730 results about "Abrasive" patented technology

The invention discloses a cosmetic glass bottle surface polishing method and system, and the method comprises the steps: carrying out gradient mesh abrasive composite modification on a sand leather base material, and carrying out three-dimensional cutting according to the surface curve contour of a glass bottle through a laser cutting technology to form a composite sand leather polishing piece; the composite sand leather grinding piece is assembled at the executing end of a six-axis linkage mechanical arm, partition differentiated grinding is carried out according to the surface pollutant distribution density image recognition result, and a glass bottle rough blank obtained after preliminary grinding is obtained; performing synchronous purging on the surface of the glass bottle rough blank by adopting inert gas flow with a micro-bubble generation device, and controlling the composite sand leather polishing piece to perform micro-vibration at the same time, so as to obtain a glass bottle semi-finished blank; and the glass bottle semi-finished blank is placed in a sealed cavity to be sprayed, final polishing is carried out in cooperation with pulse type ultrasonic vibration, and a cosmetic glass bottle finished product is obtained. According to the embodiment of the invention, high-precision grinding of the curved surface of the glass bottle can be realized, and the surface cleanliness and the gloss uniformity are improved.

The invention provides a grinding fluid, the grinding fluid comprises a base fluid, a grinding material, nano-diamond and a dispersion stabilizer, the base fluid comprises polyether and silicone oil, the grinding material comprises surface modified silicon carbide particles, and the dispersion stabilizer comprises polyethylene glycol stearate and polyvinylpyrrolidone. The surface roughness of a grinding piece can be reduced, the scratch density and microcracks of the surface are reduced, damage of grinding fluid to the grinding piece is reduced or even avoided, and the service life of a cutter can be prolonged. The invention also provides a preparation method of the grinding fluid and a process method using the grinding fluid.

The invention relates to a photoetching ordered microcosmic fixed abrasive polishing pad and a preparation method thereof. Compared with the prior art, the method has the advantages that the to-be-photoetched surface of the substrate is photoetched according to the photoetched pattern, so that the plurality of microscopic grinding columns are orderly distributed and formed on the grinding material base according to the preset distribution and arrangement mode, the distribution shape, direction and position of the microscopic grinding columns on the grinding material base are kept unchanged, and regular distribution and uniform distribution can be presented; the distribution and the size of the micro grinding columns can be adjusted according to the photoetching pattern to meet different polishing requirements, then the micro grinding columns of the substrate are compositely filled with the filling body to keep the stability of the micro grinding columns, and the polishing pad can be suitable for the micro level to meet the requirement of the manufacturing procedure below 5nm, so that the production efficiency is improved, and the production cost is reduced. The microcosmic grinding columns are formed through photoetching to replace traditional grinding particles, the chemical stability of the polishing pad during polishing is improved, the removal rate is increased, the surface roughness is reduced, and the polishing effect of the polishing pad on a polishing product is improved.

The invention relates to a self-adaptive abrasive jet strengthening method and system for a complex curved surface. The method comprises the steps that a three-dimensional point cloud data set of a workpiece is acquired; analyzing the three-dimensional point cloud data set to obtain a first principal component vector; a section plane is set, an intersection line of the section plane and the three-dimensional point cloud data set is calculated based on the first principal component vector, and the intersection line is an initial path; a normal vector of each discrete point on the initial path is calculated, calculation is carried out based on the normal vectors and the custom viewpoints, newest unit outer normal vectors of the discrete points are obtained, and the newest unit outer normal vectors are all perpendicular to the complex curved surface on the workpiece; and calculating corresponding actual position coordinates of the nozzle relative to each discrete point based on the unit outer normal vectors of the discrete points, and forming a continuous strengthening path based on the actual position coordinates. According to the method and the device, the deviation between the CAD model and the real object can be eliminated, the strengthening path planning of the nozzle has the curved surface self-adaptive capability, and the jet flow energy distribution is uniform.

