5158 results about "Copper wire" patented technology

An F-inverted compact antenna for ultra-low volume Wireless Sensor Networks is developed with a volume of 0.024λ×0.06λ×0.076λ, ground plane included, where λ is a resonating frequency of the antenna. The radiation efficiency attained is 48.53% and the peak gain is −1.38 dB. The antenna is easily scaled to higher operating frequencies up to 2500 MHz bands with comparable performance. The antenna successfully transmits and receives signals with tolerable errors. It includes a standard PCB board with dielectric block thereon and helically contoured antenna wound from a copper wire attached to the dielectric block and oriented with the helix axis parallel to the PCB. The antenna demonstrates omnidirectional radiation patterns and is highly integratable with WSN, specifically in Smart Dust sensors. The antenna balances the trade offs between performance and overall size and may be manufactured with the use of milling technique and laser cutters.

Computer based energy management including an adaptor having a server network interface and a control device interface. The server network interface receives commands from the energy management host software, the commands specify a control device and include control instructions and requests for energy usage data. The control device interface transmits the commands to the control device and receives energy usage data from the control device. The server network interface transmits the energy usage data to the energy management software in response to receiving the energy usage data from the control device. In this manner, the adaptor provides a bridge between the server network and the copper wire network to provide control and measurement of energy usage at a control device level in response to commands from a remote computer system.

The present invention provides an optical system that allows for the flexible location of an optical device that is coupled to a patch panel in a wiring closet or other optical signal source through a series of fiber optic cables and optical connections, or the flexible location of an array of such optical devices. The optical system includes, in part, one or more retractable optical fiber tether assemblies that each allow varying lengths of tether cable to be pulled and used. The retraction device of each of the optical tether assemblies may be disposed mid-tether cable, or may terminate the respective tether cable and incorporate the given optical device. In an exemplary wireless local area network (WLAN) application, each of the retractable optical fiber tether assemblies includes an integral transceiver and associated software. Thus, each of the retractable optical fiber tether assemblies functions as an antenna. The associated fiber optic cable carries both optical fiber to provide optical continuity and copper wire to provide electrical conductivity to the antenna array.

The present invention generally provides a metallization process for forming a highly integrated interconnect. More particularly, the present invention provides a dual damascene interconnect module that incorporates a barrier layer deposited on all exposed surface of a dielectric layer which contains a dual damascene via and wire definition. A conductive metal is deposited on the barrier layer using two or more deposition methods to fill the via and wire definition prior to planarization. The invention provides the advantages of having copper wires with lower resistivity (greater conductivity) and greater electromigration resistance than aluminum, a barrier layer between the copper wire and the surrounding dielectric material, void-free, sub-half micron selective CVD Al via plugs, and a reduced number of process steps to achieve such integration.

This specialized networking cable includes a plurality of twisted copper wire pairs encased in a flexible sheath for effectuating transmissive interconnections, electrically activated telltales affixed to both ends of the cable at positions adjacent to and connected to at least one of the copper wire pairs for providing an identification signal when activated; and means for selectively applying a current to the cable that activates the telltales and does not interfere with the flow of data through the cable whereby the telltales may be activated on at least one of the twisted copper pairs. An LED and an electric power connector suitable for plug-in connection of a power pack are affixed to the cable adjacent each end such that both LEDs are lighted whenever power is applied to either of the electrical connectors. The attendant illumination of the LEDs readily indicates where both ends of the networking cable are located. The networking cable also may be used for convenient telephonic communication by service personnel. One embodiment includes the cable as described above except with one end having a connector mateable with a standard Category 5 networking cable thereby providing for a standard networking cable to be converted into a specialized networking cable usable for tracing cable ends.

Processing recycled materials to recover plastics, copper wire, and other non-ferrous metals. Aspects of the invention employ density separation to separate plastic-bearing materials from copper-bearing materials. Plastic-bearing materials are further separated to separate light plastics from heavy plastics. Plastics are concentrated, extruded, and palletized. Copper and other valuable metals are recovered from copper-bearing materials using a water separation table.

Disclosed are a gapped magnetic core which may be coated or uncoated with an insulating layer or housed in an insulting box having a physical gap whose dimension is close to that of the gapped magnetic core and automated or semi-automated methods of applying copper wire on the gapped core or the core assembly and filling the gap with a spacer in the core or core assembly. The disclosed processes allow various combinations of core and spacer materials and gap configurations, resulting in a wide variety of core-coil assemblies which are useful as inductive components in electric and electronic circuits. Also disclosed is a core-coil assembly wherein a magnetic core with a gap directed off the conventional radial direction of a toroidally-wound core.

