30results about How to "Reduce roughness" patented technology

This application discloses a method and apparatus for water-guided laser curve processing based on curvature adaptive variable voltage amplitude-frequency, relating to the field of water-guided laser processing technology. It includes: collecting curvature radius data at various points along the water-guided laser processing path; establishing a control mapping model between the curvature radius and deflection voltage parameters based on the curvature radius data; wherein the deflection voltage parameters include voltage amplitude and driving frequency; using the curvature radius of the current processing point as input, obtaining a target voltage amplitude and target driving frequency that match the curve characteristics corresponding to the current curvature radius through the control mapping model; converting the target voltage amplitude and target driving frequency into driving signals and outputting them to the deflection electrode array to dynamically adjust the deflection voltage parameters and control the water beam to complete deflection scanning processing along a preset curve trajectory. This solves the problems of mismatch between deflection response and curve geometry, large trajectory tracking errors, and poor surface quality consistency in existing curve processing technologies.

This invention belongs to the field of material surface treatment technology, specifically relating to a wafer polishing slurry, its preparation method, and its application. The wafer polishing slurry comprises abrasives, oxidants, dispersants, surfactants, pH adjusters, and water. The components of the wafer polishing slurry work synergistically, shortening polishing time and improving polishing efficiency when applied to wafer polishing. Furthermore, it significantly improves the surface quality of the polished wafer, markedly reducing scratches and defects, and lowering surface roughness to below 0.15 nm, thus meeting the surface quality requirements of fields such as power electronics and radio frequency devices.

The utility model discloses a kind of ceramic gas nozzle inner hole polishing device, comprising: pressurizing device, communicate with liquid supply end by pipeline, for pressurized conveying grinding liquid;Connecting fixture, communicate with pressurizing device by pipeline, for installing product to be polished;Wherein, multiple groups of product to be polished are detachably installed in the bottom of connecting fixture, so that the grinding liquid of liquid supply end is polished to the inner hole of product to be polished after flowing through connecting fixture by pressurizing device.The nozzle locking is installed in the bottom of connecting fixture in the utility model, and the grinding liquid with good proportion is input into pressurizing device, and then flows through connecting fixture by pipeline and enters the inner hole of required polishing component, by controlling the ligand of grinding liquid and adjusting the pressure of pressurizing device, the inner hole grain can be effectively removed, to effectively reduce the roughness of inner hole, and ensure the relative consistency of roughness, can effectively solve the problem of particle falling during use.

The utility model relates to a knife sharpening technical field, and disclose an automatic knife sharpening device, including the knife rest of installation for the knife edge part of cutting knife is used to the knife sharpening assembly of grinding, the knife sharpening assembly includes the electromagnet and the knife sharpening stone of knife rest installation through the knife sharpening support, the knife sharpening stone is opposite with the knife edge part of cutting knife and is adjusted the interval of both through the electromagnet, the utility model discloses the interval of the knife sharpening stone and cutting knife is adjusted through the electromagnet, when electrifying, electromagnet core drives push rod and makes the knife sharpening stone close to the knife edge, after power off, reset under the spring action, need not stop the machine to complete grinding, can greatly shorten the knife sharpening time to improve equipment utilization and processing efficiency, and then improve actual capacity, also avoid the body injury and the dust inhalation etc. safety hidden danger brought by manual stop operation simultaneously.

This invention discloses a machining process for precision screws, belonging to the field of mechanical manufacturing technology. It includes the following steps: S1, rough machining and forming: treating the surface of the bar stock and machining functional slot structures, followed by pre-deburring; S2, structural strengthening: heat-treating the workpiece for strengthening; S3, precision finishing: correcting the form and position tolerances of the heat-treated workpiece and precision grinding each surface; S4, quality assurance delivery: completing inspection, cleaning, and packaging. This process flow is clear, employing a logical arrangement of "forming first, then strengthening, and then fine-tuning," resulting in a workpiece with not only a high-hardness surface but also improved coaxiality of its stepped axis and thread trajectory accuracy. This significantly enhances the screw's operational stability at high speeds. Furthermore, through staged quality control and precision correction, it improves the first-pass yield of the workpiece and reduces the risk of scrap due to heat treatment deformation, possessing extremely high industrial application value.

