26656 results about "Refrigerant" patented technology

A drying apparatus for drying articles such as clothing is provided. The drying apparatus includes a chamber for containing articles to be dried and a system for supplying heated dry air at a first temperature to the chamber. The air supplying system comprises an air flow pathway having an evaporator for removing moisture from air exiting the chamber and for decreasing the temperature of the air to below dew point temperature. The air supply system further has a condenser for increasing the temperature of the air exiting the evaporator to the first temperature. The drying apparatus further has a heat pump system having a refrigerant loop which includes a compressor, the condenser, a TEV valve, and the evaporator.

A falling film evaporator includes a flow distributor for uniformly distributing a two-phase refrigerant mixture across a tube bundle. The flow distributor includes a stack of at least three perforated plates each of which are separated by nearly full-width, full-length gaps or chambers. The flow distributor may also include a suction baffle and/or a distributor baffle. The distributor baffle extends downward to provide a hairpin turn past which refrigerant travels before exiting the evaporator. This directional change helps separate liquid from a primarily gaseous refrigerant stream. The suction baffle has various size openings to ensure that the flow rate of refrigerant through the hairpin turn is generally uniform and is maintained low enough to ensure liquid disentrainment over and along the length of the tube bundle within the evaporator.

The present invention provides a temperature control unit for an electrostatic adsorption electrode that is capable of controlling the wafer temperature rapidly over a wide temperature range without affecting in-plane uniformity while high heat input etching is conducted with high wafer bias power applied. A refrigerant flow path provided in the electrostatic adsorption electrode serves as an evaporator. The refrigerant flow path is connected to a compressor, a condenser, and a first expansion valve to form a direct expansion type refrigeration cycle. A second expansion valve is installed between the electrostatic adsorption electrode and the compressor to adjust the flow rate of a refrigerant. This makes it possible to compress the refrigerant in the refrigerant flow path of the electrostatic adsorption electrode and adjust the wafer temperature to a high level by raising the refrigerant evaporation temperature. Further, a thin-walled cylindrical refrigerant flow path is employed so that the thin-walled cylinder is deformed only slightly by the refrigerant pressure.

In order to improve a compressor for refrigerant, comprising an outer housing, a scroll compressor arranged in the outer housing and having a first compressor member arranged stationarily in the outer housing and a second compressor member which is movable relative to the first compressor member, the compressor members each having a base and first and second scroll ribs, respectively, which rise above the respective base and engage in one another such that the second compressor member is movable relative to the first compressor member on an orbital path about a central axis for the purpose of compressing the refrigerant, a drive unit for the second compressor member having an eccentric drive, a drive shaft, a drive motor arranged in a motor housing and having drawn-in refrigerant flowing around it as well as a bearing unit for the drive shaft which comprises a first bearing member connected to the outer housing, in such a manner that the refrigerant drawn in by the scroll compressor is free from lubricating oil to as great an extent as possible it is suggested that the refrigerant flow through an oil separator, which is arranged in the outer housing between this and the drive unit, after flowing around the drive motor and prior to entering the scroll compressor.

There is provided a means for uniformly controlling the in-plane temperature of a semiconductor wafer at high speed in a high heat input etching process. A refrigerant channel structure in a circular shape is formed in a sample stage. Due to a fact that a heat transfer coefficient of a refrigerant is largely changed from a refrigerant supply port to a refrigerant outlet port, the cross sections of the channel structure is structured so as to be increased from a first channel areas towards a second channel areas in order to make the heat transfer coefficient of the refrigerant constant in the refrigerant channel structure. Thereby, the heat transfer coefficient of the refrigerant is prevented from increasing by reducing the flow rate of the refrigerant at a dry degree area where the heat transfer coefficient of the refrigerant is increased. Further, the cross section of the channel structure is structured so as to be reduced from the second channel areas towards a third channel areas, and thereby the heat transfer coefficient of the refrigerant is prevented from decreasing. Accordingly, the heat transfer coefficient of the refrigerant can be uniformed in the channel structure.

In an air conditioning apparatus for a vehicle, a water/refrigerant heat exchanger is disposed at a refrigerant discharge side of a compressor of a refrigerant cycle, and a cooling unit for cooling a heat-generating unit with refrigerant having an intermediate pressure of the refrigerant cycle is disposed at a downstream refrigerant side of the water/refrigerant heat exchanger. The air conditioning apparatus includes an evaporator and a hot-water type heater core disposed in an air conditioning duct. In a cooling water circuit, an engine, a radiator and an electrical pump are disposed in addition to the water/refrigerant heat exchanger and the hot-water type heater core. Thus, refrigerant absorbs heat generated in the heat-generating unit, and is heat-exchanged with cooling water in the water/refrigerant heat exchanger after passing through the compressor. As a result, the heat-generating unit can be cooled sufficiently even when outside air temperature is high in the summer, and heating capacity can be effectively improved using heat generated from the heat-generating unit in the winter.