The invention relates to the technical field of petroleum base lubricant composition and a preparation method thereof, which is copper and aluminum wire drawing oil and a preparation method thereof. The copper and aluminum wire drawing oil comprises base oil, an emulsifying agent, an auxiliary emulsifying agent, a defoaming agent, an antirusting agent, a preservative and an antiwear agent. The preparation method can be carried out by the following steps that: the copper and aluminum wire drawing oil is mixed into 3 percent to 45 percent of water-based emulsion according to the weight percentage. The water-based emulsion is showered into a wire drawing die cavity in the copper and aluminum wire drawing process. The product of the invention has good lubricating property, excellent light stability and storage stability, low cost, good cooling effect, fast heat-transfer speed, little temperature-rise amplitude, nonflammability and easy cleaning, thus guaranteeing safety of use environment. Copper wires and aluminum wires which are drawn by adopting the product have even line shapes, bright surfaces, and rustless property, and also have good ultraviolet and storage stability and good stability.

A deterrent device for delivering an electric shock to an animal, pest or bird to be deterred, having the typical components of a non-conductive base to which the electrically conductive elements are attached. Instead of the typically-used copper wire, however, the braided elements comprise smaller strands of a conductive material, such as copper, aluminum or stainless steel wire, is used and is mechanically attached to the non-conductive base. The braided elements can be mechanically attached using a simple sewing operation in which the braid is sewn to the base. Because of the mechanical attachment and the ability of the braided elements to flex in both contraction and extension, the device of this invention can be used in tight corners and other contorted locations without having the wires of the typical prior art device pull free of the base.

A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.

A digital access arrangement for (i) isolating downstream components from twisted pair copper wire and (ii) separating upstream and downstream communications channels. The line isolation is performed with relatively small, lightweight components, such as an optical isolation unit for example, and can be operated with signals modulated at relatively high frequencies and having relatively high data rates and amplitudes.

A typical integrated-circuit fabrication requires interconnecting millions of microscopic transistors and resistors with aluminum wires. Yet, aluminum wires have greater electrical resistance and are less reliable than copper wires. Unfortunately, current techniques for making copper wires are time-consuming and inefficient. Accordingly, the invention provides a method of making wires or interconnects from copper or other metals. One embodiment entails forming a first diffusion barrier inside a trench using ionized-magnetron sputtering for better conformal coating of the trench, and a second diffusion barrier outside the trench using jet-vapor deposition. The jet-vapor deposition has an acute angle of incidence which prevents deposition within the trench and thus eliminates conventional etching steps that would otherwise be required to leave the trench free of this material. After formation of the two diffusion barriers, the trench is filled with metal and annealed.

An cable assembly (100) includes an insulative housing (1); a first terminal module (21) and a second terminal module (22) assembled to the insulative housing, the first terminal module (21) having first terminals (212a) and first additional terminals (212b), the second terminal module (22) having second terminals (222a) and second additional terminals (222b); a photoelectric conversion device (93) electrically connected with the first terminals and the second terminals; and a cable (6) including fiber wires (63) and copper wires (61), the fiber wires optically connected to photoelectric conversion device, the copper wires electrically connected to the first additional terminals and the second additional terminals.

A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.

The invention discloses a ground line device of a power transmission line tower, and the device comprises a line clamp which consists of two articulated splints and a torsion spring, a block pin is arranged between the two splints, the line clamp is connected with a grounding seat by a flexible copper wire, the tail ends of the two splints are respectively provided with symmetric connecting plates, opposite surfaces of the two connecting plates are symmetrically provided with clamping blocks which are respectively provided with cross clamping slots, and one end of the flexible copper wire which is connected with the line clamp correspondingly are divided into two connecting terminals and are respectively connected with the two connecting plates. A dedicated hitching device of the ground line device comprises an insulating bar, the front end of which is provided with a connecting shaft, and the front end of the connecting shaft is provided with a cross shaft head which is matched with the cross clamping slot of the ground line device of the power transmission line tower. The device has the advantages of simple structure, convenient use, time-saving and labor-saving operation, high safety performance, light self-weight, easy carrying and labor-saving disassembly, and the device can realize the ground line hitching on various towers at one step and is especially suitable for a tower with a large rotation angle and a terminal tower.

