2932 results about "Microlens" patented technology

An optical device for imaging is disclosed having at least one micro lens field with at least two micro lenses and one image sensor with at least two image detector matrices. The at least two image detector matrices each include a plurality of image detectors and there is an allocation between the image detector matrices and the micro lenses, so that each micro lens together with an image detector matrix forms an optical channel. The center points of the image detector matrices are shifted laterally by different distances, with respect to centroids, projected onto the image detector matrices, of the micro lens apertures of the associated optical channels, so that the optical channels have different partially overlapping detection areas and so that an overlapping area of the detection areas of two channels is imaged onto the image detector matrices offset with respect to an image detector raster of the image detector matrices. Further, an image processing device and a method for optical imaging are described.

In part, the invention relates to optical caps having at least one lensed surface configured to redirect and focus light outside of the cap. The cap is placed over an optical fiber. Optical radiation travels through the fiber and interacts with the optical surface or optical surfaces of the cap, resulting in a beam that is either focused at a distance outside of the cap or substantially collimated. The optical elements such as the elongate caps described herein can be used with various data collection modalities such optical coherence tomography. In part, the invention relates to a lens assembly that includes a micro-lens; a beam director in optical communication with the micro-lens; and a substantially transparent film or cover. The substantially transparent film is capable of bi-directionally transmitting light, and generating a controlled amount of backscatter. The film can surround a portion of the beam director.

An imaging device includes an image sensor chip and a package for containing the image sensor chip. Formed in the package is a vent hole that is connected to an air pump. In a light receiving area of the image sensor chip, there are photodiodes and microlenses above them. The microlenses are made of a gel-like transparent material. When the internal air pressure of the package is changed by the air pump, each microlens transforms in response to the change of the internal air pressure, and thereby changes the surface curvature thereof.

An ultra-thin digital imaging device has a thickness of several millimeters and is capable of producing data for creating images of 3 Mp and higher. The device comprises a multi-channel imaging unit that contains a plurality of optical channels formed by microlens objectives and a pixilated image sensor unit with a plurality of sensing elements. Each individual identical image obtained through each optical channel is pixilated and converted into electrical signals that are processed into data sets which can be stored in the imaging device and either reproduced on the display of the device or transmitted to an external image-reproducing device where the obtained data of individual images are transformed into a single, high-resolution megapixel image by means of a technique known in the art.

Disclosed herein is a high definition lenticular lens and a high definition lenticular image. The high definition lenticular lens can comprise a front surface having a plurality of lenticules and a substantially flat back surface opposite the front surface. Each lenticule has characteristic parameters that include a focal length, an arc angle, and a width. The arc angle is greater than about 90 degrees and the width is less than about 0.0067 inches. The lens has a gauge thickness that is equal to or substantially equal to the focal length. The high definition lenticular image comprises a precursor image joined to the high definition lenticular lens.

A complementary metal oxide semiconductor (CMOS) device with a three dimensional integration structure and a method for fabricating the same are provided. An image sensor includes a first substrate in which a photo detection device is formed; a second substrate in which a peripheral circuit is formed, wherein the first substrate and the second substrate are bonded through a plurality of bonding pads formed on both the first substrate and the second substrate, and a back side of the first substrate is turned upside down; and a microlens formed on a top portion of the back side of the first substrate.

An object of the invention is to provide a laser illuminating device and an image display device that enable to remove speckle noises in a diffraction field and an image field, uniformly illuminate an illumination plane, and realize miniaturization. A laser illuminating device 100 includes a laser light source 3, a first lens 1 including a plurality of microlenses 10 each having a predetermined numerical aperture in an in-plane direction, each of the microlenses 10 being adapted to expand laser light emitted from the laser light source 3 to thereby superimpose the laser light transmitted through each of the microlenses 10; and a second lens 2 having an effective diameter larger than an effective diameter of the first lens 1, and for compensating for a divergence angle of the laser light expanded by each of the plurality of the microlenses 10.

A solid-state image sensing element has a photoelectric conversion element which converts incoming light into an electrical signal in accordance with an amount of the light, a microlens which is arranged on an incident surface, a light guide which is arranged between the photoelectric conversion element and the microlens, and an insulating interlayer which is arranged around the light guide. The solid-state image sensing element located at a distance (H) satisfies: $\frac{H·D}{L·P}<a·\frac{N_H}{N_L}\mathrm{for}0<a<1$

where L is the distance from an exit pupil of an image sensing optical system of an image sensing device, which mounts an image sensor formed by two-dimensionally arranging a plurality of the solid-state image sensing elements, H is the distance from a center of the image sensor to a position of the solid-state image sensing element on the image sensor, D is the height from the photoelectric conversion element to an apex of the microlens, P is the spacing between the plurality of solid-state image sensing elements, N_H is the refractive index of the light guide, and N_L is the refractive index of the insulating interlayer.

