10595 results about "Heat conducting" patented technology

A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate. The wiring board is produced inexpensively by co-firing, features excellent heat-radiating performance, is capable of quickly radiating the heat from the light-emitting element when the light-emitting element is mounted, and effectively prevents a decrease in the brightness of the light-emitting element caused by the heat.

A portable personal headlamp utilizes an array of light-emitting diodes on the front face of a circuit board. Arc-shaped projections on the front face of a finned heat sink are in heat-conducting relationship with printed conductors on the rear face of the circuit board, which partially surround one lead of each light-emitting diode.

In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board. The isothermal board is fixed onto a frame body of the LED lamp and has two planes separately attached onto the heat receiving end and the LED module, so as to significantly enhance the overall heat conducting and dissipating performance, drive an LED to emit light at a lower temperature, and extend the life expectancy of the LED.

An example of this light bulb has a light emitting element (which may be an LED array) mounted on a circuit board. The circuit board is mounted on one end of a heat-conducting frame. An Edison screw or other suitable connector, for attaching the light bulb electrically and mechanically to a receptacle, is mounted on the other end of the frame. A transparent phosphor-coated ball has a flat chord face optically bonded to said array. A light-permeable globular enclosure is mounted on the frame, surrounding the ball and both homogenizing the white light output of the bulb but also concealing the yellowing unlit appearance of the remote phosphor ball centrally located within it.

A lamp with heat conducting structure includes a lamp cover made of heat dissipating material. The lamp cover has a hollow configuration therein. An interlayer is horizontally arranged in the lamp cover. The lamp cover is divided into a first space and a second space therein by the interlayer. A LED lamp assembly is disposed in the first space of the lamp cover. A power plug is disposed in the second space of the lamp cover. The power plug has a control circuit board in the second space. The control circuit board has an electronic element disposed thereon. A heat conducting tab protrudes from the interlayer of the lamp cover towards the second space. The heat conducting tab has a heat conducting surface corresponding to the electronic element to thermally contact with the electronic element.

The invention relates to a preparation method of a graphene heat conducting membrane. The method comprises the following steps: filtrating or coating graphene oxide dispersed in a solvent to obtain a graphene oxide membrane; then, reducing the graphene oxide membrane at a high temperature to obtain the graphene heat conducting membrane. The preparation method of the graphene heat conducting membrane, provided by the invention, is simple in technique, simple in operation and easy in control on conditions, and the graphene heat conducting membrane provided by the invention is controllable in shape, size and thickness and relatively high in heat conductivity.

An electro-optic display comprises a layer of reflective electro-optic material capable of changing its optical state on application of an electric field, an electrode, a heat generating component in heat conducting relationship with the electro-optic material, and a heat shield disposed between the heat generating component and the electro-optic material, the heat shield comprising a layer of thermally insulating material and a layer of thermally conducting material, the thermally conducting material being disposed between the thermally insulating material and the electro-optic material. The invention also provides an electrophoretic medium comprising a suspending fluid and a plurality of electrically charged particles suspended in the suspending fluid and capable of moving therethrough upon application of an electrical field to the electrophoretic medium, the suspending fluid containing a compatibilizer to reduce its coefficient of thermal expansion.

A backing material for suppressing the surface temperature rise of an ultrasonic probe. This backing material is provided on a back face of at least one vibrator for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, and includes: a backing base material containing a polymeric material; and a heat conducting fiber provided in the backing base material, having a larger coefficient of thermal conductivity than that of the backing base material, and running through without disconnection from a first face of the backing material in contact with the at least one vibrator to a second face different from the first face.

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets.

This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.

This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.

The invention relates to a conductive heat-conductive graphene slurry and a coating. The conductive heat-conductive graphene slurry comprises the following raw materials: 0.1-90wt% of conductive heat-conductive graphene slurry ( consisting of 3-20wt% of less graphene, 0-80wt% of base solvent, 0-80wt% of base resin), 0-60wt% of filler, 0-10% of dispersing agent, 10-60wt% of resin, 10-60wt% of curing agent, and 30-70wt% of solvent, wherein not only can the graphene slurry be antistatic, conductive and heat-conducting despite of less addition amount, but also the surface of a coated article is smoother and finer, firmer and more durable; compared with the addition amount of the existing conductive material, the conductive heat-conductive graphene slurry is lower in addition amount and can also reach lower resistivity.

