1379results about "Amplifier modifications to raise efficiency" patented technology

Described are concepts, systems, system architectures, circuits, methods, and techniques directed toward power management and control. In particular, described are concepts, systems, system architectures, circuits, methods, and techniques for implementing power converters that may not have a right-hand pole zero in their linearized, averaged control-to-output transfer function, but that may still have buck and boost functionality.

A power amplifier includes a 3-dB coupler which splits a first signal into a second signal and a third signal lagging behind the second signal by 90°, a carrier amplifier, a peak amplifier, and a hybrid coupler. The carrier amplifier amplifies the second signal and outputs a fourth signal when the first-signal power level is a first level or higher. The peak amplifier amplifies the third signal and outputs a fifth signal when the first-signal power level is a second level or higher, which is higher than the first level. The hybrid coupler includes a first transmission line receiving the fourth signal at its first terminal, and a second transmission line receiving the fifth signal at its first terminal and being open at its second terminal. The first transmission line outputs, from its second terminal, an amplified first signal obtained by combining the fourth and fifth signals.

The invention discloses a multi-channel common-mode feedback high-gain amplification circuit. The circuit comprises a differential amplification module, an output end of which is connected with a load; the input end of the common-mode detection module is connected with the output end of the differential amplification module; the first input end of the error amplification module is connected with the output end of the common-mode detection module, and the second input end of the error amplification module receives reference voltage; and the multi-path feedback control module comprises at least two feedback branches which are connected in parallel, the input ends of the feedback branches are jointly connected with the output end of the error amplification module, the output ends of the feedback branches are respectively connected with different bias nodes in the differential amplification module, and the feedback branches have path impedance with gradient change. Through a dynamic division mechanism of a feedback branch, and in combination with a gain boosting unit and a hybrid compensation network, high-precision rapid establishment under a high-speed load is realized.

A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.

An example apparatus includes: current source circuitry having a first terminal, a second terminal, a third terminal, and a fourth terminal; current sink circuitry having a first terminal, a second terminal, a third terminal, and a fourth terminal; common mode voltage circuitry having a first terminal and a second terminal, the first terminal of the common mode voltage circuitry coupled to the first terminal of the current source circuitry and the first terminal of the current sink circuitry, the second terminal of the common mode voltage circuitry coupled to the second terminal of the current source circuitry and the second terminal of the current sink circuitry; idle current source circuitry having a terminal coupled to the third terminal of the current source circuitry; and feedback current source circuitry having a terminal coupled to the fourth terminal of the current source circuitry.

An electronic device may include wireless circuitry. The wireless circuitry can include a first input transistor, a first capacitance neutralization having a source terminal coupled to a tail node, and a second order intermodulation generation circuit configured to produce second order intermodulation signals at the tail node. The wireless circuitry can further include a second input transistor and a second capacitance neutralization transistor having a source terminal coupled to the tail node. The first and second capacitance neutralization transistors can be cross-coupled with the input transistors. A fixed or adjustable current source can be coupled to the tail node. The second order intermodulation generation circuit can include a transistor biased in a weak inversion mode.

The invention discloses an ultra-wideband high-linearity power amplifier with a negative feedback structure. The ultra-wideband high-linearity power amplifier comprises an input matching network, a driving-stage amplifying circuit, an inter-stage matching network, a power-stage amplifying circuit, an output matching network, a negative feedback RLC (Radio Link Control) network and a self-adaptive biasing circuit, an input radio-frequency signal is transmitted to the driving-stage amplification circuit through the input matching network for primary amplification, transmitted to the power-stage amplification circuit through the inter-stage matching network for secondary amplification and output through the output matching network, and the driving-stage amplification circuit comprises a first transistor and a second transistor. The power level amplification circuit comprises a third transistor and a fourth transistor; the self-adaptive bias circuit is used for providing self-adaptive bias voltage for the first transistor and the third transistor; the negative feedback RLC network is used for controlling the gain and bandwidth of the amplifier and comprises a driving-stage negative feedback network and a power-stage negative feedback network. The working bandwidth of the power amplifier can be widened, and the gain, the output power and the linearity of the amplifier can be improved.

