2548 results about "Heat conducting" patented technology

The invention relates to the technical field of temperature control, in particular to an enzyme reaction kettle self-adaptive temperature control system and method, and the system comprises a temperature detection module, a temperature control module, a heat conduction oil flow control module and an automatic regulation and control module; temperature data of a reaction kettle are collected in real time through a temperature detection module, a temperature control module adjusts parameters based on a PID algorithm and fuzzy logic to generate a control instruction, and a heat conduction oil flow control module adjusts flow by combining double-closed-loop cascade control with a feedforward compensation algorithm, so that thermal inertia lag is shortened. And the automatic regulation and control module generates optimized process parameters based on a reaction kinetic model and a genetic algorithm, and dynamically adjusts a temperature set value. The control method comprises the steps of temperature data acquisition, PID control instruction generation, conduction oil flow coordinated regulation, process parameter optimization and the like. The problems that in the prior art, temperature control precision is insufficient, conduction oil flow control is not accurate enough, and technological parameters cannot be automatically regulated and controlled are solved.

The invention relates to an electrical / electronic component (10) for a motor vehicle, comprising a housing (12) enclosing a receiving space (14), at least one electrical or electronic component (16) which is received in the receiving space (14), a heat conducting element (18) which is arranged on a surface of the component (16) to be cooled and is designed to conduct heat away from the component (16), and a coolant guide device (20) which is configured to guide a dielectric coolant (22) to the heat conducting element (18), whereby the heat conducting element (18) can be exposed to and surrounded by the coolant (22), whereby heat can be transferred from the heat conducting element (18) to the coolant (22).

The present disclosure discloses a depilator including a cold compressing portion, a heat sink assembly and a heat conducting plate which are located away from the cold compressing portion. The heat conducting plate includes a main heat absorbing portion and a heat outputting portion. The main heat absorbing portion is in contact with the cold compressing portion, to absorb heat of the cold compressing portion. The heat outputting portion is in contact with the heat sink assembly, to conduct the heat to the heat sink assembly. The depilator defines a cooling channel. The depilator comprises a housing; the housing defines at least one cooling inlet and at least one cooling outlet; the cooling channel is formed between the at least one cooling inlet and the at least one cooling outlet; the heat of the heat sink assembly is dissipated through the cooling channel and the at least one cooling outlet.

The embodiment of the invention discloses a double-sided packaging structure, a power supply device and electronic equipment. The power devices are arranged on the two side plate surfaces of the PCB substrate of the double-face packaging structure, and the heat conduction piece is inserted into the PCB substrate and packaged to form a packaging body. The packaging body comprises a heat dissipation surface, and the heat dissipation surface is opposite to one side plate surface of the PCB substrate. The PCB substrate is provided with a via hole and a through hole which are connected through a copper foil, the via hole is at least connected with a power device arranged on the other side plate surface of the PCB substrate, the heat conduction piece is inserted into the through hole, and one end of the heat conduction piece extends to the heat dissipation surface of the packaging body. Through the arrangement, the power device on the non-heat-dissipation surface side can be led out through a low-heat-resistance heat dissipation path formed by the via hole, the copper foil, the through hole and the heat conduction piece in sequence, and the heat dissipation performance of the power device on the non-heat-dissipation surface side is effectively improved; meanwhile, based on the structural characteristics of the inserted heat conduction piece, the packaging width can be reduced, and the trend requirement of high-density layout is met.

The utility model discloses a single battery and a battery pack. The single battery comprises a core bag, a shell, electrodes and first heat-conducting glue, specifically, the shell comprises a shell sleeve and a cover plate, the core bag is contained in the shell sleeve, and the cover plate and the shell sleeve are connected to cover and seal the shell sleeve; the electrode comprises a pole and a pin which are electrically connected with each other, the pole is arranged on the cover plate, and one end, far away from the pole, of the pin extends to the length direction of the core package and is electrically connected with the core package; and the first heat-conducting glue is arranged between the pins and the inner surface of the shell sleeve. According to the single battery disclosed by the utility model, the heat of the core package can be quickly transferred to the shell through the first heat-conducting glue and then dissipated to the environment, so that the thermal runaway risk of the single battery is smaller.

