4687results about "Photomechanical apparatus" patented technology

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field for each of the pattern areas of the test reticle is recovered based on the acquired images from each pattern area of the test reticle. A lithography model is applied to the reticle near field for the test reticle to simulate a plurality of test wafer images, and the simulated test wafer images are analyzed to determine whether the test reticle will likely result in an unstable or defective wafer.

Methods and systems for training a prediction model to predict a mask image in which mask rule check (MRC) violations or process violations (e.g., edge placement error, sub-resolution assist feature (SRAF) printing) are minimized or eliminated. The prediction model is trained based on a loss function that is indicative of (a) a difference between the predicted mask image and a reference image, and (b) at least one selected from: an MRC evaluation of the predicted mask image or an evaluation of a simulated image of the predicted mask image.

The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.

The invention discloses a bionic TENG sensor unit for an artificial throat and a preparation method thereof, and relates to the field of artificial throats, and the sensor unit comprises a gradient micro-dome friction layer, a strain amplification layer, an electrode layer and a back cavity substrate layer. The gradient micro-dome array realizes gradual contact through gradient change of height and diameter; the strain amplification layer converts vertical vibration into horizontal strain by using a cantilever beam-sliding block structure; the back cavity array selectively amplifies vibration at a specific frequency based on the Helmholtz resonance principle. The invention further provides a corresponding preparation method. The preparation method comprises the steps of back cavity forming, electrode deposition, microstructure manufacturing, surface treatment and the like. The sensor has the advantages of high sensitivity, good frequency selectivity and strong durability, and is particularly suitable for detecting weak laryngeal vibration signals of laryngeal patients.

A method for detecting printing defects in a photolithography mask that will print on a wafer when using the photolithography mask in a specific photolithography system to print semiconductor structures on the wafer, the method comprising: acquiring a first aerial image of the photolithography mask using a mask inspection system; generating a second aerial image of the photolithography mask by applying a machine learning model (26) to the first aerial image, wherein the machine learning model is trained to map a first aerial image acquired by a mask inspection system to a second aerial image that emulates the application of the specific photolithography system to the photolithography mask; and detecting printing defects in the photolithography mask by comparing the second aerial image to a reference image.

A method and system for predicting complex electric field images with a parameterized model are described. A latent space representation of a complex electric field image is determined based on dimensional data in a latent space of the parameterized model for a given input to the parameterized model. The given input may be a measured amplitude (e.g., intensity) associated with the complex electric field image. The complex electric field image is predicted based on the latent space representation of the complex electric field image. The predicted complex electric field image includes an amplitude and a phase. The parameterized model comprises encoder-decoder architecture. In some embodiments, determining the latent space representation of the electric field image comprises minimizing a function constrained by a set of electric field images that could be predicted by the parameterized model based on the dimensional data in the latent space and the given input.

The invention discloses a batch processing technology of micro-fluidic chips, and relates to the technical field of chip processing. The method comprises the following steps: firstly, providing at least two layers of polymer coiled materials, namely a first coiled material for forming a micro-channel structure and a second coiled material for closing a micro-channel, the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA), and the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA); the thickness of the coiled material is 50-500 microns; secondly, carrying out continuous compression molding processing on the surface of the first coiled material through a roll-to-roll processing platform; through a roll-to-roll continuous process, micro-channel mold pressing, functional deposition, precise alignment bonding and online cutting are integrated, high-efficiency, high-consistency and high-integration-level batch manufacturing of the micro-fluidic chip is realized, and manual intervention and production cost are remarkably reduced.

A method for training a prediction model to generate a high-resolution image representing defects on a substrate from a low-resolution image of the substrate. The method includes inputting a first image and a reference image of defects on a substrate, which are representative of images captured using different image capture conditions, to a neural network. The neural network is executed to generate a predicted image in response to the first image. A loss function that is indicative of a difference between a defect distribution in the predicted image and a defect distribution in the reference image is calculated and the neural network is modified based on the loss function. The neural network may be trained until the loss function is minimized.

