169results about "Conductive pattern formation" patented technology

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

An object is to provide a copper-chromium oxide spinel having excellent dispersibility in a resin composition and excellent adhesion to plating, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN = (D90 - D10) / D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.

Method for manufacturing segmented electro-optic display backplanes includes (a) providing a laminate comprising an insulating layer having opposite first and second surfaces and a conductive metal layer having opposite first and second surfaces (the insulating layer second surface is superposed on the conductive metal layer first surface); (b) applying laser energy from a first laser source passing through the insulating layer onto selected portions of conductive metal layer first surface to cause adjacent portions of the insulating layer to be pyrolyzed to form conductive carbon regions; (c) applying laser energy from a second laser source on the insulating layer first surface to pyrolyze selected portions thereof into conductive carbon segments electrically isolated from each other by other portions of the insulating layer. The conductive carbon regions in the insulating layer form vias between each of the conductive carbon segments and one of the selected portions of the conductive metal layer.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

A stencil printer for printing assembly materials on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having an aperture formed therein, a support assembly coupled to the frame, the support assembly configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The stencil printer further includes a verification system for determining whether an item placed within the stencil printer is properly installed within the stencil printer.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

This invention discloses a physical sealing mechanism for a multilayer polymer-encapsulated liquid metal power supply channel, aiming to solve the reliability problem of flexible electronic devices in complex environments. The mechanism includes: firmly bonding a substrate polymer film to a textile substrate via a thermo-pressing process; forming a conductive layer by spraying liquid metal using a template; achieving multilayer stacking of an intermediate polymer film with through-holes and the conductive layer using solvent-based soft soldering technology; and finally, completely encapsulating the entire circuit by casting or coating a polymer layer. The core of this invention lies in the synergistic use of multiple physical bonding mechanisms to achieve strong interlayer adhesion, effectively preventing leakage or electrical failure of the liquid metal under extreme stretching and underwater environments. This mechanism provides a reliable solution for constructing highly robust, underwater-operable multilayer flexible electronic devices.

The application relates to the technical field of tin paste printing machines, in particular to a tin paste printing machine for circuit board patch production, which comprises a steel mesh and a scraping mechanism arranged on the steel mesh, the scraping mechanism comprises two threaded hole plates, the two threaded hole plates are respectively arranged at the center or away from a threaded rod rotating, and the two threaded hole plates are used for driving the scraping pieces to slide at the center or away from the center and contact the steel mesh. When the scraper moves to one side, the motor drives the threaded rod to rotate and cooperate with the forward threaded hole and the reverse threaded hole, and the reverse 'T' shaped sliding block linearly slides in the reverse 'T' shaped sliding groove, so that the two scraping pieces move to the center, the residual tin paste on the side is pushed to the middle of the steel mesh, a continuous tin paste belt is formed, and the tin paste gathered in the center can be directly used to fill the opening when the scraper passes, the residual tin paste on the two sides is reduced, and the waste of the tin paste is reduced.

A chip-embedded circuit board assembly includes: a prefabricated circuit board; a chip packaging unit embedded in the board, where heat dissipation fins are provided on a back surface of the chip packaging unit and protrude outward from a lower surface of the board; and a dual-layer cooler provided below the board and including an oil cooling cavity in contact with the fins and a water cooling cavity in contact with the oil cooling cavity, where interfaces of the oil and water cooling cavities are exposed from the board. The fins improve heat dissipation, and protrude outward such that the cooler does not need to contact the fins in an embedded manner, and the interfaces of the oil and water cooling cavities are exposed to facilitate piping connection. The oil cooling cavity cools the fins and achieves insulation protection, and the water cooling cavity cools the oil cooling cavity.

An electrical component includes at least one conducting trace configured for conducting radiofrequency (RF) signals. The at least one conducting trace has a broadband conductive material applied onto one or more specific locations along the at least one conducting trace. In certain embodiments, the one or more specific locations are locations detected or anticipated to have surface roughness. In certain embodiments, the presence of the broadband conductive material improves the signal integrity of RF signals conducted along the conducting trace (compared to if the broadband conductive material was not present). Certain embodiments provide methods for fabricating such electrical components.

