2920results about "Conductive pattern formation" patented technology

The invention relates to the technical field of screen printing, in particular to a PCB screen printing ink layer thickness uniformity control method, system and device and a medium. The method comprises the following steps: firstly, collecting ink layer actual thickness data and screen tension data of a PCB screen printing area, then analyzing the relevance between the two data to obtain an ink layer uniformity analysis result, further determining proper compensation parameters through process compensation analysis, finally dynamically adjusting screen printing pressure, scraper angle and printing speed, bringing screen tension into a control system, and finally, controlling the screen printing uniformity. Compared with the prior art, the method has the advantages that the adaptability and the reliability are higher, and the product yield can be improved.

The invention provides a terahertz horn antenna and a preparation method thereof, and relates to the technical field of mobile communication systems. The antenna layer is arranged to be the antenna layer with the horn antenna groove structure, and due to the advantages of the horn antenna, the terahertz horn antenna has the advantages of being simple in structure, convenient to control gain, excellent in frequency characteristic, small in loss and the like. Moreover, the antenna layer and the radio frequency layer provided by the invention are fixed through bonding of the radiation electrode and the metal film, so that a low-reflection interconnection channel is realized, THz waves can be limited in a bonding area, the problem of electromagnetic leakage caused by stacking of the antenna layer and the radio frequency layer is avoided, and the performance of the terahertz horn antenna is improved. According to the terahertz horn antenna, the antenna layer and the radio frequency layer both adopt the glass substrates, the glass substrates have the advantages of high mechanical strength, small dielectric loss and the like, and the glass substrates can bear higher temperature, so that the problems of warping and deformation of the substrates are reduced, and the preparation quality of the terahertz horn antenna can be improved.

The present disclosure relates to a high-precision multilayer PCB and a 3D printing preparation method thereof. The method includes: S1, forming a 3D circuit layer on an upper surface of a substrate; S2, forming a metal pillar at a preset position of the current 3D circuit layer by stacking; S3, forming an insulating layer on an upper surface of the current 3D circuit layer, and leading the corresponding metal pillar out of the formed insulating layer in advance by drilling a hole in the insulating layer and filling the drilled hole with the nanoscale metal slurry; S4, forming a pad layer on an upper surface of the current insulating layer and executing step S5 if the current insulating layer is a top layer; repeatedly executing steps S1 and S2 by using the current insulating layer as a new substrate and executing step S6 if not; S5, connecting the corresponding metal pillar or leading it out in advance and connecting to the pad layer, to complete the preparation of the multilayer PCB; and S6, connecting the corresponding metal pillar or leading it out in advance and connecting to the current 3D circuit layer, and returning to step S3. According to the present disclosure, the high-precision multilayer PCB with high interconnect precision can be prepared.

Disclosed in the present application are an artificial dielectric material, a lens unit and a manufacturing method therefor, and a lens antenna. The artificial dielectric material comprises a substrate and conductive materials, wherein the substrate is configured to be of a porous structure and is provided with a plurality of microporous chambers; and the conductive materials are arranged on side walls of the microporous chambers, and the shape of the microporous chambers and / or at least one of the shape, size, density and extension direction of the conductive material are adjusted to obtain different equivalent dielectric constants. The artificial dielectric material provided in the present application has a stable structure, is free of deformation after being used for a long time, is acid-resistant, waterproof and flame-retardant, and has a density less than 30 kg / m3; and the conductive materials do not fall off, and the relative positions between the conductive materials are fixed, such that contact is avoided, and an inter-modulation index of a base station antenna is not affected. Therefore, the artificial dielectric material and the manufacturing method therefor which are provided in the present application provide a higher degree of freedom for the design of a lens unit and a lens antenna.

