829 results about "Aluminum substrate" patented technology

The invention relates to the technical field of aluminum substrate production, in particular to a laser cutting device for aluminum substrate production and processing, which comprises a bottom frame and a shell fixedly connected to the bottom frame, a transparent cover plate is rotatably connected to the shell, a fixed seat is fixedly connected to the top of the bottom frame, and a laser cutting head is mounted on the fixed seat. A laser cutting head is firstly started to conduct laser cutting on an aluminum substrate, after laser cutting of the aluminum substrate is completed, a conveying roller is started to rotate reversely to drive the aluminum substrate to move downwards and forwards for discharging, and meanwhile, a reciprocating groove rod drives an n-shaped steel wire brush to move forwards through a ball and a fixing ring to make contact with an elastic supporting column I and an elastic supporting column II; the n-shaped steel wire brush can remove slag attached to the elastic supporting column I and the elastic supporting column II, in this way, the attached slag can be removed in the discharging process of the aluminum substrate, discharging and slag removal are conducted synchronously, manual removal is not needed, and therefore the follow-up laser cutting efficiency of the aluminum substrate is improved.

An object of the present invention is to provide a novel technique capable of manufacturing a large-diameter AlN substrate.The present invention is a method for manufacturing an AlN substrate, including a crystal growth step S30 of forming an AlN layer 20 on a SiC underlying substrate 10 having through holes 11. In addition, the present invention is a method for forming an AlN layer including the through hole formation step S20 of forming the through holes 11 in the SiC underlying substrate 10 before forming the AlN layer 20 on the SiC underlying substrate 10.

The invention discloses an automatic laminating device for a copper-clad plate. The automatic laminating device comprises a bottom frame, a conveying main body, a protective cover, a top cover, a glue spraying head, a connecting pipe, a rectangular groove, an assembling mechanism and a pressing mechanism, the assembling mechanism and the pressing mechanism are optimally arranged, four strip frames of the assembling mechanism are used for stacking the aluminum substrates, copper plates and the aluminum substrates are limited through a first positioning structure and a second positioning structure during laminating processing, and one aluminum substrate falls off at a time under the action of a first discharging structure and a second discharging structure, so that the production efficiency is improved, and the production efficiency is improved. The aluminum substrate is pressed on the copper plate through the pressing mechanism so that the aluminum substrate can fall on the copper plate, the attaching regularity of the copper plate and the aluminum substrate can be guaranteed, then the moving and pressing structure of the pressing mechanism rotates and moves downwards to make contact with the upper portion of the aluminum substrate, the aluminum substrate is pressed on the copper plate from right to left through the moving and pressing structure, air between the aluminum substrate and the copper plate is exhausted, and the attaching efficiency is improved.

The invention discloses an aluminum substrate UV matt finish paint and a preparation process thereof, and relates to the technical field of paints.The aluminum substrate UV matt finish paint is prepared from, by mass, 10%-20% of modified polyurethane acrylate, 25%-32% of high-functionality aliphatic polyurethane acrylate, 18%-30% of special modified epoxy acrylate resin, 0.5%-2% of dispersing agent, 0.1%-0.5% of defoaming agent, 1%-3% of anti-settling powder and the balance water. The paint is prepared from the following components in percentage by weight: 10 to 15 percent of magnesium silicate mineral, 1 to 10 percent of matting powder, 0.2 to 1 percent of 1-hydroxycyclohexyl phenyl ketone, 0.5 to 3 percent of trimethylbenzoyl-diphenyl phosphine oxide, 1 to 3 percent of acrylate flatting agent, 0.2 to 1.2 percent of polyurea modified polyurethane rheological agent and 5 to 15 percent of trimethylolpropane triacrylate. According to the UV matte finishing paint disclosed by the invention, through compounding of ternary resin and enhancement of nano silicon dioxide, a rigid and tough cross-linked network is constructed, a paint film is free of cracks when being bent at 180 degrees, the adhesive force reaches grade 0, and a coating is resistant to acid and alkali etching liquid and free of corrosion by cooperating with a silane coupling agent and a light stabilization system, and the color difference is delta Elt after the UV matte finishing paint is subjected to high temperature of 260 DEG C; and 1.5, the anti-yellowing performance is excellent.

