11346results about "Optically investigating flaws/contamination" patented technology

In a method of determining the focus of a lithographic apparatus used in a lithographic process on a substrate, the lithographic process is used to form a structure on the substrate, the structure having at least one feature which has an asymmetry in the printed profile which varies as a function of the focus of the lithographic apparatus on the substrate. A first image of the periodic structure is formed and detected while illuminating the structure with a first beam of radiation. The first image is formed using a first part of non-zero order diffracted radiation. A second image of the periodic structure is foamed and detected while illuminating the structure with a second beam of radiation. The second image is formed using a second part of the non-zero order diffracted radiation which is symmetrically opposite to the first part in a diffraction spectrum. The ratio of the intensities of the measured first and second portions of the spectra is determined and used to determine the asymmetry in the profile of the periodic structure and/or to provide an indication of the focus on the substrate. In the same instrument, an intensity variation across the detected portion is determined as a measure of process-induced variation across the structure. A region of the structure with unwanted process variation can be identified and excluded from a measurement of the structure.

Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent. The radiation that is reflected off the substrate is radially polarized.

A system for focusing light on an illumination area. The system includes a reflector having a focusing reflective surface and a focal region and an LED array having a plurality of LEDs located within the focal region. Each of the plurality of LEDs in the LED array is positioned to emit light toward the focusing reflective surface. The focusing reflective surface reflects light from each of the plurality of LEDs of the LED array toward the illumination area.

A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.

A camera assembly arranged on an unmanned and autonomously navigating aerial vehicle is employed to inspect a surface area of for material defects. The vehicle is automatically flown to the surface area from a launch site, wherein it can fly around obstacles using automatic obstacle detection and avoidance methods. A relative position of the aerial vehicle with respect to the surface area with the aid of a position sensor is continuously measured and a sequence of images of the surface area is recorded. Between the individual images, the aerial vehicle is moved along a flight path overlapping image details of the surface area. The images of the sequence are composed into an overall image of the surface area to allow for the surface area to be inspected for defects and the location of defects to be ascertained on the basis of the overall image.

Systems for inspection of patterned and unpatterned wafers are provided. One system includes an illumination system configured to illuminate the specimen. The system also includes a collector configured to collect light scattered from the specimen. In addition, the system includes a segmented detector configured to separately detect different portions of the light such that azimuthal and polar angular information about the different portions of light is preserved. The detector may also be configured to produce signals representative of the different portions of the light. The system may also include a processor configured to detect defects on the specimen from the signals. In another embodiment, the system may include a stage that is configured to rotate and translate the specimen. In one such embodiment, the system may also include an illumination system configured to scan the specimen in a wide scan path during rotation and translation of the specimen.

Methods and systems for providing illumination of a specimen for a process performed on the specimen are provided. One system configured to provide illumination of a specimen for a process performed on the specimen includes a laser configured to generate excitation light. The system also includes focusing optics configured to focus the excitation light to a plasma in an electrodeless lamp such that the plasma generates light. The system is also configured such that the light illuminates the specimen during the process.

Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

A lighting system associated with a machine vision system. The machine vision system may direct lighting control commands to the lighting system to change the illumination conditions provided to an object. A vision system may also be provided and associated with the machine vision system such that the vision system views and captures an image(s) of the object when lit by the lighting system. The machine vision system may direct the lighting system to change the illumination conditions and then capture the image.

Disclosed is a semiconductor die having a lower test structure formed in a lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end. The first end is coupled to a predetermined voltage level. The semiconductor die also includes an insulating layer formed over the lower metal layer. The die further includes an upper test structure formed in an upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure. The upper metal layer is formed over the insulating layer. In a specific implementation, the first end of the lower test structure is coupled to ground. In another embodiment, the semiconductor die also includes a substrate and a first via coupled between the first end of the lower test structure and the substrate. In yet another aspect, the lower test structure is an extended metal line, and the upper test structure is a voltage contrast element. Methods for inspecting and fabricating such semiconductor die are also disclosed.

A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The signal processing subsystem comprises a series of data acquisition nodes, each dedicated to a collection detection module and a plurality of data reduction nodes, made available on a peer to peer basis to each data acquisition nodes. Improved methods for detecting signal in the presence of noise are also provided.

An aerial inspection system has at least one transmission line, an aerial vehicle, and a detection device coupled to the aerial vehicle. The detection device is configured to detect a condition of the transmission line as the aerial vehicle flies across the transmission line. The aerial vehicle may be in the form of a drone.

