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6356 results about "Bismuth" patented technology

Bismuth is a chemical element with the symbol Bi and atomic number 83. It is a pentavalent post-transition metal and one of the pnictogens with chemical properties resembling its lighter homologs arsenic and antimony. Elemental bismuth may occur naturally, although its sulfide and oxide form important commercial ores. The free element is 86% as dense as lead. It is a brittle metal with a silvery white color when freshly produced, but surface oxidation can give it a pink tinge. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.

Spin-transfer torque magnetic random access memory having magnetic tunnel junction with perpendicular magnetic anisotropy

A spin-torque transfer memory random access memory (STTMRAM) element includes a fixed layer formed on top of a substrate and a a tunnel layer formed upon the fixed layer and a composite free layer formed upon the tunnel barrier layer and made of an iron platinum alloy with at least one of X or Y material, X being from a group consisting of: boron (B), phosphorous (P), carbon (C), and nitride (N) and Y being from a group consisting of: tantalum (Ta), titanium (Ti), niobium (Nb), zirconium (Zr), tungsten (W), silicon (Si), copper (Cu), silver (Ag), aluminum (Al), chromium (Cr), tin (Sn), lead (Pb), antimony (Sb), hafnium (Hf) and bismuth (Bi), molybdenum (Mo) or rhodium (Ru), the magnetization direction of each of the composite free layer and fixed layer being substantially perpendicular to the plane of the substrate.
Owner:AVALANCHE TECH

A kind of aluminum alloy material and preparation method thereof

The invention relates to an aluminum alloy material which is characterized in that the aluminum alloy material comprises the following components by weight percent: 0.16-1.2% of Fe, 0.001-0.8% of Cu, 0.001-0.8% of Mg, 0.001-0.8% of Zn, 0.001-0.8% of Ca, 0.001-1.0% of rare-earth elements, a trace amount of strontium, titanium, boron, nickel, chromium, zirconium, vanadium, beryllium, cobalt, lead, tin, bismuth, molybdenum, silver, indium, niobium and barium and the balance of aluminum. The alloy has excellent mechanical strength, processing performance and corrosion resistance and is suitable for the cable armored sheath.
Owner:GUANGDONG XINYI ALUMINUM ALLOY CABLE

Chemical manufacture of nanostructured materials

A low temperature chemical route to efficiently produce nanomaterials is described. The nanomaterials are synthesized by intercalating ions into layered compounds, exfoliating to create individual layers and then sonicating to produce nanotubes, nanorods, nanoscrolls and / or nanosheets. It is applicable to various different layered inorganic compounds (for example, bismuth selenides / tellurides, graphite, and other metal complexes, particularly transition metal dichalcogenides compounds including oxygen, sulfur, tellurium or selenium).
Owner:RGT UNIV OF CALIFORNIA

Polymer nanocomposite implants with enhanced transparency and mechanical properties for administration within humans or animals

Polymer nanocomposite implants with nanofillers and additives are described. The nanofillers described can be any composition with the preferred composition being those composing barium, bismuth, cerium, dysprosium, europium, gadolinium, hafnium, indium, lanthanum, neodymium, niobium, praseodymium, strontium, tantalum, tin, tungsten, ytterbium, yttrium, zinc, and zirconium. The additives can be of any composition with the preferred form being inorganic nanopowders comprising aluminum, calcium, gallium, iron, lithium, magnesium, silicon, sodium, strontium, titanium. Such nanocomposites are particularly useful as materials for biological use in applications such as drug delivery, biomed devices, bone or dental implants.
Owner:PPG IND OHIO INC

Thermoelectric and Pyroelectric Energy Conversion Devices

New thermoelectric materials and devices are disclosed for application to high efficiency thermoelectric power generation. New functional materials based on oxides, rare-earth-oxides, rare-earth-nitrides, rare-earth phosphides, copper-rare-earth oxides, silicon-rare-earth-oxides, germanium-rare-earth-oxides and bismuth rare-earth-oxides are disclosed. Addition of nitrogen and phosphorus are disclosed to optimize the oxide material properties for thermoelectric conversion efficiency. New devices based on bulk and multilayer thermoelectric materials are described. New devices based on bulk and multilayer thermoelectric materials using combinations of at least one of thermoelectric and pyroelectric and ferroelectric materials are described. Thermoelectric devices based on vertical pillar and planar architectures are disclosed. The advantage of the planar thermoelectric effect allows utility for large area applications and is scalable for large scale power generation plants.
Owner:TRANSLUCENT PHOTONICS +1