A system for sorting fine nonferrous metals and insulated copper wire from a batch of mixed fine nonferrous metals and insulated wire includes an array of inductive proximity detectors, a processing computer and a sorting mechanism. The inductive proximity detectors identify the location of the fine nonferrous metals and insulated copper wire. The processing computer instructs the sorting mechanism to place the fine nonferrous metals and insulated copper wire into a separate container than the non-metallic pieces.

The invention provides a heap-leaching method for separating copper and tin from tin-plated copper wires, belonging to the recovery processing of waste tin-plated copper wires. The method adopting thecopper sulfate replacement/heap-leaching method comprises the following steps: washing and stacking peeled waste tin-plated copper wires on an acid-proof and alkali-proof heap-leaching platform for heap-leaching; pickling the heap-leaching residue with recycling heap-leaching solution, and further washing the pickled heap-leaching residue to obtain detinned copper wires; adding hydrogen peroxideto the heap-leaching solution until no white precipitation is generated, heating the reaction solution until the reaction solution is boiling, standing, filtering, and drying to obtain original stannic acid, and further calcining the original stannic acid to obtain stannic oxide; adding a proper amount of copper powder and blowing air to the filtrate, wherein the addition amount of the copper power is the copper amount required by copper sulfate in the recycling heap-leaching solution; and controlling the temperature and time of the reaction and adjusting the concentrations of copper sulfate and sulfuric acid of the solution by sulfuric acid and water. The method has the advantages that the process is simple and easy-to-operate, the materials and devices are common and cheap, the tin-plated copper wires dispense with stirring in the heap-leaching process, the heap-leaching solution is recyclable and pollution-free, the removal rate of tin is higher than 95%, and the recovery rate of hydrogen peroxide immersion tin is higher than 98%.

An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration region having a higher concentration of accelerator. The higher concentration of accelerator causes metal to deposit at a faster rate in the acceleration region than in a non-accelerated region for the duration of metal deposition. To make a metal feature, a resist layer is applied to a workpiece surface and patterned to form a recessed region and a field region. Then, a metal seed layer is deposited on the workpiece surface. An accelerator solution is applied so that an accelerator film forms on the metal seed layer. A portion of the accelerator film is selectively removed from the field region, leaving another portion of the accelerator film in the recessed region. Then, copper is electroplated onto the workpiece, and the copper plates at an accelerated rate in the recessed region, resulting in a greater thickness of copper in the recessed region compared to copper in the field region. A wet etch is performed to remove copper from the field region. Then, the resist is removed from the field region, resulting in a coarse copper wire.

The invention relates to a method for directly producing high-purity oxygen-free copper by pyrogenic process continuous refining of scrap copper, and belongs to the technical field of non-ferrous metallurgy. The method comprises the following steps: by taking scrap copper as a raw material; analyzing the component characteristics of each batch of raw material, and then preparing into a mixture, wherein the mass percent of a copper element in the mixture is greater than or equal to 93%; adding metaphosphate or phosphorus pentoxide and flux to the mixture; refining by oxidation; stewing and drossing after oxidation is finished, and then orderly carrying out reduction refining and refining agent refining under an agitation state, so as to obtain the high-purity oxygen-free copper of which the copper content is greater than or equal to 99.95% and the oxygen content is smaller than 0.003%, wherein the electrical resistivity of the obtained copper wire after drawing is below 0.017241omega/(mm), and the relative electrical conductivity is over 100% of International annealed copper standard (IACS). The method is strong in flexibility, significant in refining effect, and applicable to different components of scrap copper materials; the scrap copper can be used for directly making a rod after being refined. Compared with the traditional pyrogenic process smelting-electrolytic refining-copper cathode purification process, the method disclosed by the invention has the beneficial effects that the flow is shortened, the cost is reduced, the energy is saved, and continuous operation is achieved.

A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties.

The invention discloses a high-performance three-dimensional porous film silicon-based negative electrode material of a lithium ion cell and a preparation method thereof. A three-dimensional porous collection body material, such as copper foil net, copper wire net, foam copper foam nickel is adopted; a layer of silicon film or silicon-metal composite film is formed on the copper foil net, copper wire net, foam copper foam nickel by a magnetron sputtering method, and then the three-dimensional porous film silicon-based negative electrode material is formed by a heat treatment manner. According to the invention, based on the three-dimensional porous structure, the forming of silicon-metal alloy as well as excellent binding force between the film negative electrode material and the three-dimensional porous collection body, the cell prepared from the porous film silicon-based negative electrode material has higher discharge specific capacity and first charge-discharge efficiency and excellent cycle performance. The method is simple in operation, and has wide application prospects in the field of lithium ion cell negative electrodes.

