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10595 results about "Heat conducting" patented technology

Heat conduction. Heat conduction, or thermal conduction, is the spontaneous transfer of thermal energy through matter, from a region at higher temperature to a region at lower temperature. It thus acts to equalize temperature differences. It is also described as heat energy transferred from one material to another by direct contact.

High efficiency heat removal system for rack mounted computer equipment

An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets.
This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.
This invention covers the design of the heat transfer components within the chassis of rack mounted computer server and the heat transfer system components external to the server within rack enclosure, as well as the external cooling system components necessary to connect to existing fluid based heat transfer and removal systems and processes.

Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof

The invention discloses a halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and a preparation method thereof. The preparation method comprises: adding vinyl dimethicone, a reinforcing material, a heat-conducting filling material and a halogen-free flame retardant in a vacuum kneader, dehydrating and blending for 30-120 minutes at 100-150 DEG C and vacuum degree of 0.06-0.1MPa to obtain a base material, adding a cross-linking agent containing hydrogen silicone oil and a cross-linking inhibitor to the base material at the normal temperature, adequately agitating for 10-30 minutes to prepare a component A; adding a platinum catalyst to the base material, adequately agitating for 10-30 minutes to prepare a component B; taking the component A and the component B of the same parts by weight, blending uniformly, and deaerating for 5-10 minutes at the vacuum degree of 0.06-0.1MPa to obtain the halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive. The potting adhesive has good flow properties and convenient use and can be cured at the normal temperature or a high temperature, condensate has excellent flame retardant property and heat-conducting property, and the potting adhesive can be widely applied to the fields of electronic electric appliance, chip encapsulation and LED encapsulation, and the like.

High-heat-conductivity rubber composite material and preparation method thereof

The invention discloses a high-heat-conductivity rubber composite material and a preparation method of the high-heat-conductivity rubber composite material. The high-heat-conductivity rubber composite material consists of the following ingredients in parts by mass: 100 of rubber, 4 to 6 of zinc oxide, 1 to 3 of stearic acid, 1 to 2 of anti-aging agents, 40 to 60 of carbon black, 1 to 1.5 of promoters, 1 to 3 of sulphur and 50 to 170 of heat conducting agents. The manufacture method comprises the following process steps that: the rubber is added into an open mill, the zinc oxide, the stearic acid, the anti-aging agents, the promoters, the carbon black and the heat conducting agents are sequentially added after the roll recovering, and finally, the sulphur is added. After rubber materials are uniformly mixed, the thin conduction is carried out, triangle bag packing and rolling are respectively carried out for five times, and the roll distance is regulated to 1.5mm for sheet output. The material sheets are placed into a mold, the vulcanization is carried out on a flat plate vulcanization machine, the vulcanization time is 15 to 20 minutes, the vulcanization temperature is 160 to 165 DEG C, and the vulcanization pressure is 10 to 12MPa. The material disclosed by the invention has an excellent physical and mechanical property and a high heat conduction factor.
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