275results about "Insulating substrate metal adhesion improvement" patented technology

A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

A rigid-flex printed circuit board with blind holes made of different materials and in the same layer comprises single-face flexible base materials arranged on the upper side surface and the lower side surface, and semi-solidified layers and double-face flexible base materials which are sequentially and alternately stacked between the single-face flexible base materials. The rigid-flex board comprises a rigid area and a flexible area, and the flexible area can be bent relative to the rigid area; the semi-cured layer comprises at least one mixed layer, the mixed layer comprises a semi-cured part located in a rigid area, and the rest part is a pure glue part; the mixed layer is arranged between the single-sided flexible base material and the double-sided flexible base material, and the single-sided flexible base material is communicated with the double-sided flexible base material through a blind hole; the blind holes comprise rigid blind holes located in the rigid area and flexible blind holes located in the flexible area. The rigid blind holes and the flexible blind holes are arranged, so that the problem that excessive glue removal or glue residue is easy to occur in blind hole processing due to the fact that prepreg glue and pure glue exist in the same dielectric layer of an existing rigid-flexible combined board is solved.

Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the surface texture aspect ratio Str is 0.02-0.24, and the load area ratio Smr1 separating protruding peaks from a core portion is 1.0-15.0%. Str and Smr1 are values measured in compliance with ISO 25178 at a cutoff wavelength of 0.251 μm using an S-filter and at a cutoff wavelength of 4.5 μm using an L-filter.

The invention discloses a multi-layer aluminum core copper-clad plate based on a plasma anodic oxidation coating and further discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: pretreating an aluminum core; performing plasma anodic oxidation by adopting a pulse power supply, and generating an aluminum oxide ceramic insulating layer on the surface of the aluminum core in situ; positioning and drilling the aluminum core, and sealing the hole with insulating resin; adhering copper foils to the two sides of the aluminum core to form a double-sided plasma anodic oxidation copper-clad aluminum plate; performing pattern manufacturing on the surface of the double-sided plasma anodic oxidation copper-clad aluminum plate, overlapping multiple layers of copper-clad aluminum plates, and performing hot-pressing curing; carrying out through hole processing and hole metallization on the copper-clad plate subjected to multi-layer lamination; and performing pattern manufacturing and anti-oxidation treatment on the surface of the copper-clad plate to obtain the multi-layer aluminum core copper-clad plate. The multi-layer aluminum core copper-clad plate has excellent mechanical reliability, insulation stability, longitudinal heat conduction efficiency and high-frequency signal transmission performance.

The instant invention relates to a method for treating a surface of a metal, a metal alloy or a metal oxide by contacting the at least one section of said metal, metal alloy or metal oxide with an acidic aqueous precoat solution comprising one or more than one tetrazole and / or triazole in combination with an acidic cleaning step which is performed either prior to or following the precoat step. It has surprisingly been found that when such pretreated surfaces are subsequently contacted with triazine compounds that the surfaces exhibit an improved resistance to delamination under thermal, humidity, and chemical stress conditions. This is demonstrated by increased adhesion strength and wedge void reduction.

The application provides a manufacturing method of glass direct copper clad circuit, relates to the technical field of microelectronic circuit manufacturing, and comprises the following steps: S01, copper foil surface planarization: the copper foil is adhered to a UV photosensitive adhesive film, and the surface of the adhered copper foil is ground; after the surface of the copper foil is ground to reach a target roughness, the copper foil is cleaned and dried; S02, laminated static pressure: a glass substrate, the UV photosensitive adhesive film with the adhered copper foil and a carrier plate are sequentially laminated and fixed, vacuum is drawn and sealed, static pressure is applied to the formed sealed body, and a structure to be welded is obtained; and S03, laser selective welding: an ultrashort pulse laser and a short pulse are combined, and multiple compound scans are performed by using an energy gradient, so that the problem that an interface gap cannot be effectively reduced and the interface is easy to be ablated when a laser is used for welding to manufacture a glass copper clad circuit is solved, and the interface fusion capacity between the copper foil and the glass is improved.

The invention discloses an insulating multi-layer Clip applied to a power module and a preparation method of the insulating multi-layer Clip, aging and layering risks of a traditional adhesive are eliminated through an adhesive-free laminated structure of the insulating multi-layer Clip, heat resistance, chemical resistance and long-term reliability of a product are improved, and meanwhile, an adhesive layer is omitted, so that the overall thickness of the product is thinner and more flexible; through the connection of deep drawing forming and the surface silver / nickel plating process, the three-dimensional assembly requirement of the insulation multi-layer Clip is met, and the conductive performance and the contact reliability of the circuit are improved. Multiple alignment errors are avoided through a one-time pressing process, the interlayer alignment precision is extremely high, the thickness of the dielectric layer is uniform, and the electrical performance consistency is good; the size precision and the circuit integrity of the product are guaranteed through the working procedures of drilling, etching, laser cutting and the like in combination with the precise temperature control and positioning technology. The method can be applied to the technical field of chip packaging.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

The present invention aims to provide a metal layered substrate with a carrier layer which maintains low adhesion between the carrier layer and an extremely thin metal layer while ensuring high adhesion of the extremely thin metal layer and a low dielectric film. In a metal layered substrate with a carrier layer 1A, an extremely thin metal layered foil 10 composed of three layers including a carrier layer 11, a separation layer 12, and an extremely thin metal layer 13 is layered on at least one side of a low dielectric film 20, characterized in that the bonding strength of the extremely thin metal layer 13 and the low dielectric film 20 is greater than the separation strength of the carrier layer 11 and the extremely thin metal layer 13.