A reticle pod with backside static dissipation has an inner pod defining an accommodation space for a reticle. Multiple flexible guiding components are correspondingly disposed on multiple outer mounting portions of the inner pod in order to guide an inner cover and an inner base of the inner pod to position without relative displacement. Multiple conductive retainers are correspondingly arranged in the accommodation space to push against a backside of the reticle and form a full-time electrical conduction with the back side of the reticle, so as to establish a static dissipation path by the conductive retainers and the inner pod. Meanwhile, with the conductive retainers pushing against the reticle as well as the flexible guiding components providing the inner cover and the inner base with automatic position guiding, the reticle is automatically pushed and positioned to a center position of the inner base.

The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.

The invention provides a volume holographic grating exposure parameter determination method and a two-dimensional pupil expansion volume holographic optical waveguide, and the method comprises the steps: carrying out the multiple rotation of a vector of a first light beam, a vector of a second light beam and a holographic photosensitive material when the wavelengths of the first light beam and the second light beam are first recording wavelengths, the rotated vectors of the first light beam and the second light beam and the rotated material position of the holographic photosensitive material are obtained; converting the wavelengths of the first light beam and the second light beam into a second recording wavelength, and rotating the rotated vectors of the first light beam and the second light beam at least once to obtain in-material vectors of the first light beam and the second light beam; determining the in-air vectors of the first light beam and the second light beam according to the in-material vectors of the first light beam and the second light beam; and determining incident angles of the first light beam and the second light beam according to the in-air vectors of the first light beam and the second light beam. According to the method, the manufacturing efficiency of the two-dimensional pupil-expanding body holographic optical waveguide comprising the coupling-in, turning and coupling-out body holographic grating can be improved.

The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.

An imprinting apparatus comprises a first carrier for carrying a flexible stamp and a second carrier movable relative to the first carrier and configured to carry a substrate having a resist layer. The second carrier comprises a chuck and a set of chuck actuators for translating a portion of the chuck in a Z-axis direction. Each chuck actuator comprises an actuator output and a lever arrangement between the actuator output and a chuck drive member. The lever arrangement enables an increase in positioning accuracy and increased stiffness, compared to the direct control of position using the actuator output.

The invention relates to a device (1) for imaging micro- and / or nanostructures, in particular structures on microlithography masks. The device (1) comprises an illumination device (10) for illuminating an object (20) with illumination radiation and an image capture unit (40) for capturing the illumination radiation transformed by the object (20), wherein the device (10) is designed to be focusable, wherein the image capture unit (40) comprises at least two image capture sensors (45, 46, 47) which are arranged such that at least one image capture sensor (45, 46, 47) is defocused regardless of the focusing of the device (1).

The present disclosure provides a semiconductor structure and a system for manufacturing the semiconductor structure. The system includes a fabrication equipment, configured to perform operations to form a layer on a wafer; an exposure equipment, configured to perform patterning operations to form a pattern of the layer; and an alignment equipment, configured to detect an alignment of two overlay marks at different elevations on the wafer. The alignment equipment includes a stage, configured to support the wafer; an optical device, configured to emit a radiation to excite a photoluminescent material of one of the two overlay marks; an optical filter, configured to receive and filter a radiation emitted from the photoluminescent material; and an optical detector, configured to convert an optical signal filtered by the optical filter to an electrical signal.

A method for fabricating a MEMS device comprising the following steps: providing a first bonding surface (1) on a first substrate (2) with a first substrate doping; providing a second bonding surface (3) on a second substrate (4) with a second substrate doping; aligning and joining the first and second bonding surfaces (1, 3) by a Si-Si direct bonding process, wherein both bonding surfaces (1, 3) have a silicon surface, and wherein an additional near-surface first doping layer (5) is produced below at least one of the bonding surfaces (1).

Methods, systems, and computer software for predicting after-etch profiles of features at varying depths. A method can include accessing after-development resist profiles of features. The method can also include applying an etch bias model on the after-development resist profiles to obtain the after-etch profiles, where the etch bias model correlates an etch bias with an etch depth.

