4930 results about "Delamination" patented technology

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

Dual damascene methods and structures are provided for IC interconnects which use a dual-damascene process incorporating a low-k dielectric material, high conductivity metal, and an improved hard mask scheme. A pair of hard masks are employed: a silicon dioxide layer and a silicon nitride layer, wherein the silicon dioxide layer acts to protect the silicon nitride layer during dual damascene etch processing, but is subsequently sacrificed during CMP, allowing the silicon nitride layer to act as a the CMP hard mask. In this way, delamination of the low-k material is prevented, and any copper-contaminated silicon dioxide material is removed.

An enchance recording head design provides conduction and mechanical restraint control in order to minimize the pole tip protrusion and the head temperature resulting from the thermal heating of the magnetic recording head during operation. In one embodiment, the recording head includes a hybrid diffuser formed within an insulation layer, at a predetermined distance from the head write section. The hybrid diffuser is comprised of a thermal conduction layer with high thermal conductivity, such as gold or copper, and a mechanical restraint layer having near zero CTE, such as a 60-80% face-centered-cubic NiFe (Invar) material. The hybrid diffuser is recessed from the ABS to prevent the delamination of the hybrid diffuser due to the otherwise displacement incompatibility between the inner insulating layer and the hybrid diffuser at the ABS.

An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant. With this integrated circuit package, no jig is required in the assembly of the integrated circuit package. Moreover, since there is no need to use adhesives to adhere the supportive legs onto the substrate, the integrated circuit package would not suffer from delamination as in the case of the prior art. The fully-exposed heat sink allows an increased heat-dissipating efficient as compared to the prior art.

A window pane has a substrate formed from glass and includes an electrical device including an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor. An electrical connector is bonded to the electrical conductor and has a first interacting portion. A terminal is disposed adjacent to the electrical connector and has a second interacting portion for interacting with the first interacting portion to mechanically couple the electrical connector and the terminal. The substrate has a first coefficient of thermal expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10⁻⁶/° C. Due to the mechanical coupling between the connector and the terminal, the terminal and connector are less prone to bending, breakage, or delamination than conventional connector structures.

Thermally stable ultra-hard compact constructions comprise a polycrystalline diamond body substantially free of a catalyst material, and a substrate that is joined thereto. The substrate can be ceramic, metallic, cermet and combinations thereof, and can be joined to the body by a braze material or other material that forms an attachment bond at high pressure/high temperature conditions. The body and substrate are specially formed having complementary interfacing surface features to facilitate providing an improved degree of attachment therebetween. The complementary surface features can in the form of openings and projections, e.g., one of the body or substrate can comprise one or more openings, and the other of the body or substrate can comprise one or more projections, disposed within or extending from respective interfacing surfaces. The complementary surface features operate to resist unwanted delamination between the body and substrate, thereby extending effective service life of the construction.

A method of forming a crack prevention ring at the exterior edge of an integrated circuit to prevent delamination and cracking during the separation of the integrated circuits into individual die. The crack prevention ring extends vertically into a semiconductor workpiece to at least a metallization layer of the integrated circuit. The crack prevention ring may be formed simultaneously with the formation of test pads of the integrated circuits. The crack prevention ring may be partially or completely filled with conductive material. An air pocket may be formed within the crack prevention ring beneath a passivation layer of the integrated circuit. The crack prevention ring may be removed during the singulation process. An optional seal ring may be formed between the crack prevention ring and the integrated circuit.

The present inventions provide apparatuses and methods for repairing or otherwise treating an intervertebral disc. The apparatus and methods in accordance with the present inventions may be used to treat or repair a tear, rent, incision, defect, aperture or delamination of the annulus fibrosus of an intervertebral disc. The apparatus and methods may employ fixation delivery apparatuses, fixation apparatuses, patch delivery tools and patches positioned in or on aspects of an intervertebral disc for treatment or repair of the intervertebral disc or its components.

A method and a device for processing a light-polymerizable material (5, 55) for building up an object (27) in layers, using a lithography based generative manufacture having a construction platform (12) for building up the object (27), a projecting exposure unit (10, 60) that can be controlled for locally selected exposing of a surface on the construction platform (12, 62) to an intensity pattern having a prescribed shape, and a control unit (11, 61) prepared for polymerizing overlapping layers (28) on the construction platform (12, 62) in successive exposure steps, each having a prescribed geometry, by controlling the projecting exposure unit (10, 60), in order to thus successively build up the object (27) in the desired shape, said shape resulting from the sequence of layer geometries. The invention is characterized in that a further exposure unit (16, 66) for exposing the surface of the construction platform (12, 62) is provided on the side opposite the projecting exposure unit (10, 60), and that the construction platform (12, 62) is designed to be at least partially transparent to light, and that the control unit (11, 61) is designed for controlling the further exposure unit (16, 66) at least while building up the first layer (28), said layer adhering to the construction platform (12, 62), for exposing in the prescribed geometry.

