1results about How to "Accurate exposure" patented technology

The application discloses a wafer cutting path exposure method and system based on LDI, and belongs to the field of exposure equipment. In order to adapt the LDI equipment to the production of wafers, the application provides a generation method of a wafer pattern to be exposed to a cutting path, the layout of the whole wafer can be obtained based on a mask pattern provided by a customer, so that the exposure pattern of the wafer cutting path can be directly generated in exposure software. In addition, a positioning method based on mark points in multiple shots is provided, and the positioning information can be changed in real time, thereby saving time. Based on the generated wafer pattern to be exposed and the positioning method, the cutting path position can be exposed accurately and efficiently through the LDI equipment. The application aims to expose the gap between the smallest units Die of the wafer (i.e. the position to be cut), form a difference in layers between the cutting path and the chip, so that the probability of collapse can be greatly reduced when cutting in the later stage.