59 results about "Resist" patented technology

The present invention provides a display device and a method for manufacturing the display device. A metal layer is formed on a highly light-transmissive substrate; a resist mask having an opening pattern is formed on the metal layer; exposed portions of the metal layer is etched away in this state to form openings; then the resist mask is removed; and a surface of the metal layer and an inner side wall of each of the openings are oxidized to form a metal oxide layer. Thus, a front surface and a rear surface of the aperture plate are caused to have different reflectances. The oxide layer is formed at the same time as when the resist mask is ashed to remove resist.

To provide a resist composition good in all of sensitivity, CDU and resolution, a resist pattern forming method using the resist composition, and a compound used in the resist composition.SOLUTION: The resist composition contains a compound containing a cation (C0) represented by formula (c0) (where Z+ represents S+ or I+; Ar1, Ar2 and Ar3 represent aromatic rings; I represents an iodine atom; Rz11, Rz21 and Rz31 represent C1-5 alkyl groups; and lz1, lz2, lz3, mz1, mz2, mz3, nz1, nz2 and nz3 represent integers of 0 or more, provided that at least one of lz1, mz1 and nz1 represents an integer of 1 or more and at least one of lz2, mz2 and nz2 represents an integer of 1 or more).SELECTED DRAWING: None

To provide a resist removal method that addresses technical issues of traditional resist removers, and enables treatment to be conducted in a short period while leaving no resist residue and minimizing damage to the target structure, as well as a structure manufacturing method that uses the method.SOLUTION: A structure manufacturing method is characterized by using two or more treatment liquids sequentially to remove a resist having a thickness of 50 μm or more.SELECTED DRAWING: None

The present invention provides a method for removing edge beads on a wafer associated with a resist coating containing a metal-containing resist composition. [Solution] In a corresponding apparatus for processing a wafer, the method comprises the step of spin-coating a wafer 150 with a metal-based resist composition 158, and then applying a first bead edge rinse solution along the wafer edge. The edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or in addition, the method comprises the step of applying a protective composition 154 to the wafer 150 before performing the edge bead rinse. The protective composition is a sacrificial material or an anti-adhesion material and is applied only to the wafer edge, or, in the case of a protective composition, over the entire wafer.

This invention relates to an etching method. The etching method of this invention includes: a resist pattern forming step, in which a resist pattern is formed on a workpiece by a resist layer made of resin; an etching step, in which the workpiece is etched through the resist layer having the resist pattern; and a resist protective film forming step, in which a resist protective film is formed on the resist layer. The etching step is repeated multiple times. After the etching step is repeated multiple times, the resist protective film forming step is performed.

The invention provides a technique for adjusting the exposure sensitivity of a resist film. A substrate processing method is provided. The method includes: a step (a) of providing a substrate (ST1) having a base film; and a step (b) in which a metal-containing resist film (ST2) is formed on the base film. The step (b) includes: a step (b1) in which a first resist film (ST21) containing a metal is formed on the base film; and a step (b2) for forming, on the first resist film, a second resist film (ST22) containing a metal at a composition ratio different from that of the first resist film.

To form a resist pattern having good CD uniformity (CDU).SOLUTION: An acid generator contains a salt represented by formula (I).SELECTED DRAWING: None

The present invention provides a resist composition and a resist pattern formation method, whereby a resist pattern having excellent CDU, sensitivity, and resolution with which it is capable of reproducing a pattern with fine dimensions can be formed. The present invention relates to a resist composition that generates an acid by exposure to light, and that exhibits a change in solubility to a liquid developer through the action of the acid. The resist composition contains a base material component (A1) that exhibits a change in solubility to the liquid developer through the action of the acid, and an acid generating agent component (B) that generates the acid by exposure to light. The acid generating agent component (B) includes a compound represented by general formula (b-1) disclosed in the description.

To provide a compound, a resin, and a resist composition which allow a resist pattern having a good pattern collapse margin to be produced.SOLUTION: The resist composition contains a compound represented by formula (I) or a resin containing a structural unit represented by formula (IP).SELECTED DRAWING: None

Manufacture resist patterns with good CD uniformity (CDU). [Solution] An acid generator containing a salt represented by formula (I). JPEG2026136094000191.jpg38170

The present application relates to a resist composition, a laminate, and a pattern forming method. The present application provides a resist composition which is excellent in sensitivity, resolution, and LWR, and is also easy to stably handle in optical lithography using a high-energy ray, a laminate including a resist film obtained from the resist composition, and a pattern forming method using the aforementioned resist composition. The means for solving the problem is a resist composition characterized by comprising a metal complex represented by the following general formula (1) and a solvent.[Chemical Formula 1]

A method for manufacturing a wiring board includes, in the stated order: a step of forming a resist layer 3 on a metal layer 20 provided on a support 1; a step of forming a pattern, including an opening 3A through which the metal layer 20 is exposed, on the resist layer 3 by exposure and development of the resist layer 3; a step of forming a copper plating layer 21 on the metal layer 20 exposed within the opening 3A by electrolytic plating; a step of removing the resist layer 3; a step of filling at least a part of an opening void 21A opening at a surface of the copper plating layer 21; and a step of removing an exposed part of the metal layer 20 by etching.

