312 results about "Reticle" patented technology

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field for each of the pattern areas of the test reticle is recovered based on the acquired images from each pattern area of the test reticle. A lithography model is applied to the reticle near field for the test reticle to simulate a plurality of test wafer images, and the simulated test wafer images are analyzed to determine whether the test reticle will likely result in an unstable or defective wafer.

An inspection device for a sub-element of a reticle pod comprises a carrier platform, a light source module, a camera module and a control module. The light source module includes a coaxial light source and a height adjustment mechanism. The height adjustment mechanism is connected to at least one of the coaxial light source and the carrier platform. The camera module is connected to the coaxial light source and has a lens facing the carrier platform. The control module is signally connected to the camera module and the height adjustment mechanism. The control module controls the height adjustment mechanism to adjust a relative distance between the coaxial light source and the carrier platform. The inspection device for a sub-element of a reticle pod performs optical inspection on the sub-element of a reticle pod.

The invention discloses a mask pattern repairing method, device and product, and relates to the technical field of semiconductor integrated circuits. The mask plate graph repairing method comprises the following steps: carrying out photoetching simulation on a mask plate graph by adopting a photoetching model to obtain a prediction graph corresponding to the mask plate graph; performing photoetching rule inspection on the prediction graph to obtain the position and the type of a defect point violating a photoetching rule in the prediction graph; according to the position of the defect point, determining a to-be-repaired area of the defect point on the mask plate graph; identifying a pattern edge in the to-be-repaired area, and calculating the influence degree of the position change of the pattern edge on the geometric deviation between the predicted pattern and the design layout by adopting the photoetching model; determining an adjustment parameter of the graph edge according to the type and the influence degree of the defect point; and adjusting the pattern edge according to the adjustment parameter to obtain a repaired mask plate pattern. According to the method, the defects in the mask plate graph can be repaired more efficiently.

The invention discloses a shape perception optical proximity effect correction method and device, a storage medium and electronic equipment, and the method comprises the steps: obtaining an original design layout; performing CMP simulation on the original design layout to generate wafer morphology data; constructing a coupling optical model based on the EUV three-dimensional mask model and the wafer morphology data; performing layout decomposition on the design layout according to a multi-patterning process rule to obtain at least two mask plate patterns; a coupling optical model is adopted to carry out collaborative morphology perception optical proximity effect correction on the at least two mask plate graphs, and at least two corrected mask plate graphs are obtained; wherein when the current mask pattern is corrected, the adopted optical proximity environment comprises a historical mask correction result generated based on the coupling optical model. According to the invention, the imaging precision of advanced process nodes can be improved.

A reticle pod having a transparent window and a manufacturing method thereof, in which, the reticle pod includes a first housing, a second housing, a transparent window member, and a thermoplastic sealing material. The first housing is configured to mate with the second housing and the two define an accommodation space for receiving a reticle. The first housing includes a window formed therethrough for exposing the reticle. The transparent window member is disposed at the window to allow a light to pass through and reach the reticle. The thermoplastic sealing material is disposed between the first housing and the transparent window member and surrounds the transparent window member, thereby forming an airtight seal between the transparent window member and the first housing.

The invention provides a mask layout generation method based on a reverse photoetching technology and a related product. The generation method comprises the following steps: performing reverse simulation on an integrated circuit target layout by using a light intensity calculation model to obtain a corresponding target light intensity distribution diagram; obtaining a target mask layout by using a preset generative adversarial network and taking the target light intensity distribution diagram as real data; the preset generative adversarial network is provided with a generator, a photoetching simulation model and a discriminator; and carrying out local optimization on the target mask layout to obtain an optimized target mask layout. According to the generation method, the target mask layout is generated by taking the target light intensity distribution diagram as real data, and through the processes of layout generation, photoetching simulation, updating iteration and verification evaluation, the generation and optimization speed of the mask layout is improved, and the pattern fidelity of the mask layout is improved.

The utility model mainly relates to the mask technology field especially, and particularly to mask clamping device and mask measuring equipment, wherein, mask clamping device includes installation base, clamping subassembly includes four clamping subassembly, four clamping subassembly jointly enclose and form the accommodation space, clamping subassembly can move up and down relative to installation base, clamping subassembly includes telescopic structural member, clamping structural member and elastic buffer, clamping structural member still includes the clamping part for abutting mask side and the horizontal setting and is used for the support of mask's support plate, the elastic buffer is located between the movable end with clamping structural member, detection subassembly is used for detecting whether mask is in horizontal state. Based on the structure design of the utility model, this mask clamping device can clamp the mask of non-standard size, and let mask measuring equipment can also measure the mask of non-standard size.

