12793 results about "Production rate" patented technology

A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting lines. A lower chip is then attached and connected to a substrate, which may be a test wafer, and an upper chip is attached and connected to the lower chip, the electrical connections being achieved through their respective connection vias. In addition to the connection vias, the chip stack package may include connection bumps formed between vertically adjacent chips and / or the lower chip and the substrate. The preferred substrate is a test wafer that allows the attached chips to be tested, and replaced if faulty, thereby ensuring that each layer of stacked chips includes only “known-good die” before the next layer of chips is attached thereby increasing the production rate and improving the yield.

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part 1a for controlled heating of a wafer placed on its top face, and block part 3a provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part 1a by abutting on or separating from the reverse surface of heater part 1a. By having the heat capacity of block part 3a be 20% or more of the total heat capacity of heater part 1a and block part 3a, the heater cooling speed can be made 10° C. / min or more.

A substrate processing apparatus which is capable of enhancing productivity in manufacturing product substrates. In process chambers 106 and 107 of an etching apparatus 100, etching is carried out on a substrate as an object to be processed, and dummy processing is carried out on at least one non-product substrate before execution of the etching. A host computer 200 determines whether or not the dummy processing is to be executed. The host computer 200 determines whether or not the interior of each of the process chambers 106 and 107 is in a stable state, and omits the execution of the dummy processing when it is determined that it is in the stable state.

Provided are a wafer level stacked package with a via contact in an encapsulation portion, and a manufacturing method thereof. A plurality of semiconductor chips and encapsulation portions may be vertically deposited and electrically connected through a via contact that may be vertically formed in the encapsulation portion. Thus, an effective fan-out structure may be produced, vertical deposition may be available regardless of the type of a semiconductor device, and productivity may be improved.

A method of mRNA production for use in transfection is provided, that involves in vitro transcription of PCR generated templates with specially designed primers, followed by polyA addition, to produce a construct containing 3′ and 5′ untranslated sequence (“UTR”), a 5′ cap and / or Internal Ribosome Entry Site (IRES), the gene to be expressed, and a polyA tail, typically 50-2000 bases in length. This RNA can efficiently transfect different kinds of cells. This approach results in increased efficiency (fidelity and productivity) of mRNA synthesis and is less time consuming because it does not require cloning, and also consequently eliminates the unwanted errors and effects related to RNA made on DNA templates obtained with cloning techniques. The results of transfection of RNAs demonstrate that RNA transfection can be very effective in cells that are exceedingly difficult to transfect efficiently with DNA constructs. Further, the levels of gene expression following mRNA transfection are consistent from cell to cell in an experiment and these levels can be controlled over a wide range simply by changing the amount of mRNA that is transfected, and without obvious cytotoxic effects due to the levels of RNA per se. Due to high efficiency the cells can be simultaneously transfected with multiple genetic constructs. The method can be used to deliver genes into cells not- or only poorly transfectable for DNA, in vitro and in vivo.

Improved adsorbent sheet based parallel passage adsorbent structures for enhancing the kinetic selectivity of certain kinetic-controlled adsorption processes, such as PSA, TSA and PPSA processes, and combinations thereof, are provided. The enhancements in kinetic selectivity made possible through the implementation of the present inventive improved adsorbent structures may unexpectedly enable significant intensification of selected kinetic adsorption processes relative to attainable performance with conventional adsorbent materials in beaded or extruded form. Such process intensification enabled by the present inventive adsorbent structures may provide for increased adsorption cycle frequencies, and increased gas flow velocities within the adsorbent beds, which may increase the productivity and / or recovery of a kinetic adsorption system incorporating the inventive adsorbent structures.