A photosensitive element according to the present disclosure, includes: a support film; a photosensitive layer; and a protective film in this order, in which the protective film is a polyethylene film, the photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, and the anthracene-based sensitizer includes an anthracene compound having an alkoxy group having 3 or less carbon atoms, bonded at a 9-position and a 10-position of an anthracene ring.

A resin substrate (111), on which a paste pattern (112) of a metal paste is formed, is fixed on a fixing plate (101) made of a metal having a thermal capacity per unit volume of 3,000 [kJ / m3·K] or more and a thermal conductivity of 45 [W / m·K] or more, and the paste pattern (112) is baked by irradiating the paste pattern (112) formed on the resin substrate (111) fixed to the fixing plate (101) with near infrared rays emitted from a light source (102), thereby forming a conductive pattern on the resin substrate (111). A peak wavelength range of the irradiated near infrared rays is 0.8 to 1.7 µm.

The invention discloses a circuit board, which is characterized by comprising a lead wire for mounting a patch fuse, which forms a circuit pattern and is broken in the middle; a patch fuse which is mounted to a broken portion of the patch fuse mounting lead wire and blocks a current flowing through the circuit pattern when an overcurrent occurs; the pattern fuse wire and the patch fuse mounting wire are arranged in parallel, and the middle of the pattern fuse wire and the patch fuse mounting wire are disconnected; and a pattern fuse which is formed at a broken portion of the pattern fuse wire and blocks a current flowing through the circuit pattern when an overcurrent occurs. Therefore, even if the patch fuse is damaged, the pattern fuse can properly cope with the blocking capacity.

This invention provides a rapid prototyping method for an integrated low-temperature co-fired ceramic substrate with integrated air bridges, relating to the technical field of hybrid integrated circuits. The rapid prototyping method specifically includes: preparation of an LTCC green substrate; preparation of an organic solvent; preparation of a pre-converter slurry for the isolation layer; preparation of a support layer slurry; air bridge printing; and air bridge sintering. This invention uses a printing process to prepare the air bridge structure, combined with a low-temperature co-fired ceramic process, to form the air bridge structure simultaneously with the preparation of the integrated LTCC substrate. The integrated air bridge process is fully compatible with the LTCC process, and simultaneous sintering saves processing time and eliminates the need for additional specialized equipment, significantly reducing production costs. The air bridge structure prepared by this invention possesses higher temperature resistance and lower parasitic capacitance (superior microwave performance) compared to air bridge structures prepared by traditional photolithography processes, thus meeting the needs of more application environments and exhibiting higher reliability.

A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.

The embodiment of the application discloses a kind of slurry management and control method and device, equipment, storage medium, the method comprises: by image acquisition device obtains the first image corresponding to printing screen plate, wherein printing screen plate is used to print slurry on workpiece;First image is identified, and the first width corresponding to the slurry strip of printing area in printing screen plate is obtained, and the slurry strip is formed by slurry accumulation;According to the size relationship of first width and preset width threshold, output target prompt information, wherein target prompt information includes the first prompt information indicating to add slurry to printing screen plate, or, the second prompt information indicating that the slurry balance of printing area is abnormal.It can realize the accurate control of the slurry balance of printing area in printing screen plate, and output the prompt information indicating to add slurry or slurry balance is abnormal, improve printing quality.