Provided are a method and a device for tunnel advance geology forecast with tunnel face blasting as a focus. The method comprises the steps of (1) drilling holes on two lateral walls at the inlet position in a tunnel; (2) filling a coupling agent into the drilled holes, and attaching weave detectors to the walls of the drilled holes; (3) winding a trigger circuit copper wire on cartridged explosive, and placing the cartridged explosive into a blasted hole of the tunnel face; (4), enabling two three-component weave detectors buried in a tunnel hole to receive reflective earthquake wave signals; (5) sending the signals to an amplifier after the signals are selected by a multi-way switch; (6) enabling the amplifier to amplify the signals and then transmit the signals to an analog/digital (A/D) converter through wireless transmission; (7) enabling a wireless communication module of a control chamber to receive a wireless signal and then transmit the wireless signal to a host, and recording the signal; and (8) achieving geology forecast through an processing program installed in the host. The device comprises signal acquisition, wireless communication and control and a data analyzing system. The method is simple, easy and low in cost, can be used for advance geology forecast of tunnels, holes and roadway underground spaces, and achieves automation and normalization of geology forecast.

The invention discloses a shielding longitudinal watertight degaussing cable and a production method thereof for ships. A tinned copper wire is impregnated with a sealant and then twisted into a twisted copper conductor which is impregnated with a conductor sealant layer on the periphery, an electro-insulating rubber layer is extruded on the periphery of the conductor sealant layer to form insulation core wires, chloroprene rubber filling bars are filled into gaps between the insulation core wires, and a plurality of insulation core wires are twisted wholly into a cable core. A cable core inner sealant layer, an inner jacket rubber layer, an armor shielding layer and an outer jacket rubber layer are sequentially arranged on the periphery of the cable core. A single wire of the cable conductor is impregnated with the sealant, the twisted copper conductor is impregnated with the conductor sealant layer on the periphery, the cable core inner sealant layer is extruded on the periphery of the cable core to form multiple sealing, the chloroprene rubber filling bars swell during follow-up vulcanization and can fill in the gaps inside the cable core completely, and tangency between the insulation core wires can be avoided, so that the sealant can permeate to the inside of the cable core to guarantee the watertight effect when the cable core inner sealant layer is extruded.

The invention discloses a super-hydrophobic/super-oleophilicity copper wire mesh for oil and water separation and a preparation method and application thereof. The preparation method comprises the steps that firstly, the copper wire mesh is ultrasonically cleaned through diluted hydrochloric acid, absolute ethyl alcohol and deionized water respectively and dried through nitrogen; chemical deposition liquid of copper sulfate and a sodium thiosulfate solution is prepared; the cleaned copper wire mesh is placed into the chemical deposition liquid for a deposition reaction; the copper wire mesh is taken out and cleaned through the deionized water and dried in the air; the dried copper wire mesh is placed in a solution of a curing agent and polydimethylsiloxane with hydroxyl sealed end, and the copper wire mesh is taken out and heated. No expensive fluorine-containing substance is needed, the copper wire mesh has the advantages that the preparation technology is simple, reaction conditions are mild, no strong acidity or strong basicity or corrosivity reagents are needed, and no harm is caused to the environment, separation of oily wastewater can be achieved rapidly and efficiently, the good separation effect on chloroform, normal hexane, petroleum ether, plant oil, diesel oil, aviation kerosene and the like is achieved, and separation of strong acidity, strong basicity and high salinity oily wastewater can be achieved.

The present invention generally provides a metallization process for forming a highly integrated interconnect. More particularly, the present invention provides a dual damascene interconnect module that incorporates selective chemical vapor deposition aluminum (CVD Al) via fill with a metal wire, preferably copper, formed within a barrier layer. The invention provides the advantages of having copper wires with lower resistivity (greater conductivity) and greater electromigration resistance than aluminum, a barrier layer between the copper wire and the surrounding dielectric material, void-free, sub-half micron selective CVD Al via plugs, and a reduced number of process steps to achieve such integration.