Thin film diode integrated with chalcogenide memory cell

An integrated programmable conductor memory cell and diode device in an integrated circuit comprises a diode and a glass electrolyte element, the glass electrolyte element having metal ions mixed or dissolved therein and being able to selectively form a conductive pathway under the influence of an applied voltage. In one embodiment, both the diode and the memory cell comprise a chalcogenide glass, such as germanium selenide (e.g., Ge2Se8 or Ge25Se75). The first diode element comprises a chalcogenide glass layer having a first conductivity type, the second diode element comprises a chalcogenide glass layer doped with an element such as bismuth and having a second conductivity type opposite to the first conductivity type and the memory cell comprises a chalcogenide glass element with silver ions therein. In another embodiment, the diode comprises silicon and there is a diffusion barrier layer between the diode and the chalcogenide glass memory element. Methods of fabricating integrated programmable conductor memory cell and diode devices are also disclosed.
Owner:OVONYX MEMORY TECH LLC

Mullite-aluminum titanate body and method for making same

This invention relates to a mullite-aluminum titanate body having a low coefficient of thermal expansion of less than 15×10−7 C−1, a high porosity of at least 38% by volume, a median pore diameter of at least 8 microns, and a narrow pore size distribution as characterized by the relation (d50-d10) / d50 being less than 0.50 corresponding to a high degree of interconnected porosity. The inventive ceramic body also contains at least 0.10% by weight metal oxide, the metal being either yttrium, calcium, bismuth, a lanthanide metal or combinations of thereof. The inventive ceramic body is particularly useful as a wall-flow filter for diesel exhaust. A method of fabrication is provided where the sintering temperature is between 1375°-1550° C.
Owner:CORNING INC

High performance lithium ion battery anode material lithium manganate and preparation method thereof

The invention provides a high performance lithium ion battery anode material lithium manganate and a preparation method of the material. The lithium manganate is a doped lithium manganate LiMn2-yXy04 which is doped with one kind or a plurality of other metal elements X, wherein X element is at least one kind selected form the group of aluminium, lithium, fluorine, silver, copper, chromium, zinc, titanium, bismuth, germanium, gallium, zirconium, stannum, silicon, cobalt, nickel, vanadium, magnesium, calcium, strontium, barium and rare earth elements lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium, and y is larger than 0 but less than or equal to 0.11. The lithium ion battery anode material lithium manganate provided in the invention has extraordinary charge and discharge cycle performance both in the environments of normal temperature and high temperature. According to the invention, the preparation method of the material is a solid phase method, the operation is simple and controllable and the cost is low so that it is easy to realize large-scale productions.
Owner:INST OF PROCESS ENG CHINESE ACAD OF SCI

Plating bath and process for depositing alloy containing tin and copper

The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
Owner:ISHIHARA CHEM +1

Copper bismuth catalyst and preparation method thereof

The invention relates to a copper bismuth catalyst for combining chemically into 1, 4-butynediol with formaldehyde and ethyne and a preparation method thereof. The preparation method comprises the following steps of: preparing mixed solution which contains copper salt, bismuth salt, magnesium salt and dispersant; dropping alcoholic solution with an organic silicon source into the mixed solution; adjusting a pH value of the mixed solution with alkaline solution to obtain mixed precipitate; and further aging, washing, drying and baking in inert atmosphere to obtain the copper bismuth catalyst with C-MgO-SiO2 a carrier, in the catalyst, the content of CuO accounts for 25-50 weight percent, and the content of Bi2O3 accounts for 2-6 weight percent. The catalyst is applied in a reaction of combining chemically into 1, 4-butynediol with formaldehyde and ethyne, and has high catalytic activity and high selectivity.
Owner:SHANXI UNIV

