586results about "Insulating substrate metal adhesion improvement" patented technology

The invention belongs to the technical field of circuit boards, and discloses a composite pressing process of a high multilayer rigid-flex circuit board, which comprises the following steps: performing microstructure processing on the surface of a rigid base material to form a three-dimensional reinforced interface, and performing chemical grafting modification treatment on a flexible base material to generate a multilayer pretreated substrate; identifying the positioning mark of each layer of substrate through an optical positioning system, establishing a lamination stress prediction model in combination with the thermodynamic parameters of the material, and outputting a lamination configuration scheme containing an interlayer matching relationship; placing the configured laminated structure in a multi-temperature-zone press, and executing a three-stage gradient heating and pressurizing program to realize interface fusion between adjacent layers of substrates; monitoring an interlayer deformation difference value of the substrate in real time through a sensing network, and eliminating the deformation difference to obtain a press-fit molded circuit substrate; through heterogeneous interface strengthening design, multi-physical field cooperative pressing and real-time deformation compensation, accurate interface fusion and low-warpage forming of the high-multilayer rigid-flex circuit board are realized.

The invention discloses a copper-clad plate as well as a middle layer and a preparation method and application thereof, and belongs to the technical field of copper-clad plates. The preparation method of the intermediate layer for the copper-clad plate comprises the following steps: orthogonally weaving PBO fibers and glass fibers to obtain blend fibers; the mass ratio of the PBO fibers to the glass fibers is (10: 90)-(60: 40); carrying out modification treatment on the blend fibers to obtain modified blend fibers; dipping the modified blend fiber in a resin-containing dipping solution; and drying the impregnated modified blend fiber. The preparation method is simple and easy to operate, the PBO fibers and the glass fibers are orthogonally woven according to a specific ratio, so that on one hand, the blend fibers have the advantages of the PBO fibers and the glass fibers, on the other hand, the anisotropy of the blend fibers is effectively optimized, and the obtained copper-clad plate has relatively low dielectric loss and expansion coefficient; the peeling strength, the heat resistance and the flexibility are better.

The invention discloses a copper surface micro-etching coarsening solution for a fine circuit as well as a preparation method and application of the copper surface micro-etching coarsening solution, and relates to the technical field of printed circuit board manufacturing. The copper surface micro-etching coarsening solution for the fine circuit is prepared from, by mass concentration, 60 g / L to 100 g / L of sulfuric acid, 40 g / L to 60 g / L of hydrogen peroxide, 0.5 g / L to 2 g / L of zinc sulfate, 10 g / L to 30 g / L of copper ions, 0.5 g / L to 1 g / L of pyridine heterocycle-containing Schiff base, 10 g / L to 100 g / L of ethyl alcohol, 1 g / L to 3 g / L of 2-mercaptobenzothiazole, 1 g / L to 5 g / L of methionine and 1 g / L to 5 g / L of polyacrylamide. According to the copper surface micro-etching coarsening solution, the 2-mercaptobenzothiazole and the methionine in the copper surface micro-etching coarsening solution can enable the copper surface to form a honeycomb structure under the low micro-etching amount, the zinc sulfate and the pyridine heterocyclic ring-containing Schiff base can form a composite film layer with copper ions on the surface of the honeycomb structure, and the interlayer binding force is improved.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

This application relates to the field of printed circuit board processing technology, and more specifically, to a low-electrical-loss copper bonding compound, its preparation method, and its application. The compound has the following structural formula: a polythiourea molecule with a nitrazole structure, wherein the degree of polymerization n is 3-10. This application benefits from the compound's special structure (C=S and -NH2), effectively achieving bonding under copper-free etching conditions, and the smooth copper surface meets the requirements for high-frequency signal transmission.

Provided is a bonded body comprising a titanium nitride layer that contains a predetermined amount of oxygen. A bonded body according to an embodiment of the present invention comprises a nitride-based ceramic member and a metal member bonded to the nitride-based ceramic member via a bonding layer. A titanium nitride layer comprising titanium nitride as a main component is formed in the interface between the nitride-based ceramic member and the bonding layer. The titanium nitride layer comprises a part containing oxygen in an amount of 1 at % or more.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.

A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Cu, Ti, and a first element being one or two selected from Sn and In, and the bonding layer includes a Ti-rich region in which a ratio (MTi / ME1) of a mass MTi of Ti to a mass ME1 of the first element being 0.5 or more and a Ti-poor region in which the ratio (MTi / ME1) being 0.1 or less.

The invention discloses a composite browning liquid for a printed circuit board and a preparation method of the composite browning liquid. The composite browning liquid comprises the following components: 60-85 g / L of 98 wt% concentrated sulfuric acid, 12-20 g / L of 30 wt% hydrogen peroxide, 1-2 g / L of a modified corrosion inhibitor, 8-14 g / L of a silane coupling agent, 1.5-3 g / L of 1-butyl-3-methylimidazolium hydrogen sulfate, 4-8 g / L of an impregnating compound, 5-8 g / L of a dispersing agent and the balance of deionized water. The modified corrosion inhibitor prepared by a specific method, the silane coupling agent, the ionic liquid and the compound surfactant are scientifically compounded, so that the copper surface treatment effect is remarkably improved, and the inherent contradiction between binding force improvement and over-etching prevention of a traditional browning liquid is solved; the browning liquid has the advantages of stable treatment effect, long service life, reduction of waste liquid output and the like, and is suitable for industrial production requirements of high-density printed circuit boards.