The utility model relates to the technical field of aluminum substrate processing, in particular to a lead positioning tool for solving skewing of a reflow soldering lead of a double-layer aluminum substrate. The lead positioning tool comprises a carrier, two long lead positioning clamps and a short lead positioning clamp, the carrier is horizontally arranged, the upper end face of the carrier is provided with an assembling groove matched with the double-layer aluminum substrate, the short lead positioning clamp is detachably installed at the upper end of the carrier, and the long lead positioning clamps are detachably installed at the lower end of the carrier. A plurality of groups of short lead channels vertically penetrating through the double-layer aluminum substrate are arranged on the double-layer aluminum substrate, the two long lead positioning clamps are detachably arranged at two ends of the upper part of the double-layer aluminum substrate respectively, and the long lead positioning clamps are respectively provided with long lead channels vertically penetrating through the long lead positioning clamps. The structure has the advantages that the structure design is simple and reasonable, the long lead of a product can be ensured to be in a vertical state after being welded with the double-layer aluminum substrate, the stress caused by lead deflection in the assembly process is avoided, and the lead distance is ensured to meet the design requirement.

The invention discloses a long-life aluminum profile for a mold and a preparation process thereof, and relates to the technical field of aluminum alloys, a zirconium film is loaded on the surface of the aluminum profile, the zirconium film generates an oxide layer on the surface of an aluminum substrate through hydrolysis reaction, micropores in the surface of the aluminum substrate are filled, and the corrosion resistance of the aluminum profile is enhanced. However, the corrosion resistance of a single zirconium film is insufficient, and the corrosion resistance of the aluminum profile is further enhanced by coating the surface of the aluminum profile with the zirconium film with the anti-corrosion liquid. 3-epoxypropoxy propyl triethoxy silane is added into the zirconium conversion liquid, so that the surface of a zirconium film is provided with epoxy groups, the epoxy groups on the surface of the zirconium film and amino groups in the corrosion-resistant chitosan microcapsules form hydrogen bonds and coordinate bonds, the bonding strength of a corrosion-resistant coating is improved, and therefore the corrosion resistance of the aluminum profile for the mold is improved.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

The present invention discloses a cyclotron metal composite target for preparing targeted radionuclide drugs, which comprises an aluminum substrate whose shape matches the shape of the target position of the accelerator. A bismuth layer is attached to or embedded in the surface of the aluminum substrate, and the thickness of the bismuth layer is 10-20 μm. The present invention provides a cyclotron metal composite target for preparing targeted radionuclide drugs, which can reduce or even avoid the melting of the target, improve the heat conduction efficiency of the target, and avoid the pollution of the equipment and its products.

[Problem] To improve the partial discharge resistance of an insulating substrate for an electronic circuit that uses an aluminum nitride sintered substrate. [Solution] Provided is an aluminum nitride sintered substrate containing zirconium-containing particles therein, wherein the aluminum nitride sintered substrate has a composition in which the Zr / Al molar ratio is 0.0017-0.0665, and the region from the end surface in the thickness direction to at least a depth of 10.0 μm is a zirconium-deficient surface layer in which the number density of the zirconium-containing particles in a cross section parallel to the thickness direction is 6.0 / 540μm2 or less.

The utility model relates to the technical field of aluminum substrate processing, in particular to aluminum substrate withstand voltage test equipment, which comprises an operation table, an aluminum substrate adjusting component and a withstand voltage test component, the withstand voltage test component comprises a test frame, a first electric adjusting telescopic rod is mounted at the upper end of the test frame, and a second electric adjusting telescopic rod is mounted at the lower end of the test frame. A testing head is mounted at the lower end of the first electric adjusting telescopic rod and comprises a mounting seat, a pressure sensor is mounted on the upper side of the mounting seat, a magnetic suction head is arranged on the lower side of the mounting seat, an adsorption seat is arranged on the outer side of the magnetic suction head, and a first mounting plate is arranged on the lower side of the adsorption seat. According to the utility model, the image of the aluminum substrate is detected through the image probe, the test point position of the aluminum substrate is automatically adjusted through the aluminum substrate adjusting component according to the image analysis, the test accuracy is improved, the voltage-withstanding test component is disassembled through the limiting plate and the pressing plate, the test needle is replaced through the magnetic suction head and the adsorption seat, and the replacement convenience of the test needle is improved.

