1010 results about "Anisotropic conductive film" patented technology

An object is to efficiently manufacture an organic EL display. A circuit substrate 10 in which is set microstructures 12 and which is formed with wiring 14, and a transparent substrate 20 formed with a transparent electrode 21, an emissive layer 25 and a cathode layer 26, are stuck together with the side formed with the wiring 14 and the side formed with the cathode layer 26 facing the inside, to thereby manufacture an organic EL display 30. In the sticking together of the circuit substrate 10 and the transparent substrate 20, an anisotropic conductive paste or an anisotropic conductive film can be used.

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input / output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

A semiconductor chip and manufacturing method thereof, the semiconductor chip including a plurality of bumps connected to a driving circuit integrated on a semiconductor substrate and an organic insulating layer disposed on the driving circuit. The organic insulating layer extends from the semiconductor substrate less than the plurality of bumps such that a lower edge of the plurality of bumps protrudes further than a lower edge of the organic insulating layer.

This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P1) on at least one side of the insulating resin sheet. The electroconductive particle in is part protruded from the reference plane (P1) is covered with a layer formed of the same resin as in the insulating resin sheet. The electroconductive particle placement sheet is characterized by satisfying a relationship of h1 > h2 wherein h1 represents an average protrusion height, which is the average of distance between the reference plane (P1) and a tangential line (L1), which is a tangential line parallel to the reference plane (P1) of the electroconductive particle and is in contact with the part protruded from the reference plane (P1), and h2 represents an average protrusion height which is the average of distance between the reference plane (P2) and a tangential line (L2), which is a tangential line parallel to the reference plane (P2) of the electroconductive particle and is on the side opposite to the tangential line (L1), provided that, when the tangential line (L2) is within the insulating resin sheet, h2 < 0; when the tangential line (L2) is on the reference plane (P2), h2 = 0; and when the tangential line (L2) is outside the insulating resin sheet, h2 > 0.