The invention discloses a PCB ink-jet printing pretreatment agent, a preparation method thereof and a PCB ink-jet printing method, and relates to the technical field of printed circuit board production. The PCB ink-jet printing pretreatment agent is prepared from the following components in mass concentration: 0.1 to 0.5 percent of an anti-diffusion agent, 0.1 to 0.5 percent of a wetting agent, 0.2 to 1.0 percent of a homogenizing agent, 0.5 to 2.5 percent of a dispersing agent, 0.1 to 3.0 percent of a cosolvent and the balance of water. The PCB ink-jet printing pretreatment agent can be used in a surface treatment procedure of a fine PCB pattern ink-jet printing process, a uniform organic layer can be formed on a PCB copper surface and a substrate surface, and the organic layer can effectively reduce surface tension of the copper surface and the substrate surface, prevent diffusion of jet printing ink on the PCB surface, promote uniform arrangement of the ink and improve the printing quality of the PCB. Stable and neat linear ink can be formed, and the product yield of a fine line ink-jet printing process is improved.

The invention discloses a manufacturing method of a high-precision bearing type rigid-flexible combined circuit board, a forming line is designed in a processing process board, the manufacturing method comprises the following steps: manufacturing a flexible board comprising a flexible area and a rigid combined area, taking a rigid copper-clad plate, and manufacturing a circuit pattern, the circuit pattern comprises an auxiliary circuit pattern corresponding to a bonding pad pattern of the flexible board, a first groove body is manufactured on the outline of the flexible area, a first connecting position is arranged between the first groove body and the auxiliary area, a second groove body is manufactured on the outline of the rigid combination area, a second connecting position is arranged between the second groove body and the auxiliary area, a rigid bearing plate is formed, the flexible plate and the rigid bearing plate are pressed and formed, and the high-precision bearing type rigid-flexible combined circuit board is formed. The flexible plate and the rigid bearing plate are manufactured independently, the rigid bearing plate is manufactured according to the forming line to form the groove body, then overall pressing is conducted, the flexible plate is formed through laser cutting, the problems of pulling, tearing and the like of the flexible plate caused by milling forming of the overall plate body are effectively solved, and the machining quality and reliability are improved.

The invention discloses an automatic plate turnover machine for PCB jet printing, and relates to the technical field of PCB jet printing, the automatic plate turnover machine for PCB jet printing comprises a supporting plate, the top of the supporting plate is fixedly connected with a supporting frame, the supporting frame is internally and rotatably connected with two mounting pipes, and a first mounting box is fixedly connected between the two mounting pipes. The feeding and discharging mechanism is used for automatically feeding and discharging PCBs, the PCBs are fed to the overturning feeding mechanisms on the two connecting frames, then the PCBs are automatically fed into the jet printing machine through the overturning feeding mechanisms for jet printing, then the PCBs are automatically overturned, the other faces of the PCBs are subjected to jet printing, and during jet printing, the feeding and discharging mechanism automatically feeds the following PCBs, so that the printing efficiency is greatly improved. And after jet printing is completed, the mounting pipe and the first mounting box are driven to rotate to the feeding and discharging position for discharging, so that double-station simultaneous jet printing processing on the double faces of the PCB is achieved, and the jet printing efficiency and the jet printing effect of the PCB are greatly improved.

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention discloses a fine circuit pattern anti-diffusion agent as well as a preparation method and a use method thereof, and relates to the technical field of printed circuit board manufacturing. The fine circuit pattern anti-diffusion agent is prepared from the following components in percentage by mass: 0.05 to 0.3 percent of an oleophobic agent, 0.1 to 0.6 percent of a bonding agent, 0.2 to 1.5 percent of an adhesion promoter, 0.5 to 4.0 percent of a wetting agent, 0.5 to 5.0 percent of a cosolvent and the balance of water, the oleophobic agent is a fluorophenylethylamine derivative, the bonding agent is a carbonyl chloride derivative, the adhesion promoter is a sulfur heterocyclic alkane derivative, the wetting agent is a methylsiloxane silane derivative, and the cosolvent is a sulfonyl ketone derivative. According to the fine circuit pattern anti-diffusion agent, an organic layer can be formed on the copper surface of a circuit board, the binding force between the copper surface and printing ink is enhanced, jet printing printing ink is prevented from diffusing on the copper surface, and the product percent of pass of a jet printing solder mask process is improved.

