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11346results about "Optically investigating flaws/contamination" patented technology

Methods and Scatterometers, Lithographic Systems, and Lithographic Processing Cells

In a method of determining the focus of a lithographic apparatus used in a lithographic process on a substrate, the lithographic process is used to form a structure on the substrate, the structure having at least one feature which has an asymmetry in the printed profile which varies as a function of the focus of the lithographic apparatus on the substrate. A first image of the periodic structure is formed and detected while illuminating the structure with a first beam of radiation. The first image is formed using a first part of non-zero order diffracted radiation. A second image of the periodic structure is foamed and detected while illuminating the structure with a second beam of radiation. The second image is formed using a second part of the non-zero order diffracted radiation which is symmetrically opposite to the first part in a diffraction spectrum. The ratio of the intensities of the measured first and second portions of the spectra is determined and used to determine the asymmetry in the profile of the periodic structure and/or to provide an indication of the focus on the substrate. In the same instrument, an intensity variation across the detected portion is determined as a measure of process-induced variation across the structure. A region of the structure with unwanted process variation can be identified and excluded from a measurement of the structure.
Owner:ASML NETHERLANDS BV

Arrangement and method for inspection of surface quality

The invention relates to a method for automatic inspection of the surface 20 of a moving object, in which a region on the object's surface is illuminated from at least two different illumination directions 13-15. The object's illuminated surface region is imaged with a camera to provide image information for analysis. The light sources in the different illumination directions 13-15 are pulsed to illuminate the object's surface region at different times, the pulsing frequency being >1 kHz The object's illuminated surface region is imaged as lines with a line scan camera 21 in sync with the above pulsing. The invention also relates to an arrangement for inspecting the surface 20 of a moving object, the arrangement comprising at least two light sources 10-12 in at least two different illumination directions 13-15 for illuminating the surface region of the object under inspection; a camera for imaging the object's surface region; and an image analyzer for analyzing the image information acquired from the object's surface 20 by imaging. The light sources 10-12 illuminate the object's surface 20 from the different illumination directions 13-15 at different times, and the camera is a line scan camera 21. The arrangement further comprises a timing controller 18 for synchronous pulsing of the light sources 10-12 and the at least one line scan camera 21, the pulsing frequency of the light sources 10-12 being >1 kHz.
Owner:THERMO RADIOMETRIE +1

Dual probe test structures for semiconductor integrated circuits

Disclosed is a semiconductor die having an upper layer and a lower layer. The die includes a lower test structure formed in the lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end, wherein the first end is coupled to a predetermined voltage level. The die also has an insulating layer formed over the lower metal layer and an upper test structure formed in the upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure, and the upper metal layer being formed over the insulating layer. The die further includes at least one probe pad coupled with the upper test structure. Preferably, the first end of the lower test structure is coupled to a nominal ground potential. In another implementation, the upper test structure is a voltage contrast element. In another embodiment, a semiconductor die having a scanning area is disclosed. The semiconductor die includes a first plurality of test structures wherein each of the test structures in the first plurality of test structures is located entirely within the scanning area. The die includes a second plurality of test structures wherein each of the test structures in the first plurality of test structures is located only partially within the scanning area. The first plurality of test structures or the second plurality of test structures has a probe pad coupled to at least one test structure.
Owner:KLA TENCOR TECH CORP

Simultaneous multi-spot inspection and imaging

A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. For patterned surface inspection, a cross-shaped filter is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface. In another embodiment, different portions of the same objective may be used for focusing the illumination beams onto the surface and for collecting the scattered radiation from the illuminated spots simultaneously. In another embodiment, a one-dimensional array of illumination beams are directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.
Owner:KLA TENCOR TECH CORP
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