The invention provides continuous hot-pressing equipment for producing a three-in-one outdoor jacket, which belongs to the technical field of outdoor jacket production and comprises a preheating conveying mechanism, a hot-pressing mechanism and a waste heat recovery mechanism. The preheating conveying mechanism pre-irons the outdoor jacket through a conveying belt and a high-temperature roller, and is matched with the airflow clothes opening assembly to automatically separate clothes bodies through upper and lower air suction nozzles and sleeve the clothes bodies to a clothes body opening rod, so that automatic operation is realized; the hot-pressing mechanism completes the compounding of multiple layers of materials through a hot-pressing plate with precise temperature control and an electric air cylinder; the waste heat recovery mechanism collects 180 DEG C hot air generated by hot pressing, heat is transferred to the roller through the water tank and the heat conducting plate, and energy recycling is achieved. The problems that in the prior art, an integral hot pressing plate is high in energy consumption, heat distribution is not flexible, waste gas is directly discharged, and manual sleeving efficiency is low are solved.

The utility model relates to the technical field of LED lamps, in particular to an LED lamp heat dissipation structure which comprises a mounting support, two sets of protective shells are arranged on the surface of the mounting support, the right protective shell is fixedly connected with the surface of the mounting support, the left protective shell is slidably connected with the surface of the mounting support, and a lamp strip body is arranged between the two sets of protective shells. A heat conducting sheet is fixedly connected to the interior of the protective shell, multiple sets of heat dissipation fins are fixedly connected to the surface, located on the outer side, of the heat conducting sheet, the surface, located on the inner side, of the heat conducting sheet abuts against the side face of the lamp strip body, the heat dissipation fins are inclined, and multiple sets of heat dissipation grooves are formed in the surface of the mounting support; part of heat generated by the lamp strip body is dissipated outwards through the heat dissipation grooves, part of the heat is conducted to the surfaces of the heat dissipation fins through the heat conduction pieces, the heat is dissipated under the action of external natural wind, the heat generated by the lamp strip body is reduced, and the use safety of the lamp strip body is effectively improved.

The invention relates to the field of cables, in particular to a safety cable connector with an anti-drop function, which comprises a female head, a connecting sleeve and a male head, the surface of the female head is connected with a connecting sleeve; the connecting sleeve is slidably connected with a male head, and the surface of the male head is fixedly connected with a plurality of guide strips; grooves corresponding to the guide strips are formed in the inner sides of the connecting sleeves, and magnetic attraction pieces capable of being matched with each other are arranged at the deepest positions of the grooves and the ends of the guide strips. A heat conducting ring and the like are also included; the contact column of the female head is fixedly connected with a heat conduction ring. When the contact column and the connecting ring are overloaded and generate heat abnormally, continuous heat is transmitted to the expansion ring through the heat conducting ring, the expansion ring is gradually extended rightwards after being heated, the expansion ring extrudes and pushes the round rod rightwards, then the round rod pushes the connecting disc and the connecting ring rightwards, the connecting disc slides along the inner side of the male head, and the male head is connected with the male head. And the circuit is cut off, so that continuous temperature rise is prevented, and a spontaneous combustion event is avoided.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a first shell, a heating element group, a fan and a heat dissipation module, the heating element set and the heat dissipation module are arranged in the first shell. The plurality of heating elements in the heating element group do not comprise a processor. And a fan is arranged on each of the two sides of the heating element group in the first shell. The positions, corresponding to the air inlets of the two fans, of the first shell are each provided with an air inlet area, and the air inlets communicate with the corresponding air inlet areas. A first air outlet of the fan faces the heating element set and is communicated with the first outlet. The heat dissipation module comprises a first heat pipe and a first heat conduction plate connected with the first heat pipe, the first heat pipe and the first heat conduction plate at least cover the heating elements in the middle area in the heating element set, and the two ends of the first heat pipe correspond to the first air outlets of the two fans respectively. According to the electronic equipment, all heating elements of a non-processor can be considered, so that the temperature of the surface of the electronic equipment is reduced.