The invention discloses a preparation and measurement method of a polymer-based multi-point force flexible sensor for knee joint pose measurement, and relates to the technical field of polymer-based flexible sensors and soft measurement. The structure of the multi-point force polymer-based flexible sensor shaped like a Chinese character'ao 'is designed for knee joint stress and posture state measurement, and the flexible sensor is prepared and packaged through a silk-screen printing method. A flexible sensor strain input-output knee joint stress data mapping set and a flexible sensor strain input-pose angle output data mapping set required by modeling are completed through a flexible sensor, a thin film force sensor corresponding to multi-point force and an inertial sensor corresponding to pose angle measurement of installed multi-point force polymers. And establishing a neural network soft measurement model based on an MLP algorithm, and carrying out training and verification. And the knee joint pose angle with reliable precision and the maximum stress state of the knee joint are obtained. The sensor has the advantages of being flexible, thin, skin-friendly, high in sensitivity and stable in signal output.

The invention discloses an electronic component solder paste printing device, and belongs to the technical field of electronic component production and processing equipment. The device comprises a shell, a steel mesh is fixedly connected to the interior of the shell, a fixed sliding rod is fixedly connected to the top of the steel mesh, a sliding groove is formed in the side wall of the steel mesh, a feeding mechanism is arranged on the outer wall of the fixed sliding rod, solder paste is stirred and automatically fed during printing work, a scraper mechanism is arranged on the inner wall of the sliding groove, and the scraper mechanism is arranged on the inner wall of the sliding groove. According to the tin paste recycling device, the tin paste can be automatically recycled during printing work, a storage mechanism is arranged on the top of the steel mesh, and when the tin paste is recycled, the tin paste can be stored in a sealed mode. The feeding box slidably extrudes the sealing block to relieve sealing of the feeding groove, automatic feeding is achieved, it is avoided that a large amount of solder paste is placed in a machining area at a time, the oxidation or deterioration risk caused by the fact that the solder paste is exposed to air for a long time is reduced, and therefore the printing work effect of electronic components is guaranteed.

The invention discloses a potassium ion sensor based on AuNPs / MXene / SPCE and a preparation method thereof, and belongs to the technical field of electronic components. Comprising a screen-printed carbon electrode SPCE, an MXene layer modified on the surface of a working electrode of the screen-printed carbon electrode, a gold nanoparticle AuNPs layer formed on the surface of the MXene layer through an electrochemical deposition method, a potassium ion selective membrane covering the gold nanoparticle AuNPs layer, and a GO-PVA hydrogel layer coating the surface of the potassium ion selective membrane. According to the prepared sensor, only potassium ions in sweat can pass through the selective membrane, the selectivity of the sensor is improved, meanwhile, due to the application of the AuNPs / MXene composite material, the surface area-volume ratio of a silk-screen printing carbon electrode is greatly improved, more potassium ions participate in ion-electron conversion, the sensitivity of the sensor is improved, and the application range of the sensor is widened. And the detection range is expanded.

A component carrier and a method of manufacturing the component carrier are presented. The component carrier comprises a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the stack comprises i) a support layer structure comprising at least one through-hole; ii) a metal paste filling material in the through-hole; and iii) a metal pad provided on and extending from an exterior main surface of the support layer structure. The metal paste filling material in the through hole and the metal pad comprise at least partially the same material.

