815results about "Insulating substrate metal adhesion improvement" patented technology

Disclosed herein are bonded structures and methods of forming the bonded structures. In some embodiments, the bonded structures include a first element having an inorganic dielectric surface, a second element having an organic dielectric surface, an interface layer between the first and second elements and bonded to the inorganic and organic dielectric surfaces. The method of forming the bonded structure includes providing the first and second elements, exposing the inorganic dielectric surface to a silane coupling agent to form the interface layer, contacting the organic dielectric surface to the interface layer, and heating the first element, second element, and interface layer to bond the first element to the second element.

The invention belongs to the technical field of circuit boards, and discloses a composite pressing process of a high multilayer rigid-flex circuit board, which comprises the following steps: performing microstructure processing on the surface of a rigid base material to form a three-dimensional reinforced interface, and performing chemical grafting modification treatment on a flexible base material to generate a multilayer pretreated substrate; identifying the positioning mark of each layer of substrate through an optical positioning system, establishing a lamination stress prediction model in combination with the thermodynamic parameters of the material, and outputting a lamination configuration scheme containing an interlayer matching relationship; placing the configured laminated structure in a multi-temperature-zone press, and executing a three-stage gradient heating and pressurizing program to realize interface fusion between adjacent layers of substrates; monitoring an interlayer deformation difference value of the substrate in real time through a sensing network, and eliminating the deformation difference to obtain a press-fit molded circuit substrate; through heterogeneous interface strengthening design, multi-physical field cooperative pressing and real-time deformation compensation, accurate interface fusion and low-warpage forming of the high-multilayer rigid-flex circuit board are realized.

The invention discloses a copper-clad plate as well as a middle layer and a preparation method and application thereof, and belongs to the technical field of copper-clad plates. The preparation method of the intermediate layer for the copper-clad plate comprises the following steps: orthogonally weaving PBO fibers and glass fibers to obtain blend fibers; the mass ratio of the PBO fibers to the glass fibers is (10: 90)-(60: 40); carrying out modification treatment on the blend fibers to obtain modified blend fibers; dipping the modified blend fiber in a resin-containing dipping solution; and drying the impregnated modified blend fiber. The preparation method is simple and easy to operate, the PBO fibers and the glass fibers are orthogonally woven according to a specific ratio, so that on one hand, the blend fibers have the advantages of the PBO fibers and the glass fibers, on the other hand, the anisotropy of the blend fibers is effectively optimized, and the obtained copper-clad plate has relatively low dielectric loss and expansion coefficient; the peeling strength, the heat resistance and the flexibility are better.

The invention relates to a printed circuit board with a ceramic substrate embedded in a local area and a preparation method of the printed circuit board, and belongs to the technical field of semiconductor devices. The preparation method comprises the following steps: performing surface treatment on the upper surface and the lower surface of the core plate to form the L3 layer and the L4 layer; processing a through groove; sticking an adhesive tape; mounting the power chip module in the through groove; forming a first bonding layer and an L2 layer on the surface of the L3 layer; removing the adhesive tape; forming a second bonding layer and an L5 layer on the surface of the L4 layer; processing a blind hole and filling copper; processing a through hole and metalizing the inner wall; performing surface treatment on the L2 layer and the L5 layer; the ceramic substrate is bonded to the area, corresponding to the power chip module, of the surface of the L5 layer through silver paste and is baked and fixed; forming a third bonding layer and an L1 layer on the surface of the L2 layer; forming a fourth bonding layer and an L6 layer on the surface of the L5 layer; processing a blind hole and filling copper; performing surface treatment on the L1 layer; and resistance welding processing, anti-oxidation treatment and cutting forming are carried out. According to the preparation method, the heat dissipation performance and the voltage tolerance of the printed circuit board can be effectively improved.

The invention provides a preparation method of a charging pile circuit board and the charging pile circuit board. The method comprises the following steps: obtaining a to-be-embedded copper block required by a charging pile circuit board; embedding the copper block to be embedded into a core plate to obtain the core plate with the copper block; laminating the copper foil, the cured sheet and the core plate with the copper block to obtain a laminated plate; performing circuit manufacturing on the laminated plate to obtain a first charging pile circuit board; obtaining a heat parameter of the first charging pile circuit board under a heat simulation model; inputting the heat parameter into a preset heat dissipation evaluation model for evaluating the heat dissipation effect of the circuit board to obtain an evaluation result; according to the evaluation result, manufacturing parameters of a target charging pile circuit board are determined; and obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board, the target to-be-embedded copper block, the target core board, the target copper foil and the target cured sheet. The heat dissipation performance of the charging pile circuit board can be improved.

