The application discloses a
wafer cleaning device based on ultrasonic cleaning and relates to the technical field of
wafer cleaning devices. The
wafer cleaning device comprises a cleaning
machine outer tank body, a wafer cleaning glass tank, an ultrasonic cleaning tank, an
ultrasonic device, a bottom plate, a cover, a cleaning tank track, a shunt
water supply device and a bubble removing uniform vibration device. The application effectively conducts
ultrasonic vibration to the wafer cleaning glass tank by taking
ultrapure water as a medium, drives the strong acid solution in the tank to uniformly vibrate and realizes efficient cleaning of the wafer. The oblique water replenishment forms high turbulent pulsation and local
shear stress at the junction with the original liquid, shears large bubbles into tiny bubbles, prevents bubble aggregation, improves liquid purity and ultrasonic cleaning efficiency. The
centrifugal separation effect of the
cyclone connecting seat and the annular
cyclone sheet makes the bubbles in the
water flow concentrate at the center position, the outer
ultrapure water is quickly discharged, the bubbles are efficiently absorbed after contacting the hydrophobic
porous membrane, and the bubble removing effect is significantly improved.