The invention discloses a PCB production process for enhancing the binding force of semi-buried copper and a PCB, and the PCB production process comprises the following steps: S1, providing a copper block, and carrying out the roughening of at least one side surface, to be combined with a prepreg, of the copper block, so as to form a machining knife pattern on the side surface; s2, placing the roughened copper block in a window pre-formed in the core board or the inner-layer circuit board to form a semi-buried copper structure; s3, overlapping at least one prepreg on the surface of the semi-buried copper structure; and S4, a pressing process is carried out, the prepreg resin in the molten state flows into and fills the machining cutter lines on the side faces of the copper blocks, and after cooling, the prepreg resin and the copper blocks form a mechanical interlocking structure. The PCB is manufactured by using the PCB production process.

The application belongs to the technical field of PCB plating, and relates to a high-precision LED PCB and a preparation method thereof, which comprises the following steps: pretreating a PCB substrate, wherein the PCB substrate has a through hole; depositing a first conductive layer on the hole wall of the PCB substrate; depositing a first metal layer on the surface and the hole wall of the PCB substrate; using a developing exposure process to make a resist film cover part of the surface of the circuit board and expose the through hole area of the surface of the circuit board, so as to form a plating pattern; depositing a second metal layer on the hole wall of the preset through hole area of the PCB substrate to obtain a preliminary product; and post-treating the preliminary product, wherein the post-treatment comprises resin hole plugging, film stripping and grinding to obtain the LED PCB. The application realizes a breakthrough in precision and reliability, greatly improves the product quality consistency, obtains a very high surface flatness of the copper surface, significantly optimizes the production efficiency and cost benefit, and provides a replicable paradigm for industry upgrading.

There is described a product (100), in particular a component carrier, comprising: i) an electrically insulating layer structure (102); ii) an electrically conductive layer structure (104); and iii) at least one glass barrier layer (150), at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104). The at least one glass barrier layer (150) comprises two main surfaces (150a, 150b), wherein the two main surfaces (150a, 150b) comprise a different adhesion property. Further, a manufacture method is described.

The invention relates to the field of PCB manufacturing, in particular to a heat dissipation type thick copper PCB preparation method for a high-power coil, and the method comprises the following steps: S1, modifying original high-thermal-conductivity fibers to obtain surface modified high-thermal-conductivity fibers; s2, mixing the surface-modified high-thermal-conductivity fibers with a resin glue solution, and performing impregnation and drying to obtain a composite prepreg; s3, forming a thick copper coil circuit on the insulating base material through an etching process; s4, performing press fit treatment to obtain a PCB semi-finished product with a high-thermal-conductivity fiber layer embedded in the middle; s5, performing drilling processing on the PCB semi-finished product obtained in the S4; s6, appearance plate milling is conducted, and a metal edge covering layer is manufactured in an edge covering area; and S7, post-processing is carried out on the PCB after metal edge covering in the step S6. According to the invention, by constructing the three-dimensional heat dissipation network composed of the high heat conduction fiber layer, the heat conduction through holes and the plate edge metal edge covering layer, efficient heat dissipation of the thick copper coil plate is realized under the condition that an external fan is not needed.

The present invention provides a bonding material that achieves good bonding strength even when bonding at low temperatures. Flake-shaped silver oxide particles or a silver oxide powder containing the particles are provided. The flake-shaped silver oxide particles have an average thickness of 10 to 100 nm and a D50 of 100 to 350 nm. Moreover, the flake-shaped silver oxide particles or silver oxide powder containing the particles may be used as a paste for bonding a semiconductor substrate with, for example, a power semiconductor chip.

To provide a method for manufacturing a wiring board and a wiring board which can achieve copper wiring having high adhesion strength, even if copper is directly sputtered on an insulation layer.SOLUTION: A method for manufacturing a wiring board includes the steps of: irradiating an insulation resin layer with vacuum ultraviolet rays; and directly forming a copper film on the insulation resin layer irradiated with the vacuum ultraviolet rays by sputtering.SELECTED DRAWING: Figure 2

The invention provides a process method for improving the uniformity of a PCB (Printed Circuit Board) mixed compression material dielectric layer. The process method comprises the following steps of: performing browning, combining, riveting, laminating, pressing, target drilling, cutting and grinding, drilling, inner layer processing, browning, laminating, pressing, target drilling, cutting and grinding on an inner layer board of a PCB. According to the process method for improving the uniformity of the dielectric layer of the PCB mixed compression material, a traditional one-time compression process is replaced, the poor thickness uniformity of the dielectric layer caused by the characteristic difference of a Standard Loss material and an Ultra low loss material can be improved, and the thickness difference of the dielectric layer caused by mixed compression of the Standard Loss material and the Ultra low loss material of a thick multilayer board can be improved. By means of the method, the poor laser hole machining quality caused by non-uniformity of the mixed pressing dielectric layer can be effectively improved, the back drilling hole stub control precision and impedance control uniformity are improved, and the market trend requirement can be met.