Implementations of disclosed systems and methods are capable of changing the frequency or other waveform characteristics dynamically based on receiving feedback about the effect of an electromagnetic pulse radiation on a target electronic device. Various implementations can be configured to emit electromagnetic pulses at a single radio frequency or a plurality of radio frequencies. For example, the frequency of the carrier electromagnetic radiation in a single pulse can change during the pulse interval. As another example, a single electromagnetic pulse can comprise a frequency comb with two or more frequencies.

Described are concepts, systems, system architectures, circuits, methods, and techniques directed toward power management and control. In particular, described are concepts, systems, system architectures, circuits, methods, and techniques for implementing power converters that may not have a right-hand pole zero in their linearized, averaged control-to-output transfer function, but that may still have buck and boost functionality.

Described are concepts, systems, system architectures, circuits, methods, and techniques directed toward power management and control. In particular, described are concepts, systems, system architectures, circuits, methods, and techniques for implementing power converters that may not have a right-hand pole zero in their linearized, averaged control-to-output transfer function, but that may still have buck and boost functionality.

Certain aspects of the present disclosure generally relate to electronic components and, more particularly, to circuitry for signal amplification for transmission. One example apparatus generally includes: a modem; a controller; a feedforward path coupled between the modem and the bias controller; and an amplifier having a main amplification path and an auxiliary amplification path, wherein the controller is configured to provide at least one bias signal for biasing the auxiliary amplification path based on information associated with a transmission signal, the information being provided by the modem to the controller via the feedforward path.

Certain aspects of the present disclosure are directed towards techniques and apparatus for implementing concurrent matching for a transmitter and a receiver. An example transceiver may include a first amplifier, a second amplifier, a third amplifier, a first transformer, a second transformer, a first switch, and a third transformer. The first switch is coupled between a terminal of a secondary winding of the first transformer and a reference potential node.

In on example, an apparatus includes: a first power amplifier (PA) to receive a first input radio frequency (RF) signal and output a first amplified RF signal; a second PA to receive a second input RF signal and output a second amplified RF signal; and a transformer circuit coupled to an output of the first PA and an output of the second PA. The transformer circuit is to provide, to a load circuit, an RF output signal comprising the first amplified RF signal and the second amplified RF signal.

The present disclosure is an open-loop digital PWM envelope tracking system with dynamic boost function. Systems, apparatuses, and methods are described for dynamically boosting (increasing) the supply voltage of an envelope tracking (ET) modulator in a transmitter system when the target / desired PA supply voltage exceeds a pre-determined threshold (e.g., the pre-determined threshold is equal to the available supply voltage of the system, such as the battery voltage). By boosting the supply voltage input to the ET modulator, the modulated supply provided to the power amplifier (PA) is also increased. As such, voltage clipping, which typically occurs when the target / desired PA supply voltage is higher than the available supply voltage, is mitigated or avoided, and the distortion of the transmitted signal is reduced.

The invention relates to a terahertz high-power power amplifier assembly, which belongs to the field of electronic devices and comprises a synthesis network consisting of a synthesis network upper cavity and a synthesis network lower cavity, and a small signal amplification module, a medium-power amplification module, a driving-stage power amplifier module, a final-stage power amplifier module and a detection module are arranged on the back surface of the synthesis network lower cavity. An E-plane waveguide directional coupler is arranged in the synthesis network, the small signal amplification module, the medium-power amplification module, the driving-stage power amplification module, the final-stage power amplification module and the E-plane waveguide directional coupler are electrically connected in sequence, and a port of the E-plane waveguide directional coupler is electrically connected with the detection module; a waveguide tube is arranged in the installation position of each module in the synthesis network, and the modules are electrically connected through the waveguide tubes. According to the invention, each stage of amplifier is modularly designed, so that the isolation degree among devices of a link can be increased, and the self-excitation risk caused by space radiation is reduced. And the testability of a single module is improved, and the troubleshooting cost and time are reduced.

Apparatus and methods for power amplifiers with broadband matching networks are disclosed. In certain embodiments, a mobile device includes a transceiver that generates a radio frequency input signal, and a front-end system including a compound semiconductor die and a silicon switch die. The compound semiconductor die includes a power amplifier including one or more power amplifier stages that amplify the radio frequency input signal to generate a radio frequency output signal. The silicon switch die includes a band selection switch that receives the radio frequency output signal. The compound semiconductor die and the silicon switch die each include at least one controllable impedance for providing a bandwidth adjustment to the power amplifier.