The utility model relates to the technical field of air compressor heat recovery, and discloses a heat recovery pipeline device for a screw air compressor, which comprises a bottom plate, a shell and an air compressor main body, the shell is fixedly connected with the bottom plate, a support seat is arranged on one side of the shell, the air compressor main body is mounted at the upper end of the support seat through a fastener, and the air compressor main body is fixedly connected with the bottom plate. According to the air compressor, heat generated during working of the air compressor body is transmitted to the multiple sets of heat conducting fins below through the heat conducting blocks, and then the heat is effectively transmitted to gas passing through the spiral pipe through the multiple sets of heat conducting fins; then heated gas enters a heat conduction coil pipe through a conveying pipe and a gas inlet pipe, a motor drives a stirring column to rotate through an output shaft, multiple sets of stirring blades on the stirring column stir water, under cooperation of a plurality of threaded groove holes, flowing of the water in the water storage tank is accelerated, the water is fully heated, and the recovery efficiency is improved.

The invention relates to the field of polyurethane film materials for batteries, and discloses a TPU composite material for a new energy battery and a preparation method of the TPU composite material. A TPU composite material for a new energy battery is composed of a cloth film layer, an adhesive film layer and a TPU film layer, the TPU film layer is prepared by melting and casting TPU hot melt adhesive, and the TPU hot melt adhesive is prepared from the following raw materials in parts by weight: 60-80 parts of polyurethane elastomer, 20-30 parts of a toughening aid, 15-25 parts of a flame retardant, 8-15 parts of a heat conducting agent, 2-4 parts of a lubricant and 1-3 parts of an antioxidant; the toughening auxiliary agent is prepared from a POE (Polyolefin Elastomer), long carbon chain alkyl glycidyl ether, dibutyl itaconate and a vinyl dimethyl terminated dimethyl-methyl trifluoropropyl polysiloxane copolymer. The TPU composite material disclosed by the invention is applied to a new energy battery, has relatively good buffering and damping effects and puncture resistance, and is good in flame retardance and thermal conductivity.

The present invention discloses an inductance component, an electronic control component and an air conditioner. The inductance component includes: an inductor and a heat conducting member for conducting the heat of the inductor, the heat conducting member exchanges heat with the inductor, and the part of the heat conducting member in contact with the inductor is an insulating part. According to the inductance component of the present invention, by providing the heat conducting member, the heat conducting member can conduct the heat generated by the inductor, thereby preventing heat from accumulating in the inductor, playing a role in quickly dissipating heat from the inductor, and further ensuring the normal operation of the inductor.

The present application discloses a liquid cooling heat dissipation device and a control method, relating to the technical field of liquid cooling heat dissipation. The liquid cooling heat dissipation device includes a heat insulation cover, a heat conducting plate, a cooling structure and a control system. By arranging a plurality of heat conducting areas on the heat conducting plate, the partition management of heat is realized, and the pertinence and efficiency of heat dissipation are improved; a plurality of spraying areas are correspondingly arranged on the cooling structure, and each heat conducting area can be matched with at least one spraying area; a temperature detection mechanism is correspondingly arranged on each heat conducting area, which can monitor the temperature data of each heat conducting area in real time. By setting the control system to dynamically adjust and control the corresponding spraying area to spray an appropriate amount of coolant according to the temperature data of each heat conducting area, the technical problem that the uneven distribution of heat inside the server affects the overall efficiency of the heat dissipation system can be solved, the accurate and efficient cooling of the heat conducting area can be realized, and the accurate heat dissipation can be achieved according to the heat difference generated at different positions of the component to be cooled, and the technical effect of ensuring the uniformity of heat dissipation can be achieved.

The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting silica gel sheet and a preparation process thereof, and the heat-conducting silica gel sheet is prepared from the following components in parts by weight: 100 parts of organic silicon rubber; 300-500 parts of a heat conducting filler; 3-8 parts of a curing agent; 1-3 parts of a catalyst; according to the invention, a composite system of silicon carbide particles with a specific crystal structure, surface-modified graphene sheets and nano-diamond particles is used as a heat-conducting filler, and the filler is subjected to accurate proportioning and surface treatment, so that not only is the heat-conducting efficiency greatly improved, but also the internal binding force and heat stability of the material are effectively enhanced; compared with a traditional heat-conducting silica gel sheet, the heat-conducting silica gel sheet can more effectively transfer heat and reduce thermal resistance under the same condition, so that the heat dissipation performance and operation reliability of electronic equipment are improved, and in addition, the heat-conducting silica gel sheet has good mechanical performance and machinability and is easy to adapt to various complex application scenes.

