438 results about "Photosensitive polymer" patented technology

An apparatus for bottom-up fabrication of three dimensional objects, the apparatus comprising: a vat for a photosensitive polymer, the floor of the vat including a working surface arranged such that, in use, light incident on the working surface interacts with the photosensitive polymer at the working surface to fabricate a portion of the three dimensional object; a build platform capable of being inserted into the vat, the build platform having a planar surface; an elevator mechanism capable of adjusting the separation between the working surface of the vat and the planar surface of the build platform; and a rotation mechanism capable of varying the relative rotational position of the vat relative to the build platform, the relative rotation being about an axis which is normal to the working surface of the vat.

An image sensor includes a double-microlens structure with an outer microlens aligned over an inner microlens, both microlenses aligned over a corresponding photosensor. The inner or outer microlens may be formed by a silylation process in which a reactive portion of a photoresist material reacts with a silicon-containing agent. The inner or outer microlens may be formed by step etching of a dielectric material, the step etching process including a series of alternating etch steps including an anisotropic etching step and an etching step that causes patterned photoresist to laterally recede. Subsequent isotropic etching processes may be used to smooth the etched step structure and form a smooth lens. A thermally stable and photosensitive polymeric/organic material may also be used to form permanent inner or outer lenses. The photosensitive material is coated then patterned using photolithography, reflowed, then cured to form a permanent lens structure.

In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with such voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete gap fill. In addition, mechanical reliability is improved, alleviating the problems associated with cracking and delamination, and leading to an improvement in device yield and device reliability.

The present invention relates to amorphous photosensitive networks. The networks are characterized by good shape memory properties.

A method of forming an alignment layer includes; providing a substrate having a base substrate and a photosensitive polymer layer disposed on the base substrate, the base substrate including a plurality of unit pixel areas, each of which is divided into a plurality of sub-pixel areas, photoaligning the photosensitive polymer layer by irradiating first light to a first exposure area of a first unit pixel area, the first light being inclined at a first angle with respect to the substrate in a first direction, and substantially simultaneously photoaligning the photosensitive polymer layer by irradiating second light to a second exposure area of a second unit pixel area at substantially the same time as the first light is irradiated to the first exposure area, the second light being inclined at a second angle with respect to the substrate in a second direction.

The present invention belongs to the field of polymer film preparing technology, and is especially method of modifying hydrophilicity of polyvinylidene fluoride film. The method combines blending and surface grafting technology, and includes the first blending polyvinylidene fluoride and one other photosensitive polymer and preparing microporous or compact film, and the subsequent surface grafting hydrophilic monomer onto the surface of the blend film. The prepared modified film has excellent chemical stability and mechanical performance similar to that of microporous polyvinylidene fluoride film as well as improved surface hydrophilicity and antifouling performance.

An inorganic pattern is formed by coating an inorganic substance-containing photosensitive composition comprising a photosensitive polymer (A), a condensable organic metal compound or a condensate thereof (B) and an inorganic filler having a functional group (C) on a base, exposing the coated layer, and developing the exposed layer to form a pattern, baking the pattern give an inorganic pattern. The photosensitive polymer (A) may be constituted of an oligomer or polymer, and a photosensitizer, and the condensable organic metal compound (B) may have a photosensitive group. The inorganic filler may be a monodispersed colloidal silica having a mean particle size of 2 to 100 nm. The proportions of the components (B) and (C) relative to 1 part by weight of the component (A) on a solid basis are about 1 to 25 parts by weight and about 1 to 20 parts by weight, respectively. Even when the content of an inorganic component is high, an inorganic pattern of high resolution can be formed with the use of the above resin composition.

A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.

An object of the present invention is to provide a liquid crystal display device that has an excellent mass-productivity and gives an image improved by the reduction of the chromaticity difference between white display and black display, the reduction of coloring and luminance in black display, and the improvement of the contrast ratio. In the present invention, of a pair of alignment films 131 and 132 formed on a pair of substrates 101 and 102, respectively, the alignment film 132 formed on the glass substrate 102 on the observer side is made of a material obtained by adding a photoisomerized compound to a photosensitive polymer and has anisotropic absorption all over the visible light wavelength region (approximately 400 nm to 750 nm).