Nanostructures synthesized using anodic aluminum oxide

This invention provides ways to fabricate nanotubes and nanobead arrays by utilizing nanopores in anodic aluminum oxide (AAO) membranes. Nanotubes of bismuth and other low melting point metals with controlled diameters and lengths can be fabricated by sintering AAO coated with appropriate metals at temperatures above their melting points. Carbon nanotubes may also be readily formed by carbonizing a polymer on the interior walls of the nanopores in AAO membranes. Palladium nanobead arrays which can be used as ultrafast hydrogen sensors are fabricated by coating the flat surface of AAO membranes with controlled pore-wall ratios.
Owner:UCHICAGO ARGONNE LLC

Composite visible light catalyst of g-C3N4/bismuth-based oxide and preparation method and application of composite visible light catalyst

The invention discloses a composite visible light catalyst of a g-C3N4 / bismuth-based oxide and a preparation method and an application of the composite visible light catalyst. Carbon nitride in the composite light catalyst is graphite-phase carbon nitride; and the bismuth-based oxide is more than one of Bi2O2CO3, BiOBr, BiOCl, Bi2WO6, BiVO4 and BiOI. The components of the obtained composite catalyst are tight in contact, so that separation of photo electron-hole pairs is facilitated, and the photocatalytic efficiency is also improved; the composite catalyst has good degradation efficiency on organic pollutants represented by methyl orange under sunlight illumination; the preparation method disclosed by the invention has the characteristics of being simple in process, simple and convenient to operate, and cheap in raw materials; the prepared composite catalyst can be widely applied to waste water treatment, atmospheric purification and the like; and a new concept is provided for design of the novel composite visible light catalyst by the preparation method.
Owner:JIHE SMART URBAN TECH (GUANGZHOU) CO LTD

Metal/thiol biocides

A composition described wherein bismuth is chelated by a complexing agent such as a pyrithione or certain other thiol compounds in the form a metal:complexing agent complex. Methods for using the composition as a bacteriocidal, bacteriostatic, antibiofilm, antifungal, and antiviral agent and as a disinfectant and preservative are also provided.
Owner:WINTHROP UNIV HOSPITAL

Lead-free free-cutting copper alloys

A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.0 percent, by weight, of silicon; and at least one element selected from among 0.02 to 0.4 percent, by weight, of bismuth, 0.02 to 0.4 percent, by weight, of tellurium, and 0.02 to 0.4 percent, by weight, of selenium. The alloy also preferable has at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminum, and 0.02 to 0.25 percent, by weight, of phosphorus. In further embodiments, the alloy has at least one element selected from among 0.02 to 0.15 percent, by weight, of antimony, and 0.02 to 0.15 percent, by weight, of arsenic.
Owner:MITSUBISHI SHINDOH CO LTD

Multiple hazard protection articles and methods for making them

Articles, including fabrics and film layers, are disclosed which can protect against multiple hazards, including radiation, chemical, biological agents, metal projectiles and fire hazards. In some embodiments, the fabrics and films of the present invention are used to produce garments having protection against multiple hazards and superior heat dissipating properties. A radiation protective compound is preferably created by mixing a radiopaque material, such as barium, bismuth, tungsten or their compounds, with powdered polymer, pelletized polymer or a liquid solution, emulsion or suspension of a polymer in solvent or water. This radiation protective mixture can then be laminated or otherwise adhered to other types of protective films or fabric, such as the protective polymer films or fabrics used for chemical protective garments, biological protective garments, bullet proof vests or fire retardant garments. The principles of this invention can also be applied to a broad range of other articles including surgical hoods, hospital gowns, gloves, patient drapes, partitions, coverings, jumpsuits, ponchos, uniforms, fatigues, tents, probes, envelopes, pouches, wallpaper, liners, drywall, house sidings, house foundations, house roofings etc.
Owner:MERIDIAN RES & DEV

Aluminum alloy for preparing hydrogen by hydrolytic decomposition and preparation thereof