The present invention employs a resist composition that generates an acid through exposure to light to undergo a change in solubility with respect to a developer by means of the action of the acid, and that contains a compound represented by formula (d0) and a base material component that undergoes a change in solubility with respect to a developer by means of the action of an acid. In formula (d0), Rd1 represents an alkyl group. k represents an integer of 2 or more. h represents an integer of 0 or more. Rd0 represents a substituent. j represents an integer of 0 or more. Here, 5+2h≥j+k is satisfied. If h is 0, k represents an integer of 2-5, and, if h represents an integer of 1 or more, k is 2 or 3. m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation. With the resist composition, high sensitivity can be achieved and lithographic properties such as resolution and dimensional uniformity can be enhanced when forming a resist pattern.

To provide an acid generator and a resist composition which allow a resist pattern having good CD uniformity to be produced.SOLUTION: There are provided: an acid generator containing a salt represented by formula (I) or a structural unit represented by formula (IP); and a resist composition.SELECTED DRAWING: None

The present invention provides: a resist composition which ensures high sensitivity and from which a resist pattern having good roughness-reducing properties can be formed; and a resist pattern forming method using said resist composition. The present invention relates to a resist composition which generates an acid when exposed and of which the solubility in a developer changes due to the action of the acid, the resist composition comprising: a main material component (A) of which the solubility in a developer changes due to the action of an acid; an acid generator component (B) that generates an acid when exposed; a first acid diffusion control component (D1); and a second acid diffusion control component (D2), wherein the acid generator component (B) includes a compound represented by general formula (B1-1) disclosed in the specification, the first acid diffusion control component (D1) includes a compound represented by general formula (d1-1) or (d1-2) disclosed in the specification, and the second acid diffusion control component (D2) includes a compound represented by general formula (d2-1) disclosed in the specification.

Lithographic patterning method for creating features on a surface of a substrate, including the steps of: applying a resist material to the surface; performing resist processing steps, including at least: selectively exposing the resist material layer to a surface treatment step, wherein the resist material in the exposed locations is chemically modified; and developing the resist material layer to selectively remove the resist material locally. The method further comprises detecting, during or after the resist processing steps, a chemical modification of the resist material for monitoring or evaluating the processing steps. The step of detecting is performed by scanning the surface using a scanning probe microscopy device, and wherein the scanning includes contacting the surface with the probe tip in a probing area. The probing area coincides with at least one location of the exposed locations and non-exposed locations, for detecting the chemical modification. The document further describes a system.

There is a need for technology that can manufacture resist patterns with good CD uniformity (CDU). [Solution] A resist composition containing a carboxylate salt represented by formula (I). JPEG2026093365000205.jpg23170

The present invention provides a deposition mask manufactured in combination of an etching method and a plating method, a manufacturing method thereof, and a deposition mask assembly including the same. The deposition mask manufacturing method includes the steps of forming a resist on a first surface and a second surface of a metal plate, leaving a plurality of first resist patterns on the second surface, forming a plating layer on a remaining portion except for the portion where the first resist patterns are left, leaving a plurality of second resist patterns on the first surface, etching a remaining portion except for the portion where the second resist patterns are left, and peeling off the first resist patterns and the second resist patterns.

To provide a resist composition which achieves higher sensitivity and can form a resist pattern with good roughness reduction, and a resist pattern forming method using the resist composition.SOLUTION: A resist composition generates an acid upon exposure, changes its solubility in a developer by the action of an acid, and contains: a base component (A) which changes its solubility in a developer by the action of an acid; an acid generator component (B) which generates an acid upon exposure; a first acid diffusion control component (D1); and a second acid diffusion control component (D2). The acid generator component (B) contains a compound represented by a general formula (b1-1) described in the specification, the first acid diffusion control component (D1) contains a compound represented by a general formula (d1-1) or (d1-2) described in the specification, and the second acid diffusion control component (D2) contains a compound represented by a general formula (d2-1) described in the specification.SELECTED DRAWING: None

To provide a resist composition from which a resist pattern having good CD uniformity can be produced.SOLUTION: A resist composition contains: an acid generator containing a salt represented by a formula (I); and a resin containing a structural unit represented by a specific formula and a structural unit having an acid-labile group. [In the formula (I), X represents an S atom or an I atom; and AI- represents an organic anion.]SELECTED DRAWING: None

Provided is a method for manufacturing a master mold for imprint, with which it is possible to form a structure having a desired regular tapered shape on a base material. Comprises: a coating step for coating a resist (3) having a predetermined film thickness on a substrate (1); an exposure step in which the resist (3) coated on the substrate (1) is exposed via a mask (4); and a developing step in which the exposed resist (3) is developed, and in the exposure step, the exposure amount is set to be two times or less of the minimum exposure amount (Df) for sensitizing the total thickness of the resist (3) coated on the substrate (1), and a predetermined portion of the resist (3) is exposed. The side surface of the structure (2) composed of the resist (3) formed by the development in the development step has a positive tapered shape.