The application relates to a processing method and a processing system for reducing the roughness of an inner hole, and the processing method comprises the following steps: S1, establishing a finite element model of contact between a rolling tool and a workpiece, wherein the rolling tool is provided with a roller, and the workpiece is provided with an inner hole; S2, performing a first simulation experiment to simulate the simulation roughness of the hole wall of the inner hole under different combinations of different interference amounts and different chamfer radii of the roller; S3, performing an offline experiment to measure the actual roughness of the hole wall of the inner hole of the workpiece under different combinations of different interference amounts and different chamfer radii of the roller, and the parameters of different interference amounts and different chamfer radii correspond to the same during the first simulation experiment and the offline experiment; S4, optimizing the finite element model based on the simulation roughness and the actual roughness; and S5, performing a second simulation experiment to simulate the simulation roughness of the hole wall of the inner hole under different combinations of different interference amounts and different chamfer radii of the roller.

This invention provides a method for processing a silicon plasma shunt disk, belonging to the technical field of silicon components for chip etching, including the following steps: S1, grinding the silicon plasma shunt disk blank to reduce its thickness to the final product thickness +1-2mm, parallelism to 0.09-0.15mm, and flatness to 0.05-0.11mm; S2, machining positioning holes, small holes, and other features on the silicon plasma shunt disk blank; S3, flipping the silicon plasma shunt disk blank and machining the reverse side features; S4, performing double-sided LAP grinding on the silicon plasma shunt disk blank with the features completed; S5, etching the ground silicon plasma shunt disk blank with mixed acid; S6, polishing the etched silicon plasma shunt disk blank with a polishing machine. This invention first processes the features of the silicon plasma distribution disk, then performs double-sided LAP grinding to remove the tool marks generated during processing, and finally, after etching and polishing, the roughness of the polished surface is lower than Ra0.05.

The application discloses a chemical mechanical polishing liquid and a polishing method for soft magnetic alloy. The polishing liquid is composed of the following raw material components in percentage by weight: 1.3wt%-1.8wt% of a chelating agent, 10wt%-13wt% of abrasive, 7wt%-9wt% of a pH buffer, 3wt%-3.5wt% of a corrosion inhibitor, 11wt%-13wt% of an oxidizing agent and the balance of deionized water. The abrasive is acidic silica sol, the oxidizing agent is hydrogen peroxide, the corrosion inhibitor is at least one of glycine, polyaspartic acid, glutamic acid and chitosan, the pH of the polishing liquid is 3-5, and the pH buffer is a citric acid-sodium citrate buffer. The polishing method comprises the following steps: grinding the soft magnetic alloy; performing chemical mechanical polishing rough polishing on the ground soft magnetic alloy by using a rough polishing slurry; performing chemical mechanical polishing fine polishing on the rough polished soft magnetic alloy by using the polishing liquid, so that the soft magnetic alloy with a smooth and flat surface is obtained. The polishing liquid is green, environment-friendly and pollution-free, and the surface of the soft magnetic alloy after polishing is smooth and flat.

This invention relates to the field of coating technology, and discloses a composite CVD coating, its preparation method, and its application. The coating comprises, from the inside out, a base layer, a first spacer layer, a first composite layer, and a second composite layer, arranged sequentially on the surface of a substrate. The first composite layer consists of a transition layer and a second spacer layer; the second composite layer consists of a third spacer layer and a surface layer; both the base layer and the surface layer are TiN; the first, second, and third spacers are MT-TiCN, κ-Al₂O₃, and TiC, respectively; the transition layer includes HT-TiCN and TiCO. The coating provided by this invention has good adhesion, strong resistance to crack propagation, and excellent overall coating quality; simultaneously, the coating particles are fine, and the surface roughness is low, which is more conducive to chip removal during processing.