The invention discloses a copper surface micro-etching coarsening solution for a fine circuit as well as a preparation method and application of the copper surface micro-etching coarsening solution, and relates to the technical field of printed circuit board manufacturing. The copper surface micro-etching coarsening solution for the fine circuit is prepared from, by mass concentration, 60 g / L to 100 g / L of sulfuric acid, 40 g / L to 60 g / L of hydrogen peroxide, 0.5 g / L to 2 g / L of zinc sulfate, 10 g / L to 30 g / L of copper ions, 0.5 g / L to 1 g / L of pyridine heterocycle-containing Schiff base, 10 g / L to 100 g / L of ethyl alcohol, 1 g / L to 3 g / L of 2-mercaptobenzothiazole, 1 g / L to 5 g / L of methionine and 1 g / L to 5 g / L of polyacrylamide. According to the copper surface micro-etching coarsening solution, the 2-mercaptobenzothiazole and the methionine in the copper surface micro-etching coarsening solution can enable the copper surface to form a honeycomb structure under the low micro-etching amount, the zinc sulfate and the pyridine heterocyclic ring-containing Schiff base can form a composite film layer with copper ions on the surface of the honeycomb structure, and the interlayer binding force is improved.

The present invention relates to a ceramic substrate unit and to a method for manufacturing same. The ceramic substrate has a plurality of line grooves, through which air flows, formed on an upper surface of a lower metal layer thereof, so that heat generated in a semiconductor chip can be released to the outside by air convection, and warping caused by a volume difference between an upper metal layer and the lower metal layer can be suppressed.

The present invention relates to a copper-clad plate with plated-through holes, a circuit board with plated-through holes, and manufacturing methods therefor. Specifically, a method for manufacturing a copper-clad plate with plated-through holes comprises the following steps: drilling an insulating substrate; performing a pre-treatment on the substrate with holes; simultaneously treating the surface and hole walls of the substrate by means of a combination of a plurality of physical vapor deposition methods, so as to form conductive seed layers on the surface and hole walls of the substrate, thereby obtaining a metallized substrate with plated-through holes; and performing electroplating thickening on the metallized substrate, so as to obtain a copper-clad plate with plated-through holes.

The invention discloses a preparation process of a thick film circuit board based on a thick film copper metal ceramic base, and relates to the technical field of circuit boards. Comprising the following steps: step 1, in a nitrogen atmosphere, adding a binder into a solvent, and uniformly stirring to obtain an organic carrier; the pretreated copper particles are added, and stirring is conducted for 20-30 minutes at the set temperature of 40-50 DEG C; adding glass powder, grinding and mixing; thick film copper paste is obtained; 2, uniformly printing the copper slurry on a ceramic substrate; putting into a sintering furnace, and pre-drying for 10-30 minutes at 150-160 DEG C in a nitrogen atmosphere; raising the temperature to 220-230 DEG C, and performing medium baking for 10-30 minutes; raising the temperature to 450-550 DEG C, and calcining for 30-40 minutes for the first time; carrying out secondary calcination for 20 to 30 minutes at the temperature of 800 to 900 DEG C; cooling, and placing in a room temperature environment for 1-2 hours to form a thick film copper layer; and the thick film circuit board with excellent conductivity and adhesive force is obtained.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

This application relates to the field of printed circuit board processing technology, and more specifically, to a low-electrical-loss copper bonding compound, its preparation method, and its application. The compound has the following structural formula: a polythiourea molecule with a nitrazole structure, wherein the degree of polymerization n is 3-10. This application benefits from the compound's special structure (C=S and -NH2), effectively achieving bonding under copper-free etching conditions, and the smooth copper surface meets the requirements for high-frequency signal transmission.

Provided is a bonded body comprising a titanium nitride layer that contains a predetermined amount of oxygen. A bonded body according to an embodiment of the present invention comprises a nitride-based ceramic member and a metal member bonded to the nitride-based ceramic member via a bonding layer. A titanium nitride layer comprising titanium nitride as a main component is formed in the interface between the nitride-based ceramic member and the bonding layer. The titanium nitride layer comprises a part containing oxygen in an amount of 1 at % or more.

The invention relates to the technical field of copper surface micro-etching processing, in particular to a copper surface organic acid type super coarsening agent micro-etching device which comprises a cleaning pool, a first conveying frame is fixed to the outer wall of one side of the top of the cleaning pool, a first assembly line is installed on the inner wall of the top of the first conveying frame, and a micro-etching pool is arranged on the outer wall of one side of the cleaning pool. A second conveying frame is fixed to the outer wall of the top between the cleaning pool and the micro-etching pool, a second assembly line is installed on the inner wall of the top of the second conveying frame, and lifting frames are symmetrically erected and fixed to the inner walls of the two sides of the bottoms of the cleaning pool and the micro-etching pool; the copper surface organic acid type super coarsening agent micro-etching device is composed of the assembly line, the cleaning pool and the micro-etching pool, the liftable conveying belts are arranged in the cleaning pool and the micro-etching pool, automatic feeding and discharging of micro-etching treatment PCBs can be achieved, and copper surface oil removal cleaning, copper surface micro-etching treatment and cleaning after copper surface micro-etching are sequentially completed; and the automation level of the copper surface organic acid type super coarsening agent micro-etching device is improved.