The invention provides an aluminum substrate drilling tool wear prediction method based on reinforcement learning, and the method comprises the steps: collecting working condition parameters, such as main shaft rotation speed, feeding speed, cutting depth, material type and historical vibration energy, through the deployment of an industrial sensor network, and achieving data standardization through feature extraction and normalization processing; a dynamic cognitive map with process meaning is constructed by adopting semantic analysis and a map generation strategy, key semantic nodes are identified by utilizing a map attention network, reinforcement learning is driven through a structured reward function, and self-adaptive optimization of a wear prediction strategy is realized; according to the method, abnormal detection and working condition abrupt change increment updating are supported, map consistency optimization is achieved by fusing expert experience, the tool wear prediction precision and the environment adaptability can be improved, and the intelligent sensing and dynamic response capacity to the complex manufacturing process can be enhanced.

The utility model discloses a connecting structure of an aluminum-based bus duct with copper-clad end parts, and relates to the technical field of busbars. The copper-aluminum eutectic conducting bar comprises a copper-aluminum eutectic conducting bar body, the copper-aluminum eutectic conducting bar body comprises an aluminum alloy base body layer A, the end portions of the upper side face and the lower side face of the aluminum alloy base body layer A are covered with copper connecting layers A, and the copper-aluminum eutectic layer A is arranged between the aluminum alloy base body layer A and the copper connecting layers A. The copper-aluminum eutectic conducting bar further comprises a connector which comprises a plurality of copper-aluminum eutectic connecting pieces. The copper-aluminum eutectic conducting bar is clamped by the connector and tightly abuts against the copper-aluminum eutectic connecting piece. The beneficial effects of the utility model lie in that the utility model combines the advantages of low density and low cost of aluminum and the characteristics of high conductivity and corrosion resistance of copper, and only the end part of the aluminum substrate is coated with copper, so that the overall cost is reduced, the excellent performance of key parts is ensured, the perfect balance between the performance and the cost is realized, and the copper-aluminum eutectic technology is adopted. The problems that interface bonding is not firm, resistance is large, and corrosion is prone to occurring when aluminum and copper are directly connected are effectively solved.

The utility model provides a super capacitor with a full-tab welding type structure, which relates to the technical field of capacitor design, and comprises a cover plate assembly, the cover plate assembly comprises an upper plastic, an aluminum substrate, a lower plastic and an adapter sheet which are sequentially arranged from top to bottom, the periphery of the aluminum substrate abuts against the top of a shell and is fixed through laser welding, and the adapter sheet is arranged on the top of the shell. The adapter plate and the upper current collector are fixed through laser welding, and the positive pole lug and the negative pole lug of the roll core assembly are respectively fixed with the lower current collector and the upper current collector through laser welding. And through the cylindrical structure, the internal connection completely adopts laser welding, the internal resistance can reach below 1 milliohm, and the blank of the domestic low-internal-resistance super capacitor is filled. Compared with an ox horn type supercapacitor, the supercapacitor provided by the utility model has the advantages that the overcurrent capability is higher, the internal resistance is lower, the overall vibration resistance is better due to the adoption of laser welding fixation, and the condition of liquid leakage is not easy to occur.