A modular thermoelectric cooling/heating unit is installed through an opening in a wall separating first and second temperature zones. This modular thermoelectric cooling/heating unit comprises a thermoelectric device including a cold surface, a hot surface, and a cooling/heating member between an electrical power supply and the cold and hot surfaces. A heat conducting block has a proximal end for thermally contacting with a first one of the cold and hot surfaces, and a distal end. A first heatsink thermally contacts with a second one of the cold and hot surfaces, a second heatsink thermally contacts with the distal end of the heat conducting block, and a thermally insulated housing covers at least a portion of the heat conducting block between the proximal and distal ends of this block. In operation, the first heatsink is located in the first temperature zone, at least a portion of the heat conducting block and the thermally insulated housing extend through the wall opening, and the second heatsink is located in the second temperature zone. The above described modular thermoelectric cooling/heating unit can be used in a modular cooling system for retrofit into an existing refrigeration unit.

An ice coating is placed on the hypodermic needle to cool the flesh during insertion. The ice coated front end is sharp, for penetration. The ice coating can be formed by cooling the needle and dipping it in water or molding ice onto the needle. A refrigeration chamber or cryogenic chamber can be used to cool the needle. The mold for forming an ice coating can be cooled by a cryogenic fluid or refrigerant being conducted into coils of the mold surrounding heat conducting mold walls that are used to form the ice coating on the needle. The water can be sterilized with disinfectant included.

The invention discloses a halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and a preparation method thereof. The preparation method comprises: adding vinyl dimethicone, a reinforcing material, a heat-conducting filling material and a halogen-free flame retardant in a vacuum kneader, dehydrating and blending for 30-120 minutes at 100-150 DEG C and vacuum degree of 0.06-0.1MPa to obtain a base material, adding a cross-linking agent containing hydrogen silicone oil and a cross-linking inhibitor to the base material at the normal temperature, adequately agitating for 10-30 minutes to prepare a component A; adding a platinum catalyst to the base material, adequately agitating for 10-30 minutes to prepare a component B; taking the component A and the component B of the same parts by weight, blending uniformly, and deaerating for 5-10 minutes at the vacuum degree of 0.06-0.1MPa to obtain the halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive. The potting adhesive has good flow properties and convenient use and can be cured at the normal temperature or a high temperature, condensate has excellent flame retardant property and heat-conducting property, and the potting adhesive can be widely applied to the fields of electronic electric appliance, chip encapsulation and LED encapsulation, and the like.

A temperature-controlled appliance is provided with mutually-independent temperature-controlled compartments arranged close to each other. Each of the compartments comprises a casing formed of a heat-insulating layer, a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite a storage space in the casing, a Peltier device thermally connected with the thermal conductor, a power supply for feeding electric power to the Peltier device, and a controller for controlling electric power to be fed to the Peltier device so that a temperature in the casing is controlled.

A flow-through muffler includes a plurality of heat conducting walls, baffles, or partitions that together define a plurality of passages arranged to form acoustic waveguides, attenuators, and/or cancellation chambers, the walls, baffles, or partitions increasing a surface area exposed to the exhaust gases to facilitate extraction of heat while attenuating or canceling the resulting sound pressure waves. The muffler may have a cooling arrangement mounted thereon, and thermoelectric generator elements or other heat-powered device, such as a reformer, connected across the heat differential between the cooling arrangement and an exterior surface of the muffler housing that is in thermal contact with the heat conducting walls, bafflers, or partitions. In addition, the muffler may be made tuneable by providing a device for varying a length of one of the passages relative to another passage, and by including a sound cancellation chamber at an intersection of the passages. In addition, the internal surfaces of the muffler may be coated with a catalyst to provide a combination muffler and catalytic converter.