The invention discloses a method for manufacturing a circuit board embedded with a carbon oil resistor, which comprises the following steps of: taking a double-sided copper-clad plate, manufacturing a circuit pattern comprising a carbon oil connecting pattern which comprises a wire end and a connecting end, adhering a dry film to two sides, a dry film windowing pattern is manufactured in the area, corresponding to the carbon oil pattern, of the surface where the carbon oil connection pattern is located, plasma treatment is conducted, then film stripping is conducted, a carbon oil layer is manufactured in the area of the carbon oil pattern, a bonding layer prepreg is taken, core plates of other layers are taken and stacked and pressed together with the carbon oil plate, and the circuit board embedded with the carbon oil resistor is formed through subsequent procedure manufacturing; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, prepregs are laminated and bonded to the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling, layering of a multi-layer board and even board explosion of the multi-layer board caused by poor bonding of the carbon oil layer are solved.

The invention discloses a high-stretching FPC (Flexible Printed Circuit) and a preparation method thereof, and the method comprises the steps: coating conductive silver paste on a flexible substrate film in a printing, dispensing or coating mode on the back of the flexible substrate film, and forming a metal circuit layer through low-temperature curing; the printing thickness of the conductive silver paste is controlled to be 8-20 [mu] m; pasting a protective layer on the metal circuit layer, and pressing; after the supporting film is torn off, shape punching is conducted, and the product is obtained. The initial paste of the conductive silver paste comprises the following components: 50 wt%-70 wt% of mixed silver powder, 10 wt%-15 wt% of acrylic resin, 10 wt%-15 wt% of dimethyl glutarate, 5 wt%-10 wt% of dimethyl adipate and 5 wt%-10 wt% of dimethyl succinate. The high-stretching FPC and the preparation process thereof have the characteristics of high efficiency and low cost, and large-scale production can be realized. And on the other hand, the operability is high, and the operability problems that flexible base materials such as TPU are prone to displacement in the silk-screen printing process, and printing is poor are solved.

The utility model relates to the technical field of raw ceramic chip printing, and provides an automatic raw ceramic chip printing machine which comprises a raw ceramic chip feeding device, a screen printing carrying table moving device and a raw ceramic chip discharging device. The raw ceramic chip feeding device comprises a first rack, a material frame conveying and positioning mechanism and a lifting, overturning and grabbing mechanism. The material frame conveying and positioning mechanism comprises a material frame and a servo conveying assembly. The lifting, overturning and grabbing mechanism comprises a first supporting base, a lifting driving assembly, a first grabbing assembly, a second supporting base, an overturning driving assembly, a second grabbing assembly, a third supporting base, a carrying driving assembly and a third grabbing assembly. The screen printing carrying table moving device comprises a second rack, an alignment lifting carrying table, a screen printing guide rail and a screen printing mechanism. The utility model has the advantages that the lifting, overturning and grabbing mechanism automatically takes away raw ceramic chips from the material frame and overturns the raw ceramic chips in a vertical state into the raw ceramic chips in a horizontal state, and the silk-screen printing mechanism prints patterns on the raw ceramic chips and automatically takes away printed matters of the raw ceramic chips, so that the production efficiency is improved.

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

The present invention relates to the technical field of flexible electronics, and relates to a breathable and stretchable circuit capable of being activated by imprinting, and a preparation method therefor and a use thereof. The preparation method for the breathable and stretchable circuit capable of being activated by imprinting in the present invention comprises the following steps: dissolving a thermoplastic polymer in a solvent, adding liquid metal particles, and mixing and dispersing to obtain a mixed solution; carrying out electrospinning on the obtained mixed solution to prepare a nanofiber membrane; and using a stamping model having a circuit pattern to stamp the obtained nanofiber membrane so as to obtain the breathable and stretchable circuit capable of being activated by imprinting. The present invention ensures the breathability and the stretchability by using the nanofiber membrane. The liquid metal particles match fibers in diameter, and therefore, liquid metal in nanofibers can be overflowed by means of imprinting to form a conductive path, achieving high-precision preparation of circuits.