To provide a resist composition and a method for forming a resist pattern, capable of forming a resist pattern that simultaneously achieves resolution enabling reproduction of a fine-dimension pattern, good sensitivity, and good CDU.SOLUTION: A resist composition generates an acid upon exposure and exhibits a change in solubility in a developing solution by the action of the acid, the resist composition comprising a base material component (A1) that exhibits a change in solubility in the developing solution by the action of the acid and an acid generator component (B) that generates an acid upon exposure, wherein the acid generator component (B) includes a compound represented by general formula (b-1) described in the specification.SELECTED DRAWING: None

To provide a resist composition capable of forming a resist pattern with sufficient resolution and exposure margin, a method for producing a resist pattern using the resist composition and a method for producing a plated article.SOLUTION: Provided is a resist composition containing a resin (A1) having acid-labile structural units, a photosensitizer (I), and a photoacid generator (B), wherein the photoacid generator (B) includes a compound whose maximum molar absorption coefficient in the wavelength range of 355 to 375 nm is 6000 (L / (mol cm)) or less, wherein the content of the photosensitizer (I) is 10% by mass or less based on the solid content of the resist composition, and when a film is formed using the resist composition at a use thickness, the minimum transmittance of radiation in the wavelength range of 355 to 375 nm in the film is 23% or more. Provided are a method for producing a resist pattern, and a method for producing a plated structure.SELECTED DRAWING: None

The resist composition comprises a metal complex containing a metal, typically zinc and a specific ligand exhibits a high sensitivity, high resolution and improved LWR when processed by photolithography. The composition is stable during storage and easy to handle. The resist composition comprises a metal complex containing a metal atom and a ligand having the formula (1a), (1b) or (1c). R1, R2, R3, R4, R5, R6 and R7 are each independently hydrogen, a C2-C20 hydrocarbylcarbonyl group which may contain a heteroatom, or C1-C20 hydrocarbyl group which may contain a heteroatom, *1 and *2 each designate a point of attachment to the metal atom.

To produce a resist pattern with good CD uniformity (CDU).SOLUTION: The acid generator contains a salt represented by formula (I).SELECTED DRAWING: None

A method for manufacturing a master mold for imprinting, with which structures formed in a desired forward taper can be formed on a base material. This method comprises a coating step in which a resist having a predetermined film thickness is coated on a base material, an exposure step in which the resist coated on the base material is exposed through a mas, and a development step in which the exposed resist is developed, the exposure step involving setting the exposure amount to be equal to or less than twice the minimum exposure amount (Df) at which the resist coated on the base material undergoes solarization across the entire thickness of the resist, and exposing predetermined portions of the resist, so that the side surface shape of the structure constituted of the resist formed by development in the development step is a forward taper.

A resist composition which generates an acid by exposure and whose solubility to a developer is changed by the action of the acid, contains: a base material component (A) whose solubility to a developer is changed by the action of the acid; and an ionic liquid (Z), the solid content concentration of the resist composition being 25 mass% or more.

The present invention provides: a compound capable of forming a resist pattern that simultaneously achieves a resolution with which it is possible to reproduce a pattern having fine dimensions, a good resist pattern shape, and an excellent DOF margin; an acid generator; a resist composition; and a method for forming a resist pattern. The present invention relates to a resist composition that generates an acid upon exposure to light, and that exhibits a change in solubility in a developing solution through the action of the acid. The resist composition contains a base material component (A) that exhibits a change in solubility in the developing solution through the action of the acid, and an acid generator component (B) that generates the acid upon exposure to light, wherein and the acid generator component (B) includes a compound represented by general formula (b-1) described in the specification.

The invention provides a method capable of improving uniformity of a plating film formed on a substrate, and a plating apparatus. A method sets, in a computer, an advancing / retreating operation scheme of a shield body in a plating apparatus provided with the shield body, the shield body being movable to a shielding position interposed between a surface to be plated of a substrate and an anode and to a retracted position retracted from between the surface to be plated of the substrate and the anode. The method comprises the following steps: acquiring an anti-corrosion pattern of the substrate; calculating a plating growth coefficient for each predetermined angle region of the substrate on the basis of the acquired resist pattern; and setting an advancing and retreating operation scheme of the shielding body on the basis of the calculated plating growth coefficient.

Provided is a resist composition which generates an acid upon exposure to light, and the solubility of which with respect to a developer solution is changed by the action of an acid. This resist composition comprises: a base material component (A), the solubility of which with respect to a developer solution is changed by the action of an acid; and a compound (B0) which is represented by general formula (b0). X0 represents a nitrogen atom or CRX0. Y0 represents a nitrogen atom or CRY0. Z0 represents a nitrogen atom or CRZ0. C represents a carbon atom. RX0, RY0, RZ0, and R0 each independently represent a hydrogen atom or a substituent. Two or more of RX0, RY0, RZ0, and R0 may be bonded to each other to form a ring structure. m is an integer of 1 or greater, and Mm+ represents an m-valent cation.