InactiveCN101289163ALower the hydrolysis reaction temperatureImprove electrochemical activityHydrogen productionDecompositionReaction rate
The invention relates to a hydrogen preparation method by hydrolyzing aluminum alloy, in particular to an aluminum alloy which can be hydrolyzed to make hydrogen and a preparation method thereof. The alloy consists of simple-substance metal aluminum, metal bismuth, metals with low melting point and water-soluble compound; according to weight percentage, the content of the metal bismuth is 8 to 50 percent, low melting point metal is 0 to 15 percent, water soluble compound is 1 to 40 percent and metal aluminum is 40 to 90 percent. The method of the invention reduces reaction temperature of aluminum hydrolysis, speeds up reaction rate of aluminum hydrolysis, enhances hydrogen yield rate, simplifies reaction devices as well as reduces hydrogen storage cost. The aluminum alloy prepared by the method of the invention is portable easily, is capable of preparing and providing hydrogen at any time and is applicable to providing humid hydrogen for fuel cells.
Owner:DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI

Low-Melting Lead-Free Bismuth Sealing Glasses

Glasses comprising Bi203, ZnO B203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and MEMS devices. Glass frit and paste compositions suitable for flow and bonding to various substrates—glass, metal, silicon, in the temperature range of 400-500 degrees Centigrade. The broad compositional range in mole % is 25-70% Bi203, up to 65% ZnO, and 1-70% B203. Such glasses do not have batched in alumina or silica. Such glasses lack alumina and silica.
Owner:FERRO CORP

Catalyst for preparing 1, 4-butynediol and preparation method thereof

The invention discloses a catalyst for preparing 1, 4-butynediol and a preparation method of the catalyst for preparing 1, 4-butynediol. According to the method, acidized nano-silica is adopted as a carrier, the adopted nano-silica has a large outer specific surface, a dipping method and a deposition-precipitation method are used for adsorbing copper and bismuth on the carrier, so that the catalyst comprises 35-65% of copper oxide by mass, and meanwhile silica sol is added, so that the catalyst is more stable and abrasion resistant. The prepared catalyst is good in activity, high in selectivity and strength, not prone to pulverizing in the process of using and capable of keeping high activity.
Owner:大连瑞克科技股份有限公司

Method for forming reflowed solder ball with low melting point metal cap

InactiveUS6344234B1Reduce the hole diameterMinimal diameterFinal product manufactureSemiconductor/solid-state device detailsTinningIndium
A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.
Owner:ULTRATECH INT INC

Low toxicity primer compositions for reduced energy ammunition

A primer composition with reduced toxicity suited for reduced-energy ammunition comprises bismuth (III) oxide as the principal oxidizer and contains a portion of propellant composition mixed therein. This composition may also be used in a cartridge which is otherwise substantially free of any other propellant compound and preferably produces a residue which is substantially free of toxic substances.
Owner:GENERAL DYNAMICS ORDNANCE & TACTICAL SYST CANADA VALLEYFIELD INC

Polyurethane reaction system having a blocked catalyst combination

Disclosed is a polyol / polyisocyanate adhesive system having an isocyanate component and a catalyzed component which form a heat-cured composition when admixed and heated above a threshold temperature. The catalyzed component has a hydroxyl-functional component catalyzed with a catalyst combination of a heat-activatable amine or amine-like catalyst which is activated at temperatures above the threshold temperature, and an activatable complexed metal catalyst comprising the reaction product of tin or bismuth catalysts, or a mixture thereof, and a molar excess of a mercapto compound complexing agent. The catalyst combination is effective to maintain the processibility of the system at ambient temperatures while promoting the rapid cure of the system when heated above the threshold temperature.
Owner:ASHLAND LICENSING & INTPROP LLC

Thermoelectric material and thermoelectric converting element using the same

Compounds are expressed by general formula of AxBC2-y where 0<=x<=2 and 0<=y<1, and have CdI2 analogous layer structures; A-site is occupied by at least one element selected from the group consisting of Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Ir, Pt, Au, Sc, rare earth elements containing Y, B, Al, Ga, In, Tl, Sn, Pb and Bi; B-site is occupied by at least one element selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, Ir, and Sn; C-site is occupied by at least one element selected from the group consisting of S, Se and Te; the compounds exhibit large figure of merit so as to be preferable for thermoelectric generator / refrigerator.
Owner:NEC CORP

