1890results about "Conductive pattern formation" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention discloses a fine circuit pattern anti-diffusion agent as well as a preparation method and a use method thereof, and relates to the technical field of printed circuit board manufacturing. The fine circuit pattern anti-diffusion agent is prepared from the following components in percentage by mass: 0.05 to 0.3 percent of an oleophobic agent, 0.1 to 0.6 percent of a bonding agent, 0.2 to 1.5 percent of an adhesion promoter, 0.5 to 4.0 percent of a wetting agent, 0.5 to 5.0 percent of a cosolvent and the balance of water, the oleophobic agent is a fluorophenylethylamine derivative, the bonding agent is a carbonyl chloride derivative, the adhesion promoter is a sulfur heterocyclic alkane derivative, the wetting agent is a methylsiloxane silane derivative, and the cosolvent is a sulfonyl ketone derivative. According to the fine circuit pattern anti-diffusion agent, an organic layer can be formed on the copper surface of a circuit board, the binding force between the copper surface and printing ink is enhanced, jet printing printing ink is prevented from diffusing on the copper surface, and the product percent of pass of a jet printing solder mask process is improved.

The invention discloses a preparation and measurement method of a polymer-based multi-point force flexible sensor for knee joint pose measurement, and relates to the technical field of polymer-based flexible sensors and soft measurement. The structure of the multi-point force polymer-based flexible sensor shaped like a Chinese character'ao 'is designed for knee joint stress and posture state measurement, and the flexible sensor is prepared and packaged through a silk-screen printing method. A flexible sensor strain input-output knee joint stress data mapping set and a flexible sensor strain input-pose angle output data mapping set required by modeling are completed through a flexible sensor, a thin film force sensor corresponding to multi-point force and an inertial sensor corresponding to pose angle measurement of installed multi-point force polymers. And establishing a neural network soft measurement model based on an MLP algorithm, and carrying out training and verification. And the knee joint pose angle with reliable precision and the maximum stress state of the knee joint are obtained. The sensor has the advantages of being flexible, thin, skin-friendly, high in sensitivity and stable in signal output.

The invention discloses a potassium ion sensor based on AuNPs / MXene / SPCE and a preparation method thereof, and belongs to the technical field of electronic components. Comprising a screen-printed carbon electrode SPCE, an MXene layer modified on the surface of a working electrode of the screen-printed carbon electrode, a gold nanoparticle AuNPs layer formed on the surface of the MXene layer through an electrochemical deposition method, a potassium ion selective membrane covering the gold nanoparticle AuNPs layer, and a GO-PVA hydrogel layer coating the surface of the potassium ion selective membrane. According to the prepared sensor, only potassium ions in sweat can pass through the selective membrane, the selectivity of the sensor is improved, meanwhile, due to the application of the AuNPs / MXene composite material, the surface area-volume ratio of a silk-screen printing carbon electrode is greatly improved, more potassium ions participate in ion-electron conversion, the sensitivity of the sensor is improved, and the application range of the sensor is widened. And the detection range is expanded.

The invention discloses a method for manufacturing a circuit board embedded with a carbon oil resistor, which comprises the following steps of: taking a double-sided copper-clad plate, manufacturing a circuit pattern comprising a carbon oil connecting pattern which comprises a wire end and a connecting end, adhering a dry film to two sides, a dry film windowing pattern is manufactured in the area, corresponding to the carbon oil pattern, of the surface where the carbon oil connection pattern is located, plasma treatment is conducted, then film stripping is conducted, a carbon oil layer is manufactured in the area of the carbon oil pattern, a bonding layer prepreg is taken, core plates of other layers are taken and stacked and pressed together with the carbon oil plate, and the circuit board embedded with the carbon oil resistor is formed through subsequent procedure manufacturing; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, prepregs are laminated and bonded to the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling, layering of a multi-layer board and even board explosion of the multi-layer board caused by poor bonding of the carbon oil layer are solved.

The present invention relates to the technical field of flexible electronics, and relates to a breathable and stretchable circuit capable of being activated by imprinting, and a preparation method therefor and a use thereof. The preparation method for the breathable and stretchable circuit capable of being activated by imprinting in the present invention comprises the following steps: dissolving a thermoplastic polymer in a solvent, adding liquid metal particles, and mixing and dispersing to obtain a mixed solution; carrying out electrospinning on the obtained mixed solution to prepare a nanofiber membrane; and using a stamping model having a circuit pattern to stamp the obtained nanofiber membrane so as to obtain the breathable and stretchable circuit capable of being activated by imprinting. The present invention ensures the breathability and the stretchability by using the nanofiber membrane. The liquid metal particles match fibers in diameter, and therefore, liquid metal in nanofibers can be overflowed by means of imprinting to form a conductive path, achieving high-precision preparation of circuits.