The invention relates to the technical field of screen printing, in particular to circuit board screen printing equipment and a screen printing process. The invention discloses circuit board screen printing equipment and a screen printing process. The equipment comprises a screen printing machine body, a mounting plate, a clamp, a silk screen, an ink scraping assembly and the like, a mounting plate is mounted at the rear part of the screen printer body through an electric guide rail; a plurality of clamps are connected to the mounting plate; the plurality of clamps are jointly provided with a silk screen; an ink scraping assembly used for scraping ink is arranged on the mounting plate; the electric drive guide rail drives the mounting plate, the clamp, the silk screen and the ink scraping assembly to ascend and descend. The maximum stroke positions of movement of the scraper and the ink returning blade are set to be located above the intercepting faces on the left side and the right side respectively, movement of the ink is intercepted, limited and guided through the intercepting faces, and in the subsequent process that the scraper and the ink returning blade scrape the ink along the intercepting faces, in the coining process and the ink returning process, it is guaranteed that the ink is located on a working area all the time; and the problem of waste caused by ink moving out of a working area due to pushing of the scraper and the ink return blade is avoided.

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

The invention discloses a conductive ink screen printing precision control method based on deep learning. The conductive ink screen printing precision control method comprises the following steps: acquiring microstructure image data of conductive ink on the surface of a screen printing substrate in real time; generating a thickness enhanced picture by adopting an improved competitive fuzzy C-means clustering algorithm; generating an edge enhancement picture by adopting an improved self-adaptive threshold function; carrying out non-subsampled Contourlet multi-scale decomposition to generate a microcrack enhanced picture; jointly inputting the enhanced pictures into a pre-trained defect recognition model, and extracting a multi-dimensional precision feature vector; dynamically generating a collaborative adjustment parameter set through the parameter prediction model, and carrying out iterative optimization to obtain an optimized parameter set; and according to the optimized parameter set, adjusting an execution mechanism of the screen printing equipment in real time through closed-loop feedback, and synchronously updating a weight coefficient of the defect identification model. According to the invention, real-time multi-dimensional perception of the microstructure of the ink is realized, the anti-interference capability of image processing is improved, a multi-parameter collaborative prediction model is established, and the microcrack detection sensitivity is enhanced.

The invention relates to a soft electronic device based on a particle phagocytosis effect and a preparation method thereof, and the preparation method comprises the following steps: S1, attaching a hollow mask plate to a polymer substrate, and controlling the position where the polymer substrate can be printed; s2, uniformly dispersing micro-nano particles on the mask plate, wherein the micro-nano particles are in contact with the polymer substrate at the hollowed-out part of the hollowed-out mask plate; s3, after the micro-nano particles make contact with the polymer substrate, the micro-nano particles gradually enter the polymer substrate through the particle phagocytosis effect, and a functional composite material is formed; and S4, removing the hollow mask plate to form the soft electronic device. According to the method, the micro / nano material is directly printed in the soft polymer matrix without introducing a solvent, so that chemical incompatibility and complex fluid dynamic behaviors are avoided. The surface energy-driven particle phagocytosis phenomenon is utilized to realize deep embedding of the material, spontaneous generation is realized, and additional introduction of energy is not needed. Different materials can be seamlessly integrated into the high-performance elastic electronic equipment. Multi-material wireless electronic equipment is created through a multi-layer phagocytic printing technology, and layered printing can be achieved.

The invention provides a circuit deposition method and device, and relates to the field of electronic circuit manufacturing, and the method comprises the following steps: preparing a deposition solution; deploying a dripping path of the deposition solution on a sample to be processed according to a preset circuit pattern; and dropwise adding the deposition solution on the sample along a dropwise adding path, and irradiating a dropwise adding region by using laser, so that an oxidation-reduction reaction occurs on the sample, thereby forming a line. The method is based on a laser-induced liquid phase deposition technology, a deposition solution containing metal ions is dropwise added to a sample to be processed according to a preset circuit pattern, laser is further used for irradiating a dropwise adding area, and a needed pattern circuit is formed along with movement of a laser irradiation position. The deposition device applying the method is simple in operation step and does not need post-treatment, and a simplified and environment-friendly solution is provided for the circuit manufacturing industry.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