A real-time monitoring system that monitors various aspects of the operation of a refrigerant-cycle system is described. In one embodiment, the system includes a processor that measures power provided to the refrigerant-cycle system and that gathers data from one or more sensors and uses the sensor data to calculate a figure of merit related to the efficiency of the system. In one embodiment, the sensors include one or more of the following sensors: a suction line temperature sensor, a suction line pressure sensor, a suction line flow sensor, a hot gas line temperature sensor, a hot gas line pressure sensor, a hot gas line flow sensor, a liquid line temperature sensor, a liquid line pressure sensor, a liquid line flow sensor. In one embodiment, the sensors include one or more of an evaporator air temperature input sensor, an evaporator air temperature output sensor, an evaporator air flow sensor, an evaporator air humidity sensor, and a differential pressure sensor. In one embodiment, the sensors include one or more of a condenser air temperature input sensor, a condenser air temperature output sensor, and a condenser air flow sensor, an evaporator air humidity sensor. In one embodiment, the sensors include one or more of an ambient air sensor and an ambient humidity sensor.

A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop comprises a heat exchanger, and propagating the air out of the first enclosed area by passing through the heat exchanger into a second enclosed area, where the air is cooled by passing through the heat exchanger.

Recovery of electric power from low-grade waste heat/solar energy, comprising a closed-cycle charged refrigerant loop. Pressurized refrigerant fluid is pumped at ambient temperature through a heat exchanger connected to a waste heat/solar source to extract heat energy during conversion to a high pressure gas. Heated/pressurized refrigerant gas is inlet into an expander to power an output shaft during the expansion of the fluid to a cooled gas at approximately 0 psig. Cooled gaseous refrigerant is condensed to a liquid at low pressure and ambient temperature, and recycled under pressure to the heat exchanger. The expander is a reverse-plumbed gas compressor; the pressurized, hot refrigerant gas is inlet at what is ordinarily its outlet, and the normal inlet becomes the expander end. The refrigerant gas mass flow pressure/temperature drop spins the expander shaft for direct mechanical power take-off, or coupling to a synchronous or inductive generator to produce electricity.

A roof top cooling unit has an evaporative cooling section that includes at least one evaporative module that pre-cools ventilation air and water; a condenser; a water reservoir and pump that captures and re-circulates water within the evaporative modules; a fan that exhausts air from the building and the evaporative modules and systems that refill and drain the water reservoir. The cooling unit also has a refrigerant section that includes a compressor, an expansion device, evaporator and condenser heat exchangers, and connecting refrigerant piping. Supply air components include a blower, an air filter, a cooling and/or heating coil to condition air for supply to the building, and optional dampers that, in designs that supply less than 100% outdoor air to the building, control the mixture of return and ventilation air.

A vehicle temperature control apparatus for controlling temperature of a temperature control object, which is at least one of inside air of a vehicle compartment and a vehicle component, includes a heat capacitive element capable of storing heat, a refrigeration cycle in which heat is absorbed from a low temperature side and is dissipated to a high temperature side, a heat exchanger that causes the heat capacitive element to exchange heat with refrigerant of the refrigeration cycle, and a heat dissipation portion which dissipates heat in the refrigerant of the refrigeration cycle to the temperature control object. Thus, a temperature control by using the heat capacitive element can be effectively performed.

A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.

A sealed well direct expansion geothermal heat exchange unit, whose sealed well can be placed in ground and/or in water, consisting of a conventional direct expansion, or other heat pump, system wherein the exterior refrigerant heat exchange lines are placed within an insulated and sealed container, which container is supplied with a circulating heat conductive liquid from and to a sub-surface sealed well encasement, which container liquid may be supplemented with heat from a solar heating system, and which unit's hot refrigerant vapor line may be supplementary cooled by means of condensate water evaporative cooling, as well as a means to provide any direct expansion, and any closed-loop water-source, geothermal heat pump system with an optional solar heating supplement in the heating mode, and with an optional water-cooled vapor line supplement in the cooling mode.

A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough.

A method for determining airflow through an evaporator coil in a vapor compression cycle by measuring the moist air conditions entering and leaving the coil, and various temperatures and pressures in the refrigerant of the vapor compression cycle. The mass airflow rate and the volumetric airflow rate are then determined.