10499 results about "Thermal conductivity" patented technology

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

A memory device with improved heat transfer characteristics. The device first includes a dielectric material layer; first and second electrodes, vertically separated and having mutually opposed contact surfaces. A phase change memory element is encased within the dielectric material layer, including a phase-change layer positioned between and in electrical contact with the electrodes, wherein the lateral extent of the phase change layer is less than the lateral extent of the electrodes. An isolation material is positioned between the phase change layer and the dielectric layer, wherein the thermal conductivity of the isolation material is lower than the thermal conductivity of the dielectric material.

The substrate processing apparatus according to the present invention is aimed to stably and efficiently perform a deposition process on a substrate W. The substrate processing apparatus supports the substrate W in a position facing a heater portion and thus rotates a holding member holding the substrate W. Furthermore, the heating portion houses a SiC heater and a heat reflecting member in an internal portion of a quartz bell jar made of transparent quartz, and depressurizes an internal space of a processing vessel and an internal space of the quartz bell jar at the same time; thereby allowing the thickness of the quartz bell jar to be thinner, and thus improving thermal conductivity of heat from the SiC heater and preventing contamination by the SiC heater.

A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.

A fast, reliable, highly integrated memory device formed of a carbon nanotube memory device and a method for forming the same, in which the carbon nanotube memory device includes a substrate, a source electrode, a drain electrode, a carbon nanotube having high electrical and thermal conductivity, a memory cell having excellent charge storage capability, and a gate electrode. The source electrode and drain electrode are arranged with a predetermined interval between them on the substrate and are subjected to a voltage. The carbon nanotube connects the source electrode to the drain electrode and serves as a channel for charge movement. The memory cell is located over the carbon nanotube and stores charges from the carbon nanotube. The gate electrode is formed in contact with the upper surface of the memory cell and controls the amount of charge flowing from the carbon nanotube into the memory cell.

The present invention discloses a LED light bulb, comprising: a LED light bulb shell; a core column with an exhaust tube and a bracket; at least one LED light emitting strip with LED chips therein emitting 4π light; a driver; and an electrical connector, wherein the LED light bulb shell is vacuum sealed with the core column so as to form a vacuum sealed chamber, which is filled with a gas having a low coefficient of viscosity and a high coefficient of thermal conductivity, the bracket and the LED light emitting strips fixed on the bracket are housed in the vacuum sealed chamber, the LED light emitting strip is in turn electrically connected to the driver, the electrical connector, while the electrical connector is used to be electrically connected to an external power supply, so as to light the LED light emitting strips. In addition, the present invention also provides the LED light emitting strips with LED chips emitting 4π light, as used in the LED light bulb.

A lubricant composition having improved lubricant properties, comprising:

(a) a lubricating fluid; and (b) nano graphene platelets (NGPs) dispersed in the fluid, wherein nano graphene platelets have a proportion of 0.001% to 60% by weight based on the total weight of the fluid and the graphene platelets combined. Preferably, the composition comprises at least a single-layer graphene sheet. Preferably, the lubricating fluid contains a petroleum oil or synthetic oil and a dispersant or surfactant. With the addition of a thickener or a desired amount of NGPs, the lubricant becomes a grease composition. Compared with graphite nano particle- or carbon nanotube-modified lubricants, NGP-modified lubricants have much better thermal conductivity, friction-reducing capability, anti-wear performance, and viscosity stability.

Disclosed is a hybrid fiber tow that comprises multiple continuous filaments and nanoscale fillers embedded in the interstitial spaces between continuous filaments. Nanoscale fillers may be selected from a nanoscale graphene plate, non-graphite platelet, carbon nano-tube, nano-rod, carbon nano-fiber, non-carbon nano-fiber, or a combination thereof. Also disclosed are a hybrid fiber tow impregnated with a matrix material and a composite structure fabricated from a hybrid fiber tow. The composite exhibits improved physical properties (e.g., thermal conductivity) in a direction transverse to the continuous fiber axis. A roll-to-roll process for producing a continuous fiber tow or matrix-impregnated fiber tow and an automated process for producing composite structures containing both continuous filaments and nanoscale fillers are also provided.

A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

An enchance recording head design provides conduction and mechanical restraint control in order to minimize the pole tip protrusion and the head temperature resulting from the thermal heating of the magnetic recording head during operation. In one embodiment, the recording head includes a hybrid diffuser formed within an insulation layer, at a predetermined distance from the head write section. The hybrid diffuser is comprised of a thermal conduction layer with high thermal conductivity, such as gold or copper, and a mechanical restraint layer having near zero CTE, such as a 60-80% face-centered-cubic NiFe (Invar) material. The hybrid diffuser is recessed from the ABS to prevent the delamination of the hybrid diffuser due to the otherwise displacement incompatibility between the inner insulating layer and the hybrid diffuser at the ABS.

A thin film magnetic head includes a slider body having a trailing surface meeting an air-bearing surface at a trailing edge. A magnetic read and write elements are disposed along the trailing surface near the trailing edge. The magnetic write element includes write poles and a coil. A portion of a heating element is disposed in a first general plane beneath the coil and above the magnetic read element. At least one thermally-insulating layer of material having a thermal conductivity of less than about 2.0 W/m-K extends in a second general plane substantially beneath the heating element.