The application discloses a cord fabric unwinding and wrinkle removing device and a production method of an unwinding roller, and belongs to the technical field of cord fabric manufacturing. The unwinding and wrinkle removing device comprises an unwinding roller, a main hot moistening positioning roller and an auxiliary hot moistening pressing roller. Cord fabric on a cord fabric winding disc sequentially passes through the unwinding roller, the main hot moistening positioning roller and the auxiliary hot moistening pressing roller. The unwinding roller is used to apply a force to the cord fabric, so that the cord fabric is stretched along the width direction of the cord fabric. The main hot moistening positioning roller is used to moisten and fix the unwound cord fabric. The auxiliary hot moistening pressing roller is used to assist in moistening the cord fabric. The unwinding and wrinkle removing device integrates unwinding, setting and moistening. When the cord fabric is unwound, the unwound state can be fixed, and the cord fabric surface can be smoothed and wrinkle-free in time through moistening, so that the cord fabric is prevented from being stained with glue due to wrinkles.

This invention is a steel billet grinding process with a constant grinding wheel linear speed. First, the steel billet is automatically fed, positioned, and locked. A laser rangefinder detects the actual length of the steel billet and calibrates the grinding wheel to align with the billet's length center. Then, the grinding wheel is controlled to apply pressure and adhere to the steel billet, driving the billet to translate and complete the grinding of both sides. During the grinding stage at the billet's ends, the speed and pressure are automatically reduced to avoid over-grinding and sharpening at the ends. A trolley tilting mechanism rotates the billet 45° multiple times, cyclically grinding all sides and edges of the billet, using a repeated grinding method with decreasing feed depth to ensure grinding accuracy. Simultaneously, photoelectric switches on both sides of the grinding wheel monitor the wear on the outer circumference of the grinding wheel in real time, dynamically adjusting the grinding wheel motor speed to maintain a constant grinding linear speed, and simultaneously calibrating the distance between the grinding wheel and the billet to stabilize the grinding pressure. This invention effectively ensures uniform overall grinding quality of the steel billet and improves the grinding accuracy and stability of the billet's sides and edges.

This invention provides a nickel-core ceramic composite powder, a slurry, a preparation method thereof, and a multilayer ceramic capacitor; wherein the nickel-core ceramic composite powder comprises core-shell particles, the core-shell particles comprising a nickel core and a ceramic layer covering the nickel core, wherein the nickel core and the ceramic layer are bonded together by a coupling agent; the slurry is obtained by mixing the nickel-core ceramic composite powder, a slurry solvent, and a binder; the internal electrode in the multilayer ceramic capacitor can be made from the nickel-core ceramic composite powder or a slurry containing the nickel-core ceramic composite powder.

This invention discloses a 5052 aluminum alloy cavity for semiconductor devices and its preparation method, relating to the field of aluminum alloy material technology. Specifically, it includes the following steps: S1: First, the 5052 aluminum alloy ingot undergoes a two-stage homogenization treatment, followed by a three-stage free forging process, and finally, spray cooling and air drying to obtain a shaped cavity substrate; S2: After plasma cleaning, the shaped cavity substrate is subjected to magnetron sputtering technology to sequentially deposit a transition layer, a barrier layer, and a functional layer on its inner surface to obtain the 5052 aluminum alloy cavity for semiconductor devices. The 5052 aluminum alloy cavity prepared by this invention can greatly ensure the stability and purity of the prepared aerospace semiconductors, meeting the manufacturing needs of high-performance chips for aerospace applications, and is of great significance.