The invention relates to the technical field of photoelectric detection, in particular to a photocurrent imaging system based on a probe station and an electrometer. The system generates a focused detection light beam through a light path system, the focused detection light beam irradiates a sample carried by a probe station after being spatially modulated by a mask plate, weak light current signals generated by the sample are collected by an electrometer, and a high-resolution light current distribution image is generated by combining scanning motion of a high-precision electric control displacement platform and intelligent processing of computer software. A physically-driven signal enhancement model, a multi-dimensional noise suppression algorithm and a dynamic imaging optimization formula are innovatively designed, the problems that in the prior art, weak light current detection precision is low, the scale connection error is large, and imaging efficiency is insufficient are solved, accurate quantitative analysis of the photoelectric characteristics of materials is achieved, and the method is suitable for popularization and application. The method is suitable for semiconductor device research and development, solar cell performance evaluation, biosensor detection and other scenes, and has both detection precision and application flexibility.

This application discloses an assembly and adjustment device for a pulse broadening unit, comprising: a visible light source device, a pulse broadening unit, a phase delay element, a linear polarizer, and a reticle; the pulse broadening unit includes a beam splitter and a mirror assembly; the output beam from the visible light source device is incident on the beam splitter; the beam splitter splits the received output beam into a first reflected beam and a transmitted beam; the first reflected beam, after passing through a reflective lens assembly, is incident on the exit surface of the beam splitter, and after being reflected by the exit surface, it illuminates the reticle together with the transmitted beam; the linear polarizer is disposed in the optical path from which the transmitted beam exits, and the angle between its transmission direction and the polarization direction of the transmitted beam transmitted from the beam splitter satisfies the following condition: eliminating part of the energy of the transmitted beam; the phase delay element is disposed in the optical path before the first reflected beam is incident on the exit surface of the beam splitter, and is used to rotate the polarization direction of the first reflected beam by the same angle.

This invention relates to the field of circuit production line technology and discloses an automatic transfer system for integrated circuit production lines, addressing the technical problems of low transfer efficiency and poor space utilization in existing technologies. The system includes: a three-dimensional storage scheduling module located on one side of the production line, used to store wafer cassettes or photomasks and generate material release instructions according to the production cycle; a vertical conveying system located below the storage module, used to transport materials from a first plane where the three-dimensional storage is located to a second plane flush with the cleanroom floor; and a horizontal conveying system located on the second plane, used to receive materials and complete automatic handover with the production equipment. This application enables fully automated transportation of materials from three-dimensional storage to the production equipment without manual intervention, significantly reducing labor costs and improving the automation level of the production line and the utilization rate of storage space.

A system for cleaning a jig of a lithographic apparatus in situ, the system comprising: a body configured to be inserted into the lithographic apparatus and engaged with the jig, where a cleaning feature is disposed on a jig-facing surface of the body; a moving system of the clamp; and a control system; wherein the control system is configured to: control the clamp to engage the body with the clamp using a first clamping force; controlling the movement system to move the clamp in an oscillating movement with application of a first clamping force, wherein the first clamping force substantially prevents relative movement between the cleaning feature and the clamp; and controlling the clamp to change the first clamping force to a second clamping force, the second clamping force being weaker than the first clamping force such that relative movement between the cleaning feature and the clamp occurs in response to the oscillating movement.

1. Name of the product in this design: Line Marker (JH-MAX2). 2. Application of this design: Laser level for marking lines in buildings, decorations, and equipment installations. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The present invention provides an inner-focus type aiming scope and rifle scope in which the focal length of the objective lens system does not change even when the focusing lens group is moved. [Solution] An inner-focus type aiming scope 10 and rifle scope, which have an objective lens system 21 having a fixed lens group 21a fixed from the object side and a focus lens group 21b movable in the optical axis direction Od, are characterized in that the focal length of the fixed lens group 21a is set to infinity, and the incident direction of the light beam Lt incident from the fixed lens group 21a to the focus lens group 21b is parallel to the optical axis direction Od. As a result, the focal length of the objective lens system 21 can be kept constant regardless of the distance to which the focus lens group 21b is moved and focused on, and the scale size of the reticle and the amount of angle change to compensate for the effects of gravity, wind, etc. can be kept constant whether the focus is set to a long distance or a short distance.