A two-photon absorbing optical recording material comprising at least one two-photon absorbing compound and a recording component is provided. Recording is made on it by utilizing the two-photon absorption of the two-photon absorbing compound in the material, and then the material is irradiated with light to thereby detect the difference in the reflectance between the recorded area and the unrecorded area thereof, and the recorded information is thereby reproduced from the material, and also provided are a photosensitive polymer composition and a photon-mode recording method for the material.

A photoresist composition for immersion lithography and a method of forming a photoresist pattern using the photoresist composition are disclosed. The photoresist composition includes a photosensitive polymer including a cycloaliphatic group blocked with at least two cyclic acetal groups as a side chain, a photoacid generator and an organic solvent. The hydrophobic photoresist composition may be changed into the hydrophilic photoresist composition by an exposure process. Thus, before the exposure process, the photoresist composition may be insoluble in a liquid for the immersion lithography. After the exposure process, an exposure portion of a photoresist film formed using the photoresist composition may be effectively dissolved in a developing solution to form a uniform photoresist pattern.

The invention relates to vegetable oil based polyurethane acrylic ester, belonging to the field of photosensitive polymer material. The vegetable oil based polyurethane acrylic ester is characterized in that the general chemical formula is Formula I, wherein R1, R2 and R3 are respectively chosen from alkane of C1-C18, at least one of the alkane is chosen from Formula II, R4 and R5 are respectively chosen from alkane of C1-C16, R6 is diphenyl methane-4,4'-diisocyanate, or hexamethylene diisocyanate, or isophorone diisocyanate or residue of 2,4-toluene diisocyanate with two isocyanate functional group removed, and R7 is 2-hydroxyethyl acrylate, or hydroxypropyl acrylate, or residue of pentaerythritol triacrylate with hydroxy functional group removed.

A photosensitive polymer comprises a fluorinated ethylene glycol group and a chemically amplified resist composition including the photosensitive polymer. The photosensitive polymer has a weight average molecular weight of about 3,000-50,000 having a repeating unit as follows:

• • wherein R₁ is a hydrogen atom or methyl group, and R₂ is a fluorinated ethylene glycol group having 3 to 10 carbon atoms.

A flexographic printing plate and a method for making a flexographic printing plate. According to one aspect, the method comprises the steps of providing a photopolymer substrate having a top surface pretreated with a non-gelatinous inkjet receptive coating; image-wise ink jetting an inkjet composition onto a portion of the pretreated surface of the photopolymer substrate to provide a photomask layer; exposing the photopolymer substrate to ultraviolet light to cure an unmasked portion of the photopolymer substrate; and processing the photopolymer substrate under conditions effective to render the cured unmasked portion of the photopolymer layer into a raised image surface suitable for use in a flexographic printing process.

The invention discloses a photosensitive microcapsule used for photodynamic therapy and a preparation method thereof, belonging to the technical field of photosensitive polymer thin film materials. The photosensitive microcapsule is prepared by the following steps: firstly, preparing photosensitive polymer materials of photosensitizer molecule graft polymer, and then adopting the layer self assembly technology, assembling polyelectrolyte materials with opposite charges on a microballoon template, and preparing a hollow capsule assembled by a plurality of capsule walls, wherein materials of the capsule walls include natural polymer glycan (CHI) or glucan directly grafted with photosensitizer by chemical bonds. The photosensitive microcapsule has good biocompatibility, fixes photosensitive molecules, can kill cancer cells effectively, can be applied to (Photodynamic Therapy) PDT, and is good in water dispersion and uniform in particle size, high in single-state oxygen content yield under the illumination of beams with specific wavelength, simple in process and easy in operation.

A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.