Preparation of supported catalyst for 1,4-butynediol

The invention relates to preparation of a supported catalyst for 1,4-butynediol. The supported catalyst used is characterized in that a mesoporous molecular sieve is used as a carrier, and soluble copper salt and bismuth are loaded on the carrier by an impregnation method so that the mass content of copper in the catalyst is 15-30%, and the mass content of bismuth is 1-6%. In the prepared catalyst, the particle size of copper oxide is 10-80nm, and the bismuth oxide is amorphous powder; the copper oxide and the bismuth oxide are uniformly distributed on the carrier and interact with the carrier; and the catalyst has high activity and high selectivity in producing 1,4-butynediol through an alkyne hydroformylation reaction, is more stable and wear-resistant than similar catalysts, and saves copper resources.
Owner:XINJIANG UNIVERSITY

Bismuth layered perovskite-like structure oxide up-conversion luminescent piezoelectric material and preparation method thereof

The invention relates to an infrared-excited oxide up-conversion luminescence piezoelectric material of a bismuth lamellar perovskite-like structure and a preparation method thereof. The up-conversion luminescence piezoelectric material has a chemical general formula of Am-1-x-RxYbyBi2BmO3M<+3>, wherein R is selected from Er<3+>, Ho<3+> and Tm<3+>, A is selected from Bi<3>, Ca<2+>, Sr<2+>, Ba<2+>, Pb<2+>, Na<+>, K<+>, La<3+> and Y<3+>, B is selected from Ti<4+>, Zr<4+>, Nb<5+>, Ta<5+>, W<6+> and Mo<6+>, m is a positive integer not smaller than 2 and not more than 8, x is not smaller than 0.000001 and not more than 0.3, and y is not smaller than 3.0 and not more than 0.6. The up-conversion luminescence piezoelectric material is prepared by adopting a solid-phase reaction method, has the characteristics of good thermal stability, good chemical stability, easiness for synthesis, high luminous intensity and adjustable color, and can be widely applied to various aspects such as three-dimensional display, infrared detection, counterfeiting prevention, solar cells and photoelectric integration, micro-electro-mechanical systems, photoelectric sensing and the like.
Owner:TONGJI UNIV

Lead-free and cadmium-free electrode silver slurry for piezoelectric ceramics and preparation method thereof

The invention discloses a lead-free and cadmium-free electrode silver slurry for piezoelectric ceramics. The lead-free and cadmium-free electrode silver slurry for piezoelectric ceramics is prepared from the following raw materials in percentage by weight: 50 to 75 percent of conducting silver micro powder, 0.5 to 5 percent of inorganic additive, 1 to 15 percent of lead-free glass powder and 15 to 45 percent of organic carrier. The lead-free and cadmium-free electrode silver slurry is technologically advantaged in that a boron-bismuth-silicon-zinc-titanium glass system is designed, the traditional lead-containing glass can be completely substituted, a lead-free product is realized, the system glass can react with a piezoelectric ceramic substrate to form a firm interface between an electrode and the substrate, and the adhesion force of the interface is more than 15N / mm<2>.
Owner:HEFEI SHENGDA ELECTRONIC TECH IND CO LTD

Electronic Package Formed Using Low-Temperature Active Solder Including Indium, Bismuth, and/or Cadmium

InactiveUS20070228109A1Increase concentrationHigh-strength, high-thermal conductivity jointsCooking-vessel materialsExhaust apparatusIndiumNiobium
An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, or tantalum; between about 0.1 and 5% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); between about 0.01 and 1% by weight of gallium up to about 10% by weight of silver; up to about 2% by weight of magnesium; and a remainder consisting of tin, bismuth, indium, cadmium, or a mixture of two or more of these elements. The alloy enables low-temperature (less than about 180° C.) soldering within relatively narrow melting ranges (less than about 10° C.).
Owner:S BOND TECH
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