A high-precision circuit board and a preparation method therefor. The method comprises: acquiring a preset circuit diagram (S1001); arranging a plurality of conductive layer groups on the basis of the preset circuit diagram, wherein conductive layers requiring formation of the same blind hole or buried hole constitute a conductive layer group, adjacent conductive layers requiring no formation of a blind hole or buried hole constitute a conductive layer group, and the conductive layer groups comprise core boards (S1002); disposing conductive layers in a stacked manner, disposing adhesive layers between the core boards of the same group or between the core boards and the conductive layers, and disposing an auxiliary layer between different conductive layer groups (S1003); laminating the stacked conductive layers, the adhesive layers, and the auxiliary layer, and peeling off the auxiliary layer after the lamination, so that the conductive layer groups constitute sub-boards (S1004); performing drilling at a preset position of a sub-board to form a through hole (S1005); disposing the sub-boards in a stacked manner, and disposing an adhesive layer between adjacent sub-boards (S1006); and laminating the stacked sub-boards and the adhesive layer (S1007).

There is provided a copper-ceramic bonded substrate, including: a ceramic substrate; and a copper sheet bonded to at least one surface of the ceramic substrate, wherein a dislocation density of the copper sheet is 1.5×1013 m-2 or less.

A substrate structure including a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one dielectric layer and at least one pad. The dielectric substrate has an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the through-hole of the dielectric substrate. The conductive material fills the through-hole to define at least one conductive through-hole. The dielectric layer is disposed on the APL and has at least one opening exposing the conductive through-hole. A diameter of the opening is greater than a diameter of the conductive through-hole. The pad is disposed in the opening, extends onto the dielectric layer, and electrically connected to the conductive through-hole.

A second layered body is located in a positive direction of a Z-axis of a first layered body. The second layered body is fixed to the first layered body as a result of bonding a first insulating body layer and a second insulating body layer. Regions that are obtained by dividing the first layered body into three equal parts in the Z-axis direction are treated as a positive region, a middle region, and a negative region. At least one section of each of one or more positive-region first conducting body layers is located in the positive region. The entirety of each of one or more middle-region first conducting body layers is located in the middle region. The Z-axis direction thickness of at least one of the one or more positive-region first conducting body layers is greater than the respective Z-axis direction thicknesses of the one or more middle-region first conducting body layers.

A copper / ceramic bonded body includes: a copper member (22) made of copper or a copper alloy; and a ceramic member (11) made of a silicon nitride, wherein the copper member (22) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (31) is provided on a ceramic member (11) side of a bonded interface between the copper member (22) and the ceramic member (11), a Mg solid solution layer (32) is provided between the magnesium oxide layer (31) and the copper member (22) and contains Mg in a state of a solid solution in a Cu primary phase, and a magnesium nitride phase (35) is present on a magnesium oxide layer (31) side of the Mg solid solution layer (32).

According to the present invention, there is provided a copper / ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf / µm2 or more and 150 mgf / µm2 or less, the region being from 10 µm to 50 µm with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.

The utility model discloses a jig for improving copper block brownification efficiency, which comprises a plurality of copper block units arranged in a matrix, each copper block unit comprises a plurality of small units arranged in a matrix, each small unit comprises an upper cover plate and a lower cover plate, a plurality of uniformly distributed through holes are arranged in the middle of the upper cover plate and the middle of the lower cover plate, and the through holes are arranged in the middle of the upper cover plate and the middle of the lower cover plate. Grooves are formed in the positions, corresponding to the through holes, of the lower surface of the upper cover plate and the upper surface of the lower cover plate; by optimizing the clamp structure, hollowed-out and over-wide and over-dense reinforcing ribs are reduced, the copper block covering density is increased, and the processing efficiency is improved; the copper block is supported through the wavy bottom surface and the triangular platform, the contact between the copper block and the boundary is redesigned, the contact area is reduced, and the browning effect is improved; through the first snap fastener and the second snap fastener, the fixing mode is improved, the copper block is prevented from shifting, the fixing mode is epoxy resin glue which is consistent with an epoxy board resin material, and new impurities cannot be introduced, and liquid medicine cannot be polluted.

The invention relates to a method for applying a protective coating (5) to a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and cured to obtain the protective coating (5). It is provided that the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and that the solvent is reduced on its way from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).