348results about "Porous dielectrics" patented technology

Processes for controlling ink migration during the formation of printable electronic features. In a preferred aspect, the invention is to a process for forming at least a portion of an electronic feature. The process includes the steps of: (a) providing a first substrate having a first surface; (b) modifying the first surface to form a modified surface; and (c) applying an ink to at least a portion of the modified surface, wherein the modified surface interacts with the ink to inhibit lateral and/or longitudinal migration of the applied ink, and wherein the applied ink forms at least a portion of the electronic feature. In another aspect, the invention is to a process for encouraging electronic ink spreading with a surfactant.

A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.

Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient thereof, and has an oxygen atom content of from 15 to 55% by mass. When heated at a predetermined temperature falling between 150 and 350° C., at least 95% by mass of the material decays within 10 minutes. The heat-decaying material has many applications for production of porous materials, conductive particles transfer sheets, transfer sheets for circuit formation, pattern formation, etc.

A transmission line circuit is described which includes a conductive plane, a plurality of signal traces, and an intermediate layer between the conductive plane and the signal traces. The intermediate layer maintains a substantially constant separation between the conductive plane and the signal traces. At least a portion of the intermediate layer comprises air. The signal traces and the conductive plane form transmission lines.

A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-imprgnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 mu m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 mu m or less therebetween.

In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.

Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

An electrical circuit containing a substrate having thereon a receptive layer, wherein the receptive layer has a conductive polymer impregnated in the receptive layer, and a method for forming the electrical circuit.

The present disclosure relates generally to the field of sequential surface chemistry. More specifically, it relates to products and methods for manufacturing products using Atomic Layer Deposition (“ALD”) to depose one or more materials onto a surface. ALD is an emerging variant of Chemical Vapor Deposition (“CVD”) technology with capability for high-quality film deposition at low pressures and temperatures, which may produce defect-free films, on a macroscopic scale, at any given thickness. The present disclosure includes, in varying embodiments, methods of manufacturing microelectronic assemblies and components such as battery electrodes, capacitors, resistors, catalyzers and PCB assemblies by ALD, and the products manufactured by those methods.

A board that may include for example a first conductive area on a first side and a second conductive area on a second side of such board. The board may be fitted with a plurality of holes that may for example open or end on both such first side and such second side of such board. A conductive material in the form of for example a liquid or gel may be applied or for example painted onto one or both sides of such board so that such material may for example substantially fill some or all of such holes and may establish a connection through which an electric current may pass from for example the first conductive area to the second conductive area. A switch having for example a board with a plurality of holes running through such board from a first side to a second side. A conductive material may for example be applied to such board so that such material substantially fills for example two or more of such holes and may be capable of forming an electrical connection between a conductive area on a first side of such board and a conductive area on a second side of such board. A method of forcing a conductive liquid into a plurality of holes in a board so that the liquid forms for example a connection capable of carrying a current between a conductive area on a first side of such board and a conductive area of a second side of such board.

A method of producing porous polyimide resin that enables pores to be formed in a precursor of polyimide resin, with its form of microphase-separated structure wherein a dispersive compound is dispersed in the precursor of polyimide resin being kept unchanged, so as to provide significantly reduced dielectric constant and also provide improvement in mechanical strength and heat resistance, and the porous polyimide resin produced in the same producing method. A coating comprising porous polyimide resin is formed by applying resin solution comprising a precursor of polyimide resin and a dispersive compound and then drying a solvent, to form a coating in which the dispersive compound is dispersed in the precursor of polyimide resin; extracting the dispersive compound from the coating for removal to make the precursor of the polyimide resin porous; and imidizing the coating after preheated in a temperature range of 190–250° C.

To provide an anisotropic conductive film which can respond to increasing pitch reduction of connection targets while maintaining connection reliability, and can be manufactured at a lower cost than conventional, and to provide a method of manufacturing the same. The anisotropic conductive film is provided with a porous film consisting of polymer, having numerous holes penetrating in a film thickness direction, the holes being in a honeycomb arrangement and having inner wall surfaces which curve outwards, a conductive material that fills the holes in the porous film, and an adhesive layer coated on both surfaces of the porous film. The porous film is formed by leaving a supporting substrate on which cast is a polymer solution where a polymer is dissolved in a hydrophobic, volatile organic solvent, under high humidity conditions.

Low-loss printed circuit boards, low-loss wide-band antennas, and manufacturing methods thereof are provided by using a resin as a board material. A resin material (101) having a predetermined shape is prepared in a molding step, and the resin material (101) is foamed in a foaming step. As a result, a skin layer (111) and a foamed part (112) are formed. Since the skin layer (111) does not allow close contact of plating, the skin layer (111) is removed in the shape of a conductor pattern in a skin-layer removing step to expose the foamed part (112) in the interior. Electroless plating is carried out in a conductor-layer forming step; and, as a result, plating is brought into close contact with the foamed part (112) having an anchor effect, and a conductor layer (120) is formed.

A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.

The present invention provides a layered product having a porous layer made mainly of a polymer on a base, and a process for producing the same; and a functional layered product wherein a pattern of a functional material, such as an conductive material, is formed onto a light-transmitting base using the layered product having the porous layer, and a process for producing the functional layered product. A layered product comprising a base and a porous layer on at least one surface of the base, wherein the porous layer is constituted of a composition containing a polymer as a main component, the porous layer has micropores having an average pore diameter of 0.01 to 10 μm, and has a porosity of 30 to 85%, the composition constituting the porous layer has a glass transition temperature of 20° C. or higher, and the porous layer is a layer which is convertible to a transparent layer by a heat treatment through disappearance of the micropores. A conductive pattern is formed on the porous layer surface of the layered product, and then the resultant layered product is subjected to a heat treatment to cause the micropores in the porous layer to disappear, thereby converting the porous layer to a transparent layer.