The glass containers described herein are resistant to delamination, have improved strength, and increased damage resistance. In one embodiment, a glass container may include a body having an inner surface, an outer surface and a wall thickness extending between the outer surface and the inner surface. At least the inner surface of the body may have a delamination factor less than or equal to 10. The body may also have a compressively stressed layer extending from the outer surface of the body into the wall thickness. The compressively stressed layer may have a surface compressive stress greater than or equal to 150 MPa. A lubricous coating may be positioned around at least a portion of the outer surface of the body, such that the outer surface of the body with the lubricous coating has a coefficient of friction less than or equal to 0.7.

The present invention relates to a method for producing a part (108, 200, 300), comprising the following steps:

• • a) applying a first flat layer consisting of a support material (102, 202, 302), to a construction platform (101, 201, 301),
  • b) introducing at least one recess (103, 203, 303) into the support material (102, 202, 302),
  • c) filling the recess (103, 203, 303) with a construction material (104, 204, 304),
  • d) applying a further layer of support material (102, 202, 302),
  • e) repeating steps b) through d) until completion of the part (108, 200, 300), and
  • f) removing the support material (102, 202, 302).

This method is to provide a manufacturing method and a device that combine the advantages of the layerwise construction (rapid prototyping) with the advantages of machining (e.g. high-speed cutting) and particularly permit the production of sharp-edged contours.

Furthermore, the present invention relates to a device for carrying out the method.

This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the dielectric layer to prevent delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost.

A laminated window assembly for a device, such as a handheld electronic device (e.g., a media player or mobile telephone), includes a window layer that preferably is glass, and a larger, substantially transparent lip-forming layer to which it is laminated, preferably by a substantially clear adhesive. Additional adhesive preferably is placed at at least portions of the edge of the window layer adjacent the lip-forming layer, especially at the corners, to resist delamination. Holes preferably are formed in the lip—e.g., at the corners—to resist the lip-forming layer peeling apart from the window layer forming layer. The holes preferably make up at most about 33% of the periphery of the window layer.

This disclosure presents methods and devices for treating a tear, rent, incision, defect, aperture or delamination of the annulus fibrosus of an intervertebral disc. The methods and devices can employ fixation delivery apparatuses, fixation apparatuses, patch delivery tools and patches positioned, at least in part, in or on aspects of an intervertebral disc for treatment of the intervertebral disc or its components. In some aspects, these techniques include the use of this includes a fixation apparatus that includes at least one bone anchor connected to at least one disc anchor by a shortenable elongate member.

A prosthetic device having a generally fixed member formed from a low friction material such as ultra-high molecular weight polyethylene and an articulating titanium member, which includes an articular bearing surface. The articular surface is a zirconium oxide layer formed by applying a coating of zirconium onto the titanium member and heating this in an oxygen-containing environment. This causes the zirconium to oxidize and further causes the zirconium to migrate into the titanium member forming a titanium zirconium diffusion layer, which prevents delamination.

A process to produce models in layers is described, whereby a first material and then selectively a second material is applied in layers on a building platform and these two application stages are repeated until a desired pattern is achieved. The two materials form a solid if a suitable mixture ratio is used and the first material is a material mixture. The material mixture is at least partially prepared prior to each application stage.

A roaming sensor system collects data on the condition of roads and bridge decks and identifies and maps defects, including cracks, potholes, debonding, tracking, delamination, surface ice, surface water, and rebar corrosion. Data are collected by a vehicle or a fleet of vehicles driven at normal traffic speeds. The vehicle is outfitted with sensors that collect data using acoustic surface waves, ground penetrating radar, mm wave surface radar, and/or video images. The data are transmitted to a control center for analysis and distribution.

In a semiconductor device for use in a wafer level chip scale package (WLCSP) and a method for fabrication, an inner scribe seal is formed around a functional circuit area that does not extend all the way into the corners of the rectangular die, and an outer scribe seal follows the perimeter of the die and into the corners, with the outer scribe seal having a continuous barrier wall towards the die edges so that moisture penetration in dielectric layers of the die is minimized, and cracks and delamination are stopped near the die edges. Limiting the extent of the insulating layer or layers in the WLCSP to cover the functional circuit area also reduces the stresses caused by these layers near the die corners. Other features further enhance the strength and barrier properties of the scribe seals and the layers near the die corners, terminate cracks and delamination at various levels within the dielectric stack of the die and the die protective overcoat, and prevent damage during the WLCSP assembly process.

A method of remotely monitoring the radiant energy (6) emitted from a turbine component such as a turbine blade (1) having a low-reflective surface coating (3) which may be undergoing potential degradation is used to determine whether erosion, spallation, delamination, or the like, of the coating (3) is occurring.

Gas barrier polyamide compositions exhibiting a low crystallization rate and good coinjection stretch blow moldability with polyethylene terephthalate (PET) to enable the fabrication of clear, high barrier multilayer PET bottles that have a long shelf life.