67 results about "Metrology" patented technology

According to the metering detection calibration method and system, the dynamic waiting time is determined on the basis of the characteristic relaxation time of the instrument to be calibrated, and data is recorded after output is stable, so that the problems that the traditional fixed waiting time cannot adapt to the relaxation characteristic of the instrument, and data instability or low efficiency is easily caused are solved; the instrument is ensured to be fully stable so as to improve data reliability, and waiting time redundancy is avoided; and meanwhile, the equivalent effective times are calculated by combining the actual retention time after the output value is stabilized and the characteristic relaxation time of the instrument to be calibrated, and a final calibration result is obtained by adopting a statistical method for dynamically quantifying the data contribution degree, so that the problems that the existing equal weighting or manual weighting mode is strong in subjectivity and is difficult to reflect the real reliability of the data are solved. And the accuracy and objectivity of the calibration result are improved.

A method of determining a parameter of interest of a structure comprising at least one first feature oriented along a first axis of a structure coordinate system and at least one second feature oriented along a second axis of the structure coordinate system. The method comprising: illuminating the first feature and the second feature with first illumination from a first direction oblique to said first axis and second axis, so as to generate first scattered radiation from the first feature and second scattered radiation from the second feature, detecting a first interference pattern formed by interference between a portion of the first scattered radiation and first reference illumination; detecting a second interference pattern formed by interference between a portion of the second scattered radiation and the first reference illumination; and determining the parameter of interest of the structure using the first interference pattern and the second interference pattern.

A metrology system may receive one or more first images of an overlay target on a sample from a first detector, where the overlay target includes one or more Moiré structures, which may be formed as first-layer features and second-layer features that at least partially overlap and have different pitches. In the first images, the first-layer features and the second-layer features may be unresolved, but a Moiré pitch may be resolved. The system may further receive one or more second images of the overlay target from a second detector, where at least one of the first-layer features or the second-layer features are resolved in the one or more second images. The controller may generate a metrology measurement based on the one or more first images and generate a measurement of a systematic error associated with the metrology measurement based on the one or more second images.

An acquisition method and system of an addressing pattern, a measurement method, and related devices; the acquisition method of the addressing pattern includes: acquiring a positioning field of view region corresponding to a target pattern, the positioning field of view region having the target pattern; dividing the positioning field of view region into a plurality of first unit regions; acquiring a pattern density of each first unit region; and acquiring a position of an addressing pattern located around the target pattern in the positioning field of view region according to a plurality of first unit regions having the largest difference in pattern density with adjacent first unit regions. The acquisition method of the addressing pattern of the embodiment is advantageous in improving the uniqueness of the selected addressing pattern, reducing the probability of the addressing pattern being similar to the patterns of other regions, thereby being advantageous in accurately positioning the addressing pattern, and further being capable of accurately positioning the target pattern based on the addressing pattern, and accordingly being advantageous in improving the process reliability, for example, improving the accuracy of the measurement result of the target pattern in the process of measuring the target pattern.

A method of metrology target design is described. The method includes determining a sensitivity of a parameter of a metrology target design to a perturbation of a process parameter for forming, or measuring the formation of, the metrology target, and determining a robustness of the metrology target design based on the sum of the sensitivity multiplied by the perturbation of at least one of the process parameters.

A metrology method related to measurement of a structure on a substrate, the structure experiencing process variations is disclosed. The method comprises: obtaining first measurement data related to a phase of measurement radiation that has been scattered from one or more markers and to a plurality of measurement conditions; obtaining second measurement data relating to the intensity of the measurement radiation and to the plurality of measurement conditions; obtaining a weighting of the first measurement data and the second measurement data, the weighting comprising a modulus component associated with a modulus of a complex weight and an argument component associated with an argument of the complex weight; and determining a first parameter value of a first parameter from the first measurement data and the second measurement data weighted by the weighting.

The utility model relates to the technical field of metering devices, and discloses a metering device convenient to read metering data, which comprises a metering assembly, the lower end of the metering assembly is provided with a base, the upper end of the base is also provided with a washing assembly, a starting motor, a matching rotating shaft, a shaft rod and a synchronous belt drive a turntable to rotate, and at the moment, a lifting piece and the washing assembly synchronously rotate; the flushing assembly is located on the metering cylinder, then the air cylinder part is started reversely, the connecting base and the flushing box can be driven to move downwards until the blocking cover makes contact with the metering cylinder, then the micro pump body is started, water can be pumped out and discharged through the flushing pipe, water can be sprayed into the metering cylinder, and the water slides along the inner wall of the metering cylinder; meanwhile, an electric push rod is started, a cleaning plate can be pushed to move downwards, the inner wall of the metering cylinder is cleaned, liquid can be discharged from a guide pipe, the interior of the metering cylinder is clean, residual liquid is reduced, and the accuracy of the metering result is guaranteed.