A system and method of automated civil infrastructure metrology for inspection, analysis, and information modeling utilizes an unmanned aerial vehicle (UAV) equipped with a position tracking system and digital cameras to capture a plurality of images of a structure to be inspected. The UAV is flown in a scan pattern around the structure while continually capturing images of the structure while position and orientation data is also recorded and linked for each of the images. Image processing and pattern recognition software algorithms are used to analyze the images and create an information model of the structure which is then used to carry out a virtual inspection of the structure in a three dimensional software environment.

A system for acquiring, processing, storing, analyzing and reporting data relating to the condition of a road or other pavement surface (102) in real time. The system includes a digital camera (104) mounted on a vehicle and positioned relative to a pavement surface (102) so as to capture images of the pavement surface (102) while the camera (104) is moving relative to the surface (102). The system also includes an illumination assembly (100) to illuminate the region from which an image is taken and an interface between the digital camera (104) and at least one computer. The system also includes a processor in the computer for processing the images to detect and classify cracks and other pavement surface (102) features.

Apparatus for automatically inspecting a stream of matter comprises lamps which emit a detection medium, such as IR or visible light, to be active at the matter, a rotary polygonal mirror which receives from a multiplicity of detection zones at the matter detection medium which has been varied by variations in the matter, an optical detection device which receives the varied medium by reflection from the mirror, to detect a plurality of wavelengths of the varied medium substantially simultaneously, and to generate detection data in respect of that plurality of wavelengths substantially simultaneously and in dependence upon the variations in the medium, and a microprocessor which obtains the detection data from the device. The beams of the varied medium which are received at the device and emanate from the zones travel along respective paths from the matter to the mirror 9 which paths converge continuously with respect to each other from the matter to the mirror. Those paths may extend to the mirror indirectly by way of at least one planar mirror, or directly to the mirror, in which latter case the axis of the mirror would be substantially parallel to the direction of advance of the matter.

A wafer inspection apparatus has a supporting means (10) for rotatably supporting a wafer (W) formed of a disk, a circumferential edge imaging means (40) for imaging a circumferential edge (S) of the wafer (W) that is supported by the supporting means for rotation, a notch imaging means (50) for imaging a notch (N), a notch illumination part (52) for illuminating the notch (N), and a control means (70) for processing image data imaged by the circumferential edge imaging means (40) and the notch imaging means (50). The circumferential edge imaging means (40) has a plurality of imaging cameras (41) for imaging a plurality of different parts in a thickness direction of the circumferential edge of the wafer (W). The different parts of the circumferential edge (S) of the wafer (W) include an apex at right angles to a surface of the wafer (W) and a front side bevel and a back side bevel inclined relative to the apex. The notch imaging means (50) for the wafer (W) having the notch (N) has a plurality of imaging cameras (51) for imaging different parts in the thickness direction of the notch (N).

The invention relates to a method for automatic inspection of the surface 20 of a moving object, in which a region on the object's surface is illuminated from at least two different illumination directions 13-15. The object's illuminated surface region is imaged with a camera to provide image information for analysis. The light sources in the different illumination directions 13-15 are pulsed to illuminate the object's surface region at different times, the pulsing frequency being >1 kHz The object's illuminated surface region is imaged as lines with a line scan camera 21 in sync with the above pulsing. The invention also relates to an arrangement for inspecting the surface 20 of a moving object, the arrangement comprising at least two light sources 10-12 in at least two different illumination directions 13-15 for illuminating the surface region of the object under inspection; a camera for imaging the object's surface region; and an image analyzer for analyzing the image information acquired from the object's surface 20 by imaging. The light sources 10-12 illuminate the object's surface 20 from the different illumination directions 13-15 at different times, and the camera is a line scan camera 21. The arrangement further comprises a timing controller 18 for synchronous pulsing of the light sources 10-12 and the at least one line scan camera 21, the pulsing frequency of the light sources 10-12 being >1 kHz.

Disclosed is a semiconductor die having an upper layer and a lower layer. The die includes a lower test structure formed in the lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end, wherein the first end is coupled to a predetermined voltage level. The die also has an insulating layer formed over the lower metal layer and an upper test structure formed in the upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure, and the upper metal layer being formed over the insulating layer. The die further includes at least one probe pad coupled with the upper test structure. Preferably, the first end of the lower test structure is coupled to a nominal ground potential. In another implementation, the upper test structure is a voltage contrast element. In another embodiment, a semiconductor die having a scanning area is disclosed. The semiconductor die includes a first plurality of test structures wherein each of the test structures in the first plurality of test structures is located entirely within the scanning area. The die includes a second plurality of test structures wherein each of the test structures in the first plurality of test structures is located only partially within the scanning area. The first plurality of test structures or the second plurality of test structures has a probe pad coupled to at least one test structure.