In a grinding method for grinding a substantially planar workpiece surface of a workpiece, a grinding machine is used which has a grinding wheel with an abrasive side surface, wherein the grinding wheel can be rotated about a rotational axis by means of a rotational drive and can be fed by means of a feed drive in a feed direction oriented parallel to the rotational axis.To carry out a grinding operation, the workpiece is arranged in a working position, the grinding wheel is set in rotation about the axis of rotation, the abrasive side surface is brought into contact with the workpiece surface by feeding the grinding wheel; and the grinding wheel is fed from a starting position with workpiece contact to generate material removal according to a feed function. The feed of the grinding wheel takes place according to a workpiece-specific feed function depending on a material proportion curve, whereby the material proportion curve represents a distribution of workpiece material in a surface profile depending on a cutting depth measured parallel to the feed direction.

The invention belongs to the related field of ultra-precision polishing technology, and discloses an ultrasound-piezoelectricity-photocatalysis assisted chemical mechanical polishing method which comprises the following steps: mixing a basic polishing abrasive, a piezoelectric material and a photocatalyst, calcining and grinding, and processing to obtain a modified abrasive; preparing a polishing solution containing a piezoelectric catalysis carrier and a photocatalysis carrier at the same time; the polishing process is completed through a chain of mechanical stress, a piezoelectric electric field, efficient carrier separation and more active species participating in reaction. The invention further discloses a matched polishing device. Compared with the prior art, the method has the advantages that the material removal rate can be effectively increased, the polishing time can be effectively shortened, the surface quality can be further improved, the subsurface damage can be reduced, in addition, a more environment-friendly polishing solution can be used, the waste liquid treatment cost is reduced, the environment is protected, and the method is suitable for industrial production. Therefore, the polishing device is especially suitable for various high-hardness materials to realize the polishing application occasions of low-damage and ultra-smooth surfaces of the high-hardness materials.

The utility model is applicable to the technical field of silicon nitride ceramic substrate preparation, and provides a surfactant mixing and ball-milling device for silicon nitride ceramic substrate preparation, which comprises a ball mill, a feeding component and a driving component, the ball mill comprises a support arranged horizontally, a hollow circular ball milling barrel and a machine cover arranged in the horizontal direction. The feeding assembly is arranged at the top of the ball milling barrel and is used for injecting milling balls and grinding materials into the ball mill; the driving assembly is arranged at the end, away from the ball milling barrel, of the support and used for providing power for ball milling of the ball mill. The device solves the problems that when powder of a silicon nitride ceramic substrate is prepared in a ball milling mode, a ball mill is prone to being damaged due to the fact that the falling speed of grinding media (steel balls and ceramic balls) is too high, and powder is prone to being splashed due to the fact that the grinding media fall to hit the powder. The purpose of ensuring that the powder and the grinding medium smoothly enter the ball mill through the feeding assembly is achieved.

The invention relates to the technical field of grinding fluid, in particular to efficient grinding fluid for an MPO connector, a preparation method and application of the efficient grinding fluid for the MPO connector. 27%-44% of alpha-aluminum oxide; 8%-15% of a styrene-maleic anhydride copolymer; 2%-5% of a modified polyurea solution; 0.05% to 0.3% of perfluoropolyether; 0.5%-2% of citric acid; 0.5%-1.5% of a polyether modified polysiloxane defoaming agent; by adopting a composite abrasive material system of the nano-diamond and the alpha-aluminum oxide, the grinding efficiency and the surface quality are improved in a breakthrough manner.

A mixed abrasive synergistic enhancement immersion microjet processing system and method for RB-SiC ceramic microstructures is characterized by: the micro-abrasive air jet nozzle is driven by an active rack and driven gear, and one end is connected to a precision sandblasting machine containing micron-sized abrasive particles; its output end is immersed in a slurry tank containing submicron / nano-sized abrasive particles; the micro-abrasive air jet nozzle ejects a gas-solid two-phase flow and generates a large number of microbubbles; the driving effect of the microbubbles effectively mixes the submicron / nano-sized abrasive particles in the slurry tank with the gas-solid two-phase flow ejected by the micro-abrasive air jet nozzle, thereby obtaining a mixed abrasive synergistic enhancement immersion microjet; the waste liquid passes through a primary filter particle recovery outlet, a secondary filter particle recovery outlet, and a tertiary filter particle recovery outlet in real time, where the micron-sized abrasive particles and erosion debris are screened, dried, and classified for collection, ultimately achieving efficient and high-quality processing of RB-SiC ceramic microstructures.