The invention discloses a reflow soldering curve measuring method. The method comprises the steps that S1, a temperature measuring plate is manufactured; the temperature measuring plate comprises an aluminum substrate, a device is fixedly arranged above the aluminum substrate by smearing silver adhesive, a thermocouple is arranged on the device, the front end of the thermocouple is fixedly arranged on a device body through conductive adhesive, and a wire body on the thermocouple is fixed through high-temperature-resistant adhesive tape. One end, far away from the thermocouple, of the wire body is connected to a furnace temperature measuring instrument, and the surface temperature of the device is detected and recorded in the measuring process; s2, measuring a curve; and S3, data management. The invention belongs to the field of reflow soldering curve measuring methods, and particularly relates to a reflow soldering curve measuring method. According to the method, by designing and combining existing test methods, furnace temperature curves of reflow corresponding to devices of different packaging types are innovated on the basis of IPC-JEDEC J-STD-020F-2022 Moisture Reflow Sensitivity for Non-Hermetic Surface Mount Devices (SMDs), and the accuracy rate of selecting the reflow curve during a pretreatment test is improved.

The invention discloses a high-thermal-conductivity insulating aluminum substrate and a preparation method thereof, and belongs to the technical field of insulating materials. The high-thermal-conductivity insulating aluminum substrate comprises an aluminum substrate and a thermal conductive coating uniformly coated on the surface of the aluminum substrate; the preparation method of the heat-conducting coating comprises the following steps: adding the modified boron nitride into the epoxy resin, uniformly mixing, adding the epoxy curing agent, the flatting agent, the anti-settling agent, the defoaming agent and the acetone, and uniformly mixing and stirring to obtain the heat-conducting coating. The modified boron nitride is added into the heat-conducting coating, so that the flexibility and corrosion resistance of the heat-conducting coating are remarkably improved, the service life of the heat-conducting coating is prolonged, and the aluminum substrate is well protected.

The present invention discloses a preparation method of a copper-clad aluminum reflective bus bar and a photovoltaic module. The bus bar body includes a base layer and a tin layer. The base layer includes an aluminum substrate and a copper layer wrapped on the outer surface of the aluminum substrate. The light incident surface of the bus bar body is a serrated structure. Its preparation process is as follows: Step 1, wrap a copper strip on the surface of an aluminum core; Step 2, weld the butt joint of the copper strip by argon arc welding to form a wrapped structure; Step 3, roll the copper-clad aluminum substrate in Step 2 through a rolling mill for reflective pattern rolling to form serrated reflective patterns on one of its surfaces; Step 4: heat-treat the product after rolling in Step 3; Step 5, coat the surface of the product after heat treatment in Step 4 with a soldering flux; Step 6, tin-plate by hot dip plating process; Step 7, cool and wind up. Through the design of the reflective surface pattern, the present invention realizes the improvement of the overall power of the photovoltaic module by increasing the effective utilization rate of light per unit area of the photovoltaic module.

The utility model relates to the field of PCB detection, in particular to a withstand voltage detection device for a PCB. Comprising a detection table, and a calibration plate of an L-shaped structure is arranged at one corner of a detection area; the annular outer edge of the detection area is also provided with a fastener; the fastening piece comprises a mounting plate, a fastening plate and a fastening rod; a testing structure is arranged on the back plate and comprises a rotating motor, a rotating shaft, a guide rod, a mounting seat and a testing needle; the rotating motor is mounted on the back plate through a bracket; an output shaft of the rotating motor is connected with the rotating shaft; the guide rod is arranged on the back plate and is parallel to the rotating shaft; the mounting seat penetrates through the rotating shaft and is in threaded connection with the rotating shaft; meanwhile, the mounting seat also penetrates through the guide rod, and the mounting seat and the guide rod are in sliding connection; the test needles are installed on the installation seat and used for carrying out electrified withstand voltage test operation on the aluminum substrate, and the distance between the two test needles is adjustable. The device is simple in operation, facilitates the fixation of the PCB, can be suitable for the withstand voltage detection of various PCBs with various specifications, and is more practical.