The utility model relates to laser cladding processing technical field, concretely is a kind of laser cladding metal additive manufacturing equipment, including the connecting assembly for being connected in the wall of extension long tube spray head, multiple rollers are equipped in the circumferential direction on connecting assembly, the fan blade of coaxial setting is respectively fixedly installed on each roller, and the outer periphery of multiple rollers is used to contact the inner wall of workpiece simultaneously, and with the rotation of workpiece homodirectional rotation, to realize that fan blade rotates under the driving of roller and generates airflow.The utility model can inhibit the elastic deformation of the extension long tube spray head far end by the rotation of roller set, ensure light path transmission and spot size stability, improve cladding layer precision, quality and efficiency.Meanwhile, fan blade rotation can efficiently discharge cladding heat, slow down component aging, prolong service life, protect high-quality cladding layer formation;And fan blade rotation can also discharge excess powder and smoke, improve processing visibility and efficiency, reduce cladding layer surface roughness, improve surface quality.

The application discloses a preparation process of a lead zirconate titanate (PZT) film layer, a film layer structure and application thereof, and relates to the technical field of piezoelectric material film layer preparation. The preparation process comprises the following steps: S1, forming a low tensile stress silicon nitride layer on the surface of a substrate, which is used for homogenizing the in-plane stress gradient of a wafer; and S2, forming a piezoelectric functional layer on the surface of the silicon nitride layer in a sputtering mode, wherein the piezoelectric thin film material of the piezoelectric functional layer is lead zirconate titanate (PZT). The film layer structure and the preparation process thereof adopt the silicon nitride layer to relieve the thermal mismatch stress of the piezoelectric functional layer system, can improve the piezoelectric constant e31 of the central region of the wafer, and improve the uniformity of the whole wafer.

The application discloses a method and device for laser stripping silicon carbide ingots. First, the laser focal point is aimed at a preset plane inside the ingot, and the laser is processed on the preset plane in a set direction and scanning line interval to form a plurality of explosion points on the plane to prepare a modified layer. Then, the modified layer is irradiated and heated by a xenon lamp. After the heating is completed, a pulling force opposite in direction and perpendicular to the end surface is applied to the two ends of the ingot to strip the wafer from the silicon carbide ingot. The application greatly reduces the pulling stress required for stripping, improves the stability of stripping, and at the same time, makes the wafer form a relatively flat stripping surface, reduces the roughness of the stripping surface, reduces the material loss of subsequent grinding, improves the silicon carbide stripping efficiency, and reduces the production cost.

The utility model relates to a kind of cutting fluid polishing devices, belong to the technical field of valve parts processing equipment, it includes liquid storage, input pipeline and driving part, liquid storage is hollow inside, cutting fluid is placed inside, cutting fluid contains polishing particle, input pipeline is arranged between liquid storage and the part to be processed, it extends to the part to be processed direction in one end, other end is inserted into liquid storage until its end is in cutting fluid, driving part is arranged on input pipeline, for cutting fluid in liquid storage is inhaled into input pipeline, and cutting fluid in input pipeline is injected into the part to be processedThe utility model has thoroughly removed the scrap iron remaining in the part to be processed, polish the inside of the part to be processed at the same time, inhibit the metal powder of the inner surface of the part to be processed from falling off, prevent medium pollution and accident, realize the effect of chip removal and polishing synchronous processing.

The utility model relates to metal tubular product processing equipment technical field especially relates to a kind of oxygen-free copper microtube cutting device.Its technical scheme includes bottom plate and the polishing mechanism being arranged in the bottom plate top side, the polishing mechanism includes the base being fixed in the bottom plate top, the top side fixed connection box of the base, the outer wall side fixed connection of the box has driving motor, the output end transmission connection of the driving motor has transmission structure, the outer wall of the transmission structure is equipped with polishing sandpaper, the top side of the bottom plate is provided with cutting drive mechanism.The utility model oxygen-free copper microtube cutting device, it has can realize the high-precision cutting of oxygen-free copper microtube, so that cutting surface surface roughness drops, and it has can carry out fine polishing to the cutting surface of oxygen-free copper microtube, effectively remove burr, oxide layer and other defects generated in cutting process, improve the surface quality of microtube's advantage.

