1112results about "Conductive pattern formation" patented technology

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

The invention relates to the technical field of electronic design automation, and provides an intelligent three-dimensional design optimization system for an ink-jet circuit board. The system comprises a field programmable gate array core control module, a microcontroller co-processing module, a multi-channel stepping motor driving module, a multi-mode communication interface module, a sensor feedback and state monitoring module and a three-dimensional layout optimization structure. High-precision real-time control and management are realized through heterogeneous cooperation of the programmable gate array core control module and the microcontroller cooperative processing module; in cooperation with multi-channel stepping motor driving, multi-mode communication and sensor feedback, a three-dimensional layout optimization structure is used for carrying out system space optimization on components, signals and a power supply, and heat dissipation, electromagnetic compatibility and signal integrity are remarkably improved. According to the system, the control precision and the real-time monitoring and remote management efficiency are effectively improved, the response speed, the operation stability and the maintainability of the system are enhanced, and high integration level and high reliability are achieved.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to an adsorption layer for promoting patterning and separation of liquid metal, a preparation method of the adsorption layer and a recoverable flexible liquid metal sensing device. The metal organic framework material-polymer is used as an adsorption layer for promoting patterning and separation of the liquid metal, and the characteristics that the liquid metal is adsorbed on the surface of the polymer and repelled on the surface of the metal organic framework material are achieved by adjusting surface functional groups and roughness. And meanwhile, high-precision patterning is carried out on the polymer through a 3D printing or photoetching technology, and a high-precision liquid metal pattern is obtained under selective adsorption of the liquid metal. Besides, according to the dissolution characteristics of the metal-organic framework material and the polymer, a two-step recovery method for dissolving the polymer, separating the liquid metal from the polymer and then dissolving and separating the metal-organic framework material is designed, and the scheme of the invention is beneficial to the integration and sustainable development of the liquid metal-based electronic device.

An additively manufactured electronics packaging assembly including a build substrate formed from a plurality of additively printed layers. One or more additively printed electrical interconnects can be positioned within the plurality of layers. The assembly can include an electronics housing built along the build substrate. The electronics housing can include one or more additively printed walls extending around a component cavity and a housing lid enclosing and sealing the cavity. One or more additively printed electrical circuits can be included within the component cavity, which can be electrically connected with the additively printed electrical interconnects. One or more electronic components can be positioned within the cavity and can be electrically connected to the additively printed electrical interconnects. The additively printed electrical circuits can be used to indicate a leak in the additively manufactured electronics packaging assembly.

A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.

The invention discloses a manufacturing method of a flexible electronic skin light source, which comprises the following steps: cutting a base material to obtain a base material raw material with a required size; obtaining conductive silver paste, mixing the conductive silver paste with a diluent, and uniformly stirring to prepare conductive ink; printing conductive ink on the surface of the base material raw material according to a preset circuit pattern by using screen printing equipment to obtain a base material circuit diagram; placing a light source patch at a corresponding position of the substrate circuit diagram, and electrically connecting the light source patch with the circuit diagram by adopting welding equipment to obtain an electrically connected light source patch substrate; laminating a polyimide reinforcing material on the back surface of the light source patch to obtain a flexible light source semi-finished product; the flexible light source semi-finished product is packaged, the flexible light source semi-finished product is completely wrapped, and the flexible electronic skin light source is obtained; the flexible electronic skin light source manufactured through the method can be bent in any direction, the bending frequency of the flexible light source is greatly increased, and the service life of the flexible light source is greatly prolonged.

The present disclosure is directed to providing a thermoplastic resin composition that serves as a material for a component for a telecommunication apparatus with excellent performance as an antenna and that exhibits excellent antenna performance regardless of injection molding conditions, particularly when injection molding is performed at high temperatures. The present disclosure contains a polyphenylene ether-based resin and a laser direct structuring additive (LDS additive), wherein the inter-particle distance of the LDS additive is 2.2 to 3.2 ¡..tm, the Vicat softening temperature is 90 °C or higher, and the water absorption rate is 1.5% or less.