The invention relates to the technical field of heat dissipation, and discloses a cold plate, a cooling system and electronic equipment, the cold plate comprises a cold plate body and at least one heat conduction piece, and the cold plate body is internally provided with a liquid cooling cavity; the cold plate body is provided with a first face, and at least part of the first face is used for making contact with a heating element. The at least one heat conduction piece is arranged in the liquid cooling cavity, the heat conduction piece is connected with the portion, corresponding to the first face, in the liquid cooling cavity and extends in the direction away from the first face, and the heat dissipation efficiency can be effectively improved.

The invention discloses a hot stamping die, and particularly relates to a local quenching adjustable splicing type hot stamping die which comprises a male die and a female die, and the female die adopts a splicing type structural design and comprises a first insert provided with a cooling water channel; the insert II is also provided with a cooling water channel; the third insert is provided with a heating channel, and an electric heating rod or a heat conduction rod penetrates into the heating channel; wherein the first insert, the second insert and the third insert are alternately inlaid on the female die; moreover, when the first insert or the third insert is embedded in the female die, a pit area is formed between the inner wall of the first insert or the third insert and the forming face through the height difference. When the second insert is embedded in the female die, the inner wall of the second insert is flush with the forming face. The technical problem of improving the local quenching adjustable performance of the hot stamping die is solved, so that new requirements of different materials / parts or follow-up process parameter adjustment on regional mechanical property distribution of hot stamping parts are better met.

The invention provides a liquid-cooling cold plate device provided with micro-channels for enhancing heat exchange, which belongs to the technical field of liquid-cooling cold plates and comprises a shell, a heat conducting plate is arranged at the top of the shell, a heat insulating plate is arranged in the shell, and a cooling plate is arranged between the heat conducting plate and the heat insulating plate; the cooling plate comprises an upper plate and a lower plate, and a cooling flow channel is formed between the upper plate and the lower plate; flow collecting blocks are arranged at the two ends of the shell, flow collecting cavities are formed in the flow collecting blocks, the two flow collecting cavities are communicated through cooling flow channels, ports are formed in one ends of the two flow collecting blocks, and the two ports are connected with an external cooling equipment pipeline; a water inlet is formed in the bottom of one group of flow collecting blocks, and a drain outlet is formed in the bottom of the other group of flow collecting blocks; the water inlet is connected with a drain outlet pipeline, and a drain valve is arranged on the connecting pipeline; and a control module is arranged below the heat insulation plate. The device is composed of two groups of slow flow cavities and a plurality of groups of shunting flow channels, and is matched with a cooling flow channel of a filter block, a drain outlet and a blow-down valve, so that the device can clean dirt and impurities.

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a chip module and a heat dissipation piece, the chip module and the heat dissipation piece are stacked and arranged on the circuit board, the chip module and the circuit board are conducted through a solder ball, and the heat dissipation piece is in heat conduction connection with the chip module; the circuit board assembly further comprises heat-conducting glue and a heat-conducting piece, in the plane direction of the circuit board, a part of the heat-conducting glue is filled in the gap between the chip module and the circuit board and makes contact with the solder balls, the other part of the heat-conducting glue is located outside the chip module, and the heat-conducting piece extends in the thickness direction of the circuit board and makes contact with the solder balls. The heat-conducting piece is used for being in heat-conducting connection with the heat-dissipating piece and the other part of the heat-conducting glue. According to the circuit board assembly, through contact between the solder balls and the heat-conducting glue and contact between the heat-conducting glue and the heat-conducting piece, heat-conducting connection between the chip module and the heat-dissipating piece is achieved, thermal resistance between the chip module and the heat-dissipating piece is reduced through the heat-conducting piece and the heat-conducting glue, and therefore the heat-dissipating efficiency of the circuit board assembly is improved.