The invention discloses an inner circle surface cluster magnetic jet polishing device and method, and belongs to the technical field of polishing equipment.The magneto-rheological polishing and jet polishing are combined, that is, magneto-rheological polishing liquid is jetted out of a liquid outlet of a cluster magnetic jet polishing head at a high speed under the high-pressure effect, efficient jet rough polishing is conducted on the inner circle surface of a workpiece, and the inner circle surface is polished. And meanwhile, under the action of the magnetic field, the magnetorheological polishing liquid is converted into a magnetorheological polishing pad and a flexible clamping abrasive for secondary fine polishing, so that the problems of workpiece deformation and poor surface quality easily caused by traditional honing and polishing are solved, the defect of low efficiency of single magnetorheological polishing is overcome, and the polishing efficiency and the surface quality are improved. Besides, the device can adapt to workpieces with different diameters by replacing cluster magnetic jet polishing heads and workpiece discs with different sizes, and the machining requirements of the workpieces made of different materials are met by matching with adjustable polishing liquid pressure, flow and rotating speed parameters; due to the expanded double-station design, the machining efficiency is improved, and the machining requirements of high-quality inner circle surface parts are met.

A floor cleaning / refurbishment pad that includes a support layer, the support layer having a central region and an outer peripheral edge defining an outer support layer dimension, a loft material layer overlaying the support material layer and connected thereto, the loft material composed of at least one loft material and the microfiber loft material layer having a height HL and an outwardly facing surface and an agitator / abrasive strip overlaying a portion of the support material layer and connected thereto, the agitator strip having a height HA and an outwardly facing surface.

The invention provides a composite abrasive part, application, a preparation method and a processing machine tool, the composite abrasive part can be used for inner hole processing and grinding wheel processing, and the composite abrasive part is formed by mixing and pressing multi-granularity composite abrasive particles and a metal-resin binding agent. According to the multi-granularity composite abrasive particles, small-granularity particles are used for filling gaps among large-granularity particles, so that the number of effective abrasive particles participating in material removal on the surface of an abrasive layer is increased, the material removal depth of a single abrasive particle is reduced, and the surface roughness is improved; the composite grinding material piece comprises a rigidity grinding and polishing composite section, and the rigidity grinding and polishing composite section comprises rigidity grinding areas and flexible polishing areas which are sequentially and alternately combined in the axial direction or the circumferential direction of the composite grinding material piece, so that the material removal process is discretized, the possibility of generating machining cracks is reduced, and efficient mirror surface machining is achieved.

The invention discloses a manufacturing method of a grinding wheel for a high-uniformity and easy-to-sharpen grinding single crystal diamond cutter, and belongs to the field of superhard materials and products in machining, the manufacturing method mainly comprises the steps of wet mixing, tape casting, laser cutting, lamination, matrix surface treatment, integrated sintering, size processing, sharpening and the like, and finally the grinding wheel with the total thickness of an abrasive layer being 7-15 mm is formed. The grinding wheel layer is formed by intersecting and laminating a piece a and a piece b, the height of diamonds at the junction of the piece a and the piece b tends to be consistent, the diamond exposure height and smoothness are better compared with direct feeding sintering, meanwhile, the piece a can be designed to be of a porous structure through proper binder selection, and therefore the dressing efficiency is further improved, and the dressing effect is better. And higher processing quality and efficiency of the diamond cutter are indirectly improved.

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate. In some examples, linear motion may be used for chemically planarizing.

The invention provides a single-layer core-shell structure polishing abrasive for silicon carbide wafer polishing, a polishing solution, a preparation method and a polishing method, and relates to the technical field of chemical mechanical polishing, the single-layer core-shell structure polishing abrasive takes silicon dioxide with the particle size of 300-800 nm as an inner core and aluminum oxide with the particle size of 10-150 nm as an outer shell, the particle size ratio of the inner core to the outer shell is 2: 1-10: 1, and the polishing solution is prepared from silicon dioxide with the particle size of 300-800 nm and aluminum oxide with the particle size of 10-150 nm. And single-layer coating is realized through cationic polyelectrolyte assisted electrostatic adsorption. The polishing solution comprises the following components in parts by weight: 3-15 parts of a polishing abrasive with a single-layer core-shell structure, 0.2-8 parts of an oxidizing agent, 0.1-8 parts of a dispersing agent and the balance of deionized water, and the pH value is adjusted to 8-11. The hardness of the inner core abrasive material of the prepared polishing abrasive material with the core-shell structure is smaller than that of the outer shell abrasive material, the polishing abrasive material with the core-shell structure has high dispersity and low agglomeration rate, in the final polishing process of SiC wafers, the surface roughness Ra smaller than or equal to 0.15 nm can be obtained, meanwhile, the material removal rate is kept to be larger than or equal to 1500 nm / h, the scratch density is remarkably reduced, and the polishing abrasive material is suitable for batch finish machining of high-end power device substrates.