The invention relates to a manufacturing method of a high-heat-dissipation circuit board. The manufacturing method comprises the following steps of manufacturing a first multi-layer board and a second multi-layer board; anti-etching photosensitive dry films are attached to the single faces of the first multilayer board and the second multilayer board; etching the exposed copper foil layers of the first multilayer board and the second multilayer board; semi-grooves are machined in the exposed film layers of the first multilayer board and the second multilayer board; the capillary copper pipe is subjected to blocking and browning treatment, and semi-cured resin coating is carried out; the first multi-layer plate and the second multi-layer plate are stacked, and the capillary copper pipe is horizontally arranged in the containing groove; riveting the first multi-layer plate and the second multi-layer plate which are pre-embedded with the capillary copper pipes by using a rivet through electromagnetic hot melting; laminating the riveted first and second multi-layer boards, the outer layer prepreg and the outer copper foil layer by using a vacuum laminating machine to form a semi-finished board; performing ultrasonic nondestructive testing on the semi-finished plate; and post-processing the semi-finished board to obtain the circuit board. According to the manufacturing method, the circuit board with the horizontally-embedded capillary copper pipe is obtained through the processes of film drying, single-face etching, groove milling and the like, and the heat dissipating capacity is increased.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

A copper block browning auxiliary jig for a copper block embedded circuit board is suitable for the field of copper block embedded PCB processing and comprises a board frame, the board frame comprises a whole-face covering screen cloth and a movable hinge with a one-way 90-degree bending position, the covering screen cloth is provided with a plurality of net bags, the net bags can be opened along with the one-way 90-degree bending of the board frame, and the movable hinge is provided with a plurality of clamping grooves. And a to-be-browned copper block is placed in the straight plate frame behind the net bag. According to the utility model, the problems of poor browning, scratches and the like caused by overlapping of ultra-small copper blocks through liquid medicine stamping during browning can be solved on the basis of the original production equipment, and the device can be applied to copper blocks in different shapes and can be repeatedly used, so that the cost input is saved, the production efficiency is improved, and the yield is improved.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

The invention discloses a production process for preparing a three-dimensional circuit by using laser forming and chemical etching after metallization of a plastic surface, and relates to the technical field of three-dimensional circuit preparation. The method comprises the following steps: S1, carrying out ultrasonic cleaning and oil removal on a plastic base material; s2, performing sand blasting roughening or laser treatment; s3, chemical coarsening is carried out; s4, palladium activation; s5, chemically plating a copper bottom; s6, thickening the circuit by chemical copper plating or electro-coppering; s7, plating a tin or nickel protective layer on the surface of the copper layer; s8, surface metal in a non-circuit area is cut off through laser forming; s9, copper etching is carried out; and S10, surface layer metal is plated again, and passivation hole sealing protection is carried out. According to the method, the material selection range of a three-dimensional circuit is greatly expanded, the processing limitation of a traditional process on a complex circuit structure is broken through, the circuit design requirements in different fields can be met, the process effectively solves the problem of high risk of circuit overflow plating connection when a high-precision circuit is manufactured on the surface of a plastic base material in the past, and the product quality is improved. The precision and the product yield of the three-dimensional circuit are further improved, and the method has a wide application prospect.

[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible circuit board, and a manufacturing method thereof. [Solution] This copper-clad laminate is characterized by including a low dielectric resin film which has a relative dielectric constant of 3.5 or lower and a dielectric loss tangent of 0.008 or lower at a frequency of 10 GHz and an electroless copper plating layer which is laminated on at least one surface of the low dielectric resin film, wherein the electroless copper plating layer has a Ni-content of 0.01 to 1.2 wt%, and the electroless copper plating layer has a volume resistivity of 6.0 µΩ·cm or lower.

This invention proposes a multilayer circuit structure and its fabrication method. The multilayer circuit structure includes a substrate and integrated circuits disposed on both sides of the substrate. Each integrated circuit includes a flexible insulating layer and two flexible conductive layers disposed on both sides of the flexible insulating layer. Each flexible conductive layer has a rough surface and a smooth surface, with each rough surface in contact with the flexible insulating layer. One side of the flexible conductive layer has a rough surface that contacts the flexible insulating layer, significantly increasing the contact area and improving the adhesion between the flexible conductive layer and the flexible insulating layer. This design helps reduce the risk of delamination and peeling, enhances the mechanical stability of the circuit structure, and maintains stable performance, especially when subjected to thermal cycling and mechanical stress during manufacturing. The multilayer circuit structure uses a material with a certain degree of flexibility, enabling it to withstand stress from mechanical operations during manufacturing. The combination of these two factors improves the manufacturing yield of the multilayer circuit structure.

