46100results about "Cooling/ventilation/heating modifications" patented technology

Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.

A cabinet for housing a vertical array of heat-producing units has an equipment chamber adapted to support the array such that the array cooperates with the cabinet in use to define a first plenum, the first plenum having an inlet for receiving a flow of cooling fluid and an outlet defined by a plurality of openings through the array whereby the first plenum communicates with the openings in use to exhaust substantially all of the flow of cooling fluid through the openings and hence through the array, wherein the inlet to the first plenum admits fluid to the first plenum in a substantially horizontal direction. Related methods and data centre installations are also disclosed and claimed.

A cooling solution is provided for a modular data center. The modular data center includes a plurality of racks, each of the racks having a front face and a back face, wherein the plurality of racks is arranged in a first row and a second row, such that the back faces of racks of the first row are facing the second row, and the back faces of the racks of the second row are facing the first row, a first end panel coupled between a first rack of the first row and a first rack of the second row, the first end panel having a bottom edge and a tope edge, a second end panel coupled between a second rack of the first row and a second rack of the second row, the second end panel having a top edge and a bottom edge, and a roof panel coupled between the top edge of the first panel and the top edge of the second panel. Cooling equipment within at least one of the equipment racks draws hot air from between the rows of racks and delivers cooled air out of the front face of one of the racks.

The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a thermal interface formed from a flexible graphite sheet and/or a heat sink formed from a graphite article.

An exhaust air removal system and method for use with a rack or enclosure containing equipment is provided. The system and method are configured for removal of exhaust air vented from equipment during operation to thereby remove heat from the equipment. In one aspect, the system includes a fan unit preferably configured to serve as a back door of an equipment rack or enclosure and configured to provide access to an interior of the rack or enclosure. The fan unit provides multiple fans coupled to internal exhaust ducts that are arranged to draw and to remove exhaust air vented from rack-mounted equipment. The fan unit is further configured to vent exhaust air to an area external to a rack or enclosure, such as an external exhaust duct or plenum. Removal of hot and warm exhaust air vented from rack-mounted equipment enables the equipment to operate effectively, drawing sufficient amounts of cooling air to meet its cooling requirements. The fan unit is constructed for portability and for easy attachment to and removal from a rack or enclosure, providing flexibility in handling equipment exhaust needs.

Systems and methods are provided for determining data center cooling and power requirements and for monitoring performance of cooling and power systems in data centers. At least one aspect provides a system and method that enables a data center operator to determine available power and cooling at specific areas and enclosures in a data center to assist in locating new equipment in the data center.

A cooling system and method employing separation chutes and baffles is disclosed. The separation chutes separate the cooled air descending from a heat exchanger positioned above heat-generating equipment in an equipment room from heated air ascending from the heat-generating equipment. Separation of the airflows reduces turbulence and increases cooling efficiencies. The separation chutes are made of a variety of materials, both rigid and flexible, for a variety of applications.

A portable laptop stand comprising a generally rectangular flat board having a longitudinal axis perpendicular to a width of the board; said board having a distal end; said board having a proximal end; said board having a first portion, a second portion pivotably coupled to the first portion, and a main body pivotably coupled to the second portion; wherein the first portion has a longitudinal axis that is perpendicular to the longitudinal axis of the board; wherein the second portion has a longitudinal axis that is perpendicular to the longitudinal axis of the board; wherein said first portion is capable of folding back towards the main body and contact the main body. The board having a first attachment means disposed on the first portion; and a second attachment means disposed on the main body to detachably attach to said first attachment means.

A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element.

Systems and methods are provided for determining data center cooling and power requirements and for monitoring performance of cooling and power systems in data centers. At least one aspect provides a system and method that enables a data center operator to determine available power and cooling at specific areas and enclosures in a data center to assist in locating new equipment in the data center.

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.