A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first electrode part disposed on the second insulating layer; a second electrode part disposed on the first electrode part; a second insulating layer disposed on the second electrode part; and a fourth insulating layer disposed on the third insulating layer, wherein an upper surface of the first insulating layer includes a plurality of first convex parts, wherein a lower surface of the fourth insulating layer includes a plurality of second convex parts, and wherein at least one of distances between adjacent first convex parts among the plurality of first convex parts includes a region different from at least one of distances between adjacent second convex parts among the plurality of second convex parts.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

Substrates may be metallized by introducing a seed layer upon a base substrate, mechanically polishing the seed layer, and forming a metal layer upon the seed layer after mechanical polishing. The base substrate may comprise a ceramic, such as silicon nitride or aluminum nitride, a polymer, silicon, metal, or glass. The seed layer optionally may be rendered electrically conductive by mechanical polishing of an initially non-conductive seed layer. The metal layer may be formed by depositing a metal nanoparticle composition upon the seed layer after mechanical polishing and consolidating metal nanoparticles therein, such as through a hot pressing operation. The metal nanoparticle composition may contain one or more additives that facilitate CTE matching of the metal layer to the base substrate.

To provide a method for manufacturing a double-sided metal-clad laminate plate that has an adhesive layer and an insulating resin layer, restrains drying failure of the adhesive layer, surely advances crosslinking reaction, and forms a thick adhesive layer.SOLUTION: A method forms adhesive resin layers AD1 and AD2 on an insulating resin layer R1 of a first metal-clad laminate plate C1 and on an insulating resin layer R2 of a second metal-clad laminate plate C2, respectively. The thickness of the adhesive resin layer is preferably in the range of 12 to 75, and a first heat treatment condition of a drying step is set such that the temperature is in the range of 80 to 160°C, the time is set to 3 to 20 minutes, and the amount of solvent remaining in the adhesive resin layer is set in the range of 0.1 to 0.5% by weight. The adhesive resin layer AD1 and the adhesive resin layer AD2 are arranged to abut against each other, and a second heat treatment is performed after a metal-clad laminate plate C1' with the adhesive resin layer and a metal-clad laminate plate C2' with the adhesive resin layer are temporarily pressure-joined to each other, thereby forming a double-sided metal-clad laminate plate C having the first metal-clad laminate plate C1, the adhesive layer AD, and the second metal-clad laminate plate C2.SELECTED DRAWING: Figure 1

The invention discloses a micro-etching and super-roughening solution for enhancing the binding force of a PCB copper surface and resin and application of the micro-etching and super-roughening solution, and relates to the technical field of PCB machining, the copper surface micro-etching and super-roughening solution takes water as a solvent, and solutes comprise copper ions, chloride ions, organic acid, organic acid salt and 100-400 ppm of an azole corrosion inhibitor; the azoles corrosion inhibitor is selected from at least one of 1-hydroxybenzotriazole, 3, 5-diamino-1, 2, 4-triazole, 2-aminobenzimidazole, tetrazole or 3-amino-5-methylthio-1H-1, 2, 4-triazole, and the corrosion inhibitor is selected from at least one of 1-hydroxybenzotriazole, 3, 5-diamino-1, 2, 4-triazole, 2-aminobenzimidazole, tetrazole or 3-amino-5-methylthio-1H-1, 2, 4-triazole. According to the surface micro-etching super-roughening liquid, a specific micro-etching system is combined with a specific azole corrosion inhibitor, so that selective corrosion of a copper surface is achieved, a more rugged shape is formed, the contact area is increased, and the interface bonding force of copper and resin is improved.

A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.

The invention relates to the technical field of glue filling between PCB thick copper wires, in particular to a method for filling glue between PCB thick copper wires. Comprising the following steps that a CCL incoming material is subjected to positioning cutting, the CCL incoming material is cut into the consistent production size, the cutting precision is + / -0.1 mm, it is guaranteed that the sizes of cut plates are consistent, and follow-up machining is facilitated; manufacturing an inner-layer circuit; performing inner layer AOI (Automatic Optic Inspection); carrying out inter-line resin printing; according to the method, through the accurate resin printing and baking curing steps, it can be guaranteed that the space between the thick copper wires is fully and evenly filled with the resin, the problems of lack of glue and bubbles are effectively avoided, through the whole board coating, even and flat brushing of the resin and the accurate baking curing process, the uniformity of the board thickness can be guaranteed, and the production efficiency is improved. Through the steps of accurate exposure energy control, developing etching, film removing treatment and the like, the definition and accuracy of a circuit pattern can be ensured.