This invention discloses a polishing slurry, its preparation method, and its application, relating to the field of polishing slurry technology. The polishing slurry of this invention comprises silica abrasive, citric acid, and sodium citrate, with a pH < 7. It effectively controls metal ion contamination during the polishing process of synthetic quartz, improves the removal rate during the polishing of quartz glass substrates, and reduces the surface roughness of the quartz. It synergistically optimizes chemical corrosion and mechanical removal, achieving an atomically smooth, scratch-free, and subsurface-damage-free quartz glass substrate surface while maintaining a high material removal rate. Furthermore, it possesses characteristics such as low contamination, easy cleaning, and environmental friendliness.

A coating protection device and method for turbine regulating stage blades against solid particle erosion is disclosed, relating to the field of turbine blade treatment technology. A workpiece motion control mechanism, located at the top of the coating chamber, clamps the workpiece and sample and controls their rotation, while also being connected to a bias power supply. The evaporation source, located at the bottom of the coating chamber, consists of a crucible, deflection coil, electron gun, and high-current ion source. A vacuum and gas supply system evacuates the coating chamber and supplies reactive and working gases to the coating chamber and the high-current ion source. A water and power supply system provides water cooling and power to all components. A control system is used for real-time control and adjustment of various process parameters. Based on high-current ion-enhanced electron beam evaporation coating technology, through the coordinated operation of the evaporation source and the workpiece motion control mechanism, a coating protection can be applied to turbine stage blades, thereby improving the blades' resistance to solid particle erosion and ensuring the safety and stability of the unit's operation.

The application relates to the technical field of laser micro-nano processing, and particularly provides a femtosecond laser processing system and method, wherein the femtosecond laser processing system comprises a laser emission module and a beam shaping module; the beam shaping module comprises a pulse separator, a spatial light modulator and a beam expander; the laser emission module, the pulse separator, the beam expander and the spatial light modulator are sequentially arranged; the laser emission module is used for emitting laser pulses; the laser pulses sequentially pass through the pulse separator and the beam expander and then reach the spatial light modulator; the pulse separator is used for splitting the laser pulses and introducing a pulse delay time between the split laser pulses; the beam expander is used for expanding the laser beam; and the spatial light modulator is used for shaping a Gaussian beam into a flat-top beam. The application has the effect of improving the processing quality of nanochannels on a grating surface.

This invention provides a high-satiety chicken small molecule peptide and its application in chicken meal replacement powder. First, a gastric self-expanding microsphere is prepared, with yeast β-glucan and hydroxypropyl methylcellulose as the wall material and modified chicken small molecule peptide as the core material. The microsphere absorbs water and expands in the acidic environment of the stomach, generating a feeling of fullness. In the intestinal environment, it slowly releases the modified chicken small molecule peptide, promoting absorption and regulating intestinal health. Furthermore, solid-state fermentation of mixed grain powder using Aspergillus oryzae is used to prepare the chicken meal replacement powder. The addition of the gastric self-expanding microsphere and fermented mixed grain powder further enhances satiety, meeting the market demand for healthy meal replacement foods.

The application discloses a kind of intelligent welding path planning methods of welding wire width drive, with welding wire width as global unique driving parameter, intelligent linkage and dynamically generate key threshold and strategy in path planning whole process. Specifically include: based on the generation of cutting threshold, deduplication tolerance, path point deduplication tolerance, continuous welding judgment threshold based on the threshold to the discretization path point of analytic self DXF drawing is globally endpoint cutting to eliminate interference;Carry out angle filtering and neighborhood deduplication cross point accurate detection;Carry out neighborhood order-preserving path point deduplication optimization;And based on the dynamic configuration of three-section type welding speed and the judgment continuous welding logic based on welding wire width. The application is coupled to path planning algorithm by welding process parameter (welding wire width) in depth, realizes the full-link automatic intelligent optimization from drawing analysis to robot code generation, significantly improves welding quality, precision and efficiency, and is strong in universality.