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

The invention discloses a conductive ink screen printing precision control method based on deep learning. The conductive ink screen printing precision control method comprises the following steps: acquiring microstructure image data of conductive ink on the surface of a screen printing substrate in real time; generating a thickness enhanced picture by adopting an improved competitive fuzzy C-means clustering algorithm; generating an edge enhancement picture by adopting an improved self-adaptive threshold function; carrying out non-subsampled Contourlet multi-scale decomposition to generate a microcrack enhanced picture; jointly inputting the enhanced pictures into a pre-trained defect recognition model, and extracting a multi-dimensional precision feature vector; dynamically generating a collaborative adjustment parameter set through the parameter prediction model, and carrying out iterative optimization to obtain an optimized parameter set; and according to the optimized parameter set, adjusting an execution mechanism of the screen printing equipment in real time through closed-loop feedback, and synchronously updating a weight coefficient of the defect identification model. According to the invention, real-time multi-dimensional perception of the microstructure of the ink is realized, the anti-interference capability of image processing is improved, a multi-parameter collaborative prediction model is established, and the microcrack detection sensitivity is enhanced.

The invention provides a circuit deposition method and device, and relates to the field of electronic circuit manufacturing, and the method comprises the following steps: preparing a deposition solution; deploying a dripping path of the deposition solution on a sample to be processed according to a preset circuit pattern; and dropwise adding the deposition solution on the sample along a dropwise adding path, and irradiating a dropwise adding region by using laser, so that an oxidation-reduction reaction occurs on the sample, thereby forming a line. The method is based on a laser-induced liquid phase deposition technology, a deposition solution containing metal ions is dropwise added to a sample to be processed according to a preset circuit pattern, laser is further used for irradiating a dropwise adding area, and a needed pattern circuit is formed along with movement of a laser irradiation position. The deposition device applying the method is simple in operation step and does not need post-treatment, and a simplified and environment-friendly solution is provided for the circuit manufacturing industry.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a high-performance inner-layer ultra-thick copper circuit board which comprises a bearing table, a back plate and the like. A back plate is arranged on the bearing table. Printing ink is stored through the storage box, the situation that printing ink is not evenly printed due to printing ink diffusion is avoided, and the printing ink printing effect of equipment is improved; through the structure that the middle of the flow dividing rod is high and the two sides of the flow dividing rod are low, ink is slowly collected into the storage box along the flow dividing rod in cooperation with flowability of the ink, the problem that the ink utilization rate is low is solved, and meanwhile the situation that the ink is accumulated and hardened for a long time is avoided. The circuit board is ejected upwards through the ejector rod, then a worker can hold the lower side of the circuit board with hands to take out the circuit board, and the circuit board is prevented from being damaged while the worker conducts discharging conveniently. And the circuit board is accurately placed on the upper side of the fixing frame through cooperation of a guide plate and a limiting block, so that feeding by workers is more convenient.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

A stretchable circuit board assembly and a method for manufacturing the same are provided. The circuit board assembly includes a flexible circuit board and an outer circuit board. The flexible circuit board includes a first base layer and an inner wiring layer. The flexible circuit board is divided into a connecting area and a stretchable area. The inner wiring layer within the connecting area includes an electrical connecting portion exposed from the outer circuit board. The stretchable area is configured to deform into at least one bent portion. The bent portion is used to cause the electrical connecting portion to stretch relative to the outer circuit board. The outer circuit board includes a second base layer and an outer wiring layer. A surface of the second base layer away from the outer wiring layer defines at least one blind groove. The blind groove is configured to receive the bent portion.