According to an embodiment, An integrated circuit comprising a first cascode radio frequency (RF) power amplifier that includes a first common source transistor having a gate configured to receive a first RF signal, and a source connected to a neutral point; a first common gate transistor having a gate and a drain connected to a power source node, and a source connected to a drain of the first common source transistor; and a first resistor coupled between a bulk of the first common gate transistor and a first bulk bias node configured to provide a voltage that is greater than or equal to a voltage at the source of the first common gate transistor, wherein the first resistor is configured to obtain a floating point.

A method includes determining whether an audio signal processed in a class-D amplifier is clipping. Responsive to clipping of the audio signal, a speaker voltage is estimated as a ratio of a power supply voltage of the class-D amplifier to a resistance of a speaker driven by the class-D amplifier. An amplitude of the audio signal is controlled based on the speaker voltage.

Aspects of this disclosure relate to voltage modulators with staged activation of switches. A voltage modulator can receive supply voltages and provide a selected one of the supply voltages as an output voltage. The voltage modulator can include switches in parallel where one of the switches in parallel activates before another switch in parallel in association by transitioning the output voltage between different supply voltages. Embodiments of this disclosure relate to symbol-based envelope tracking. Related systems and methods are disclosed.

The invention is suitable for the technical field of power electronics, and provides a high-voltage amplifier control method, device and equipment, and the method comprises the steps: generating a dynamic power supply voltage rail, and extracting an error signal output by the dynamic power supply voltage rail and a target; the error signal is decomposed into at least two frequency components, and the frequency components are respectively processed by adopting a differentiated amplification strategy. The processed components are synthesized into a compensation signal, and the compensation signal is superposed with the power supply voltage rail, so that a high-fidelity final output signal is generated. According to the invention, the efficiency is improved through dynamic power supply, the residual error signal is subjected to frequency division, and a differential strategy is adopted for accurate compensation, so that various distortions and noises are effectively eliminated, and the unification of high efficiency and high precision is realized.

A current leakage mitigation circuit is provided. The circuit includes a charge storage circuit for receiving a control signal output, and a correction circuit connected to a bottom plate of the charge storage device. The control signal is output by an amplifier circuit connected to the current leakage mitigation circuit. The correction circuit samples the control signal, applies a filter to the control signal for to extracting a predefined frequency component, amplifies the filtered control signal, and applies the amplified control signal to the bottom plate of the current storage device.

A high-voltage input stage circuit without bias current includes a high-voltage conversion unit, a clamping unit and an input unit. The high-voltage conversion unit is connected to the clamping unit, and is used to generate a unique switching voltage based on the magnitude of the differential input voltage, and the switching voltage is respectively input into the positive phase clamping unit and the negative phase clamping unit of the clamping unit. The clamping unit is connected to the high-voltage conversion unit and the input unit, and is used to realize conduction or shutdown based on the switching voltage to input the differential input voltage into the input unit; the input unit is used to realize voltage output to the subsequent load.

Aspects described herein include devices and methods for an envelope tracking power supply. In some aspects, the envelope tracking power supply includes an envelope signal input port, an output power port, an input interface circuit coupled to the envelope signal input port, sensing and conditioning circuitry, and amplifier circuitry coupled between the input interface circuit and the sensing and conditioning circuitry, the amplifier circuitry having one or more control inputs. The envelope tracking power supply additionally includes switcher circuitry coupled to the output of the sensing and conditioning circuitry, and the output power port, and the supply further includes output filter circuitry coupled to the output power port and machine learning circuitry configured to receive state tracking data for performance of a transmit power amplifier (PA) that receives power via the output power port.

Apparatuses and systems implementing an amplifier module are described. The amplifier module can include a substrate. A driver amplifier die, a splitter network, an output amplifier die, a bias controller, and a combiner network can be coupled to the substrate. The driver amplifier die can be configured to receive an input radio frequency (RF) signal. The splitter network can be configured to split an intermediate RF signal outputted from the driver amplifier die into first and second RF signals. The output amplifier die can be configured to receive the first and second RF signals. The bias controller can be configured to bias the driver amplifier die and the output amplifier die. The combiner network can be configured to combine first and second outputs of the output amplifier die to generate an output RF signal and terminate at least one harmonic of the output amplifier die's output impedance.