A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Cu, Ti, and a first element being one or two selected from Sn and In, and the bonding layer includes a Ti-rich region in which a ratio (MTi / ME1) of a mass MTi of Ti to a mass ME1 of the first element being 0.5 or more and a Ti-poor region in which the ratio (MTi / ME1) being 0.1 or less.

The invention discloses a processing method of a millimeter wave radar circuit board, which can realize signal shielding by embedding a copper wire, and compared with the traditional method for realizing signal shielding by adopting a blind hole, the embedded copper wire can be continuously arranged along a radio frequency circuit pattern, so that the signal shielding area can be effectively increased, and the signal shielding efficiency is improved. And the signal shielding effect can be improved. Besides, traditional blackening, blackening removal, plasma degumming, hole filling electroplating, copper reduction and other procedures can be omitted in the machining process, the machining process is greatly shortened, and then the machining efficiency of the millimeter wave radar circuit board can be improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

The invention discloses a composite browning liquid for a printed circuit board and a preparation method of the composite browning liquid. The composite browning liquid comprises the following components: 60-85 g / L of 98 wt% concentrated sulfuric acid, 12-20 g / L of 30 wt% hydrogen peroxide, 1-2 g / L of a modified corrosion inhibitor, 8-14 g / L of a silane coupling agent, 1.5-3 g / L of 1-butyl-3-methylimidazolium hydrogen sulfate, 4-8 g / L of an impregnating compound, 5-8 g / L of a dispersing agent and the balance of deionized water. The modified corrosion inhibitor prepared by a specific method, the silane coupling agent, the ionic liquid and the compound surfactant are scientifically compounded, so that the copper surface treatment effect is remarkably improved, and the inherent contradiction between binding force improvement and over-etching prevention of a traditional browning liquid is solved; the browning liquid has the advantages of stable treatment effect, long service life, reduction of waste liquid output and the like, and is suitable for industrial production requirements of high-density printed circuit boards.

The invention relates to a manufacturing method of a high-heat-dissipation circuit board. The manufacturing method comprises the following steps of manufacturing a first multi-layer board and a second multi-layer board; anti-etching photosensitive dry films are attached to the single faces of the first multilayer board and the second multilayer board; etching the exposed copper foil layers of the first multilayer board and the second multilayer board; semi-grooves are machined in the exposed film layers of the first multilayer board and the second multilayer board; the capillary copper pipe is subjected to blocking and browning treatment, and semi-cured resin coating is carried out; the first multi-layer plate and the second multi-layer plate are stacked, and the capillary copper pipe is horizontally arranged in the containing groove; riveting the first multi-layer plate and the second multi-layer plate which are pre-embedded with the capillary copper pipes by using a rivet through electromagnetic hot melting; laminating the riveted first and second multi-layer boards, the outer layer prepreg and the outer copper foil layer by using a vacuum laminating machine to form a semi-finished board; performing ultrasonic nondestructive testing on the semi-finished plate; and post-processing the semi-finished board to obtain the circuit board. According to the manufacturing method, the circuit board with the horizontally-embedded capillary copper pipe is obtained through the processes of film drying, single-face etching, groove milling and the like, and the heat dissipating capacity is increased.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The invention relates to the technical field of circuit boards, in particular to a low-profile coarsened copper foil for a circuit board and application of the low-profile coarsened copper foil for the circuit board, and the low-profile coarsened copper foil adopts a two-coarsening and one-solidifying treatment process and comprises the following steps: adding indium and cerium elements and hydroxyethyl cellulose with the molecular weight of 80,000-100,000 into coarsening liquid; the components in the silane treatment liquid are limited, and imidazole amide propyl triethoxy silane is used as a coupling agent to react with tetraethyl silicate and modified bisphenol A polyaryletherketone under the catalysis of ammonia water; the imidazole amide propyl triethoxy silane is synthesized by taking imidazole and gamma-isocyanate propyl triethoxy silane as raw materials; the preparation method of the modified bisphenol A type polyaryletherketone comprises the following steps: synthesizing a monomer containing an imide phenoxy hexafluoropropane structure by using 2, 2-bis [4-(4-aminophenoxy benzene)] hexafluoropropane and 4-chlorophthalic anhydride as raw materials, copolymerizing the monomer with bisphenol A and 4, 4 '-difluorobenzophenone, and introducing an imide phenoxy hexafluoropropane group on a main chain structure of the polyaryletherketone.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.