An integrated cleaning and liquid supply device and online cleaning method for
polyurethane polishing pads are disclosed. The device includes a base, a rotating seat, a swing arm, an independent liquid supply pipeline
system and cleaning pipeline, a high-pressure
nozzle array, and a positioning sensor
assembly. During the
polishing stage,
polishing liquid is dripped through the liquid supply outlet. During the cleaning stage, the swing arm moves centripetally to a preset position aligned with the center of the polishing pad. The positioning sensor triggers a high-pressure pump, causing pure water to be sprayed as an atomized jet along the
diameter of the pad surface through the high-pressure
nozzle array. Simultaneously, the polishing pad rotates at a
low speed, utilizing the synergistic effect of
centrifugal force and high-pressure
water flow to thoroughly remove residual contaminants within the micropores of the
polyurethane. This invention integrates liquid supply and deep cleaning functions into the same motion mechanism, eliminating the need for
machine shutdown or manual intervention. It offers advantages such as non-contact, non-destructive, thorough cleaning, and high
automation, extending the life of the polishing pad and improving the stability of the CMP process.