1736results about "Conductive pattern formation" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention discloses a preparation and measurement method of a polymer-based multi-point force flexible sensor for knee joint pose measurement, and relates to the technical field of polymer-based flexible sensors and soft measurement. The structure of the multi-point force polymer-based flexible sensor shaped like a Chinese character'ao 'is designed for knee joint stress and posture state measurement, and the flexible sensor is prepared and packaged through a silk-screen printing method. A flexible sensor strain input-output knee joint stress data mapping set and a flexible sensor strain input-pose angle output data mapping set required by modeling are completed through a flexible sensor, a thin film force sensor corresponding to multi-point force and an inertial sensor corresponding to pose angle measurement of installed multi-point force polymers. And establishing a neural network soft measurement model based on an MLP algorithm, and carrying out training and verification. And the knee joint pose angle with reliable precision and the maximum stress state of the knee joint are obtained. The sensor has the advantages of being flexible, thin, skin-friendly, high in sensitivity and stable in signal output.

The invention discloses a potassium ion sensor based on AuNPs / MXene / SPCE and a preparation method thereof, and belongs to the technical field of electronic components. Comprising a screen-printed carbon electrode SPCE, an MXene layer modified on the surface of a working electrode of the screen-printed carbon electrode, a gold nanoparticle AuNPs layer formed on the surface of the MXene layer through an electrochemical deposition method, a potassium ion selective membrane covering the gold nanoparticle AuNPs layer, and a GO-PVA hydrogel layer coating the surface of the potassium ion selective membrane. According to the prepared sensor, only potassium ions in sweat can pass through the selective membrane, the selectivity of the sensor is improved, meanwhile, due to the application of the AuNPs / MXene composite material, the surface area-volume ratio of a silk-screen printing carbon electrode is greatly improved, more potassium ions participate in ion-electron conversion, the sensitivity of the sensor is improved, and the application range of the sensor is widened. And the detection range is expanded.

The present invention relates to the technical field of flexible electronics, and relates to a breathable and stretchable circuit capable of being activated by imprinting, and a preparation method therefor and a use thereof. The preparation method for the breathable and stretchable circuit capable of being activated by imprinting in the present invention comprises the following steps: dissolving a thermoplastic polymer in a solvent, adding liquid metal particles, and mixing and dispersing to obtain a mixed solution; carrying out electrospinning on the obtained mixed solution to prepare a nanofiber membrane; and using a stamping model having a circuit pattern to stamp the obtained nanofiber membrane so as to obtain the breathable and stretchable circuit capable of being activated by imprinting. The present invention ensures the breathability and the stretchability by using the nanofiber membrane. The liquid metal particles match fibers in diameter, and therefore, liquid metal in nanofibers can be overflowed by means of imprinting to form a conductive path, achieving high-precision preparation of circuits.

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

A stretchable circuit board assembly and a method for manufacturing the same are provided. The circuit board assembly includes a flexible circuit board and an outer circuit board. The flexible circuit board includes a first base layer and an inner wiring layer. The flexible circuit board is divided into a connecting area and a stretchable area. The inner wiring layer within the connecting area includes an electrical connecting portion exposed from the outer circuit board. The stretchable area is configured to deform into at least one bent portion. The bent portion is used to cause the electrical connecting portion to stretch relative to the outer circuit board. The outer circuit board includes a second base layer and an outer wiring layer. A surface of the second base layer away from the outer wiring layer defines at least one blind groove. The blind groove is configured to receive the bent portion.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a quick release device for an SMT red glue printing screen. Comprising a frame, a supporting plate and a printing screen plate, an inserting groove is formed in the frame, the supporting plate is installed on the frame through the inserting groove, and the printing screen plate is detachably installed on the supporting plate; a push-out assembly is arranged in the frame, and the supporting plate is pushed out of the inserting groove through the push-out assembly so that the printing screen can be replaced conveniently. The device has the effect of improving the mounting or dismounting and replacing efficiency of the printing screen plate, and has the characteristics of simple structure and convenience in operation.

The invention discloses a laser printing assisted reduced pressure filtration preparation process of an electromagnetic loss metasurface, which belongs to the field of microwave communication, has the advantages of short time consumption and low cost, and is suitable for small-batch design and preparation in product research and development. The electromagnetic loss metasurface template is prepared through a laboratory laser or ink-jet printing technology to obtain the microfiltration membrane mask, operation is convenient and fast, consumed time is short, and cost is low. The electromagnetic loss metasurface is obtained by pattern deposition on a microfiltration membrane mask through a decompression suction filtration process, and finally the electromagnetic loss metasurface is obtained through transfer printing and packaging. The preparation process has wide application prospects in the fields of aerospace, radar communication, medical electronics and the like.