Hybrid metrology apparatus (1000, 1100, 1200, 1300, 1400) measures a structure (T) manufactured by lithography. An EUV metrology apparatus (244, IL1/DET1) irradiates the structure with EUV radiation and detects a first spectrum from the structure. Another metrology apparatus (240, IL2/DET2) irradiates the structure with second radiation comprising EUV radiation or longer-wavelength radiation and detects a second spectrum. Using the detected first spectrum and the detected second spectrum together, a processor (MPU) determines a property (CD/OV) of the structure. The spectra can be combined in various ways. For example, the first detected spectrum can be used to control one or more parameters of illumination and/or detection used to capture the second spectrum, or vice versa. The first spectrum can be used to distinguish properties of different layers (T1, T2) in the structure. First and second radiation sources (SRC1, SRC2) may share a common drive laser (LAS).

An automated inspection system particularly adapted for detection and discrimination of surface irregularities of specularly reflecting and other materials, such as are employed in laminate chip carriers and printed circuit boards, includes an area scan image sensor allowing illumination sources to surround an area of a surface being inspected. The illumination source preferably provides either or both bright field and dark field illumination of the surface; developing generally complementary images of surface irregularities. A self-registering rules-driven process for developing inspection masks reduces alignment operations and improves performance. Image enhancement and morphological operations to detect surface irregularities are performed by digital signal processing, preferably using a dedicated vision processor. Masks screen potential defects to critical mounting and bonding surfaces accurately without requiring alignment of data or reference images to acquired images. Since potential defects are copied from acquired images and stored, verification of defects may be performed without further access to the inspected part and without removal of the part to another specialized apparatus, simplifying processing and increasing throughput and operator efficiency.

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Methods and systems for detecting defects on a specimen are provided. One system includes a generative model. The generative model includes a non-linear network configured for mapping blocks of pixels of an input feature map volume into labels. The labels are indicative of one or more defect-related characteristics of the blocks. The system inputs a single test image into the generative model, which determines features of blocks of pixels in the single test image and determines labels for the blocks based on the mapping. The system detects defects on the specimen based on the determined labels.

Disclosed are methods and apparatus for automatic optoelectronic detection and inspection of objects, based on capturing digital images of a two-dimensional field of view in which an object to be detected or inspected may be located, analyzing the images, and making and reporting decisions on the status of the object. Decisions are based on evidence obtained from a plurality of images for which the object is located in the field of view, generally corresponding to a plurality of viewing perspectives. Evidence that an object is located in the field of view is used for detection, and evidence that the object satisfies appropriate inspection criteria is used for inspection. Methods and apparatus are disclosed for capturing and analyzing images at high speed so that multiple viewing perspectives can be obtained for objects in continuous motion.

The present invention provides an improved system for identifying defects in a composite structure by providing a light source such that defects, and in particular dark defects on a dark background and/or light defects on a light background, can be identified by capturing images of the illuminated composite structure. In particular, the improved system for identifying defects in a composite structure may provide a reflective surface, dispersion elements, and multiple and/or moveable light source(s) and/or camera(s) in order to ensure that the most accurate images of any area of the composite structure, even curved or contoured areas, are captured and processed. As a result, the system of the present invention permits the operator to quickly identify and correct defects which would otherwise create structural flaws or inconsistencies that may affect the integrity of the composite structure.

A linear illumination unit (30) has a line of unlensed LEDs (31) which emit light spreading out. The light is focused into a line by a Fresnel lens (33) which allows spread and mixing of light in the linear direction and limits spread in the ortliogonal direction. A Fresnel lens is particularly effective for this purpose. The housings 34 have slots 36 to help control light spread, and the housings are open-ended to allow spread of light in the linear direction beyond the confines of the, geometry of the units. Thus, units (30) may be interconnected to provide seamless linear light in a modular manner.

Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.

A process control method to monitor ion implantation process conditions by measuring the optical properties of a masking material is provided. A patterned masking material may protect underlying regions of a semiconductor substrate from undergoing a chemical or physical change during an ion implantation process. The patterned masking material, however, may also undergo a chemical or physical change during processing. The chemical or physical changes to the masking material during such processing may also cause the optical properties of the material to change. The optical properties of the masking material may be used to determine the concentration of ions implanted into the semiconductor substrate.

A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. For patterned surface inspection, a cross-shaped filter is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface. In another embodiment, different portions of the same objective may be used for focusing the illumination beams onto the surface and for collecting the scattered radiation from the illuminated spots simultaneously. In another embodiment, a one-dimensional array of illumination beams are directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.

The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. One embodiment provides a substrate inspection apparatus, comprising a vacuum chamber lid, the lid comprising a body defining at least three ports located to provide a field of view to a common area on a substrate transfer plane and light management system.