An exposure apparatus comprises a first object support configured to support a first object (e.g. a reticle) and a second object support configured to support a second object (e.g. a reticle). The first and second object supports are movable relative to an illumination region. In some embodiments, imaging optics of the exposure apparatus may be anamorphic (i.e. having a reduction factor of the image(s) that is different in two different directions. In some embodiments, a gap between the first object support and the second object support may be sufficiently small that a single object may be partially supported by the first object support and partially supported by the second object support. An exposure method is disclosed in which an image is formed of each of two objects (reticles) during a single scanning exposure process.

This invention provides a processing system and method for improving the critical dimension uniformity of wafers. The processing system includes an exposure module for exposing a monitoring pattern to an effective pattern area on a photomask; a detection module for acquiring dimensional deviation data of the monitoring pattern and detecting the dimensional deviation data to ensure that the dimensional deviation data is within a preset range; and a photolithography module for transferring the pattern on the photomask to the wafer. The detection module is further used to measure critical dimensions on the wafer, acquiring measurement data at different locations within each exposure area on the wafer. The photolithography module is used to adjust the required exposure dose for the exposure area based on the measurement data to improve the critical dimension uniformity of the wafer. The processing system and method for improving the critical dimension uniformity of wafers provided by this invention can improve the critical dimension uniformity of wafers.

A reticle inspection and purging method comprises following steps. A first reticle is moved from a first load port of a lithography tool to a reticle inspection tool located outside the lithography tool. The first reticle is inspected using the reticle inspection tool located outside the lithography tool. Whether the first reticle is acceptable for exposure is determined based on the inspection result. In response the determination determines that the first reticle is not acceptable for exposure, the first reticle is purged.

An apparatus monitoring semiconductor manufacturing equipment includes an optical detector, a light generator generating light along an optical path towards a semiconductor substrate, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, in which the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light sequentially passing through the first slits and the third slits, and the second pattern corresponds to a second portion of light sequentially passing through the second slits and the third slits.

Embodiments herein describe methods, devices, and systems for a reticle stage provided with an electrostatic clamp. The disclosure provides an electrostatic clamp system for holding an object by electrostatic clamping force, the clamp system comprising a clamp provided with a plurality of burls to support the object and at least one electrode configured to generate the electrostatic clamping force, and a controller connectable to the at least one electrode and configured to vary the electrostatic clamping force dependent on acceleration of the clamp.

The application discloses a robot gripper device compatible with a photomask and a photomask box, relates to the technical field of semiconductor automation equipment, and improves the problems of complex equipment structure, low space utilization and high operation and maintenance cost caused by the separation of the photomask and the photomask box taking and placing functions in the prior art.The robot gripper device comprises a base, a driving mechanism, a photomask taking and placing unit and a photomask box taking and placing unit, the base is sequentially provided with a first rotating arm and a second rotating arm from bottom to top, and the second rotating arm is rotationally provided with a mounting plate at the end portion; the photomask taking and placing unit is arranged on one side of the mounting plate and comprises a first gripper; the photomask box taking and placing unit is arranged on the other side of the mounting plate and comprises a second gripper; the first gripper and the second gripper are both provided with telescopic extension arm assemblies; the driving mechanism drives the first rotating arm and the second rotating arm to move cooperatively, so as to drive the mounting plate to rotate and switch, and the working states of the two taking and placing units are controlled; and the application has the effects of being compatible with taking and placing of two workpieces, simplifying the equipment structure, saving space and reducing cost.

The present application relates to a kind of parallel positioning device of photo mask edge cleaning equipment, including mounting bracket, two sliding range finding mechanisms, strip nozzle and rotary drive mechanism;Two sliding range finding mechanisms are located in the two sides of the mounting bracket, including sliding piece on the mounting bracket and the range finding sensor for measuring the distance between it and calibration piece and installed on the sliding piece;The middle position of strip nozzle is rotatably installed on the mounting bracket, and each end is connected with a sliding piece by a linkage mechanism, and the sliding piece is driven to slide by the linkage mechanism in the process of rotating the strip nozzle;Rotary drive mechanism is installed between the mounting bracket and the strip nozzle, for driving the strip nozzle to rotate to the position that the distance measured by two range finding sensors is equal.The present application can conveniently position the strip nozzle in parallel.

A display module (1000) and a driving method thereof, a display panel, a window and a vehicle, the display module (1000) comprising: a substrate (101), an electrochromic structure (100) and a touch structure (200), both the electrochromic structure (100) and the touch structure (200) being disposed on the substrate (101). The electrochromic structure (100) comprises a first control electrode (110), a second control electrode (120) and an electrochromic layer (130), the first control electrode (110) and the second control electrode (120) are oppositely arranged, and the electrochromic layer (130) is arranged between the first control electrode (110) and the second control electrode (120); at least one of the first control electrode (110) and the second control electrode (120) is multiplexed as a touch electrode of the touch structure (200). The electrochromism structure (100) and the touch control structure (200) share at least one electrode, the electrochromism active peep-proof effect can be met while the touch control function is met, meanwhile, no additional mask is needed in the manufacturing process, and the productivity is basically not affected.