A Doherty power amplifier (PA) includes a main amplifier, an auxiliary amplifier, a first inductor coupled between an output of the main amplifier and a first node, a second inductor coupled between an output of the auxiliary amplifier and the first node, and a third inductor coupled between a supply rail and the first node. The Doherty PA also includes a first capacitor coupled between the output of the main amplifier and a ground, a second capacitor coupled between the output of the auxiliary amplifier and the ground, and an impedance matching circuit coupled between the output of the auxiliary amplifier and an output of the Doherty PA.

A radio frequency circuit includes a first radio frequency circuit, a second radio frequency circuit, and a first switch circuit. The first switch circuit includes a first terminal connected to an antenna connection terminal, a second terminal connected to the first radio frequency circuit, and a third terminal connected to the second radio frequency circuit. The first radio frequency circuit includes a first power amplifier circuit supporting a first power class, and a first filter circuit connected to the first power amplifier circuit and having a passband that includes a first band. The second radio frequency circuit includes a second power amplifier circuit supporting a second power class having a maximum output power greater than a maximum output power of the first power class. The second radio frequency circuit includes a second filter circuit connected to the second power amplifier circuit and having a passband that includes the first band.

The invention relates to a low-power-consumption high-performance D-type power amplifier modulation method and circuit and a D-type audio power amplifier, and the method comprises the steps: separating a pair of BD mode modulated signals outputted by a PWM modulation module in the D-type audio power amplifier circuit into a common mode component and a differential mode component, and outputting the common mode component and the differential mode component; feeding back the common-mode component and the differential-mode component to a differential input end through a common-mode feedback link and a differential-mode feedback link respectively; wherein the common-mode component and the common-mode feedback link are completely arranged in the chip; the differential mode component and the differential mode feedback link are realized by a power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) integrated inside the chip or an external power MOSFET; and outputting the differential mode component to a to-be-driven object through the power output stage. According to the method, after two feedback links are separated, in a zero-input mute state, no common-mode signal is sent to an output stage for amplification, and power consumption is not caused at the output stage, so that the overall efficiency is greatly improved; and meanwhile, static bottom noise is almost eliminated.

A radio frequency module is provided that includes a module laminate having main surfaces that oppose each other; at least one power amplifier circuit on a first main surface; and at least one integrated circuit on the second main surface. The integrated circuit includes at least one switch included in a switched-capacitor circuit and at least one switch included in a supply modulator. The switched-capacitor circuit generates a plurality of discrete voltages based on an input voltage and outputs the generated plurality of discrete voltages to the supply modulator. The supply modulator selectively outputs at least one voltage of the generated plurality of discrete voltages to a power amplifier. The power amplifier circuit includes a first amplifying transistor of the power amplifier.

An amplifier circuit includes first and second amplifiers, first and second input-side coils, first and second output-side coils, a resistance element, a first switch including first to fourth terminals, and a second switch including fifth to seventh terminals. The first input-side coil is connected between the first amplifier and the first terminal, the second input-side coil is connected between the second amplifier and the third terminal, the first output-side coil is connected between a signal output terminal and the second terminal, the second output-side coil is connected between the fifth terminal and the fourth terminal, and the resistance element is connected between the sixth terminal and the ground.

A radio frequency (RF) power amplifier based on transformer matching is provided. The RF power amplifier includes: a first-stage amplification circuit configured with an input terminal and an output terminal, wherein the output terminal of the first-stage amplification circuit is configured to be connected to one terminal of a main coil of a first transformer; the first transformer configured to include the main coil and a secondary coil, wherein one terminal of the secondary coil is grounded and the other terminal of the secondary coil is connected to a medium-low power mode input terminal of a power switch; the second-stage amplification circuit configured with an input terminal for receiving the amplified RF signal from the first-stage amplification circuit, wherein an output terminal of the second-stage amplification circuit is configured to be connected to a high power mode input terminal of the power switch.