The invention provides a preparation method of low-temperature sintering nano copper conductive ink. The preparation method comprises the steps of: dissolving a copper salt and a protective agent in an organic solvent, heating until the copper salt and the protective agent are completely dissolve, regulating the pH value to be 8.6-10.5 by using ammonia water, dropping a reducing agent in a reaction system, reacting for 10-60minutes and continuously stirring, gradually cooling; carrying out centrifuging, washing and vacuum drying to obtain high-purity nano copper particles; and dispersing the nano copper particles in solvents with different proportions to obtain stable nano copper conductive ink. The preparation method has the advantages that the particle size of nano copper powder in the prepared nano copper conductive ink is 5-30nm, and the prepared nano copper conductive ink has high oxidization resistance and can not be oxidized after stored for above one year in air; the nano copper conductive ink has high conductivity, the resistivity of the sintered electronic device is only 2-5 times that of the conventional copper wire and can be kept unchangeable after being placed for a long time in air; and the preparation method is suitable for preparing various printed electronic devices, is simple in process, and can realize massive production.

A detection and near-field communication device for detecting the approach of a portable device integrating a near-field communication antenna for communicating with the portable device, includes:

a printed circuit including: an upper face oriented toward the portable device and a lower face, a microcontroller, a near-field reader, a detection module, a near-field communication antenna, situated on a face of the printed circuit having a first surface and being linked to the near-field reader;

a plurality of resonators made of copper wire windings, printed on a face of the printed circuit, covering a surface substantially identical to the first surface;

the resonators including frequency adjustment elements so as to resonate at the near-field communication frequency; and

the resonators generating a voltage variation across their terminals and being connected to the detection module to detect the approach of the portable device.

The invention discloses a bonded copper wire product which uses high-purity copper wires as a matrix and is coated with a pure-palladium protective layer on the surface thereof. According to weight percentage, the bonded copper wire product contains 1.35 percent to 8.19 percent of palladium and the balance of copper; the production method of the palladium-plated bonded copper wire comprises the following steps: extraction of high-purity copper, preparation of a single-crystal copper bar, coarse drawing, heat treatment, palladium plating on the surface, fine drawing, heat treatment, surface cleaning and shunt winding. The invention abandons the traditional backward technique of application directly after drawing firstly and then electroplating, and adopts the technique that firstly, copper wires with diameter of less than 1mm are produced, then the pure-palladium layer is electroplated, and finally, the palladium-plated bonded copper wire finished product is produced by fine drawing. The bonded copper wire product can effectively improve the oxidation resistance of the bonded copper wires, ensure that the appearance of the finished product keeps silver metallic luster, and greatly prolong the quality guarantee period of the bonded copper wire product after being sealed off; in addition, the mechanical strength of the finished product is strengthened and the oxidation resistance thereof is improved, thus being beneficial to reducing the wire diameter of the bonded copper wire, shortening welding spacing and being more applicable to packaging of high-density and multi-pin integrated circuits.

The invention discloses an insulating ethylene propylene rubber LSOH electric power or control cable for ships and warships and a processing method thereof. Multi-strand tinned copper wires twisted conductor is adopted and an extruded ethylene propylene rubber insulating layer is covered on the outer surface of the conductor. Three-core or four-core insulating wires are twisted together. An armorlayer is arranged between three insulating cores and a jacket layer. The outer of the armor layer is provided with the jacket layer. An inner jacket layer is arranged between four insulating cores andthe armor layer. The armor layer is arranged between the inner jacket layer and the jacket layer. The processing method comprises the steps of twisting tinned copper wires with a wire twisting machine to form a conductor, manufacturing the insulating layer outside of the conductor with an extruding machine, irradiating and cross-linking the insulating layer with an electron accelerator, twistingthe insulating cores with a cable-former, braiding the armor layer with a braiding machine, and extruding an oil-proof LSOH jacket layer outside of the armor layer. The invention has the advantages that the products meet the performance demand of the cables for ships and warships, according with the GJB1916-94 general specification for low smoke cable and flexible cord for ships and warships.

The invention relates to a method for testing the corrosion behavior under a thin liquid film in a gas environment, which is characterized in that the method comprises the following steps that: (1) one end of a cylindrical metal sample is encapsulated with epoxy resin after being welded with a copper wire; (2) all the wires which are connected with an electrode penetrate through a corrosion test case to form small holes which are sealed by glass glue; (3) the thickness between waterproof breathable films on the bottom part of a device is controlled by setting and adjusting the thickness of the metal sample and the thin liquid film; (4) a corrosive gas is generated by using a corrosive gas generation system and is fed into a solution; (5) the corrosive gas must be always fed during the experiment process to ensure the concentration of the corrosive gas; and (6) electrochemical parameters of the metallic corrosion under the thickness of thin liquid film are obtained. The invention has the advantages that the difficulty that the thickness of the liquid film is difficult to accurately set and control is solved, the control accuracy of the think liquid film can reach plus or minus 0.5 Mum, and the method has good stability when being tested.