The embodiment of the invention provides a vapor chamber and electronic equipment, and relates to the technical field of vapor chambers, the vapor chamber comprises a heat conduction assembly, one end of the heat conduction assembly along a first direction is used for contacting with a heat source; the first cover plate covers the end, away from the heat source, of the heat conduction assembly, an evaporation cavity and a heat dissipation cavity used for allowing steam to flow are formed between the first cover plate and the heat conduction assembly, the heat dissipation cavity surrounds the outer side of the evaporation cavity, and at least part of the orthographic projection of the evaporation cavity in the first direction coincides with the heat source; the heat dissipation cavity is divided into at least two sub-cavities which are sequentially arranged on the peripheral side of the evaporation cavity in a surrounding mode through the separation assembly, the sub-cavities communicate with the evaporation cavity, steam entering the evaporation cavity can be guided through the sub-cavities to be diffused in different directions, the distribution uniformity of the steam in the heat dissipation cavity is improved, and therefore the temperature uniformity of the vapor chamber is improved.

The invention discloses a uniform-temperature heat dissipation structure. The uniform-temperature heat dissipation structure of the embodiment comprises a heat conduction substrate and a heat dissipation device, wherein the heat dissipation device is provided with a plurality of hollow heat dissipation fins and a cavity for containing a cooling working medium; wherein the inner side surface of the heat conducting substrate is connected with the radiator to seal the cavity, a first capillary structure layer is arranged on the inner side surface of the heat conducting substrate, and a second capillary structure layer is arranged on the inner side surface of the hollow radiating fin; an evaporation area of a cooling working medium is formed on the inner side surface of the heat conduction substrate, a condensation area of the cooling working medium is formed by the hollow heat dissipation fins, and the cooling working medium is condensed in the hollow heat dissipation fins and then flows back to the first capillary structure layer from the second capillary structure layer. The radiator provided with the hollow radiating fins and the capillary structure is used for radiating heat, the radiator has the advantages of being light in weight, saving material cost and being large in radiating area, heat can be evenly diffused to all the radiating fins through evaporation of the cooling working medium, rapid radiating is achieved through evaporation-cooling circulation of the cooling working medium, and the radiating efficiency is remarkably improved.

The invention discloses a protective adhesive film for sealing and testing a semiconductor and a preparation method of the protective adhesive film, and relates to the technical field of adhesives. The protective adhesive film is obtained by taking a modified acrylate monomer as a main body, taking a synthetic product of 2-hydroxypyridine and methacryloyl chloride as a modifier, taking trimethylolpropane triacrylate as a cross-linking agent and adding maleic anhydride modified modified chitosan and modified polyimide in a polymerization film forming process. The modified acrylate monomer is obtained by taking graphene oxide modified by vinyl trimethoxy silane and hollow glass beads modified by methacryloxy propyl trimethoxy silane as heat conducting fillers; the modified polyimide is obtained by adding a boron nitride nanosheet modified and acidified by amino acrylic acid as a heat-conducting reinforcing filler into a polyimide prepolymer and then carrying out imidization. The mechanical property, heat conduction efficiency and low-temperature brittleness of the protective adhesive film can be improved.

The utility model provides a heat conduction structure and a molten salt reactor cabin. The heat conduction structure comprises a first pipeline, a heat conduction layer and at least one heat pipe, the first pipeline is provided with a first end face and a second end face at two ends; the heat conduction layer is arranged on the periphery of the first pipeline from the first end face in the length direction of the first pipeline. The heat conduction layer is shorter than the first pipeline; a plurality of channels are formed in the end face of the side, away from the first end face, of the heat conduction layer in the axial direction of the heat conduction layer. Two ends of the heat pipe are closed; one end of each heat pipe is arranged in the channel, and the other end of each heat pipe faces the second end face, so that the part, located in the heat conduction layer, of each heat pipe serves as a condensation section, and the part, not located in the heat conduction layer, of each heat pipe serves as an evaporation section in the working state. Fused salt freezing blockage in the fused salt pipeline can be effectively prevented, and the temperature uniformity of the fused salt pipeline is improved; and the dismounting difficulty of the molten salt reactor cabin through-wall pipeline can be reduced, so that the heat conduction structure is easy to maintain, and the safety and the reliability of the molten salt reactor cabin are improved.

