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97705results about How to "Improve cooling effect" patented technology

Multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric, preparation method and application

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g/m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.
Owner:DONGHUA UNIV

Fire-proof and heat-insulating composite fabric with multi-stage expansion and heat dissipation, preparation method and application

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.
Owner:DONGHUA UNIV

Semiconductor package and method for fabricating the same

Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input / output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input / output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD
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