19782 results about "Heat conducting" patented technology

A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate. The wiring board is produced inexpensively by co-firing, features excellent heat-radiating performance, is capable of quickly radiating the heat from the light-emitting element when the light-emitting element is mounted, and effectively prevents a decrease in the brightness of the light-emitting element caused by the heat.

A portable personal headlamp utilizes an array of light-emitting diodes on the front face of a circuit board. Arc-shaped projections on the front face of a finned heat sink are in heat-conducting relationship with printed conductors on the rear face of the circuit board, which partially surround one lead of each light-emitting diode.

In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board. The isothermal board is fixed onto a frame body of the LED lamp and has two planes separately attached onto the heat receiving end and the LED module, so as to significantly enhance the overall heat conducting and dissipating performance, drive an LED to emit light at a lower temperature, and extend the life expectancy of the LED.

An example of this light bulb has a light emitting element (which may be an LED array) mounted on a circuit board. The circuit board is mounted on one end of a heat-conducting frame. An Edison screw or other suitable connector, for attaching the light bulb electrically and mechanically to a receptacle, is mounted on the other end of the frame. A transparent phosphor-coated ball has a flat chord face optically bonded to said array. A light-permeable globular enclosure is mounted on the frame, surrounding the ball and both homogenizing the white light output of the bulb but also concealing the yellowing unlit appearance of the remote phosphor ball centrally located within it.

A lamp with heat conducting structure includes a lamp cover made of heat dissipating material. The lamp cover has a hollow configuration therein. An interlayer is horizontally arranged in the lamp cover. The lamp cover is divided into a first space and a second space therein by the interlayer. A LED lamp assembly is disposed in the first space of the lamp cover. A power plug is disposed in the second space of the lamp cover. The power plug has a control circuit board in the second space. The control circuit board has an electronic element disposed thereon. A heat conducting tab protrudes from the interlayer of the lamp cover towards the second space. The heat conducting tab has a heat conducting surface corresponding to the electronic element to thermally contact with the electronic element.

The invention relates to a preparation method of a graphene heat conducting membrane. The method comprises the following steps: filtrating or coating graphene oxide dispersed in a solvent to obtain a graphene oxide membrane; then, reducing the graphene oxide membrane at a high temperature to obtain the graphene heat conducting membrane. The preparation method of the graphene heat conducting membrane, provided by the invention, is simple in technique, simple in operation and easy in control on conditions, and the graphene heat conducting membrane provided by the invention is controllable in shape, size and thickness and relatively high in heat conductivity.

An electro-optic display comprises a layer of reflective electro-optic material capable of changing its optical state on application of an electric field, an electrode, a heat generating component in heat conducting relationship with the electro-optic material, and a heat shield disposed between the heat generating component and the electro-optic material, the heat shield comprising a layer of thermally insulating material and a layer of thermally conducting material, the thermally conducting material being disposed between the thermally insulating material and the electro-optic material. The invention also provides an electrophoretic medium comprising a suspending fluid and a plurality of electrically charged particles suspended in the suspending fluid and capable of moving therethrough upon application of an electrical field to the electrophoretic medium, the suspending fluid containing a compatibilizer to reduce its coefficient of thermal expansion.

A backing material for suppressing the surface temperature rise of an ultrasonic probe. This backing material is provided on a back face of at least one vibrator for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, and includes: a backing base material containing a polymeric material; and a heat conducting fiber provided in the backing base material, having a larger coefficient of thermal conductivity than that of the backing base material, and running through without disconnection from a first face of the backing material in contact with the at least one vibrator to a second face different from the first face.

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets.

This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.

This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.

The invention relates to a conductive heat-conductive graphene slurry and a coating. The conductive heat-conductive graphene slurry comprises the following raw materials: 0.1-90wt% of conductive heat-conductive graphene slurry ( consisting of 3-20wt% of less graphene, 0-80wt% of base solvent, 0-80wt% of base resin), 0-60wt% of filler, 0-10% of dispersing agent, 10-60wt% of resin, 10-60wt% of curing agent, and 30-70wt% of solvent, wherein not only can the graphene slurry be antistatic, conductive and heat-conducting despite of less addition amount, but also the surface of a coated article is smoother and finer, firmer and more durable; compared with the addition amount of the existing conductive material, the conductive heat-conductive graphene slurry is lower in addition amount and can also reach lower resistivity.

A modular thermoelectric cooling/heating unit is installed through an opening in a wall separating first and second temperature zones. This modular thermoelectric cooling/heating unit comprises a thermoelectric device including a cold surface, a hot surface, and a cooling/heating member between an electrical power supply and the cold and hot surfaces. A heat conducting block has a proximal end for thermally contacting with a first one of the cold and hot surfaces, and a distal end. A first heatsink thermally contacts with a second one of the cold and hot surfaces, a second heatsink thermally contacts with the distal end of the heat conducting block, and a thermally insulated housing covers at least a portion of the heat conducting block between the proximal and distal ends of this block. In operation, the first heatsink is located in the first temperature zone, at least a portion of the heat conducting block and the thermally insulated housing extend through the wall opening, and the second heatsink is located in the second temperature zone. The above described modular thermoelectric cooling/heating unit can be used in a modular cooling system for retrofit into an existing refrigeration unit.

An ice coating is placed on the hypodermic needle to cool the flesh during insertion. The ice coated front end is sharp, for penetration. The ice coating can be formed by cooling the needle and dipping it in water or molding ice onto the needle. A refrigeration chamber or cryogenic chamber can be used to cool the needle. The mold for forming an ice coating can be cooled by a cryogenic fluid or refrigerant being conducted into coils of the mold surrounding heat conducting mold walls that are used to form the ice coating on the needle. The water can be sterilized with disinfectant included.

The invention discloses a halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and a preparation method thereof. The preparation method comprises: adding vinyl dimethicone, a reinforcing material, a heat-conducting filling material and a halogen-free flame retardant in a vacuum kneader, dehydrating and blending for 30-120 minutes at 100-150 DEG C and vacuum degree of 0.06-0.1MPa to obtain a base material, adding a cross-linking agent containing hydrogen silicone oil and a cross-linking inhibitor to the base material at the normal temperature, adequately agitating for 10-30 minutes to prepare a component A; adding a platinum catalyst to the base material, adequately agitating for 10-30 minutes to prepare a component B; taking the component A and the component B of the same parts by weight, blending uniformly, and deaerating for 5-10 minutes at the vacuum degree of 0.06-0.1MPa to obtain the halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive. The potting adhesive has good flow properties and convenient use and can be cured at the normal temperature or a high temperature, condensate has excellent flame retardant property and heat-conducting property, and the potting adhesive can be widely applied to the fields of electronic electric appliance, chip encapsulation and LED encapsulation, and the like.

A temperature-controlled appliance is provided with mutually-independent temperature-controlled compartments arranged close to each other. Each of the compartments comprises a casing formed of a heat-insulating layer, a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite a storage space in the casing, a Peltier device thermally connected with the thermal conductor, a power supply for feeding electric power to the Peltier device, and a controller for controlling electric power to be fed to the Peltier device so that a temperature in the casing is controlled.