The present invention relates to the technical field of bearing seats, and discloses a porous heat-dissipating bearing seat, which includes an upper housing, a lower housing, and a bearing. The upper housing and the lower housing form the main body of the bearing seat, and the bearing is arranged in the main body of the bearing seat formed by the upper housing and the lower housing. A heat-dissipating mechanism is arranged on the upper housing and the lower housing; the heat-dissipating mechanism includes a sealing ring, a liquid inlet pipe, a liquid outlet pipe, a cavity, and a rib. By opening a cavity for storing a coolant, the coolant is used to directly contact the bearing to quickly dissipate heat from the bearing. A heat conducting sheet is provided for heat exchange with the coolant. After the coolant is heated, the heat is exchanged from the heat conducting sheet to the heat sink, and the heat sink with a larger area is used for heat exchange with the air. In a space where the air flow is slow, the coolant is added into the cavity through the liquid inlet pipe, and the coolant is discharged from the liquid outlet pipe to realize the replacement of the coolant in the cavity, thereby ensuring the heat dissipation of the bearing.

The invention discloses a heat conduction type heat dissipation cable, and relates to the technical field of heat dissipation cables, the heat conduction type heat dissipation cable comprises a central capillary main pipe, a plurality of conductor strands are arranged on the outer side of the central capillary main pipe, a heat dissipation ring is arranged on the other side of each conductor strand, and a plurality of first heat dissipation holes are integrally formed in the heat dissipation ring; according to the invention, heat generated by the conductor strands is quickly transmitted through the heat conducting column, and the magnetic conductive sheet and the magnetocaloric material sheet are matched to generate magnetocaloric effect by utilizing magnetic field intensity fluctuation caused by current change: when the current is increased, heat is released to strengthen evaporation of a working medium, and when the current is reduced, heat is absorbed to directly cool, so that a self-adaptive heat adjusting mechanism is formed; heat can be quickly transferred through evaporation-condensation of low-boiling-point fluid through phase change circulation of the central capillary main pipe and the branch capillary pipes, and multi-path heat dissipation of the heat dissipation ring and the fins is combined, so that the heat dissipation efficiency under different current loads is improved, and the problem of local overheating is effectively avoided.

The utility model provides a hot air circulation tunnel type sterilization drying oven, which relates to the technical field of drying equipment and comprises a group of supports, a conveying belt is arranged between the supports, a sterilization drying oven body is arranged at the tops of the supports, fan covers are arranged on two sides of the sterilization drying oven body, one side of each fan cover is connected with an air pipe, and the other side of each fan cover is connected with an air pipe. A heat recovery box is installed at the top of the sterilization drying oven body, the other end of one air pipe penetrates through the interior of the heat recovery box to be connected with the other air pipe, a plurality of heat conduction fins are installed in the sterilization drying oven body, circulating fans are installed on the two sides of the heat conduction fins, and the circulating fans are installed in a fan cover. A replacement assembly is installed in the sterilization drying oven body and connected with the heat conduction fins. The heat conduction fins can be replaced conveniently and rapidly, the heat exchange efficiency is improved, the heat transfer performance of the heat exchanger is recovered or improved, and heat can be transmitted more effectively.

The utility model discloses a concrete temperature monitoring device convenient to clean, and relates to the technical field of concrete performance testing. The concrete temperature monitoring device convenient to clean comprises a temperature measurement shell, a driving structure and a protection structure, the protection structure comprises a probe shell, a connecting base, a temperature measurement probe, a heat conduction layer and a communication hole, the connecting base is fixedly connected to one end of a temperature measurement rod, the probe shell is fixedly connected with the connecting base, and the temperature measurement probe is arranged in the probe shell. The temperature measuring probe is fixedly connected with the connecting seat, the heat conducting layer is arranged between the probe shell and the temperature measuring probe, the communicating hole is formed in the circle center of the connecting seat, the probe shell makes contact with concrete, heat is transmitted into the temperature measuring probe through the heat conducting layer, and the temperature measuring probe can be prevented from making direct contact with the surface of the concrete in an indirect temperature measuring mode. The surface of the temperature measuring probe is prevented from being abraded, and the problem that the surface of the temperature measuring probe is easily abraded due to repeated use of the temperature measuring probe is solved.