An apparatus and a polishing system for rotational magnetorheological abrasive flow nano-finishing are described. The apparatus includes an upper cylinder with coupled upper piston and a lower cylinder with coupled lower piston. A first motor drives synchronized reciprocating motion of both pistons via respective slider crank mechanisms. A magnet fixture positioned between the cylinders includes permanent magnets arranged in a ring configuration with a central hole for workpiece placement. A second motor rotates the magnet fixture to manipulate magnetic field orientation. The cylinders, pistons and magnet fixture define a space for containing magnetorheological (MR) fluid including ferromagnetic particles, abrasive particles and carrier fluid. The configuration enables controlled fluid flow through the hole while maintaining direct workpiece contact, with ferromagnetic particles exhibiting both rotational and reciprocal movement patterns. This dual-motion finishing approach enables material removal through magnetic field-controlled abrasive action, achieving nano-scale surface quality on complex geometries.

A polishing composition, includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a ruthenium removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

This application relates to a fixed abrasive having a low wettability bond material. An abrasive article includes a fixed abrasive body having a specific MOR / EMOD ratio associated with a specific bond volume percentage. The body also has a micron 2 Average bond post area (BPA) of: b) 1536 mm 2 c) an average bond post count (BPC) of at least 140 per micron; or d) an average bond wetting radius of at least 30 per micron; or d) a combination of a) and b).

An abrasive tool for a floor grinder, wherein the tool extends along a wear direction (D) from a grinding surface (G) to a mounting surface (M), wherein the abrasive tool comprises at least two sections (410, 420, 430) separated by a surface (P) transversal to the wear direction (D), where the at least two sections comprise respective abrasive materials associated with different grit sizes, where the section located closer to the grinding surface (G) is associated with a larger grit size compared to the section located closer to the mounting surface (M).

The present invention employs a configuration without a base material, and provides a base material-less abrasive material that flexibly deforms to conform to the surface of the object to be polished, especially if the surface has a curved shape, and has good polishing characteristics. The substrate-less abrasive material 1 of the present invention does not have a substrate, and a plurality of abrasive grains 2 are held in a dispersed state in a base portion 3 which contains a total of 60 volume% or more of at least one of the base components of resin and elastomer. The type A durometer hardness measured in accordance with the hardness test specified in JIS K7311-1995 is 50 to 80, the tensile strength is 70 to 250 MPa, and the tensile elongation is 10 to 360%.

According to the present invention, a moderately high polishing speed for a specific material and appropriate ratio of polishing speeds between two or more different materials are achieved in polishing using a polishing composition. The present invention relates to a polishing composition comprising abrasive grains, a water-soluble polymer having no alcoholic hydroxyl group in a side chain, a polyvalent carboxylic acid (salt), and an oxidizing agent, and having a pH of less than 6.

The invention relates to the technical field of polishing, in particular to a mirror polishing method for stainless steel. The mirror polishing method for the stainless steel comprises the following steps that a stainless steel product to be polished is roughly polished through a rough grinding and polishing medium, the rough grinding and polishing medium comprises a first plant grinding material and polishing paste, and the polishing paste comprises an oxidizing agent and a complexing agent; and fine polishing is conducted on the stainless steel product to be polished after rough polishing through a fine grinding and polishing medium, wherein the fine grinding and polishing medium comprises a second plant abrasive. The problem of pollution of a traditional grinding material is solved from the source, the mechanical grinding effect and the chemical polishing effect are effectively cooperated, and the surface roughness Ra of stainless steel can be precisely machined to the mirror level below 0.05 mu m. And moreover, for the special-shaped stainless steel product, better polishing uniformity can be shown, and the geometric accessibility is good.