The invention discloses a liquid metal flexible circuit manufacturing method based on a paper-based seal, and belongs to the field of intelligent manufacturing. Firstly, a hollowed-out mask of a circuit pattern is carved on adhesive sticker printing paper, the hollowed-out paper-based mask is pasted to a transparent adhesive film, the paper-based seal of a hollowed-out structure is manufactured, and the adhesive sticker printing paper is composed of an upper layer surface material, a middle adhesive layer and lower layer release paper; secondly, liquid metal is evenly squeezed into a groove formed in the hollowed-out position of the paper-based seal; thirdly, the upper-layer surface material is torn off, the lower-layer release paper of the paper-based seal is attached to the flexible substrate, then the remaining paper-based seal is torn off, and a liquid metal circuit pattern on the flexible substrate is obtained; and finally, uniformly spraying a protective coating on the surface to obtain the liquid metal flexible circuit. The thickness of the manufactured liquid metal flexible circuit is only less than 30 microns, and flow migration caused by the too thick liquid metal layer can be effectively prevented; the manufacturing method is simple, convenient and rapid, and has a wide application prospect in the field of manufacturing of flexible wearable equipment.

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

The invention provides a precise circuit packaging substrate and a manufacturing method thereof, and the method comprises the following steps: providing a substrate which comprises a core plate and a conductive metal layer at least disposed on the first surface of the core plate; forming a grain boundary buffer material layer on the surface, far away from the core plate, of the conductive metal layer, and pretreating the grain boundary buffer material layer to obtain a grain boundary buffer layer; providing an electroplating shielding layer, and forming a base circuit layer on the surface, away from the substrate, of the grain boundary buffer layer based on the electroplating shielding layer; at least one layer of wiring structure is formed on the surface, away from the substrate, of the base circuit layer, the wiring structure comprises a dielectric layer covering the exposed surface of the base circuit layer, a metal connecting layer penetrating through the dielectric layer and a conductive circuit layer located on the surface, away from the base circuit layer, of the dielectric layer, and the metal connecting layer is electrically connected with the base circuit layer and the conductive circuit layer. According to the precise circuit packaging substrate and the manufacturing method thereof, the problem of circuit separation in the process of manufacturing the precise circuit packaging substrate is avoided, and the yield of the packaging substrate is improved.

A component carrier including: i) a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a first metal trace comprising a rough surface; and iii) a second metal trace arranged adjacent to the first metal trace, comprising a smooth surface. The component carrier is configured to guide high-frequency and or high-speed signals through the second metal trace.

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a high-performance inner-layer ultra-thick copper circuit board which comprises a bearing table, a back plate and the like. A back plate is arranged on the bearing table. Printing ink is stored through the storage box, the situation that printing ink is not evenly printed due to printing ink diffusion is avoided, and the printing ink printing effect of equipment is improved; through the structure that the middle of the flow dividing rod is high and the two sides of the flow dividing rod are low, ink is slowly collected into the storage box along the flow dividing rod in cooperation with flowability of the ink, the problem that the ink utilization rate is low is solved, and meanwhile the situation that the ink is accumulated and hardened for a long time is avoided. The circuit board is ejected upwards through the ejector rod, then a worker can hold the lower side of the circuit board with hands to take out the circuit board, and the circuit board is prevented from being damaged while the worker conducts discharging conveniently. And the circuit board is accurately placed on the upper side of the fixing frame through cooperation of a guide plate and a limiting block, so that feeding by workers is more convenient.

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first insulating layer, and a first via layer penetrating through at least a portion of the first insulating layer to connect the first metal layer to the second metal layer. The first via layer has a tapered shape becoming narrower toward a top of the first insulating layer, and an upper surface of the first metal layer is substantially flat, and a side surface of the first metal layer has a curved surface.