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21717 results about "Interconnection" patented technology

In telecommunications, interconnection is the physical linking of a carrier's network with equipment or facilities not belonging to that network. The term may refer to a connection between a carrier's facilities and the equipment belonging to its customer, or to a connection between two (or more) carriers.

Fabric or garment with integrated flexible information infrastructure

A fabric, in the form of a woven or knitted fabric or garment, including a flexible information infrastructure integrated within the fabric for collecting, processing, transmitting and receiving information concerning-but not limited to-a wearer of the fabric. The fabric allows a new way to customize information processing devices to "fit" the wearer by selecting and plugging in (or removing) chips/sensors from the fabric thus creating a wearable, mobile information infrastructure that can operate in a stand-alone or networked mode. The fabric can be provided with sensors for monitoring physical aspects of the wearer, for example body vital signs, such as heart rate, EKG, pulse, respiration rate, temperature, voice, and allergic reaction, as well as penetration of the fabric. The fabric consists of a base fabric ("comfort component"), and an information infrastructure component which can consist of a penetration detection component, or an electrical conductive component, or both. The preferred penetration detection component is a sheathed optical fiber. The information infrastructure component can include, in addition to an electrically conductive textile yarn, a sensor or a connector for a sensor. A process is provided for making an electrical interconnection between intersecting electrically conductive yarns. Furthermore, a process is established for sheathing the plastic optical fiber and protecting it.
Owner:GEORGIA TECH RES CORP

Electrochromic rearview mirror incorporating a third surface metal reflector

An electrochromic variable reflectance mirror for a vehicle includes a reflector/electrode on the third surface of the mirror. This reflector/electrode forms an integral electrode in contact with the electrochromic media, and may be a single layer of a highly reflective material or may comprise a series of coatings. When a series of coatings is used for the reflector/electrode, there should be a base coating which bonds to the glass surface and resists any adverse interaction, e.g., corrosive action, with the constituents comprising the electrochromic media, an optional intermediate layer (or layers) which bonds well to the base coating and resists any adverse interaction with the electrochromic media, and at least one highly reflective layer which directly contacts the electrochromic media and which is chosen primarily for its high reflectance, stable behavior as an electrode, resistance to adverse interaction with the materials of the electrochromic media, resistance to atmospheric corrosion, resistance to electrical contact corrosion, the ability to adhere to the base or intermediate layer(s) (if present) and to the epoxy seal, and ease of cleaning. If a base layer is deposited it preferably covers the entire third surface; however, when this is done the highly reflective layer may optionally only coat the central portion of the third surface and not the perimeter edge portion. The third surface reflector/electrode provides of improved electrical interconnection techniques used to impart a voltage drive potential to a transparent conductor on the mirror's second surface.
Owner:GENTEX CORP

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP
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