The invention relates to the technical field of food packaging, in particular to a bacteriostatic aluminum foil material for a meal box and a preparation method thereof. The material is subjected to aluminum foil surface activation, then is sequentially impregnated in a sol impregnation liquid and an outer layer coating liquid, is subjected to dip coating, and finally is subjected to ultraviolet curing to obtain a multi-layer composite structure. The middle layer is made of an aminated organic silicon material and is firmly combined with the aluminum base material and the outer layer resin through chemical bonds, so that the adhesive force of the coating is remarkably improved. The outer coating is added with a phenyl triazole modified layered double hydroxide loaded nano-silver antibacterial agent, so that slow release and efficient broad-spectrum antibacterial property of silver ions are realized, the thermal stability is improved, and reliable performance under a high-temperature condition is ensured. The multilayer design and multiple antibacterial mechanisms have a synergistic effect, the problems of poor antibacterial durability, insufficient adhesive force, low heat resistance and the like of a traditional lunch box aluminum foil material are effectively solved, meanwhile, food safety is considered, and the aluminum foil material is suitable for the field of modern high-requirement food packaging.

The invention belongs to the technical field of catalytic materials, and particularly relates to a nickel-iron-cobalt entropy alloy nanowire three-dimensional interconnection grid film and a preparation method and application thereof. The preparation method comprises the following steps: taking an aluminum sheet containing copper impurities as a substrate, and preparing a three-dimensional ordered porous aluminum oxide template through anodic oxidation; then, the nickel-iron-cobalt entropy alloy nanowire is prepared in a pore channel limited range through direct current co-electrodeposition; the nickel-iron-cobalt entropy alloy nanowire three-dimensional interconnection grid film is obtained after the aluminum substrate and the 3D-AAO template are removed, the material is based on the mixed entropy effect and structural integrated design and can be directly used as a self-supporting electrode for efficiently and stably electrolyzing water for oxygen evolution, the three-dimensional grid structure and the self-supporting characteristic of the material promote electrolyte transmission and gas product desorption, and the oxygen evolution efficiency is improved. The mass transfer efficiency is improved, the use of a traditional binder is avoided, and the electrode stability is enhanced; the problems that an existing medium-entropy alloy catalyst is high in synthesis energy consumption, the catalytic activity is poor under the industrial-grade large-current working condition, active substances fall off in the reaction and the like are solved.

The utility model discloses a processing device based on a foamed and layered aluminum substrate, and relates to the technical field of aluminum substrate processing devices. The device comprises a processing box, wherein a heating box is fixedly mounted on one side of the processing box; a washing assembly is arranged in the machining box and comprises a rotating rod, the bottom of the rotating rod is rotationally connected with the inner bottom of the machining box through a bearing seat, a containing disc is fixedly connected to the surface of the rotating rod, one side of the interior of the machining box communicates with a washing head, and the top of the rotating rod extends out of the machining box and is fixedly connected with a driving motor. Through the arrangement of the first belt pulley and the second belt pulley, one group of driving motors can be used for driving two groups of mechanisms at the same time, certain use cost is saved, through the arrangement of the rotating rod, the placing disc and the positioning column, static washing and drying forms can be changed, certain machining efficiency is improved, and the production cost is reduced. According to the utility model, a simple structure is utilized, better functions are realized, and the device is worthy of popularization.

The utility model relates to a bathroom cabinet board which comprises a film covering layer, a base plate layer, an aluminum honeycomb plate layer, a base plate layer and a film covering layer which are sequentially arranged in a stacked mode in the direction from the top face to the bottom face. The substrate layer comprises an aluminum substrate layer or a stainless steel substrate layer. According to the utility model, the aluminum honeycomb plate layer is introduced, and the multilayer composite structure design of the two substrate layers and the two film layers is combined, so that the problem that the plate surface is easy to sink can be solved, the product strength is improved, in addition, the waterproof and moistureproof advantages are realized, the quality problem caused by water swelling is thoroughly solved, and the service life of the product is prolonged.

The invention provides a multi-channel high-precision resistance temperature coefficient test system and method, and the system comprises a vacuum system module which is used for a vacuum test environment, a temperature control heating module which is a heating device with programmable temperature control, and a multi-channel test module which comprises a resistance tester, a multi-channel acquisition card and a connection interface, the multi-channel acquisition card is connected with the resistance tester through an interface, the multi-channel acquisition card is connected with the aviation plug through a test line, the aviation plug is detachably connected with a sample to be tested through the test line, and the temperature monitoring module adopts a thermocouple to test temperature. The data acquisition terminal records and processes multichannel resistance values and corresponding temperature data in real time, the sample table module is used for placing multichannel test samples and is placed in the temperature control heating module, and a sample table adopts an aluminum-based PCB (printed circuit board) or a copper-based PCB subjected to aluminum nitride ceramic or insulation treatment and can bear at least two test samples at the same time.