The invention relates to a grinding and / or polishing pad (48b; 48c) for a grinding and / or polishing machine (12a), with an abrasive interface (80a; 80b; 80c) and with at least one extraction opening (46b; 46c) arranged on a side facing away from the abrasive interface (80a; 80b; 80c). It is proposed that the grinding and / or polishing pad (48b; 48c) has at least one intake opening (78b; 78c) for drawing in ambient air, located on the side facing away from the abrasive interface (80a; 80b; 80c) and in particular on the side surface (110b).

The application discloses a round-shank hard alloy cutter base surface pretreatment method, which comprises the following steps: S1, spraying soft abrasive to the blade part of the cutter base for micro passivation treatment; S2, inserting the blade part after the micro passivation treatment into hard abrasive, and rotating the blade part to perform friction roughening treatment; and S3, immersing the cutter base after the friction roughening treatment in a mixed acid solution to perform etching treatment. The hard alloy cutter pretreatment method provided by the application is simple in operation and has wide applicability to cutter shapes; the surface state of the cutter after treatment is quantitatively characterized, and the repeatability and stability in industrial production are improved; the soft abrasive is first used to perform micro passivation treatment on the blade part, and then the hard abrasive is used to perform friction roughening treatment on the blade part, so that the cutter surface roughening is more uniform.

The present disclosure relates to chemical mechanical polishing (CMP) compositions for polishing molybdenum surfaces. In particular, the CMP composition includes an abrasive, a molybdenum (Mo) etching inhibitor, an oxidizer, and water, combined in specified amounts to provide a composition with advantageous properties such as high Mo:TEOS removal rate selectivity and / or high Mo:SiN removal rate selectivity.

The invention relates to the technical field of ultra-fine oilstones, in particular to an ultra-fine oilstone and a preparation method thereof.The preparation method comprises the steps that calcined and KH-570 modified diatomite is dispersed in water, a monomer N-isopropylacrylamide, a free radical initiator and an accelerant TEMED are added, the mixture is stirred and reacted for 1-10 h at the room temperature, sediment is filtered out, the sediment is leached with cold water and then dispersed in a polyethylene glycol aqueous solution, and the ultra-fine oilstone is obtained; and then adding the grinding material and the glass powder, heating to 40-60 DEG C, stirring and mixing for 10-60 minutes, filtering, pressing and drying the obtained solid in a mold, and finally sintering.

A polishing device (PD) comprises: - a flexible abrasive sheet (FA) having a back face (FR) suitable for polishing a workpiece (PAP), - a flexible backing sheet (FS) positioned in front of the front face (FV) of the abrasive sheet (FA), to which is attached a set (ES) of ballast bags (SL) distributed in a chosen manner and having respective weights chosen to apply uniform pressure to the abrasive sheet (FA) during the polishing of the workpiece (PAP), and - a support (SD) on which the abrasive sheet (FA) and backing sheet (FS) are suspended. Figure 1

The invention belongs to the technical field of grinding wheel abrasives, and particularly relates to a diamond porous microsphere, a grinding wheel abrasive and a preparation method and application thereof. The preparation raw materials of the diamond porous microspheres comprise mixed powder, a binder and water, the mixed powder comprises a first ceramic bond, diamond and a pore forming agent. The first ceramic bond, the diamond and the pore forming agent are used as raw materials for preparing the diamond porous microspheres, the diamond porous microspheres have natural pores and prefabricated spherical pores, the porosity is high, and the self-sharpening performance of the grinding wheel grinding material can be improved; the grinding wheel abrasive material is prepared through secondary air degreasing sintering of the diamond porous microspheres, a new three-dimensional pore structure is formed among the naturally stacked diamond porous microspheres, the grinding wheel abrasive material with a'natural pore + prefabricated spherical pore + stacked pore 'multi-stage pore structure is obtained, the cooling, lubricating and chip removal effects of a grinding wheel can be greatly improved, and the service life of the grinding wheel is prolonged. Therefore, the grinding performance and the service life of the grinding wheel are improved.

An abrasive article can include an abrasive body including abrasive particles and a bond material including an organic material. The body may include a lubricant including an inorganic material. The bond material can include a maximum Tan delta of greater than 0.18.