5865 results about "Cooling Units" patented technology

A thermal treatment apparatus includes a processing container, a substrate holding unit for holding a plurality of substrates at predetermined intervals in a direction inside the processing container, a heating unit for heating the processing container, a supply unit for supplying gas, a plurality of supply ports provided respectively at different locations in the direction, and a cooling unit for cooling the processing container by supplying the gas into the processing container by the supply unit via each of the supply ports, wherein the supply unit is provided in such a way that the supply unit independently controls flow rates of the gases supplied via each of the supply ports.

At least one version is directed to a mobile data center that includes a trailer having a length greater than a width and having an interior, the trailer being configured to be transported in a direction generally parallel to the length, and a plurality of equipment enclosures installed in the interior of the trailer to form a row, with the row being parallel to the length of the trailer, wherein the row is positioned in the interior such that a first aisle is on a front side of the row and a second aisle is on a back side of the row. The mobile data center also includes at least one cooling unit constructed and arranged to draw warm air from the second aisle and provide cool air to the first aisle to cool equipment contained in the plurality of equipment enclosures.

A photoresist coating and developing apparatus 1 includes a photoresist film forming unit that forms a photoresist film on a substrate; a heat treatment unit that heats the substrate on which the photoresist film is formed by the photoresist film forming unit; a cooling unit that cools the substrate, on which the photoresist film is formed and which is heated by the heat treatment unit, to normal temperature; a heating unit 61 that heats the substrate, which is cooled to normal temperature by the cooling unit, to a predetermined temperature; a load-lock chamber L1 that unloads the substrate under depressurized atmosphere to expose the photoresist film; and a transfer device 62 that transfers the substrate from the heating unit 61 to the load-lock chamber L1.

A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, and at least one panel coupled to a pair of the housings to bridge a gap between the pair of the housings, where the housings and the at least one panel are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region such that the heat-producing equipment, when mounted to the housings, will expel the heated gas into the hot region.

An improved solution for cooling a data center is provided. In an embodiment of the invention, a data center design that combines physical segregation of hot and cold air streams together with a data hall variable air volume system is provided. The invention is a data center design that resolves air management issues of re-circulation, bypass and load balance. Bypass is airflow supplied by the cooling units that directly returns without cooling servers. Recirculation airflow is server discharge warm air that returns directly without being cooled. Load balance is supplying the required server airflow. An embodiment includes physical segregation of cold and hot air streams and by providing variable air volume to match server load. Air segregation is done by enclosing the hot aisle end and above the cabinets. The air conditioning system provides variable air volume to the data hall (cold side) to meet server demands. The cooling plant consists of variable-air-volume air-cooling system, which cools air by air free cooling (economizer) and is supplemented with mechanical cooling in the warmer seasons.

In an air conditioning apparatus for a vehicle, a water / refrigerant heat exchanger is disposed at a refrigerant discharge side of a compressor of a refrigerant cycle, and a cooling unit for cooling a heat-generating unit with refrigerant having an intermediate pressure of the refrigerant cycle is disposed at a downstream refrigerant side of the water / refrigerant heat exchanger. The air conditioning apparatus includes an evaporator and a hot-water type heater core disposed in an air conditioning duct. In a cooling water circuit, an engine, a radiator and an electrical pump are disposed in addition to the water / refrigerant heat exchanger and the hot-water type heater core. Thus, refrigerant absorbs heat generated in the heat-generating unit, and is heat-exchanged with cooling water in the water / refrigerant heat exchanger after passing through the compressor. As a result, the heat-generating unit can be cooled sufficiently even when outside air temperature is high in the summer, and heating capacity can be effectively improved using heat generated from the heat-generating unit in the winter.

A method of calculating net sensible cooling capacity of a cooling unit includes measuring a discharge pressure from of fluid from a compressor and a suction pressure from an evaporator, calculating a condensing temperature of fluid flowing from the compressor and an evaporating temperature of fluid flowing from the evaporator, calculating a mass flow rate of fluid flowing from the compressor, calculating enthalpy of fluid flowing from the compressor, of fluid flowing from the thermal expansion valve, and of fluid flowing from the evaporator, calculating a mass flow rate of fluid flowing through the hot gas bypass valve, and calculating net sensible cooling capacity. Embodiments of cooling units and other methods are further disclosed.

Methods and apparatus for controlling the temperature of a seat such as a vehicle seat are disclosed. The apparatus includes an electrical heater disposed in the seat, a cooling unit such as a cooling element and a fan, a detector for detecting the temperature associated with the electrical heater, and a controller for controlling the electrical heater and the cooler based upon the detected temperature and upon the humidity algorithm comprising a predetermined set of calculations of the humidity of air at different temperatures.

Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof.

A refrigerated truck has a power management system for optimally distributing power between one or more energy sources, energy sinks, or energy storage components on the refrigerated truck. One such power consuming component includes a refrigeration unit that cools a refrigerated compartment of the refrigerated truck. Particularly with regard to this refrigeration unit, the power management system is operative to direct power from multiple power sources to the refrigeration unit so as to efficiently use available power. To do so, the power management system dynamically determines the availability of certain power sources and selects a preferred power source based on availability and a defined order of power source preference. For example, one defined order of power source preference may include, in order of preference upon availability, a shore power source, a truck engine generator drivingly connected to the refrigerated truck's engine, one or more auxiliary power sources, and a stand alone refrigerator unit engine.

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

A roof top cooling unit has an evaporative cooling section that includes at least one evaporative module that pre-cools ventilation air and water; a condenser; a water reservoir and pump that captures and re-circulates water within the evaporative modules; a fan that exhausts air from the building and the evaporative modules and systems that refill and drain the water reservoir. The cooling unit also has a refrigerant section that includes a compressor, an expansion device, evaporator and condenser heat exchangers, and connecting refrigerant piping. Supply air components include a blower, an air filter, a cooling and / or heating coil to condition air for supply to the building, and optional dampers that, in designs that supply less than 100% outdoor air to the building, control the mixture of return and ventilation air.