The present invention provides a liquid-cooling heat dissipation apparatus for a power device, and an on-board charger. The liquid-cooling heat dissipation apparatus comprises a circuit board, a power device, and a heat dissipation assembly which are sequentially stacked. One side of the power device is connected to the circuit board by means of pins on the power device, and the other side of the power device is installed on a heat dissipation surface of the heat dissipation assembly. In the present invention, the power device is directly installed on the heat dissipation surface of the heat dissipation assembly, so that compared with the prior art, the present invention omits an intermediate heat transfer layer such as an aluminum substrate, reducing thermal contact resistance, thereby improving heat dissipation performance; additionally, the aluminum substrate is not used, so that no additional pressing strip is required to press the aluminum substrate, thereby reducing the complexity of installation, and reducing the installation space required for the power device.

The present application relates to the technical field of automotive electronics, and discloses an FPC structure and a manufacturing method. In a first aspect, an FPC structure is provided, comprising a supporting substrate and an aluminum substrate, wherein the supporting substrate comprises an integrally formed flexible board body and a flexible board connecting piece, and the aluminum substrate is covered on the supporting substrate; in a second aspect, a manufacturing method for the above-mentioned FPC structure is provided, comprising the following steps: Step 1: cutting and blanking, cutting the raw material into rectangular sheets required for production; Step 2: performing laser drilling on the rectangular sheets; Step 3: laminating a protective film on the rectangular sheets; Step 4: corroding the unprotected aluminum material through exposure, development, and etching to expose the final circuit pattern; Step 5: covering with a protective film to protect the formed circuit; and at the same time, the flexible board body and the flexible board connecting piece are integrally punched and formed. The present application can simplify the manufacturing process of the FPC and improve the processing efficiency.

The present invention relates to the field of circuit boards, and more specifically, to a method for preparing a flexible aluminum PCB substrate material that can be arbitrarily bent and shaped. The flexible aluminum PCB substrate prepared by the present invention has an ingenious and rational structural design. The aluminum plate and copper foil are combined using a thermally conductive adhesive, resulting in excellent flexibility, resistance to breakage, and the ability to bend arbitrarily, meeting the diverse shapes and all-round lighting requirements of LED lamps. Furthermore, heat generated by the LED lamp is rapidly transferred to the aluminum substrate via the thermally conductive adhesive and then dissipated from the aluminum substrate, thereby achieving rapid heat dissipation and achieving excellent heat dissipation effects.

The invention discloses an on-board connector, and relates to the technical field of electronic connectors, the on-board connector comprises a PCB, the PCB is provided with an installation assembly and a protection assembly, the installation assembly comprises a connecting groove, a clamping plate is fixedly connected in the connecting groove, and the inner side of the PCB is provided with a plastic shell. According to the on-board connector, by pressing the elastic clamping plate which is arranged on the PCB and is connected with the button at the bottom, the clamping plate can be easily clamped into or separated from the clamping grooves in the tops of the connecting blocks on the two sides of the plastic shell, the connector can be quickly mounted and dismounted through the plug-in design, the assembling process is greatly simplified, meanwhile, the fixing plate designed in a T shape is tightly attached to the surface of the PCB, and the fixing plate is not prone to falling off. According to the utility model, the metal terminal is arranged on the insulation body and acts together with the grounding plate, so that not only is an excellent mechanical fixing effect provided, but also good grounding performance is ensured, the insulation body is accurately fixed between the metal terminal and the aluminum substrate of the PCB, the key electrical creepage distance is fundamentally ensured, and the potential safety hazard of discharge is eliminated.