The embodiments of the disclosure provide an image data processing method for laser imaging, a computer device and a computer-readable storage medium. In the embodiments, in case where the gap distance corresponding to a previous laser is not an integer multiple of the preset width of pixel row, the image resolution for a scan area associated with a next adjacent laser is increased to the second resolution to decrease the width of pixel row in the associated scan area, thereby more pixel rows may be obtained in the same area in the raw scan image, and the pixel rows closer to the position actually scanned by the laser spot may be selected as the target pixel rows, which may decrease the deviation between the position of the pixel row actually scanned by the laser and the theoretical position of the pixel row, and further improve the laser scan imaging accuracy.

The invention discloses an optical proximity correction method, a mask plate and a semiconductor structure forming method, and the optical proximity correction method comprises the steps: obtaining a reference layout which comprises a plurality of first metal wire patterns, a plurality of second metal wire patterns and a plurality of cutting patterns; a to-be-corrected graph is obtained from the multiple cut-off graphs, the to-be-corrected graph comprises a first to-be-corrected graph and a second to-be-corrected graph, the first to-be-corrected graph and the second to-be-corrected graph are adjacent, and the distance between the first to-be-corrected graph and the second to-be-corrected graph is smaller than a first preset size; determining a target reference pattern corresponding to the to-be-corrected pattern from the plurality of second metal wire patterns; on the basis of the target reference graph, the first to-be-corrected graph and the second to-be-corrected graph are combined and corrected, a combined graph is obtained, the combined graph is formed, and the situation that a mask design rule is violated is avoided.

A method may include illuminating an overlay target on a sample as the sample is translated along a stage-scan direction with two or more illumination beams. The two or more illumination beams include at least a first illumination beam having a first wavelength and a second illumination beam having a second wavelength, where the first wavelength is different than the second wavelength. The method may further include receiving time-varying interference signals from two or more photodetectors associated with a first-layer grating feature and a second-layer grating feature of a grating-over-grating structure. The first-layer grating feature may have a first pitch and the second-layer grating feature may have a second pitch different than the first pitch. The method may further include determining an overlay measurement between one of the first-layer grating feature and the second-layer grating feature of the sample based on the time-varying interference signals.

The invention belongs to the technical field of photoresists, and relates to a wide-color-gamut yellow dye for a color filter, a synthesis method of the wide-color-gamut yellow dye, a green photoresist and a preparation method of the green photoresist. The green photoresist is prepared from the following raw materials in parts by weight: 4 to 8 parts of green pigment, 3 to 8 parts of resin, 3 to 10 parts of acrylic monomer, 0.5 to 2 parts of photoinitiator, 0.2 to 0.4 part of auxiliary agent and 75 to 85 parts of organic solvent. The synthesized yellow dye has good photoresist system adaptability and high molar absorption coefficient, and meanwhile, due to the fact that acrylic acid is grafted, acrylic acid on the yellow dye has carbon-carbon double bonds, under the action of a photoinitiator, after bond breaking, the yellow dye can react with resin or an acrylic monomer and is cured in a film, and the yellow dye has good chemical resistance.

The invention discloses a nanoimprint adhesive and a preparation method thereof, the nanoimprint adhesive is prepared from the following raw materials: an optical monomer, an acrylate prepolymer, a modified acrylate prepolymer, nanoparticles, a photoinitiator, a coupling agent and a diluent, the structural general formula of the optical monomer is shown in the specification, R1 is methyl or hydrogen, R2 is methyl or hydrogen, and R3 is methyl or hydrogen. And the difference between the refractive index of the nanoparticles and the refractive index of the optical monomer is greater than 0.4. According to the nanoimprint adhesive provided by the invention, the optical monomer and the nanoparticles have a synergistic effect, so that the refractive index of the cured nanoimprint adhesive can reach 1.7-1.8. The optical monomer can participate in curing together with other components to form a macromolecular or cross-linked network, so that the cured colloid can realize higher structural strength, nanoimprint demoulding is facilitated, the micro-nano structure is kept intact during demoulding, and the colloid is not easy to remain; and when a reliability test is carried out, the micro-nano structure on the cured colloid can be kept relatively complete, so that the production yield can be improved.