The invention discloses a method for manufacturing a high-precision carbon oil resistor circuit board for a vehicle, which comprises the following steps of: attaching a thick copper layer and a micro-adhesive film to form an attaching plate, and manufacturing a groove in the attaching plate corresponding to a resistor pattern; the thickness of the thick copper layer is greater than the depth of the groove; the grooves are filled with carbon oil, then curing processing is carried out, carbon oil patterns are formed, and the whole board forms a carbon oil pattern board; laminating the first single-sided copper-clad plate and the carbon oil pattern plate; the first single-sided copper-clad plate is opposite to the carbon oil pattern; removing the micro-adhesive film, carrying out copper reduction treatment on the thick copper layer, exposing the carbon oil pattern, forming a carbon oil pattern double-sided board, then manufacturing a circuit pattern, and carrying out post-process processing to form a circuit board; the precision of the carbon oil pattern manufactured through the reverse manufacturing process is far higher than that of traditional silk-screen printing, and the problem that the resistance value of the carbon oil pattern exceeds the standard due to the fact that the processing size of the carbon oil pattern is not easy to control in a silk-screen printing ink manufacturing mode in the prior art is solved.

The invention belongs to the technical field of conductive silver paste, and particularly relates to composite conductive silver paste and a preparation method and application thereof. The raw materials comprise modified silver powder, glass powder and an additive; wherein the raw materials of the modified silver powder comprise micron-scale silver powder and nano-scale silver powder; the organic carrier comprises the following raw materials: polyimide resin, simethicone and a dispersing agent; the additives comprise carbon nanotubes, a titanate coupling agent, fumed silica, a defoaming agent and an organic carrier. The method comprises the following steps: adding the modified silver powder, the glass powder, the carbon nano tube, the titanate coupling agent, the fumed silica and the defoaming agent into the organic carrier, and stirring to obtain primary mixed slurry; and grinding the preliminary mixed paste until the fineness of the paste is less than or equal to 5 microns, and then defoaming to obtain the composite conductive silver paste. The composite conductive silver paste is applied to preparation of a flexible circuit board. The printing forming process is adopted, waste water and waste gas are avoided, safety is high, and production efficiency is high.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

A method for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes receiving in a fixture the circuit package module upside down and removably coupling a stencil to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. The method also includes applying solder paste over the stencil to pass through the apertures to add solder paste to the solder interconnects. The method also includes removing the stencil from over the fixture, and removing the circuit package module from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

The utility model discloses a millimeter wave radar PCB of an antenna area Hoz, and belongs to the technical field of PCBs. The millimeter wave radar PCB comprises n layers of circuit boards, wherein n is an even number; the n layers of circuit boards respectively form antenna radio frequency layers and digital signal control layers, the L1-L2 layers are the antenna radio frequency layers, and the L3-Ln layers are the digital signal control layers; the antenna radio frequency layer comprises an antenna pattern, the outer EA position of the antenna pattern is provided with a triangular protruding part protruding outwards, and the inner EA position of the antenna pattern is provided with a triangular notch part recessed inwards. The antenna has the beneficial effects that the 45-degree triangle design is additionally arranged at the outer EA position of the antenna pattern, 25 microns are added outwards, the 45-degree triangle design is designed at the inner EA position, and 25 microns are cut inwards, so that the precision of the feeder line, the bonding pad and the EA is ensured.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

A method for fabricating a printed gel-electronic circuit includes depositing a conductive material on a substrate, depositing first gel over the conductive material on the substrate, air-drying the first gel, depositing second gel over the air-dried gel, freezing a combination of the second gel, the air-dried gel, and the conductive material, and thawing the combination of the second gel, the air-dried gel, and the conductive material.

An exchanging unit for use in a printing device including a printing section to execute a printing process of printing a viscous fluid on a processing target object using a screen mask, and includes a receiving section configured to receive an accommodation rack having multiple shelf sections each configured to accommodate a frame that is capable of supporting an exchangeable member for use in the printing device, a lifting and lowering section configure to lift and lower the accommodation rack between an exchange position where to exchange the exchangeable member and a liftable position situated further downwards than the exchange position, and a moving section configured to move the accommodation rack between the liftable position where the accommodation rack can be lifted up by the lifting and lowering section and an accommodation position where the accommodation rack enters an interior of a housing of the printing device.

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

The invention provides a multifunctional flexible electronic device based on ionic liquid gel and patterned liquid metal and a preparation method. The preparation method comprises the following steps: firstly preparing ionic liquid gel with excellent performance as an upper substrate and a lower substrate of the flexible electronic device, then forming a high-resolution conductive pattern on the ionic liquid gel through a template printing method by using liquid metal alloy subjected to surface modification, and finally curing and packaging by using another layer of ionic liquid gel. According to the flexible electronic device, the modified particles are introduced to be mixed with the liquid metal, the flexible electronic device with the tensile adjustable resistance change characteristic is prepared, and meanwhile, the conductive patterns form firm interface bonding with the gel matrix through hydrogen bonds formed between the gallium with the oxidized surface and carboxyl of the ionic gel. Even if the prepared multifunctional flexible electronic device is stretched and released, the composite material can keep continuous contact with the base material, so that stable electric connection is maintained, and the method is suitable for the fields of wearable electronics and flexible electronics.