A brushless motor fuel pump with a built-in controller, comprising a control unit, a brushless motor and a fuel pump connected in sequence. The control unit includes an oil outlet cover, a controller, a heat conducting pad, a mounting bracket and a metal heat sink. The mounting bracket is fixedly installed on the upper end of the brushless motor. A circulation cavity for the outflow of oil fluid is provided between the mounting bracket and the upper end of the brushless motor. The circulation cavity, the brushless motor and the fuel pump are connected in sequence. The oil outlet cover is fixedly connected to the upper end of the mounting bracket, and the oil outlet cover is provided with an oil outlet communicating with the circulation cavity. The mounting bracket and the oil outlet cover are hermetically connected to form a sealed cavity for installing the controller. The controller, the heat conducting pad and the metal heat sink are connected in sequence from top to bottom. The lower part of the metal heat sink is hermetically installed in a mounting hole provided in the mounting bracket, and the metal heat sink passes through the mounting hole and is exposed in the circulation cavity.

The utility model provides a heating assembly and an aerosol generating device, the heating assembly comprises a supporting tube, the supporting tube comprises a heat resistance area and a heat conduction area, and the heat resistance area is used for blocking heat conduction of the adjacent heat conduction area; the heating coating is arranged on the outer surface of the supporting pipe and covers the heat resisting area and the at least one heat conduction area. According to the application, the heat resistance area is arranged, so that heat transfer can be slowed down, and heat is concentrated in the preset area; meanwhile, as the heat resistance area is arranged on the supporting pipe, a heat resistance structure does not need to be machined at the heating coating, the heating coating can be of a complete coating structure, and microcracks formed at the heating coating due to machining can be avoided. In addition, the complete coating structure has a complete layered structure, and the compression resistance is higher.

The invention belongs to the technical field of graphite metal composite heat dissipation devices, and provides a flexible graphene film heat conduction cable and a preparation method thereof.The preparation method comprises the steps that the surface of a graphene film is cleaned and punched, and the graphene film with micron-sized pores in the surface is obtained; sequentially plating a layer of active metal film and a layer of heat-conducting metal film on the surface of the graphene film, and cutting to obtain a graphene film; graphene films are overlaid layer by layer to obtain a laminated material, and the two ends of the laminated material are clamped to a hot-pressing mold to be subjected to hot-pressing welding treatment, so that a locally connected flexible heat conduction section is obtained; and the flexible heat conduction section and the heat conduction metal shell are assembled, a soldering lug is placed for brazing and finish machining, and the flexible graphene film heat conduction cable is obtained. According to the method, the internal connection problem of the flexible section is solved by establishing a synergistic process of surface punching, double-layer coating and hot pressing, the heterogeneous connection problem of the flexible section and the shell is solved in a manner of sampling coating and brazing, and through the synergistic effect of all links, the overall performance and reliability of the heat-conducting cable are remarkably improved.

The invention discloses electric power infrastructure intelligent monitoring equipment based on a virtual simulation technology, and the equipment comprises a microcomputer protection host, a plurality of groups of heat conduction plates are installed at the upper end of the microcomputer protection host in an array manner, and one end of each heat conduction plate is provided with a semiconductor chilling plate. The device has the beneficial effects that an active heat dissipation mechanism composed of a semiconductor chilling plate, a heat conduction plate, a heat dissipation motor, heat dissipation fan blades, a gear ring, a gear and a brush is arranged, the semiconductor chilling plate can increase the temperature difference between the two ends of the heat conduction plate, then high heat conduction efficiency is guaranteed, active heat dissipation in the device is achieved, and the service life of the device is prolonged. A heat dissipation motor drives heat dissipation fan blades to rotate through a rotating shaft to dissipate heat of a semiconductor chilling plate, the efficient refrigeration performance of the semiconductor chilling plate is guaranteed, the rotating shaft drives a gear ring to rotate through a gear, the gear ring drives a brush to clean the surface of a dustproof net, then the heat dissipation effect of the semiconductor chilling plate is guaranteed, and efficient heat dissipation can be conducted in the device through combination of the two. The processing rate of the device is ensured and the use performance of the device is improved.