5 μm using an L-filter.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1

The invention discloses a multi-layer aluminum core copper-clad plate based on a plasma anodic oxidation coating and further discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: pretreating an aluminum core; performing plasma anodic oxidation by adopting a pulse power supply, and generating an aluminum oxide ceramic insulating layer on the surface of the aluminum core in situ; positioning and drilling the aluminum core, and sealing the hole with insulating resin; adhering copper foils to the two sides of the aluminum core to form a double-sided plasma anodic oxidation copper-clad aluminum plate; performing pattern manufacturing on the surface of the double-sided plasma anodic oxidation copper-clad aluminum plate, overlapping multiple layers of copper-clad aluminum plates, and performing hot-pressing curing; carrying out through hole processing and hole metallization on the copper-clad plate subjected to multi-layer lamination; and performing pattern manufacturing and anti-oxidation treatment on the surface of the copper-clad plate to obtain the multi-layer aluminum core copper-clad plate. The multi-layer aluminum core copper-clad plate has excellent mechanical reliability, insulation stability, longitudinal heat conduction efficiency and high-frequency signal transmission performance.

The instant invention relates to a method for treating a surface of a metal, a metal alloy or a metal oxide by contacting the at least one section of said metal, metal alloy or metal oxide with an acidic aqueous precoat solution comprising one or more than one tetrazole and / or triazole in combination with an acidic cleaning step which is performed either prior to or following the precoat step. It has surprisingly been found that when such pretreated surfaces are subsequently contacted with triazine compounds that the surfaces exhibit an improved resistance to delamination under thermal, humidity, and chemical stress conditions. This is demonstrated by increased adhesion strength and wedge void reduction.

The application provides a manufacturing method of glass direct copper clad circuit, relates to the technical field of microelectronic circuit manufacturing, and comprises the following steps: S01, copper foil surface planarization: the copper foil is adhered to a UV photosensitive adhesive film, and the surface of the adhered copper foil is ground; after the surface of the copper foil is ground to reach a target roughness, the copper foil is cleaned and dried; S02, laminated static pressure: a glass substrate, the UV photosensitive adhesive film with the adhered copper foil and a carrier plate are sequentially laminated and fixed, vacuum is drawn and sealed, static pressure is applied to the formed sealed body, and a structure to be welded is obtained; and S03, laser selective welding: an ultrashort pulse laser and a short pulse are combined, and multiple compound scans are performed by using an energy gradient, so that the problem that an interface gap cannot be effectively reduced and the interface is easy to be ablated when a laser is used for welding to manufacture a glass copper clad circuit is solved, and the interface fusion capacity between the copper foil and the glass is improved.

The invention discloses an insulating multi-layer Clip applied to a power module and a preparation method of the insulating multi-layer Clip, aging and layering risks of a traditional adhesive are eliminated through an adhesive-free laminated structure of the insulating multi-layer Clip, heat resistance, chemical resistance and long-term reliability of a product are improved, and meanwhile, an adhesive layer is omitted, so that the overall thickness of the product is thinner and more flexible; through the connection of deep drawing forming and the surface silver / nickel plating process, the three-dimensional assembly requirement of the insulation multi-layer Clip is met, and the conductive performance and the contact reliability of the circuit are improved. Multiple alignment errors are avoided through a one-time pressing process, the interlayer alignment precision is extremely high, the thickness of the dielectric layer is uniform, and the electrical performance consistency is good; the size precision and the circuit integrity of the product are guaranteed through the working procedures of drilling, etching, laser cutting and the like in combination with the precise temperature control and positioning technology. The method can be applied to the technical field of chip packaging.

Provided is a laminated structure suitable for manufacturing a printed board, the laminated structure being capable of suppressing peeling of a wiring pattern at the time of application of bending stress to the printed board. The laminate structure includes a resin base material and a metal layer provided on a first surface of the resin base material. The resin base material has a recessed portion opening in the first surface, has a stress relaxation structure on an inner surface of the recessed portion, and a part of the metal layer extends into the recessed portion.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

The present invention aims to provide a metal layered substrate with a carrier layer which maintains low adhesion between the carrier layer and an extremely thin metal layer while ensuring high adhesion of the extremely thin metal layer and a low dielectric film. In a metal layered substrate with a carrier layer 1A, an extremely thin metal layered foil 10 composed of three layers including a carrier layer 11, a separation layer 12, and an extremely thin metal layer 13 is layered on at least one side of a low dielectric film 20, characterized in that the bonding strength of the extremely thin metal layer 13 and the low dielectric film 20 is greater than the separation strength of the carrier layer 11 and the extremely thin metal layer 13.

The invention discloses a PCB production process for enhancing the binding force of semi-buried copper and a PCB, and the PCB production process comprises the following steps: S1, providing a copper block, and carrying out the roughening of at least one side surface, to be combined with a prepreg, of the copper block, so as to form a machining knife pattern on the side surface; s2, placing the roughened copper block in a window pre-formed in the core board or the inner-layer circuit board to form a semi-buried copper structure; s3, overlapping at least one prepreg on the surface of the semi-buried copper structure; and S4, a pressing process is carried out, the prepreg resin in the molten state flows into and fills the machining cutter lines on the side faces of the copper blocks, and after cooling, the prepreg resin and the copper blocks form a mechanical interlocking structure. The PCB is manufactured by using the PCB production process.

Disclosed is a substrate for printed circuits, which comprises a base film having polyimide as a main component and a conductor layer formed on at least one side of the base film, the conductor layer having a metal sintered layer formed on the base film and an electrolysis-free plating layer formed on the metal sintered layer, wherein the number of voids having a maximum width of 5 μm or more in plan view in the base film is 10 or less per 0.25 mm 2 of the reference unit area on the surface of the base film.

The application belongs to the technical field of PCB plating, and relates to a high-precision LED PCB and a preparation method thereof, which comprises the following steps: pretreating a PCB substrate, wherein the PCB substrate has a through hole; depositing a first conductive layer on the hole wall of the PCB substrate; depositing a first metal layer on the surface and the hole wall of the PCB substrate; using a developing exposure process to make a resist film cover part of the surface of the circuit board and expose the through hole area of the surface of the circuit board, so as to form a plating pattern; depositing a second metal layer on the hole wall of the preset through hole area of the PCB substrate to obtain a preliminary product; and post-treating the preliminary product, wherein the post-treatment comprises resin hole plugging, film stripping and grinding to obtain the LED PCB. The application realizes a breakthrough in precision and reliability, greatly improves the product quality consistency, obtains a very high surface flatness of the copper surface, significantly optimizes the production efficiency and cost benefit, and provides a replicable paradigm for industry upgrading.

The invention relates to a flexible printed circuit board comprising a conductor track unit (14). A first side (30) of the conductor track unit (14) is connected to a first carrier film (16) by means of a first adhesive layer (18). A first outer side (20) of the flexible printed circuit board (12) is formed by a surface of the first carrier foil (16) facing away from the conductor track unit (14). The flexible printed circuit board (12) comprises a second carrier film (26) which is connected to a second side (32) of the conductor track unit (14) by means of a second adhesive layer (28). A second outer side (34) of the flexible printed circuit board (12) is formed by a surface of the second carrier film (26) facing away from the conductor track unit (14). The first adhesive layer (18) has a lower thickness (40) than the second adhesive layer (28). The invention also relates to a control device comprising such a printed circuit board (12) and to a method for manufacturing a flexible printed circuit board (12).