To improve the connection reliability.SOLUTION: A wiring board includes a wiring layer, an insulating layer laminated on the wiring layer, an opening that penetrates the insulating layer to the wiring layer, and a conductor film formed in the opening of the insulating layer. The surface of the insulating layer includes a smooth portion exposed from the conductor film, and a roughened portion including an inner wall surface of the opening covered with the conductor film and having a surface roughness larger than that of the smooth portion.SELECTED DRAWING: Figure 2

This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

This invention discloses a selective roughening method for ceramic copper-clad laminates, comprising the following preparation steps: S1 printing an active solder layer between ceramic and copper foil; S2 preparing the ceramic copper-clad laminate; S3 etching copper onto the sintered ceramic copper-clad laminate; S4 removing unwanted solder layers; S5 cleaning, roughening, cleaning, acid washing, cleaning, immersion, and drying the patterned ceramic copper-clad laminate according to the following process, and filling it with nano-silicon and organosilane; S6 printing a thermosetting wet film to expose the area to be surface treated; S7 removing the surface roughening structure; S8 finally, subjecting the ceramic copper-clad laminate to nickel plating, chemical silvering, and then stripping to form the final structure. Compared with the prior art, this invention has the following beneficial effects: effectively avoiding the problem of solder voids caused by surface roughening pits, good surface weldability, and the concave structure of the welding area effectively prevents solder overflow during the welding process and reduces micropores in the chemical silver plating layer.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

The present invention provides a laminated structure which is suitable for the manufacture of a printed board and which can suppress peeling of a wiring pattern when a bending stress is applied to the printed board. A laminated structure includes a resin base material and a metal layer provided on a first surface of the resin base material, the resin base material having a recessed portion which opens on the first surface and an inner surface of the recessed portion having a stress relaxation structure, a portion of the metal layer extending into the recessed portion.

The invention discloses a rigid-flex board and a preparation method thereof. The preparation method of the rigid-flex board comprises the following steps: providing a core board, a copper foil layer, a bonding sheet and a double-sided adhesive film; adhering a double-sided adhesive film to the core plate; arranging a windowing area on the bonding sheet, wherein the windowing area corresponds to the soft board area of the core board; stacking the copper foil layer and the core plate in sequence, arranging the bonding sheet between the copper foil layer and the core plate, and arranging the double-sided adhesive film in the windowing area; laminating the core plate, the copper foil layer and the bonding sheet; and removing the copper foil layer in the soft board area of the core board so as to expose the soft board area of the core board at the windowing area. According to the invention, the double-sided adhesive film is attached to the core plate, and the flowing glue of the bonding sheet is prevented from flowing to the soft plate area of the core plate by using the double-sided adhesive film during pressing, so that compared with the traditional process adopting ink for glue prevention protection, the process does not need to additionally coat ink, reduces links such as silk-screen printing and ink fading, reduces the production process, and reduces the operation complexity and the production cost.

A rigid-flex printed circuit board with blind holes made of different materials and in the same layer comprises single-face flexible base materials arranged on the upper side surface and the lower side surface, and semi-solidified layers and double-face flexible base materials which are sequentially and alternately stacked between the single-face flexible base materials. The rigid-flex board comprises a rigid area and a flexible area, and the flexible area can be bent relative to the rigid area; the semi-cured layer comprises at least one mixed layer, the mixed layer comprises a semi-cured part located in a rigid area, and the rest part is a pure glue part; the mixed layer is arranged between the single-sided flexible base material and the double-sided flexible base material, and the single-sided flexible base material is communicated with the double-sided flexible base material through a blind hole; the blind holes comprise rigid blind holes located in the rigid area and flexible blind holes located in the flexible area. The rigid blind holes and the flexible blind holes are arranged, so that the problem that excessive glue removal or glue residue is easy to occur in blind hole processing due to the fact that prepreg glue and pure glue exist in the same dielectric layer of an existing rigid-flexible combined board is solved.

Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the surface texture aspect ratio Str is 0.02-0.24, and the load area ratio Smr1 separating protruding peaks from a core portion is 1.0-15.0%. Str and Smr1 are values measured in compliance with ISO 25178 at a cutoff wavelength of 0.251 μm using an S-filter and at a cutoff wavelength of 4.5 μm using an L-filter.

In a first region, a multilayer body is bent along a first bending line such that a first main surface is located farther on an outer peripheral side than a second main surface. In a second region, the multilayer body is bent along a second bending line such that the first main surface is located farther on an inner peripheral side than the second main surface. In the first region, a first metal foil layer is located farther on an outer peripheral side than a center of the multilayer body. In the second region, a second metal foil layer is located farther on the outer peripheral side than the center of the multilayer body. In the second region, a distance between the second metal foil layer and the second main surface is shorter than a distance between the second metal foil layer and the first main surface.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1