This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m DEG K and it is capable of being molded using high speed molding techniques such as injection molding.

A susceptor for holding semiconductor wafers in an MOCVD reactor during growth of epitaxial layers on the wafers is disclosed. The susceptor comprises a base structure made of a material having low thermal conductivity at high temperature, and has one or more plate holes to house heat transfer plugs. The plugs are made of a material with high thermal conductivity at high temperatures to transfer heat to the semiconductor wafers. A metalorganic organic chemical vapor deposition reactor is also disclosed utilizing a susceptor according to the present invention.

Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.

It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.

A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al2O3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W/m-K and a wet dielectric breakdown strength of at least about 475 Vac/mil.

A ceramic thermal barrier coating (TBC) (18) having first and second layers (20, 22), the second layer (22) having a lower thermal conductivity than the first layer for a given density. The second layer may be formed of a material with anisotropic crystal lattice structure. Voids (24) in at least the first layer (20) make the first layer less dense than the second layer. Grooves (28) are formed in the TBC (18) for thermal strain relief. The grooves may align with fluid streamlines over the TBC. Multiple layers (84, 86,88) may have respective sets of grooves (90), Preferred failure planes parallel to the coating surface (30) may be formed at different depths (A1, A2, A3) in the thickness of the TBC to stimulate generation of a fresh surface when a portion of the coating fails by spalling. A dense top layer (92) may provide environmental and erosion resistance.

A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

A thermally induced sound wave generating device comprising a thermally conductive substrate, a head insulation layer formed on one surface of the substrate, and a heating element thin film formed on the heat insulation layer and in the form of an electrically driven metal film, and wherein when the heat conductivity of the thermally conductive substrate is set as α_s and its heat capacity is set as C_s, and the thermal conductivity of the beat insulation layer is set as α_I and its heat capacity is set as C_I, relation of 1/100≧α_IC_I/α_SC_S and α_SC_S≧100×10⁶ is realized. This is a new technical means capable of greatly improving the function of a pressure generating device based on thermal induction.

A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate. The wiring board is produced inexpensively by co-firing, features excellent heat-radiating performance, is capable of quickly radiating the heat from the light-emitting element when the light-emitting element is mounted, and effectively prevents a decrease in the brightness of the light-emitting element caused by the heat.

Disclosed is a nano-scaled graphene article comprising a non-woven aggregate of nano-scaled graphene platelets wherein each of the platelets comprises a graphene sheet or multiple graphene sheets and the platelets have a thickness no greater than 100 nm (preferably smaller than 10 nm) and platelets contact other platelets to define a plurality of conductive pathways along the article. The article has an exceptional thermal conductivity (typically greater than 500 Wm⁻¹K⁻¹) and excellent electrical conductivity (typically greater than 1,000 S/cm). Thin-film articles of the present invention can be used for thermal management in micro-electronic devices and for current-dissipating on an aircraft skin against lightning strikes.

Aerogel composite materials having a lofty fibrous batting reinforcement preferably in combination with one or both of individual short randomly oriented microfibers and conductive layers exhibit improved performance in one or all of flexibility, drape, durability, resistance to sintering, x-y thermal conductivity, x-y electrical conductivity, RFI-EMI attenuation, and/or burn-through resistance.

Certain embodiments provide a system including a heater. The heater includes one or more electrical conductors. The heater is configured to generate a heat output during application of electrical current to the heater. The heater includes a ferromagnetic material. A conduit at least partially surrounds the heater. A fluid is located in a space between the heater and the conduit. The fluid has a higher thermal conductivity than air at standard temperature and pressure (STP) (0° C. and 101.325 kPa). The system is configured to provide (a) a first heat output below a selected temperature when time-varying electrical current is applied to the heater, and (b) a second heat output near or above the selected temperature when time-varying electrical current is applied to the heater.

A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes an electrostatic chuck coupled to a metallic base. The electrostatic chuck includes at least one chucking electrode and metallic base includes at least two fluidly isolated conduit loops disposed therein. In another embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.

An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.

A composition for a Coating System (paint) which forms an insulating material being designed to both reflect infrared radiation and have reduced thermal conductivity. The coating system may be either a single Thermal Coating or may be a Thermal Coating used in combination with a Thermal Primer. The Thermal Coating is formulated using conventional techniques and a resin used in paint manufacture, but utilizes primary pigments and extender mineral pigments which preferentially reflect in the infra red area of the solar spectrum. A method of characterizing particulate materials for their infra red reflectivity is described, which provides a means for preferential selection of particulate additives based on their relative visible light and infrared reflectivity. Additionally the incorporation of hollow micro-spheres is desired to reduce thermal conductivity. The Thermal Primer is designed to provide adhesion between the Thermal Coating and the substrate on which it is applied and uses conventional techniques to achieve those properties. However it has been found advantageous to incorporate hollow micro-spheres with low thermal conductivity, such as glass, ceramic or polymeric micro-spheres and/or an extender pigment with low thermal conductivity such as calcined clay to further reduce heat flow through the Coating System.