A method and system for presenting both autostereoscopic images and planar images in a single display is disclosed. The design comprises processing the planar images received in the form of planar image data. The processing comprises at least one from a group comprising selectively employing bleed-through processing to enhance the planar image data when viewed through a lens sheet comprising slanted lenticules, selectively introducing blurring into the planar image data, and selectively employing anti-alias processing to the planar image data. Certain super pixels may be computed that differ from standard pixels, and lenticules in the data sheet may be slanted at desired angles. The physical lenticules may cause bleed-through that may be processed. Resolution may be computed after processing, and the resolution implemented for display. Mode switching between planar and autostereoscopic imaging may be provided in the form of Metadata or visible flags.

A variable focal length microlens system having a base section with a fluid chamber and a fluid pressurization mechanism. A flexible, substantially transparent polymer lens section is fixed above the fluid chamber and the lens section has a curvature providing an initial focal point when in an unstrained state. The fluid chamber is substantially sealed and the fluid pressurization mechanism includes a flexible wall in the base section. The flexible wall may be displaced by magnetic activation, PZT activation of another activating mechanism.

A focus detecting device comprises a first photoelectric conversion section for performing photoelectric conversion of a light beam emitted from a first pupil area of a image pickup optical unit, a second photoelectric conversion section for performing photoelectric conversion of a light beam emitted from a second pupil area different from the first pupil area, a light intercepting section having openings for allowing passage of a portion of light in the first pupil area and for allowing passage of a portion of light in the second pupil area, and a detecting section for detecting a focus condition of the image pickup optical unit on the basis of photoelectric conversion outputs of the first photoelectric conversion means and the second photoelectric conversion sections. For example, when the image pickup optical unit has a large defocus quantity, the light intercepting section is set in an optical path for focus detection.

Microlens sheetings with composite images are disclosed, in which the composite image floats above or below the sheeting, or both. The composite image may be two-dimensional or three-dimensional. Methods for providing such an imaged sheeting, including by the application of radiation to a radiation sensitive material layer adjacent the microlenses, are also disclosed.

An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a cascaded light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the cascaded light guide has an air interface. The air interface improves the internal reflection of the cascaded light guide. The cascaded light guide may include a self-aligned color filter having air-gaps between adjacent color filters. Air-gaps may be sealed from above by a transparent sealing film. The transparent sealing film may have a concave surface over the air-gap to diverge light that cross the concave surface into the air-gap away from the air-gap into adjacent color filters. These characteristics of the light guide eliminate the need for a microlens. Additionally, a portion of a support wall between a pair of color filters may have a larger width above than below to form a necking to hold down the color filters for better retention.

Despeckle elements, laser beam homogenizers and methods for despeckling are provided. The despeckle element includes a transparent material having a first surface including a plural number of optical steps and a second surface having a plural number of microlenses. Each of the number of optical steps is in a one-to-one correspondence with at least one of the microlenses. One of the first surface and the second surface is configured to receive collimated light having a coherence length and a remaining one of the first surface and the second surface is configured to pass the collimated light separated into a plurality of beamlets corresponding to the number of microlenses. A height of each step of at least two of the optical steps is configured to produce an optical path difference of the collimated light longer than the coherence length.

A vertical color filter sensor group formed on a substrate (preferably a semiconductor substrate) and including at least two vertically stacked, photosensitive sensors. In preferred embodiments, the sensor group includes at least one filter positioned relative to the sensors such that radiation that has propagated through or reflected from the filter will propagate into at least one sensor. Preferably, the filter is or includes a layer that has been integrated with the sensors by a semiconductor integrated circuit fabrication process. In other embodiments, the sensor group includes a micro-lens. Other aspects of the invention are arrays of vertical color filter sensor groups, some or all of which include at least one filter or micro-lens, and methods for fabricating vertical color filter sensor groups and arrays thereof.

The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

The present invention inhibits variations in sensitivity of an image pickup element formed in a jointed area in the image pickup element produced using exposure in a joined fashion.

The image pickup element 11 has a light receiving area 102 formed on a substrate 101, an insulation layer 104 deposited on a light receiving area 102, and a microlens 106 formed on the insulation layer 104 and collecting incident light onto the light receiving area 102. A pattern 103L and a pattern 103R with an optical axis of the microlens 106 as a divisional line by exposure in a joined fashion in different exposure steps are arranged with an optical path for incident light collected by the microlens 106 held therebetween, and are provided so that a clearance from the optical path equals a distance L. The distance L is set to be larger than the alignment accuracy of an exposure device exposing the patterns 103L and 103R.

There are provided image pickup devices capable of significantly increasing production yield and ensuring long-term reliability and a method for manufacturing the image pickup devices. This invention is characterized in that it has a large number of light-receiving portions 2 formed at a surface portion of a wafer 1 and a microlens 3 formed for each of the light-receiving portions, through electrodes 4 for performing supply of power to the light-receiving portions 2 and passing and reception of an electrical signal are provided all over the periphery of the wafer 1, one end of each through electrode 4 is connected to an electrode pad 4a which is connected to a wire leading to a light-receiving element at the surface portion of the wafer 1, the other end is connected to a wire through a back electrode 5, a rib 7 which serves as a partition portion arranged to surround the microlenses 3 on four sides is provided on the surface of the wafer 1, a transparent plate 8 of optical glass or the like is bonded to an upper surface of the rib 7 with adhesive, and a protective frame 10 is provided at a junction between the rib 7 and the transparent plate 8.

The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.