A plurality of lighting units using light emitting diodes as light sources is accommodated in a lamp housing in such a state as to be supported on a common metallic support member provided tiltably. When a part or all of the lighting units are turned on, the light emitting diodes generate heat with a light emission. These light emitting diodes are supported on the common metallic support member. Also in the case in which any of the lighting units is turned on, therefore, the heat generated by the light emitting diodes is moved to the metallic support member having a large heat capacity through boards and light source support blocks by a heat conducting function. Consequently, a rise in the temperatures of the light emitting diodes can be suppressed.

The invention discloses a heat-conducting silicone grease composition which mainly consists of organic silicone oil, a silicane coupling agent and heat-conducting powder, wherein the silicane coupling agent covers the surface of the heat-conducting powder; the heat-conducting powder is prepared from powders with larger, intermediate and small diameters; and the concerned metal powder is subjected to heat treatment to form an oxide film on the surface of the metal powder. The heat-conducting silicone grease composition has high heat conductivity and good fluidity; secondarily, the heat-conducting silicone grease composition has high temperature resistance and can keep good heat conductivity and fluidity at 250 DEG C; additionally, the heat-conducting silicone grease composition requires no refrigeration and has the advantages of simplified storage and operation flows and high reliability.

To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The vehicular power converter includes a power circuit section provided with a switching element; a control circuit section for controlling the switching element; and a housing for accommodating the power circuit section and the control circuit section, wherein a first heat conducting layer intervenes between a base plate having a first heat exchange section for cooling the power circuit section and the power circuit section; a second heat conducting layer intervenes between a cover having a second heat exchange section for cooling the control circuit section and the control circuit section; and the first heat exchange section and the second heat exchange section are disposed on one main surface side and on the other main surface side of an outer circumferential surface part of the housing, respectively.

A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.

A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.

The invention relates to a method for preparing polyacrylonitrile-based carbon fiber with reinforced carbon nanometer tubes, which comprises the following steps: respectively dispersing and dissolving carbon nanometer tubes (CNT) and polyacrylonitrile (PAN) in dissolvent, obtaining PAN/CNT spinning solution through mixing the solution, obtaining PAN/CNT fiber through carrying out the wet-spinning method to the solution, then carrying out pre-oxidation and carbonization to the wet-spinning fiber to prepare the carbon fiber with reinforced carbon nanometer tubes. The mechanical property of the carbon fiber which is prepared by the method of the invention is obviously improved, and the prepared carbon fiber can be applied to the fields of reinforcing materials, conducting, electrostatic resistance, heat conducting and the like.

An LED lamp assembly includes a first heat sink, a plurality of second heat sinks secured to a periphery of the first heat sink, a plurality of LED modules respectively attached to the second heat sinks and a plurality of heat pipes interconnecting the first heat sink and the second heat sinks. The first heat sink comprises a heat conducting body defining a through hole therein and a plurality of first fins around the heat conducting body. The second heat sinks each comprise a plurality of second fins facing the first fins of the first heat sink. The heat pipes each comprise an evaporating section attached to a corresponding second heat sink and a condensing section extending into the through hole of the heat conducting body of the first heat sink and attached to the heat conducting body.

The invention discloses a thermal management system and a thermal management method of a battery pack of an electric automobile. The thermal management system comprises the battery pack and further comprises a water pump, wherein the battery pack comprises a cooling plate for cooling liquid to flow circularly; the water pump is connected with the battery pack; the water pump is connected to a water inlet of a three-way valve; each of two water outlets of the three-way valve is connected with a PTC (Positive Temperature Coefficient) heater and a radiator; the PTC heaters and the radiators are connected on the battery pack; and all components mentioned above are connected with one another through cooling liquid pipelines. The thermal management system disclosed by the invention is a feasible and reliable thermal management structure by which the battery pack is cooled in a way of liquid cooling, wherein heat of batteries is taken away by the cooling plate, and isolation of the cooling plate from the batteries is achieved by adopting a heat-conducting insulation board; in addition, radiating and cooling abilities of the entire battery pack are achieved by employing the water pump, the radiators, the PTC heaters, etc.