The invention discloses a PCB and a production method and application thereof, the PCB comprises a PCB substrate, the PCB substrate is provided with a plurality of pads, a planar transformer and a plurality of lines, the PCB substrate is provided with first grooves corresponding to the pads one by one, and the PCB substrate is provided with second grooves corresponding to the planar transformer; copper foil layers are deposited on the inner wall of the first groove and the surface of the PCB substrate corresponding to the plurality of lines, so that a bonding pad and lines are formed, and a tin alloy layer is arranged on the copper foil layer corresponding to the bonding pad area; the planar transformer is embedded in the second groove, the planar transformer comprises a magnetic core and a coil, and the coil is electrically connected with the copper foil layer. According to the invention, the generation of welding spot bubbles can be effectively avoided, the welding quality and the heat dissipation performance can be improved, the production process can be simplified, the production cost can be reduced, and the product integration can be improved.

The invention provides a circuit board with copper columns with different heights, a preparation method of the circuit board and a circuit board assembly. The first copper column and the second copper column which are different in height are formed by tearing off the separable copper foil layer and the base material layer, and certain base material layer and copper foil layer are reserved on the surface of the copper column, so that the uniformity (smoothness) of the height of the copper column can be improved, the heat dissipation performance can be improved, and the pollution problem caused by using a dry film is avoided. According to the circuit board, three-dimensional wiring can be achieved on a two-dimensional plane, coupling between adjacent signal lines is reduced, crosstalk between signals can be reduced, the mechanical strength balance of connecting points is ensured through the smooth copper column thickness, and therefore the reliability of a printed part can be improved.

The utility model relates to an integrated circuit printing device in the technical field of integrated circuit printing, which comprises a body and an adsorption platform, the adsorption platform is provided with a plurality of vacuum holes, the side edge of the body is provided with side edge vacuum holes, and the body is internally provided with a limiting pin. According to the utility model, an optimization mode that the PCB units are in one-to-one correspondence with the vacuum holes is adopted, so that the adsorption effect is greatly enhanced, the phenomena of substrate warping, shaking and the like caused by vacuum adsorption weakness in the printing process are effectively avoided, the solder paste printing balling quality is greatly improved, the defective rate of products is remarkably reduced, and the production efficiency is improved. And the production efficiency is greatly improved, and considerable economic benefits are created for integrated circuit manufacturing enterprises.

The application belongs to the technical field of circuit board printing, and particularly relates to a high-performance circuit board anti-soldering printing process. The high-performance circuit board anti-soldering printing process comprises the following steps: S1, pretreatment; S2, preparation of anti-soldering ink; S3, silk screen printing; and S4, curing. Through the pretreatment fine etching, preparation of anti-soldering ink, high-precision silk screen printing and segmented curing process, the adhesion, temperature resistance and thermal shock resistance of the anti-soldering layer are significantly improved, the dielectric loss and process defect rate are reduced, and the strict requirements of high-frequency and high-speed circuits on reliability and signal integrity are fully met.

The invention relates to a preparation method of a flexible base material, a base material, a preparation method of a circuit board and the circuit board. The preparation method of the flexible base material comprises the following steps: providing glass fiber cloth; immersing the glass fiber cloth into the premixed slurry; the glass fiber cloth soaked with the premixed slurry is dried, and the flexible base material is obtained; wherein the premixed slurry is prepared from the following components in parts by weight: 5 to 15 percent of a solvent, 5 to 10 percent of dicyandiamide, 1 to 6 percent of 2-methylimidazole, 40 to 55 percent of epoxy resin and 10 to 25 percent of a filling agent. According to the technical scheme provided by the invention, the reflectivity of the flexible substrate can be improved to a certain extent, and yellowing of the flexible substrate is avoided.

The invention discloses circuit board screen printing alignment equipment with a line defect detection interface, and relates to the technical field of circuit board processing equipment.The circuit board screen printing alignment equipment comprises a bearing support, a first fixing plate and an electric telescopic rod, a feeding mechanism is installed on the right side of the bearing support, and a qualified product discharging mechanism is installed on the left side of the bearing support; and a defective product discharging mechanism is arranged on the side of the qualified product discharging mechanism in parallel. According to the circuit board silk-screen alignment equipment with the circuit defect detection interface, by arranging the alignment detection camera, when a circuit board to be printed is conveyed to the transfer mechanism through the feeding mechanism, defect detection processing can be automatically carried out on a circuit on the circuit board, printing processing is carried out on the circuit board without defects, and the circuit board defect detection processing efficiency is improved. And defective products are conveyed away through the defective product discharging mechanism, so that it is effectively ensured that the equipment can screen out the defective products in time before silk-screen processing, and the purposes of reducing ink loss and facilitating detection are achieved.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.