The invention relates to the technical field of punching equipment, and discloses an aluminum pole piece punching device which comprises a rack, a movable seat driven by a lifting machine is installed at the upper end of an inner cavity of the rack, a punching mold located over a bearing table is installed at the bottom of the movable seat, and a bearing plate used for containing an aluminum substrate is installed at the upper end of the bearing table; at least one pair of pressing assemblies is installed on the upper end face of the bearing plate and used for pressing at least one set of opposite sides of the aluminum substrate, and an inserting plate is installed at the bottom of the movable base. The inserting plate is inserted into the inserting hole along with descending of the movable base, the movable block is pushed to drive the transmission rack and the threaded rod to rotate, the pressing plate is made to press down and fix the aluminum substrate, manual intervention or complex electrical elements are not needed in the whole process, automatic pressing is achieved through mechanical linkage, the operation intensity is reduced, and potential safety hazards of manual operation are eliminated; meanwhile, shutdown maintenance caused by electrical faults is avoided, and the product quality and the production efficiency are improved.

The invention provides a thermoelectric separation PCB manufacturing method based on an aluminum-based electroplating process, and the method comprises the steps: manufacturing a circuit layer through employing an FR4 single-sided board, and forming a needed circuit through etching; a set area is milled on the FR4 single-sided board in a numerical control mode, and a reserved space is formed; cutting the PP insulating layer to form a through hole matched with the reserved space; the aluminum substrate, the PP insulating layer and the FR4 single-sided board are overlapped and subjected to compression molding, an intermediate board is obtained, and a groove is formed in the intermediate board; covering a dry film protection circuit layer on the intermediate plate, and electroplating in the region of the groove through an electroplating process to obtain a copper layer; and removing the dry film, and completing subsequent manufacturing according to the existing process to obtain the PCB. The cost is reduced and the process is simplified.

The invention belongs to the technical field of metal substrates, and particularly relates to a graphene composite high-thermal-conductivity aluminum substrate, a preparation method and application. The graphene composite high-thermal-conductivity aluminum substrate comprises a conductive copper foil layer, a graphene composite high-thermal-conductivity layer and an aluminum substrate layer, the graphene composite high heat conduction layer comprises an upper layer, a middle layer and a lower layer, and the upper layer is connected with the conductive copper foil layer and is a heat conduction adhesive layer; the middle layer is a graphene composite sheet layer and is a film layer formed by compounding and hot-pressing graphene and a polymer; the lower layer is connected with the aluminum substrate layer and is a graphene modified aluminum oxide film layer; graphene in the graphene composite sheet layer is arranged in a horizontal orientation manner; graphene in the aluminum oxide film layer is arranged in a vertical orientation manner. According to the graphene composite high-thermal-conductivity aluminum substrate and the preparation method thereof, the graphene is used for constructing a longitudinal efficient heat conduction path and balancing stress, and the obtained graphene composite high-thermal-conductivity aluminum substrate has ultrahigh heat conduction performance, ultralow warping rate and good reliability and can be used in high-performance electronic devices and circuit boards.

The utility model relates to the field of aluminum substrates, in particular to a turnover mechanism for detecting the size of an aluminum substrate. Comprising a detection platform which is distributed left and right and is of a rectangular frame structure, and the center of the detection platform is a detection area; a fastening piece is also arranged in the detection area and comprises a turnover motor, a rotating shaft, an auxiliary plate and a fastening plate; the overturning motor is arranged on the detection platform through a bracket and has a locking function; the rotating shafts are distributed left and right and can rotate relative to the side wall of the detection area, and the rotating shafts are connected with a turnover motor so as to complete 180-degree turnover operation of the auxiliary plate; the auxiliary plate is of a concave structure, and one side of the auxiliary plate is fixed to the rotating shaft through welding. And the fastening plate is arranged in the auxiliary plate in a manner of moving up and down so as to complete the installation of the aluminum substrate with preset fastening force. The aluminum substrate detection device is reasonable in structural design, can conveniently turn over to carry out double-sided automatic detection on the basis of ensuring fastening installation of the aluminum substrate, and is more practical.