A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

The invention discloses a high-heat-conductivity rubber composite material and a preparation method of the high-heat-conductivity rubber composite material. The high-heat-conductivity rubber composite material consists of the following ingredients in parts by mass: 100 of rubber, 4 to 6 of zinc oxide, 1 to 3 of stearic acid, 1 to 2 of anti-aging agents, 40 to 60 of carbon black, 1 to 1.5 of promoters, 1 to 3 of sulphur and 50 to 170 of heat conducting agents. The manufacture method comprises the following process steps that: the rubber is added into an open mill, the zinc oxide, the stearic acid, the anti-aging agents, the promoters, the carbon black and the heat conducting agents are sequentially added after the roll recovering, and finally, the sulphur is added. After rubber materials are uniformly mixed, the thin conduction is carried out, triangle bag packing and rolling are respectively carried out for five times, and the roll distance is regulated to 1.5mm for sheet output. The material sheets are placed into a mold, the vulcanization is carried out on a flat plate vulcanization machine, the vulcanization time is 15 to 20 minutes, the vulcanization temperature is 160 to 165 DEG C, and the vulcanization pressure is 10 to 12MPa. The material disclosed by the invention has an excellent physical and mechanical property and a high heat conduction factor.

A multiple-set heat-dissipating structure for a LED lamp for performing the heat dissipation of the LED set includes a heat-conducting base, a plurality of heat pipes and a plurality of heat-dissipating bodies. On end face of the heat-conducting base is used for adhering to and contacting with the LED set. Each heat pipe has a heat-absorbing end and a heat-releasing end, respectively. The heat-absorbing end is connected to the other end face of the heat-conducting base. Each heat-dissipating body has a hollow cylinder. The outer periphery of the cylinder is formed with a plurality of radial heat-dissipating pieces and is connected on the heat-releasing end of each heat pipe. By dispersing each heat pipe and heat-dissipating body, the heat generated by the operation of the LED set can be conducted and dissipated by each heat pipe and heat-dissipating body at multiple points. In this way, the LED set can be continuously operated under a suitable working temperature and thus its life can be elongated.

The invention discloses an aluminum alloy and a preparation method and application thereof. The aluminum alloy comprises the following components in percentage by weight: 4-9% of silicon, 0.5-1.5% of copper, 0.3-1% of iron, 0-0.1% of rare earth elements, 0-0.3% of titanium, 0-0.5% of magnesium, 0-0.05% of boron, 0-0.1% of manganese, 0-0.1% of zirconium, 0-0.1% of chromium, 0-10% of zinc, 0-0.05% of strontium, 0-0.1% of lithium, 0-0.005% of vanadium, and 77.095-95.2% of aluminum. The aluminum alloy, provided by the invention, is excellent in comprehensive mechanical performance, higher in strength and hardness and higher in ductility, and can be machined to structural elements having various shapes and thicknesses. Above all, the aluminum alloy, provided by the invention, is excellent in heat conductivity. The aluminum alloy, provided by the invention, is suitable for serving as a structural material having higher requirements on the heat conducting performance, and in particular, is suitable for serving as a structural part of an electronic product.

The invention is concerned with new approaches to cooling processing equipment in data centers. A cooling system is described herein that is suitable for cooling processing equipment in data centers. The cooling system includes a vertical conduit carrying a cooling liquid and an array of elongate heat conducting elements, such as heat pipes, extending laterally outwardly from the conduit. An inner end portion of each heat conducting element is in thermal contact with cooling liquid flowing in the conduit and an outer end portion of each heat conducting element is adapted for conductive thermal contact with at least one heat producing electronic component.

An LED light source using back-reflecting collection optics with a supporting structure and heat sink to block only a small amount of light. A reflector has a front and back side with an LED positioned on the front side of the reflector. A heat conducting body is positioned at least partially between the reflector and the LED. The heat conducting body provides a pathway for heat to flow from the LED toward the back side of the reflector.