The utility model relates to the field of sensor packaging, in particular to an embedded
image sensor packaging structure which comprises a substrate, an annular heat conduction groove and a heat dissipation
assembly, heat is efficiently collected through a heat dissipation
copper sheet, and heat is efficiently conducted through sintered
silver paste. Heat absorbed by the heat dissipation
copper sheet can be quickly transmitted to the vertical heat conduction through holes in the substrates, so that the heat is efficiently transmitted between the substrates, the heat dissipation path is expanded, the heat dissipation efficiency is improved, the
electrical conduction between the heat dissipation
copper sheet and the vertical heat conduction through holes is ensured, the
electrical performance of the whole packaging structure is more stable and reliable, and the service life of the packaging structure is prolonged. The
image sensor is simple in structure and convenient to use,
signal interference and
transmission loss are reduced, the quality and stability of output signals of the sensor are guaranteed, the trapezoidal waterproof dam is formed at the edge of the double-layer stepped
infrared optical filter, the waterproof capacity can be further enhanced,
water vapor is prevented from entering the
image sensor from the edge of the
optical filter, and it is guaranteed that the image sensor can work normally in a humid environment.