The invention relates to the technical field of metering, and discloses a metering monitoring method and a metering monitoring system.The method comprises the steps that a handover mode is determined according to a service identifier of a handover service and a mapping table, and the mapping table comprises the corresponding relation between the service identifier and the handover mode; according to a handover mode corresponding to the handover service, determining a to-be-collected actual data item, a standard data item and a fluctuation range of the handover service; collecting actual data items of the handover service; determining an actual handover amount according to the actual data item of the handover service, and determining a standard handover amount according to the standard data item; and determining whether the handover service is abnormal or not according to whether the comparison result of the actual handover amount and the standard handover amount exceeds the corresponding fluctuation range or not. According to the invention, the structured and automatic processing of the metering data is realized, the accuracy and reliability of the metering data are improved, the abnormity of handover data is found in time, and the automation level of metering management is greatly improved.

The invention relates to the technical field of measurement switch calibration, and discloses a measurement switch calibration device and calibration method. Parameter initialization is completed by determining a measurement input voltage range, a quantization resolution, a maximum allowable error threshold and an initial segmentation boundary, initial segments are divided based on the current boundary, sampling points of all the segments are calculated, and actual output measurement is carried out to obtain an input and output corresponding relation. Then, constructing a quadratic polynomial fitting function of each section according to a sampling result, and setting a check point in each section to verify an interpolation error so as to evaluate fitting precision; and if the error exceeds the limit, performing adaptive subdivision on the interval until the requirement is met. After all the segments meet the precision requirement, a global calibration mapping function is integrated and constructed, a boundary index structure is established, and finally a result is deployed into a measurement device, so that a corresponding segment function can be called according to the real-time input voltage during online operation for precise calibration.

A method for multi-merit adaptive sampling may include receiving an initial sampling map and a first set of metrology data. The method may further include calculating figure of merit metrics. The method may include ranking each initial sampling point in the initial sampling map based on the figure of merit metrics and levels of process variation. The method may include generating an adjusted sampling plan for at least one of a second sample in the first lot or a future process layer of the first sample based on the rank of each initial sampling point. An adjusted set of sampling points may be generated by increasing a number of sampling points in a first sample region associated with a first level of process variation and decreasing a number of sampling points in a second sample region associated with a second level of process variation.

The invention relates to a scattering measurement-based metrology system and method. The measurement model is trained from raw scatterometry data collected by a scatterometry-based overlay metrology system from an experimentally designed DOE wafer. Each measurement site includes one or more metrology targets fabricated with programmed overlay variations and known process variations. Each measurement site is measured with a known metrology system variation. In this manner, the measurement model is trained to separate the actual overlay from process variations and metrology system variations that affect overlay measurements. Thus, estimation of the actual overlay from the training measurement model is robust to process variations and metrology system variations. The measurement model is trained based on scatter measurement data collected from the same metrology system used to perform measurements. Thus, the measurement model is insensitive to system errors, asymmetry, and the like.

A metrology system including a measurement sub-system to collect zero-order double diffraction from a metrology target in response to an illumination beam, where the metrology target includes one or more grating-over-grating structures, having common pitches on two sample layers. The system may further include a controller to generate an after-develop inspection (ADI) metrology measurement of the metrology target at an ADI process step, generate an after-etch inspection (AEI) metrology measurement of the metrology target at an AEI process step, determine a non-zero offset (NZO) measurement based on a difference of the ADI metrology measurement and the AEI metrology measurement, and control one or more process tools based on at least one of the ADI metrology measurement, the AEI metrology measurement, or the NZO measurement.

The present application relates to the technical field of metrology automation calibration and testing, and provides an automatic metrology calibration data processing method, device, equipment, storage medium and program product, comprising: acquiring sampling parameters, and starting real-time monitoring of environmental influence quantity information; controlling a metrology standard device and a measured device to perform independent repeated observation according to the sampling parameters, so as to collect a measurement data sequence; associating each measurement data in the measurement data sequence with corresponding sampling time information and the monitored environmental influence quantity information, so as to generate a measurement data original record; and calculating a calibration result according to the measurement data original record, and automatically evaluating uncertainty. The present application realizes fine management and control of measurement whole-process data and automatic evaluation of uncertainty by establishing one-to-one corresponding association records of the measurement data of independent repeated observation and real-time environmental influence quantity and time information, and has the advantages of high calibration efficiency, complete data traceability chain and objective and accurate results.