The invention relates to an auxiliary cathode design for preparing a uniform nickel-phosphorus alloy resistive film by electroplating, which aims at the edge polarization effect generated by electroplating the nickel-phosphorus alloy resistive film, changes the distribution of electric field lines by adding an auxiliary cathode, and improves the uniformity of a plating layer by adjusting the width of a copper sheet, the front-back distance and the like. And the edge polarization effect caused by electroplating can be effectively solved. The method is suitable for aerospace, electronic circuit and other industries.

The invention discloses a solder paste printing and quality detection integrated system for circuit board production, which relates to the technical field of circuit board detection, and is characterized by comprising a control module, a printing module, a quality detection module and a feedback regulation module, the device has the effects that the control module performs deviation analysis and comprehensive quality evaluation based on a solder paste quality standard preset in the quality standard database, when detection data exceed a standard range, the control module generates instructions for adjusting printing pressure, scraper speed, scraper angle and solder paste supply quantity, the deviation is corrected in real time through the feedback adjustment module, and the printing quality is improved. Therefore, the printing quality is optimized; when the data is within the standard range, the system does not need to be adjusted, the printing module continues to operate according to the original parameters, an efficient real-time closed-loop control process is formed, the process complexity is reduced through an integrated detection and feedback mechanism, the production efficiency is improved, boundary integrity detection and parameter dynamic optimization are achieved through a # imgabs0 # visual algorithm, and the method is suitable for large-scale production. And the defect rate is effectively reduced.

The present invention relates to the field of screen printing technology, and in particular to a circuit board screen printing device and a screen printing process. A circuit board screen printing device and a screen printing process, including a screen printing body, a mounting plate, a fixture, a screen and an ink scraping assembly, etc.; a mounting plate is installed on the rear of the screen printing body through an electric drive rail; a plurality of fixtures are connected to the mounting plate; a screen is installed on the plurality of fixtures; an ink scraping assembly for scraping ink on the mounting plate; the mounting plate, the fixture, the screen and the ink scraping assembly are driven up and down by the electric drive rail. By setting the maximum travel position of the scraper and the ink return knife to be located above the intercepting surfaces on the left and right sides respectively, the movement of the ink is intercepted, limited and guided by the intercepting surface, and the scraper and the ink return knife subsequently scrape the ink along the intercepting surface. During the printing process and the ink return process, it is ensured that the ink is always located on the working area, avoiding the problem of ink moving outside the working area due to the push of the scraper and the ink return knife, causing waste.

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

The invention relates to a modularized PCB laser imaging device, and belongs to the field of PCB machining, the modularized PCB laser imaging device comprises a supporting seat, a mounting groove is formed in the supporting seat, a conveying belt and a fixing block are mounted in the mounting groove, and a first support, a second support, a third support and a second guide plate are mounted on the supporting seat; the first support, the second support and the third support are each provided with an electric lifting sliding base, an electric translation sliding base and a laser machining head, a guide assembly is installed on each electric lifting sliding base, a diagonal plane is formed in each electric lifting sliding base, a connecting frame is installed on the fixing block, and protruding blocks are installed on the two sides of each connecting frame. A first magnetic block is installed on the protruding block, and a sliding groove is formed in the conveying belt. The PCB laser imaging device solves the problems that an existing PCB laser imaging device cannot shrink and clamp after being centered, cannot automatically release after being processed, and cannot concentrate a PCB production line in the same longitudinal space.

The utility model discloses a fluid damper, an ink supply assembly, printing equipment and a printing production line, belongs to the technical field of printing equipment, and aims to solve the technical problem that an existing printing equipment easily causes non-uniform ink jet of a printing head, the fluid damper comprises a shell and a pressure attenuation part, and an ink inlet cavity and a damping cavity are formed in the shell; an ink inlet hole and an ink outlet hole which are communicated with the ink inlet cavity are formed in the shell, the junction of the damping cavity and the ink inlet cavity is sealed and separated by a pressure attenuation part, and the fluid damper is connected with an external ink supply assembly and an external ink using assembly. When the pressure in the ink pipe is changed, the pressure is transmitted to the pressure attenuation part, and the pressure attenuation effect of the pressure attenuation part and the gas cavity in the damping cavity are used for absorbing and compensating the pressure in the ink inlet cavity, so that the pressure fluctuation amplitude in the ink pipeline is reduced.