A system and method for generating predictive images for wafer inspection using machine learning are provided. Some embodiments of the system and method include acquiring the wafer after a photoresist applied to the wafer has been developed; imaging a portion of a segment of the developed wafer; acquiring the wafer after the wafer has been etched; imaging the segment of the etched wafer; training a machine learning model using the imaged portion of the developed wafer and the imaged segment of the etched wafer; and applying the trained machine learning model using the imaged segment of the etched wafer to generate predictive images of a developed wafer. Some embodiments include imaging a segment of the developed wafer; imaging a portion of the segment of the etched wafer; training a machine learning model; and applying the trained machine learning model to generate predictive after-etch images of the developed wafer.

Disclosed in the present invention is a large-area printing and transferring method for a two-dimensional material micro-pattern array. The method comprises: preparing a two-dimensional material dispersion; fixedly attaching a mask engraved with a target two-dimensional material micro-pattern onto a porous polymer filter membrane; performing suction filtration and deposition on the two-dimensional material dispersion by means of a vacuum filtration device, so as to obtain a porous polymer filter membrane having the target two-dimensional material micro-pattern; and printing the target two-dimensional material micro-pattern onto a target substrate from the porous polymer filter membrane, and overturning the target substrate to separate same from the porous polymer filter membrane, so as to complete the transferring. The method for printing a two-dimensional material micro-pattern array and transferring same between different substrates as provided by the present invention is easy to operate, has high transfer efficiency and low costs, and can achieve large-area, high-precision, defect-free and patterned two-dimensional material manufacturing of a two-dimensional material micro-pattern array and pollution-free transferring of same between different substrates.

A method for metrology may include receiving an inspection image of a structure on a sample, extracting a gray level value profile associated with the structure from the received inspection image, and determining a critical dimension of the structure from the extracted gray level value profile based on a threshold value. The threshold value may be determined from multiple gray level value profiles associated with the structure and may be indicative of gray level value at a location where a variation between different gray level value profiles of the multiple gray level value profiles is a minimum. And each gray level value profile of the multiple gray level value profiles may be associated with a different apparatus setting.

A method for sample scheme generation includes obtaining measurement data associated with a set of locations; analyzing the measurement data to determine statistically different groups of the locations; and configuring a sample scheme generation algorithm based on the statistically different groups. A method includes obtaining a constraint and / or a plurality of key performance indicators associated with a sample scheme across one or more substrates; and using the constraint and / or plurality of key performance indicators in a sample scheme generation algorithm including a multi-objective genetic algorithm. The locations may define one or more regions spanning a plurality of fields across one or more substrates and the analyzing the measurement data may include stacking across the spanned plurality of fields using different respective sub-sampling.

The invention relates to a laminated staggered sub-wavelength polarization grating structure and a preparation method thereof, through staggered arrangement of a first metal grating layer and a second metal grating layer, transmission of polarized light of a transverse electric field can be effectively inhibited, and the extinction ratio is remarkably improved. Through the substrate, the first dielectric layer, the second dielectric layer, the first metal grating layer, the third dielectric layer and the second metal grating layer which are sequentially arranged from bottom to top, the whole device obtains a higher extinction ratio while keeping high transmittance, the overall structure is simple, the processing difficulty and cost are reduced, and the production efficiency is improved. And the number of the used dielectric layers and metal layers is small, the thickness requirement is low, and therefore it is ensured that the cost is controllable.

A glass including silica and titania is disclosed. An average hydroxyl concentration of a plurality segments of the glass is in a range from about 20 ppm to about 450 ppm, an average titania concentration of the plurality of segments is in a range from about 6 wt. % to about 12 wt. %, and each segment of the plurality of segments has a length of about 12.7 mm, a width of about 12.7 mm, and a height of about 7.62 mm. The hydroxyl concentration of each segment is measured using a Fourier transform infrared spectroscopy in transmission, the refractive index is measured using an optical interferometer with a 633 nm operating wavelength and a resolution of 270 microns×270 microns pixel size, and the average titania concentration is determined based upon the measured refractive index.