Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

35030 results about "Liquid phase" patented technology

Liquid phase (plural liquid phases) (physics) One of the three fundamental structural phases of matter in which the thermal mobility of molecules or atoms is comparable with the cohesiveness, having them connected but fluid in a mass.

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:IBM CORP

Device and technique for producing cyclohexane by benzene hydrogenation

The invention discloses a device and technique for producing cyclohexane by benzene hydrogenation. The device for producing cyclohexane by benzene hydrogenation comprises a reactor, a superfine bubble generator and a bubble breaker, wherein the reactor is provided with a first containing cavity; the wall of the first containing cavity is provided with a feed port, a circulation discharge port, a circulation return port and a gas phase outlet; the superfine bubble generator is provided with a second containing cavity; the wall of the second containing cavity is provided with a return port and a gas phase outlet; the return port of the superfine bubble generator communicates with the circulation return port of the reactor; the bubble breaker is arranged in the second containing cavity; the bubble breaker is provided with a gas phase inlet and a liquid phase inlet which communicates with the circulation discharge port of the reactor; and the gas phase inlet of the bubble breaker communicates with the gas phase outlet of the reactor. The device disclosed by the embodiment of the invention has the advantages of high mass transfer efficiency, high reaction rate, short reaction time, low material consumption and energy consumption, simple structure, low manufacturing cost and low maintenance cost.
Owner:NANJING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products