The invention provides a vertical silk-screen up-and-down bidirectional screen shifting device, and relates to the field of circuit board production, the vertical silk-screen up-and-down bidirectional screen shifting device comprises mounting frames, the two mounting frames are each provided with a screen shifting mechanism, screen mechanisms are arranged in the two mounting frames, and a same PCB body is arranged between the two screen mechanisms; fixed plate frames are fixedly connected to the outer walls of the two sides of the two mounting frames, and displacement processing modules are arranged on the four fixed plate frames; the displacement mechanism for moving the screen printing plate comprises four fixing frame pieces. According to the PCB printing screen shifting device, the effect of shifting of the PCB printing screen is achieved, the position between the PCB and the screen shifts between the previous printing and the current printing, printing ink left in the previous printing is staggered from the position of a hole in the printed PCB, and therefore the amount of the printing ink left on the screen is always only the amount left in the previous printing, and the printing efficiency is improved. And the ink is prevented from blocking holes.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a quick release device for an SMT red glue printing screen. Comprising a frame, a supporting plate and a printing screen plate, an inserting groove is formed in the frame, the supporting plate is installed on the frame through the inserting groove, and the printing screen plate is detachably installed on the supporting plate; a push-out assembly is arranged in the frame, and the supporting plate is pushed out of the inserting groove through the push-out assembly so that the printing screen can be replaced conveniently. The device has the effect of improving the mounting or dismounting and replacing efficiency of the printing screen plate, and has the characteristics of simple structure and convenience in operation.

The invention belongs to the field of micro-nano manufacturing technology and microelectronic manufacturing, and particularly relates to a method for manufacturing a complex curved surface conformal high-resolution embedded circuit, which comprises the following steps of: firstly, processing a nano groove structure with a specific pattern on a hard curved surface substrate according to a preset path; a metal seed layer is deposited in the groove, then the groove is filled with a conductive material by adopting filling technologies such as precise electroplating / chemical plating, fusion strengthening is generated among various metals by adopting a laser heating mode, and the adhesive force with the hard curved surface substrate groove structure can be further enhanced after the metals are cooled. And the requirements of extremely severe service environments are met. A new solution is provided for low-cost manufacturing of the embedded curved surface circuit which is high in resolution, adjustable in height-width ratio, high in electrical performance, high in adhesive force and capable of combining multiple materials.

The invention discloses a laser printing assisted reduced pressure filtration preparation process of an electromagnetic loss metasurface, which belongs to the field of microwave communication, has the advantages of short time consumption and low cost, and is suitable for small-batch design and preparation in product research and development. The electromagnetic loss metasurface template is prepared through a laboratory laser or ink-jet printing technology to obtain the microfiltration membrane mask, operation is convenient and fast, consumed time is short, and cost is low. The electromagnetic loss metasurface is obtained by pattern deposition on a microfiltration membrane mask through a decompression suction filtration process, and finally the electromagnetic loss metasurface is obtained through transfer printing and packaging. The preparation process has wide application prospects in the fields of aerospace, radar communication, medical electronics and the like.

The invention discloses a method for manufacturing a high-precision carbon oil resistor circuit board for a vehicle, which comprises the following steps of: attaching a thick copper layer and a micro-adhesive film to form an attaching plate, and manufacturing a groove in the attaching plate corresponding to a resistor pattern; the thickness of the thick copper layer is greater than the depth of the groove; the grooves are filled with carbon oil, then curing processing is carried out, carbon oil patterns are formed, and the whole board forms a carbon oil pattern board; laminating the first single-sided copper-clad plate and the carbon oil pattern plate; the first single-sided copper-clad plate is opposite to the carbon oil pattern; removing the micro-adhesive film, carrying out copper reduction treatment on the thick copper layer, exposing the carbon oil pattern, forming a carbon oil pattern double-sided board, then manufacturing a circuit pattern, and carrying out post-process processing to form a circuit board; the precision of the carbon oil pattern manufactured through the reverse manufacturing process is far higher than that of traditional silk-screen printing, and the problem that the resistance value of the carbon oil pattern exceeds the standard due to the fact that the processing size of the carbon oil pattern is not easy to control in a silk-screen printing ink manufacturing mode in the prior art is solved.

The invention belongs to the technical field of conductive silver paste, and particularly relates to composite conductive silver paste and a preparation method and application thereof. The raw materials comprise modified silver powder, glass powder and an additive; wherein the raw materials of the modified silver powder comprise micron-scale silver powder and nano-scale silver powder; the organic carrier comprises the following raw materials: polyimide resin, simethicone and a dispersing agent; the additives comprise carbon nanotubes, a titanate coupling agent, fumed silica, a defoaming agent and an organic carrier. The method comprises the following steps: adding the modified silver powder, the glass powder, the carbon nano tube, the titanate coupling agent, the fumed silica and the defoaming agent into the organic carrier, and stirring to obtain primary mixed slurry; and grinding the preliminary mixed paste until the fineness of the paste is less than or equal to 5 microns, and then defoaming to obtain the composite conductive silver paste. The composite conductive silver paste is applied to preparation of a flexible circuit board. The printing forming process is adopted, waste water and waste gas are avoided, safety is high, and production efficiency is high.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