A modeled correction may be generated based on metrology measurements and a weighting map. Residuals between the modeled correction and the metrology measurements may be weighted according to the weighting map. The modeled correction may be weighed via the weighting map according to a position at which the metrology measurements were generated on a sample. The modeled correction may include dose, focus, and overlay. A process tool may be controlled based on the modeled correction to control the dose, focus, and overlay.

A system for target centering detection may be configured receive one or more acquisition images of a sample from an overlay metrology sub-system and determine, using a machine learning-based centering model, one or more stage correctables based on the received one or more acquisition images. The system may be configured to cause a sample stage of the overlay metrology sub-system to adjust a stage position based on the determined one or more stage correctables and receive one or more measurement images of the sample from the overlay metrology sub-system based on the adjusted stage position of the sample stage. The system may then be configured to determine one or more overlay measurements based on the received one or more measurement images.

Disclosed is a method of determining an illumination-detection system alignment of an illumination-detection system describing alignment of at least one detector and / or measurement illumination of a metrology apparatus in terms of two or more illumination-detection system alignment parameters, each illumination-detection system alignment parameter relating to a respective degree of freedom for aligning the detector and / or the measurement illumination. The method comprises obtaining a diffraction pattern relating to diffraction of broadband radiation from a structure; transforming each of one or more diffraction orders of the diffraction pattern to a respective region coordinate system, each region coordinate system comprising a first axis and a second axis, each region coordinate system being such that said first axis is aligned in relation to a direction of an intensity metric of each transformed diffraction order; and determining illumination-detection system alignment parameter values for the illumination-detection system alignment parameters.

A substrate and associated patterning device are disclosed. The substrate comprises at least one target arrangement suitable for metrology of a lithographic process, the target arrangement comprising at least one pair of similar target areas, the at least one pair of similar target areas being arranged such that the target arrangement is centrosymmetric, or at least the target areas for measurement in a single direction together are centrosymmetric. A metrology method for measuring the substrate is also disclosed. A metrology method is also disclosed, comprising measuring such a target arrangement and determining a value of a parameter of interest from the scattered radiation, while correcting for a deformation of the metrology apparatus used.

The application provides an automatic detection method and device for measuring switches, and relates to the technical field of electric power measurement and detection. The specific steps comprise: synchronously collecting power data of an electric energy meter and each measuring switch in real time, comparing and judging whether the power error is excessive, and marking the time when the error is excessive as a first time; taking the first time as a starting point, adaptively determining an integral time window according to the power fluctuation characteristics, dynamically segmenting the power curve, adaptively selecting an integral method, and completing electric energy calculation; and marking abnormal candidate switches through consistency judgment of the electric energy data of the measuring switches, and completing measurement condition judgment in combination with an electric energy error threshold and an allowed floating upper and lower limit. The application solves the problems of large integral error and distorted data caused by traditional fixed cycle collection, accurately distinguishes whether the error is caused by measurement abnormality of the measuring switch itself or normal measurement error caused by non-fault factors such as load fluctuation, and realizes rapid positioning of the abnormal measuring switch.

Disclosed is a method for determining a spectral weighting for configuring spectral characteristics of broadband measurement illumination. The method comprises obtaining first metrology data comprising metrology data from at least a first proper subset of a plurality of targets on a substrate, respectively for each of a plurality of different illumination conditions; determining a respective first spectral weighting component for each target of at least a second proper subset of targets from said first metrology data, said first spectral weighting component being determined to provide a substantially wavelength independent mean intensity from each respective said target; determining a respective second spectral weighting component for each target of at least the second proper subset of targets from said first metrology data; and determining a respective spectral weighting for each target of at least the second proper subset of targets from said first spectral weighting component and said second spectral weighting component.

A system for target centering detection may be configured receive one or more acquisition images of a sample from an overlay metrology sub-system and determine, using a machine learning-based centering model, one or more stage correctables based on the received one or more acquisition images. The system may be configured to cause a sample stage of the overlay metrology sub-system to adjust a stage position based on the determined one or more stage correctables and receive one or more measurement images of the sample from the overlay metrology sub-system based on the adjusted stage position of the sample stage. The system may then be configured to determine one or more overlay measurements based on the received one or more measurement images.