The application discloses a single-point solid electrolyte electrochemical machining method, which comprises the following steps: preparing a gel solid for single-point solid electrolyte electrochemical machining; manufacturing a single-point solid electrolyte electrochemical machining tool; and machining by using the single-point solid electrolyte electrochemical machining tool. In the machining process, the application uses a solid electrolyte, and a series of problems caused by liquid electrolyte flow and sputtering in traditional electrochemical machining are avoided in the machining environment. The application adopts the solid electrolyte to perform electrochemical machining, so that the electrolyte can be constrained, and local and selective material removal can be realized. The machining tool manufactured by using the gel solid with low roughness is used to perform electrochemical machining, so that good surface quality can be obtained. The single-point solid electrolyte electrochemical machining tool in the application can be conveniently installed on various motion platforms and machine tools, and through trajectory programming, machining of complex shapes can be realized, so that the application range is wide, and the machining efficiency is high.

This invention discloses an embedded metal-based ceramic membrane and its preparation method. The membrane uses a continuous metal matrix as its main framework. During solid-state sintering, the metal particles undergo plastic deformation at their contact points, forming sintering necks. The ceramic powder is in a discontinuous, discrete state. After being uniformly dispersed by powder adsorption and cold isostatic pressing, it is embedded and locked within the gaps in the metal framework. This product has a metal membrane structure as its main component, offering high filtration accuracy and uniform distribution. The outer surface of the membrane has a continuous, smooth, and clean metal phase that can be directly welded. It exhibits low sintering shrinkage, good dimensional stability, excellent intrinsic hydrophilicity, and superior fluid permeability. The preparation process is simple and controllable.

This invention discloses an internally charged positive pressure leak detection device for a palladium alloy membrane purifier, comprising an outer shell with a leak detection port and a helium filling port at both ends. The interior of the outer shell is a cavity for accommodating the palladium alloy membrane purifier under test. The inlet of the palladium alloy membrane purifier is connected to the helium filling port, which is used to fill the palladium alloy membrane purifier with helium. The leak detection port is used to connect to a vacuum and leak detection device. This internally charged positive pressure leak detection device actively fills the palladium alloy membrane purifier with helium and sets up a vacuum detection chamber outside the purifier, creating a large differential pressure detection environment with a clear direction that is completely consistent with the actual operating conditions of the palladium alloy membrane purifier. This ensures that any microscopic leak channels that may open under actual working stress can be detected under these conditions, making it suitable for fields such as semiconductors, electronics, and proton exchange membrane fuel cells.

The present application relates to the technical field of paint, in particular to a hydrolytic linear self-polishing antifouling paint and a preparation method thereof.The linear self-polishing resin system is obtained by compounding ion exchange resin, silane ester resin and additive A in a certain proportion, and is applied to the antifouling paint, so that not only the linear self-polishing antifouling paint can be obtained, but also the unstable hydrolysis of the combination of the ion exchange resin and the silane ester resin during the storage process in the storage tank can be prevented.The linear self-polishing property provided by the present application can greatly prolong the antifouling period of the paint, reduce the roughness of the coating surface and reduce fuel consumption.

This invention provides a method for preparing oat polypeptides and their applications and compositions, relating to the field of cosmetics technology. The preparation method of this invention includes the following steps: (1) oat swells, is dried after steam explosion treatment, and then pectinase, cellulase, and amylase are added for enzymatic hydrolysis of carbohydrates to obtain enzymatically hydrolyzed oat residue; (2) a complex protease is added to the enzymatically hydrolyzed oat residue, and a first enzymatic hydrolysis is performed under the condition of 3-8% volume concentration of ethanol to obtain enzymatic hydrolysate A; the complex protease is papain, bromelain, and flavor protease in a mass ratio of 3-6:3-6:2; (3) trypsin is added to enzymatic hydrolysate A for a second enzymatic hydrolysis to obtain enzymatic hydrolysate B; (4) enzymatic hydrolysate B is ultrafiltered to obtain oat polypeptides. This application obtains oat polypeptides with small molecular weight and high content, which, when used in the preparation of cosmetics, have significant moisturizing, anti-wrinkle, and skin roughness-reducing effects.