An inspection system includes a stage for positioning a substrate to be inspected, one or more reticle-based diagnostic targets positioned on the stage, and a reticle inspection sub-system having a field of view encompassing the stage. The system includes a controller configured to move the field of view between portions of the stage to selectively perform substrate and run time diagnostics (RTD) of predefined image quality metrics. In embodiments, the system may be an APMI system for EUV mask inspection and the diagnostic targets may be EUV reticle-based diagnostic targets having predefined EUV performance patterning. In embodiments, the diagnostic targets may be positioned adjacent to the mask to be inspected to permit contiguous scanning to perform inspection and RTD.

The invention discloses a pattern etching device and a pattern etching method used in a vacuum environment. The pattern etching device comprises a shell, a bearing seat, a mask plate mechanism and an ion beam source, a working cavity is formed in the shell, a communicating opening is further formed in the shell, and the working cavity is communicated with the outside through the communicating opening; the bearing seat is mounted in the working cavity of the shell; the mask plate mechanism comprises a hard mask plate located in the working cavity and a connecting piece connected with the hard mask plate, the connecting piece penetrates out of the working cavity of the shell and is movably connected with the shell, the hard mask plate is located above the bearing seat, and a through hole is formed in the hard mask plate; the ion beam source is installed in the shell, the ion beam source can emit plasma to the sample support of the bearing seat, and the through hole of the hard mask plate is located on the emission path of the plasma. The device can etch the sample in a vacuum environment, and is suitable for vacuum interconnection equipment.

A design method of a Gibbs-Wulff optical vortex array mask plate, steps are as follows: obtaining an electric field expression of a Gibbs-Wulff optical vortex array, combining the amplitude, phase of the Gibbs-Wulff optical vortex array with a blazed grating, obtaining a complex transmittance function of the Gibbs-Wulff optical vortex array mask plate, and the mask plate described based on the complex transmittance function is the Gibbs-Wulff optical vortex array mask plate. The present application utilizes the principle of computer holography, and obtains the amplitude modulation phase mask plate of the Gibbs-Wulff optical vortex array through computer coding, so that the Gibbs-Wulff optical vortex array with controllable boundary and controllable structure and arrangement mode in the boundary can be generated. Thus, the present application has important application value in the fields of particle manipulation and optical micro-machining.

One or more embodiments of the present disclosure describe an artificial intelligence assisted substrate defect repair apparatus and method. The AI assisted defect repair apparatus employs an object detection algorithm. Based on the plurality of images taken by detectors located at different respective positions, the detectors capture various views of an object including a defect. The composition information as well as the morphology information (e.g., shape, size, location, height, depth, width, length, or the like) of the defect and the object are obtained based on the plurality of images. The object detection algorithm analyzes the images and determines the type of defect and the recommends a material (e.g., etching gas) and the associated information (e.g., supply time of the etching gas, flow rate of the etching gas, etc.) for fixing the defect.

A manufacturing and test methodology for Zetta-scale computing engines is disclosed. The system employs a reticle-sized MEMS probe card to sequentially verify the electrical continuity of passive interconnects on a Wafer-Scale Silicon Circuit Board (WSSCB) prior to component assembly. By stepping across the wafer and testing one module at a time, the apparatus generates a defect map of the substrate's high-density wiring without the need for full-wafer probing or active powering. Following verification, Known Good Die (KGD) stacks—comprising Logic and HBM—are attached to the valid sites of the WSSCB via micro-bonding. This "step-and- repeat" verification strategy ensures high manufacturing yield for the complex all-silicon domain assembly.

The invention discloses a technology for double-sided photoetching of a small-size device, and belongs to the technical field of photoetching. According to the technology, fixing and photoetching assistance of a small-size device are achieved through a mold, a hollow area is arranged in the middle of a body of the mold and used for containing a to-be-photoetched device, and four columnar digging holes are formed in the periphery of the body and used for fixing the mold during photoetching; during operation, a solid medium is introduced into the hollow area of the mold to fix the device, then the fixed device and the upper and lower surfaces of the mold are smoothed, then the position, needing photoetching, on the device is determined through a test instrument, a mask plate is manufactured according to the position, and double-surface photoetching operation is completed. According to the technology, by integrating mold structure design and coherent operation processes, the small-size device can be stably fixed, the surface smoothness is guaranteed, the accuracy of the photoetching position and the consistency of double-sided photoetching are effectively improved, and the technology is suitable for efficient and accurate double-sided photoetching of the small-size device.

