991 results about "Anisotropic conductive film" patented technology

In a first aspect of the invention, an image display device, in which one or more groups of particles or liquid powders are sealed between opposed two substrates, at least one of two substrates being transparent, and, in which the particles or the liquid powders, to which an electrostatic field produced by two groups of electrodes having different potentials is applied, are made to move so as to display an image, has a construction such that a member for transmitting a signal, which is applied to circuits for an image display, is provided to the substrate by means of an anisotropic conductive film and members such as the electrode are provided to a substrate opposed to a transparent substrate. In second to sixth aspects of the invention, an image display device has a construction such that the electrode is arranged to a surface of the substrate through a transparent elastic member, or, an anti-reflection layer is arranged, or, a connection operation between two substrates through a partition wall is optimized.

A chip package includes a semiconductor substrate, a first metal pad over the semiconductor substrate, and a second metal pad over the semiconductor substrate. In a case, the first metal pad is tape automated bonded thereto, and the second metal pad is solder bonded thereto. In another case, the first metal pad is tape automated bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is solder bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is solder bonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is wirebonded thereto.

The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and/or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.

A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

The present invention discloses an electroconductive particle comprising (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.

Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

The invention relates to the field of laminated glass, particularly a laminated glass with high heat reflectivity and electric heating function applicable to the field of vehicles or construction, more particularly an automobile windshield glass installed on a vehicle. The electrically-heatable low-emissivity coated laminated glass comprises two glass substrates, a middle polymer sandwiched between the two glass substrates, low-emissivity film and a bus, wherein the low-emissivity film is arranged on at least one glass substrate surface in contact with the middle polymer; the bus is distributed on the low-emissivity film; and the bus is a pressure-sensitive adhesive or anisotropic conductive adhesive. According to the electrically-heatable low-emissivity coated laminated glass provided by the invention, the ACF (anisotropic conductive film) or PSA (pressure-sensitive adhesive) is used as the bus in combination with the low-emissivity film to heat the laminated glass, thereby removing frost and melting ice; and thus, compared with the adoption of other buses, the invention simplifies the production technique, is convenient to operate, lowers the material cost and enhances the production efficiency and process yield.

A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50μm thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 μm or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

An integrated circuit structure is provided. The integrated circuit structure includes a die and an anisotropic conducing film (ACF) adjoining the back surface of the die. The die includes a front surface; a back surface on an opposite side of the die than the front surface; and a through-silicon via (TSV) exposed through the back surface of the die.

An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or cycloalkylamino-functional group on one of the aromatic rings, as a co-catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as Novacure imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes amides and lactams, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or dicycloalkylamino-functional group. Secondary cocatalysts of low mobility at the storage conditions, such as those with a long chain substitutent, dimeric or oligomeric amides or lactams, are particularly preferred. The improved epoxy composition is implemented as adhesives for manufacturing an anisotropic conductive film (ACF) and also for connecting, encapsulating, or packaging of electronic devices.

Various methods are described where the semiconductor die and the lead frame (or the BGA or LGA substrate) are spaced apart to reduce stress. In one scenario, an air gap is formed between the semiconductor die and the lead frame by depositing a perimeter (made, for example, using polymer) either on the semiconductor die or the lead frame. In another scenario, an anisotropic conducting film (ACF) is formed with an air gap between the semiconductor die and the lead frame (or the BGA or LGA substrate). The air gap relieves stress on the semiconductor die. Further, a lead frame-based isolator package and a BGA (or LGA) isolator package are described. A window-frame ACF-based isolation method for magnetic coupling in a lead-frame package and BGA (or LGA) package is also described.

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

A mounting structure includes a substrate, a first terminal, a first flexible circuit board, and a second terminal. The first terminal is arranged in a first region of a first face of the substrate. The first flexible circuit board is connected to the first terminal through an anisotropic conductive film. The second terminal is arranged in a second region of a second face, which is a rear face relative to the first face of the substrate, wherein the second region does not overlap the first region in plan view. A region of the second face of the substrate, which overlaps the first region in plan view, is formed to be a smooth face.

An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

An anisotropically conductive connector, not causing permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion even if the target electrodes are projected, and achieving stable conductivity over a long time period even when pressed repeatedly, a production process thereof, and an inspection circuit board equipped with the connector. The connector includes (1) anisotropically conductive film, with plural conductive path-forming parts each extending in a thickness-wise direction of the film arranged insulated by insulating parts and including at least 2 elastic layers, which are each formed by an insulating elastic polymeric substance, and (2) conductive particles exhibiting magnetism in portions of the respective elastic layers, at which conductive path-forming parts are formed. The connector satisfies H₁≧30, and H₁/H₂≧1.1, H₁, H₂ being durometer hardnesses of the elastic polymeric substance of one of elastic layers forming surfaces of the film, and of the elastic polymeric substance of the other, respectively.