A method for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes receiving in a fixture the circuit package module upside down and removably coupling a stencil to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. The method also includes applying solder paste over the stencil to pass through the apertures to add solder paste to the solder interconnects. The method also includes removing the stencil from over the fixture, and removing the circuit package module from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

The utility model discloses a millimeter wave radar PCB of an antenna area Hoz, and belongs to the technical field of PCBs. The millimeter wave radar PCB comprises n layers of circuit boards, wherein n is an even number; the n layers of circuit boards respectively form antenna radio frequency layers and digital signal control layers, the L1-L2 layers are the antenna radio frequency layers, and the L3-Ln layers are the digital signal control layers; the antenna radio frequency layer comprises an antenna pattern, the outer EA position of the antenna pattern is provided with a triangular protruding part protruding outwards, and the inner EA position of the antenna pattern is provided with a triangular notch part recessed inwards. The antenna has the beneficial effects that the 45-degree triangle design is additionally arranged at the outer EA position of the antenna pattern, 25 microns are added outwards, the 45-degree triangle design is designed at the inner EA position, and 25 microns are cut inwards, so that the precision of the feeder line, the bonding pad and the EA is ensured.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

The invention discloses a processing method for realizing multiple surface treatments on a PCB (Printed Circuit Board), which belongs to the technical field of printed circuit boards, and comprises the following steps of: firstly, pasting an adhesive tape to protect a tin-plated cerium alloy and a gold-plated area, processing a local nickel-gold immersion position, and then pasting the adhesive tape to protect the tin-plated cerium alloy and the nickel-gold immersion area. And finally, an adhesive tape is pasted or blue gel is printed to protect the nickel gold immersion and gold plating areas, and only the position needing tin-cerium alloy plating is exposed to complete tin-cerium alloy plating processing. Through accurate positioning and protection measures, the method can ensure that three different surface treatments of tin-cerium alloy plating, nickel-gold immersion and gold plating can be realized on the same PCB, and the highly complicated design requirements are met.

A method for fabricating a printed gel-electronic circuit includes depositing a conductive material on a substrate, depositing first gel over the conductive material on the substrate, air-drying the first gel, depositing second gel over the air-dried gel, freezing a combination of the second gel, the air-dried gel, and the conductive material, and thawing the combination of the second gel, the air-dried gel, and the conductive material.

An exchanging unit for use in a printing device including a printing section to execute a printing process of printing a viscous fluid on a processing target object using a screen mask, and includes a receiving section configured to receive an accommodation rack having multiple shelf sections each configured to accommodate a frame that is capable of supporting an exchangeable member for use in the printing device, a lifting and lowering section configure to lift and lower the accommodation rack between an exchange position where to exchange the exchangeable member and a liftable position situated further downwards than the exchange position, and a moving section configured to move the accommodation rack between the liftable position where the accommodation rack can be lifted up by the lifting and lowering section and an accommodation position where the accommodation rack enters an interior of a housing of the printing device.

The invention belongs to the technical field of silk-screen printing thick conductors, and particularly relates to printing equipment and method for manufacturing a thick conductor and a thick conductor circuit. The printing area is used for printing conductor paste on the LTCC raw ceramic chip; the drying area is used for drying the conductor paste printed on the LTCC raw ceramic chip; the workbench is installed on a guide rail arranged between the printing area and the drying area, and a plurality of adsorption openings are formed in the workbench and used for adsorbing and fixing LTCC raw ceramic chips. The control system controls the workbench to move between the printing area and the drying area through the guide rails. Compared with the prior art, the device has the beneficial effects that multiple printing and drying procedures can be completed on the same equipment, and by improving the workpiece fixing mode and the transfer mode between the procedures, it is guaranteed that alignment marks on a screen printing plate and a green ceramic chip are accurately aligned every time printing is conducted; by using the equipment, the thick conductor can be printed on the LTCC raw ceramic chip, the sintering thickness of the conductor is greater than 50 microns, the pattern line width precision of the thick conductor is high, and the alignment precision is high.

An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is laid thereon for a surface profile of the printed circuit board to be captured for generating a surface data file of the printed circuit board, and a condition determination module that compares data from the surface data file with data from one or more stencil data file as a nominal reference via a matching process to determine the condition of the printed circuit board based on a set of categories. The printed circuit board is sent for further processing (i.e., stencil printing) after being determined to be in a match-successful condition where data from the surface data file falls within a tolerance of the nominal reference.