The application discloses a motor control circuit board preparation process, comprising providing a circuit board semi-product with a single functional surface; the functional surface comprises a functional area and a non-functional area, and the functional area comprises a ring-shaped conductive area, a contact area and a wear-resistant conductive area; on the functional surface of the circuit board semi-product, a carbon oil functional layer is selectively formed on the functional area by silk printing, the carbon oil functional layer covers the surface of the copper circuit, and a clear boundary relationship is formed between the carbon oil functional layer and the adjacent non-functional area; the circuit board is subjected to pre-drying treatment; the circuit board is subjected to solder mask treatment to form a solder mask layer covering the non-functional area and an insulating protection part and a boundary limiting structure surrounding the carbon oil functional layer, and the solder mask layer and the carbon oil functional layer are matched in a spacing, lapping or window opening mode; the forming quality and the adhesion stability of the carbon oil edge are improved, the mutual interference between the functional area and the non-functional area is reduced, and the consistency and the processing yield of the circuit board product are further improved.

A high speed circuit and a method of manufacturing low crosstalk differential traces are disclosed. The high speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and a second surface opposite the first surface. The ground plane layer has a first surface that contacts the second surface of the printed circuit board. The pair of first and second differential traces are located on the first surface of the printed circuit board. The first differential trace and the second differential trace carry an electrical signal. The cascading common mode filter includes an external common mode filter and an internal common mode filter. The external common mode filter includes a U-shaped gap segment located on the first surface of the ground plane layer. The internal common mode filter includes an H-shaped gap segment located on the first surface of the ground plane layer. The H-shaped gap segment is located adjacent to the U-shaped gap segment.

The application discloses an integrated circuit board, a preparation method thereof and an aircraft floodlight circuit. The integrated circuit board comprises: an insulating substrate, a first surface of the insulating substrate is provided with a first microstructure, wherein the first microstructure comprises a first groove and a first columnar structure, and the first groove is in a net shape and surrounds the first columnar structure; and a conductive pattern is arranged on the first surface and at least partially located in the first groove; and the conductive pattern comprises a nano metal reduction layer. The application can reduce the volume and weight of the circuit in the aircraft.

The invention is aimed at providing a transfer method for a functional material onto a receiving substrate. The method comprises the steps of: providing a plate including at least one cavity, providing a functional material followed by providing at least one coating covering the functional material. Releasing the coated functional material by imparting an energy pulse at the at least one cavity such that the functional material is transferred onto a receiving substrate.

A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductive layer and the intermediate layer. After the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer. The intermediate layer before the etching includes a portion overlapping the second conductive layer in a vertical direction and another portion not overlapping the second conductive layer in the vertical direction.

The invention relates to an electronics assembly (EA) comprising: - a circuit carrier (ST), - a semiconductor component (HB) which is embedded in the circuit carrier (ST) and has an electrical contact surface (KF1), - wherein the contact surface (KF1) of the semiconductor component (HB) is contacted physically and electrically by means of a microvia (MV), the microvia (MV) being sintered onto the contact surface (KF1) of the semiconductor component (HB) in a sintering process from a metallic, in particular copper-containing, sinter paste (SP). The invention also relates to an inverter comprising said electronics assembly (EA) and to a method for manufacturing said electronics assembly (EA)

This invention discloses a processing technology for photoelectric glass used in curtain walls, relating to the field of photoelectric glass processing technology, including the following steps: S1, cleaning and drying tempered glass; S2, cutting PVB film and attaching it to the tempered glass; S3, making FPCB light strips using FPCB material; S4, manufacturing conductive strips; S5, attaching the conductive strips to the PVB film of the tempered glass; S6, attaching the FPCB light strips to the PVB film; S7, placing tempered glass on the FPCB light strips to form a photoelectric glass module; S8, placing the photoelectric glass module into an autoclave for heating to form a complete photoelectric glass. This invention mainly uses FPCB, which has good flexibility and a small difference in thermal expansion coefficient, as the carrier substrate for LEDs, making it suitable for the strain and deformation of large curtain walls. This process cuts a whole FPCB light board into single FPCB light strips, which are then inserted into the conductive strips. This avoids waste of FPCB material and allows for flexible allocation of the distance between the FPCB light strips to adapt to any size. The detachable connection makes the curtain wall photoelectric glass easy to maintain.