A method and system are presented for use in measuring characteristic(s) of patterned structures. The method utilizes processing of first and second measured data, wherein the first measured data is indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of illuminating and / or collected light conditions corresponding to the characteristic(s) to be measured, and the second measured data comprises at least one spectrum obtained from the patterned structure in Optical Critical Dimension (OCD) measurement session. The processing comprises applying model-based analysis to the at least one Raman spectrum and the at least one OCD spectrum, and determining the characteristic(s) of the patterned structure under measurements.

This invention relates to the field of metrology calibration, and more particularly to an adaptive calibration method, apparatus, device, and storage medium for a metrology box. The method includes the following steps: powering on the metrology box normally, performing self-operating noise detection, and constructing a self-operating noise feature set; performing initial calibration and real-time metrological detection on the metrology box based on the self-operating noise feature set, outputting multiple metrological data sequences; performing sequence-by-sequence feature analysis and differential calculation of adjacent time periods based on the multiple metrological data sequences to obtain a feature difference value sequence; synchronously acquiring environmental monitoring parameters of the metrology box; tracing environmental interference sources based on the environmental monitoring parameters and marking interference sources; performing offset calibration based on the interference sources to obtain offset calibration reference parameters; and performing real-time operating condition metrological detection based on the offset calibration reference parameters. This invention achieves accurate and efficient metrology box detection and calibration.

A metrology system includes an imaging system. The imaging system may include an objective lens. The metrology system may include one or more detectors. The metrology system may include an objective positioning stage structurally coupled to the objective lens and configured to adjust a focal plane of at least one of the one or more detectors via movement along an optical axis of the metrology system. The metrology system may include one or more proximity sensors configured to measure lateral positions of a stage element as the objective positioning stage moves along the optical axis. The metrology system may be configured to determine a metrology measurement associated with a target on a sample using the images and lateral positions of the stage element when implementing a metrology recipe.

A diffraction measurement target that has at least a first sub-target and at least a second sub-target, and wherein (1) the first and second sub-targets each include a pair of periodic structures and the first sub-target has a different design than the second sub-target, the different design including the first sub-target periodic structures having a different pitch, feature width, space width, and / or segmentation than the second sub-target periodic structure or (2) the first and second sub-targets respectively include a first and second periodic structure in a first layer, and a third periodic structure is located at least partly underneath the first periodic structure in a second layer under the first layer and there being no periodic structure underneath the second periodic structure in the second layer, and a fourth periodic structure is located at least partly underneath the second periodic structure in a third layer under the second layer.

Disclosed is a method comprising: obtaining measured data relating to at least one measurement by a measurement apparatus configured to irradiate radiation onto each of one or more structures on a substrate: decomposing the measured data using a decomposition method to obtain multiple measured data components: obtaining simulated data relating to at least one simulation based on the one or more structures: decomposing the simulated data using the decomposition method to obtain multiple simulated data components: matching between at least a portion of the simulated data components and at least a portion of the measured data components; and extracting a feature of the substrate based on the matching of at least a portion of the simulated data components and at least a portion of the measured data components.

A metrology method includes: performing a first exposure on a substrate to form a first patterned layer including a plurality of first target units, each first target unit including first target features; performing a second exposure on the substrate to form a second patterned layer including a plurality of second target units that are overlayed with respective ones of the first target units, each second target unit having second target features, wherein ones of the plurality of second target units have the second target features positioned at different offsets, respectively, relative to a reference location; imaging the second target units overlayed on the first target units; and determining edge placement errors based on positions of edges of the second target features in the second target units relative to edges of the first target features of the underlying first target units.

The application discloses a kind of angle adjustment geometric metrology equipment for geological mapping, it is related to geometric metrology field, including metrology main body, metrology main body is by column and is set to the adjusting platform of column top end, adjusting platform upper surface is integrated with data acquisition end, the top center of column is fixed with vertical rod, the top of vertical rod is integrally provided with spherical reference head, the bottom center of adjusting platform is fixed with the articulation sleeve matched with spherical reference head, for adjusting the horizontal and deflection angle adjustment of platform, the outer wall of adjusting platform is provided with circumferential angle measurement scale, the deflection angle value of reference surface adjustment can be directly read;The application can complete the angle adjustment of reference surface and data reading without additional auxiliary tools, significantly improve the accuracy of geometric metrology, provide stable and reliable reference support for the accurate collection of core geometric quantities such as measurement point angle and flatness, reduce the measurement error caused by unstable reference and inconvenient angle reading.