The utility model discloses a vacuum adsorption traction plate which comprises a traction plate body, a vacuum pipe and a vacuum pump. The interior of the traction plate is hollowed out to form a vacuum groove, a vacuum hole and a vacuumizing opening are formed, a vacuum valve is installed on the vacuumizing opening, and the vacuumizing opening is connected with a vacuum pump through a vacuum pipe, so that during use, a membrane material is placed in the area where the vacuum hole of the traction plate is located, the vacuum pump is opened to pump out air in the vacuum groove, and the membrane material and the traction plate are tightly adsorbed together; then closing the vacuum valve and pulling out the vacuum pipe, so that the membrane material can be pulled for processing; and when the membrane material needs to be taken down, the vacuum valve is opened to enable air to enter the vacuum groove. The membrane material traction device is reasonable in design and simple in structure, the membrane material and the traction plate can be quickly connected without additionally using adhesive tapes or other bonding materials, and the working efficiency is improved while the stability of the membrane material traction process is ensured.

The invention relates to the technical field of high-precision assembly of an LED die bonding process, in particular to a steel mesh and PCB size matching dynamic mapping method and device, and solves the problem of matching failure caused by size change of a steel mesh. The method comprises the following steps of: selecting a PCB (Printed Circuit Board) product of which the stability meets a preset condition after solder paste printing is completed from the current production, and calculating by extracting solder paste images at four corners of the PCB product to obtain the actual size data of the current screen; matching a to-be-matched PCB with the screen plate based on the actual size data of the current screen plate; and when a preset screen data updating condition is met, re-selecting the printed PCB product meeting the preset condition from the current production, extracting the solder paste images at the four corners of the PCB product to update the actual size data of the screen, and continuing to match the subsequent to-be-matched PCB with the screen based on the updated actual size data.

Method for manufacturing a flexible strain sensor, comprising: Placing a flexible substrate on a movable stage in a working chamber, in which the movable stage, suitable for a desired movement according to a control signal, and a nozzle, suitable for spraying towards an upper surface of the movable stage, are installed, and with which a first pressure control unit, suitable for controlling an internal pressure of the working chamber, is combined; and preparing a printing material mixture, which comprises metal nanoparticles and carbon nanotubes (CNTs) in a powder form, which is to be introduced into a printing material tank, which is provided with an upper outlet that communicates with a nozzle via a first communication line, and a lower inlet, with which a second pressure control unit, suitable for controlling pressure, is combined. Control, by means of a control unit, a movement of the movable stage by providing a predetermined motion control signal to the movable stage in order to move the flexible substrate at a desired speed along a path which corresponds to a predetermined conductor pattern of a strain sensor, Forming a relatively low-pressure atmosphere within the working chamber by operating the first pressure control unit and simultaneously a relatively high-pressure atmosphere at a lower inlet of the pressure material tank by operating the second pressure control unit, In parallel with controlling the movement of the movable stage, the printing material mixture is forcibly transmitted in an aerosolized state through the first communication line from the printing material tank to be sprayed through the nozzle towards a surface of the flexible substrate by means of a compression wave, which is caused by a pressure difference between the low-pressure atmosphere and the high-pressure atmosphere. Direct printing of a predetermined conductor pattern of the strain sensor onto the flexible substrate by a process in which the printing material mixture, which is extruded through the nozzle, collides with the surface of the flexible substrate to create cracks on the surface, and the CNTs penetrate into the cracks and are mechanically anchored to the flexible substrate, and then the following metal nanoparticles and CNTs of the printing material mixture are deposited in a predetermined width and height on the surface of the flexible substrate. Connecting a first and a second lead wire, which extend electrically to protrude from the flexible substrate, to both ends of the predetermined conductor pattern of the strain sensor and Binding a flexible cover, which has the same size as the flexible substrate, to the surface of the flexible substrate on which the predetermined conductor pattern is printed, so that the predetermined conductor pattern is inserted between the flexible substrate and the flexible cover.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.