1. The name of the design product: graphical user interface of menu function interaction of electronic device. 2. The use of the design product: an electronic device. 3. The design points of the design product: the part of graphical user interface in the electronic device. 4. The picture or photo that best shows the design points: design 1 front view. 5. The electronic device of design 1-design 10 is the usual design, and other views of design 1-design 10 are omitted. 6. Design 1 is designated as the basic design. 7. Purpose of the Graphical User Interface: The product interfaces in Designs 1-10 serve as the interface for displaying and interacting with the infrared thermal imaging menu functions; in Designs 1 and 6, the main view interface is the interactive interface for setting the reticle; in the main view interface, rotating the up knob to "Reticle Type 2" displays interface change state diagram 1; in interface change state diagram 1, rotating the up knob to "Reticle Type 3" displays interface change state diagram 2; in interface change state diagram 2, rotating the right knob to "Reticle Color Black" displays interface change state diagram 3; in interface change state diagram 3, rotating the right knob to "Reticle Color Red" displays interface change state diagram 4; in interface change state diagram... In interface 4, rotating the right knob to "Dial Color Green" displays interface state change diagram 5; in Design 2 and Design 7, the main view interface is the interactive interface for dial settings; in the main view interface, rotating the left knob to "Display Settings" displays interface state change diagram 1; in interface state change diagram 1, rotating the up knob to "Screen Brightness 4" displays interface state change diagram 2; in interface state change diagram 2, rotating the up knob to "Screen Brightness 5" displays interface state change diagram 3; in interface state change diagram 3, rotating the right knob to "Picture-in-Picture - On" displays interface state change diagram 4; in Design 3 and Design 8, the main view interface is for image settings. Interactive Interface; In the main view interface, rotating the up knob to "Image Contrast 4" displays interface change state diagram 1; in interface change state diagram 1, rotating the right knob to "Weather Mode - Rain" displays interface change state diagram 2; In Designs 4 and 9, the main view interface is the interactive interface for interconnection functions; in the main view interface, rotating the up knob to "Wi-Fi - Off" displays interface change state diagram 1; in interface change state diagram 1, rotating the right knob to "Bluetooth - On" displays interface change state diagram 2; in Design 5, the main view interface is the interactive interface for gun type settings; in the main view interface, rotating the up knob to "Gun Type Selection B" displays interface change state diagram 2. The interface changes as shown in Figure 1. In Figure 1, rotating the up knob to "Gun Type Selection C" displays Figure 2. In Figure 2, rotating the right knob to "Impact Recording - On" displays Figure 3. In Design 10, the main view interface is the interactive interface for gun type settings. In the main view interface, rotating the up knob to "Gun Type Selection SE" displays Figure 1. In Figure 1, rotating the up knob to "Gun Type Selection C" displays Figure 2. In Figure 2, rotating the right knob to "Impact Recording - On" displays Figure 3. 8. Other situations requiring explanation: Other explanation: Designs 6-10, the designs for which protection is sought include color.

The application discloses a topography-aware optical proximity correction method and device, a storage medium and an electronic device. The topography-aware optical proximity correction method comprises the following steps: obtaining an original design layout; performing CMP simulation on the original design layout to generate wafer topography data; constructing a coupled optical model based on an EUV three-dimensional mask model and the wafer topography data; decomposing the layout of the design layout according to multi-graphic patterning process rules to obtain at least two mask layout; and performing collaborative topography-aware optical proximity correction on the at least two mask layout by using the coupled optical model to obtain at least two corrected mask layout; wherein when the current mask layout is corrected, the optical proximity environment used includes historical mask correction results generated based on the coupled optical model. The application can improve the imaging accuracy of advanced process nodes.

Embodiments of the present application disclose a lens device, an electronic device, a method for manufacturing the lens device, and a mask plate. Embodiments of the present application can be applied to electronic devices in different application scenarios. The variable-focus flexible lens device includes a transparent film body made of a light-induced modulus control material. The film body has a lens portion for forming a lens. The elastic modulus of the lens portion is configured to increase or decrease from the center to the periphery. The lens portion can produce corresponding deformation to form a lens with good structural compatibility. In practical applications, on the basis of not affecting the existing main structure of the electronic device, on the one hand, the space occupied in the optical axis direction during the focusing process can be reduced, and the product manufacturing cost can be effectively controlled during the adjustment of the focal length error.