A rack-mount server system of a liquid cooling system, in which a heat-generating component such as a CPU is cooled by a coolant has a plurality of server modules with heat-generating components which are cooled by the circulating coolant. The server modules are connected in parallel to a circulation coolant path through which the coolant to cool the server modules is circulated. In the middle of the coolant circulation path is a cooling unit that cools the coolant by radiating its heat to the outside air. Furthermore, a bypass route parallel to the server modules and going around the server modules is provided in the coolant circulation path, and the circulation quantity of the coolant is controlled in the bypass route. Alternatively, the flow quantity of the coolant is controlled in each of the server modules.

A cooling system and method are provided for facilitating cooling of a liquid-cooled electronics rack. The cooling system includes a coolant flow controller, a modular cooling unit and a pressure controller. The flow controller is associated with a respective electronics rack and controls flow of coolant through that electronics rack based on its changing cooling requirements. The cooling unit includes an adjustable coolant pump for facilitating supply of coolant to the rack. The pressure controller is associated with the cooling unit for controlling pressure of coolant at an output of the cooling unit via control of pump speed of the pump. Responsive to adjusting coolant flow through the electronics rack, the pressure controller automatically adjusts pump speed of the adjustable pump to maintain pressure about a constant coolant pressure set point at an output of the cooling unit, thereby conserving power while still cooling the liquid-cooled electronics rack.

Systems and methods for data center control are provided. The data center includes a plurality of racks and at least one cooling unit. The racks including at least one server. Information regarding the at least one cooling unit, the at least one server, the plurality of racks, and at least one application is received. A rack based cooling metric threshold is also received. The systems and methods can determine a layout of the data center that minimizes total power consumption of the plurality of racks and the cooling unit while maintaining cooling performance at an acceptable level based on the threshold.

In one embodiment, a surgical navigation system is provided with a transmitter assembly that includes at least one coil for creating an electromagnetic field in the vicinity of a surgical operation. The surgical navigation system also includes a cooling unit thermally coupled to the transmitter assembly for dissipating heat generated by the transmitter assembly and a receiver assembly that includes at least one coil configured to generate signals induced by the field. The surgical navigation system further includes electronic circuitry coupled to and communicating with the transmitter assembly and the receiver assembly for calculating at least a position of the receiver coil.

A fluid communication system for providing coolant to and exhausting coolant from a cooling unit includes flexible tubing and a plurality of support members. Each support member is configured to be secured to a support structure and to be releasably secured to the flexible tubing. Each support member includes a first part and a mating second part, with the first and second parts being configured to be secured to one another with the flexible tubing disposed in between. A method of installing a fluid communication system of a cooling system is further disclosed.

A computer enclosure cooling unit adapted to current dimensional standards which is capable of controlled cooling of individual semiconductor devices as well as of the air circulated within the computer housing. The disclosed invention utilizes Peltier devices, a controller unit, both liquid and gaseous heat exchangers, and low cost construction methods to provide a compact, effective computer enclosure cooling system meeting the cooling needs of current high-speed, heat producing computer systems and components.

A temperature-controlled container utilizing a sorption cooling unit to maintain the temperature within the container. The sorption cooling unit cools the interior of the container and rejects waste heat to the exterior. The sorption cooling unit provides a lightweight and low volume alternative to the traditional gel pack cooling systems that are commonly used in the modern shipping industry for shipping containers.

A cooling unit includes a first module having a first intake opening and a first exhaust opening formed therein. At least one first air moving device may be configured to draw air along a first flow path from the first intake opening to the first exhaust opening. A first heat exchanger may be positioned in the first flow path. The cooling unit may further include a second module having a second intake opening and a second exhaust opening. At least one second air moving device may be configured to draw air along a second flow path from the second intake opening and direct air to the second exhaust opening. A second heat exchanger may be positioned in the second flow path. A conduit system is in fluid communication with the first heat exchanger and the second heat exchanger. The conduit system may be configured to deliver coolant from the first heat exchanger of the first module to the second heat exchanger of the second module and from the second heat exchanger of the second module to the first heat exchanger of the first module. Methods of cooling a space with a cooling unit are further disclosed.

Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof.

An air conditioning unit is provided for a parked truck / boat to cool the sleeping cabin. The cabin air conditioner having a cooling unit comprising a cooling chamber with at least one insulated wall having on opposite sides there of a heat sink and a cooling block having there between thermoelectric chip(s) or a high efficient D.C. compressor or cold storage phase change material. The air conditioning unit also comprises an air intake conduit, a cool air conduit, an exhaust conduit and means of supplying power to the cooling unit. A method for cooling the. sleeping cabin through the use of the air conditioning unit disclosed in the invention is also provided.

A data center cooling system includes a data center having electronic equipment that is supported in multiple racks; a cooling fluid source; multiple cooling units in the data center, where each cooling unit is configured to cool air warmed by a sub-set of the electronic equipment in the data center; multiple control valves, including a control valve associated with a particular cooling unit of the cooling units; and a controller arranged to modulate the control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit.

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed.

The power unit includes H bridge inverter circuit, capacitance in DC section connected to DC bus in inverter circuit, and control circuit for controlling operation of the power unit. The power unit also includes a clipping energy consumption circuit. Combining a small quantity of active power absorbed by active electric power filter, the method realizes controlling DC bus voltage of power unit. The active electric power filter includes following parts: inverter with each phase including at least one power unit; voltage detection circuit, central control system, filtering circuit, precharge circuit, income line switch, interface and communication circuit, and cooling unit etc.