1093 results about "Aluminum substrate" patented technology

The invention provides an Al-Mg alloy negative electrode current collector, a preparation method thereof and a negative-electrode-free sodium metal battery, and relates to the field of batteries. The preparation method of the Al-Mg alloy negative electrode current collector comprises the following steps: sputtering magnesium on the surface of an aluminum foil by adopting a magnetron sputtering mode, and forming a magnesium coating on the aluminum foil; and calcining the aluminum foil with the magnesium plating layer to obtain the Al-Mg alloy negative electrode current collector, and the Al-Mg alloy negative electrode current collector comprises an aluminum substrate layer and an Al-Mg alloy layer located on the aluminum substrate layer. According to the present invention, the Al-Mg alloy with characteristics of high sodium affinity and stable three-dimensional structure is introduced into the negative electrode current collector so as to induce the uniform deposition of sodium, inhibit the growth of sodium dendrites, reduce the loss of active sodium, and prolong the cycle life of the battery; the negative electrode current collector can be used in a sodium metal battery without a negative electrode. In addition, the method has the advantages of being easy to operate and low in raw material cost, and large-scale application and popularization are facilitated.

The invention relates to the technical field of aluminum substrate processing, in particular to a television backlight aluminum substrate conveying and discharging structure with high stability, which comprises a conveying frame serving as a basic supporting part of the whole conveying structure; the discharging frame is installed on the upper portion of the conveying frame and used for discharging of the aluminum substrates, and a limiting assembly is installed on the inner side of the discharging frame; the conveying mechanism is installed on the inner side of the conveying frame and located below the discharging frame, and kinetic energy is provided for conveying the aluminum substrates; and the discharging mechanisms are mounted on the two sides of the surface of the discharging frame and are symmetrically arranged. According to the discharging device, the limiting assembly is arranged to be matched with the discharging frame, when an aluminum substrate is placed in the discharging frame, limiting plates on the two sides are pushed, then the limiting plates can push connecting rods and first elastic pieces to move, and after the aluminum substrate is located in the discharging frame, the limiting plates can be pushed to clamp and limit the aluminum substrate through the elastic effect of the first elastic pieces; and therefore, the shaking of the device during movement is reduced, and the transportation stability is improved.

The invention relates to the technical field of aluminum substrate production, in particular to a laser cutting device for aluminum substrate production and processing, which comprises a bottom frame and a shell fixedly connected to the bottom frame, a transparent cover plate is rotatably connected to the shell, a fixed seat is fixedly connected to the top of the bottom frame, and a laser cutting head is mounted on the fixed seat. A laser cutting head is firstly started to conduct laser cutting on an aluminum substrate, after laser cutting of the aluminum substrate is completed, a conveying roller is started to rotate reversely to drive the aluminum substrate to move downwards and forwards for discharging, and meanwhile, a reciprocating groove rod drives an n-shaped steel wire brush to move forwards through a ball and a fixing ring to make contact with an elastic supporting column I and an elastic supporting column II; the n-shaped steel wire brush can remove slag attached to the elastic supporting column I and the elastic supporting column II, in this way, the attached slag can be removed in the discharging process of the aluminum substrate, discharging and slag removal are conducted synchronously, manual removal is not needed, and therefore the follow-up laser cutting efficiency of the aluminum substrate is improved.

An object of the present invention is to provide a novel technique capable of manufacturing a large-diameter AlN substrate.The present invention is a method for manufacturing an AlN substrate, including a crystal growth step S30 of forming an AlN layer 20 on a SiC underlying substrate 10 having through holes 11. In addition, the present invention is a method for forming an AlN layer including the through hole formation step S20 of forming the through holes 11 in the SiC underlying substrate 10 before forming the AlN layer 20 on the SiC underlying substrate 10.

The invention belongs to the technical field of factory control. The invention provides an antibacterial aluminum plate production control method and system based on a large model. The method comprises the following steps: obtaining production preparation data and a target adhesive force index related to the antibacterial aluminum plate to be produced; inputting the target adhesion index, the aluminum substrate surface roughness and the assistant type into a key production parameter prediction model constructed based on a large model, and outputting a group of predicted key production parameters by the key parameter prediction model; and the aluminum substrate is coated with the silver ion coating according to the key production parameters, so that the antibacterial aluminum plate meeting the target adhesive force index is produced. According to the method, specific key production parameters can be formulated on the basis of the surface roughness of the aluminum substrate, the category of the coating and the type of the assistant, and the silver ion coating is cured according to the key production parameters, so that the antibacterial aluminum plate which is adaptive to a target adhesive force index expected by a customer can be obtained; and personalized customization of the antibacterial performance of the antibacterial aluminum plate by customers is realized.

The utility model relates to the technical field of light feeding devices, in particular to an eye-closed three-dimensional light feeding LED device, which is characterized in that a pupil LED chip group comprises a red light chip and a near-infrared light chip with the wavelength range of 625nm to 960nm; a pupil LED chip set, an eyelash LED chip set and a meibomian gland LED chip set are fixedly installed on the pupil aluminum substrate, and forced eye closing distance control hair is arranged on the pupil aluminum substrate. A lens aluminum substrate and an eyebrow acupoint aluminum substrate are mounted on the lens seat; the system further comprises an integrated control circuit. By using the red light chip, the optical power density comparable to that of laser and the effective irradiation area larger than that of the laser can be obtained, and the alignment precision of a light source to acupuncture points is reduced; by utilizing the blood activating function of dark red and near-infrared light, myopia, eyebrow thickening and eyelash thickening can be prevented and controlled; health care can be carried out on meibomian glands and a suspension tough system, and light stimulation can be carried out on eye protection acupuncture points; all-directional three-dimensional light feeding can be realized anytime and anywhere; the safety values under various limit conditions refer to three kinds of sunlight.

The invention discloses an automatic laminating device for a copper-clad plate. The automatic laminating device comprises a bottom frame, a conveying main body, a protective cover, a top cover, a glue spraying head, a connecting pipe, a rectangular groove, an assembling mechanism and a pressing mechanism, the assembling mechanism and the pressing mechanism are optimally arranged, four strip frames of the assembling mechanism are used for stacking the aluminum substrates, copper plates and the aluminum substrates are limited through a first positioning structure and a second positioning structure during laminating processing, and one aluminum substrate falls off at a time under the action of a first discharging structure and a second discharging structure, so that the production efficiency is improved, and the production efficiency is improved. The aluminum substrate is pressed on the copper plate through the pressing mechanism so that the aluminum substrate can fall on the copper plate, the attaching regularity of the copper plate and the aluminum substrate can be guaranteed, then the moving and pressing structure of the pressing mechanism rotates and moves downwards to make contact with the upper portion of the aluminum substrate, the aluminum substrate is pressed on the copper plate from right to left through the moving and pressing structure, air between the aluminum substrate and the copper plate is exhausted, and the attaching efficiency is improved.

The utility model discloses an improved lamp strip with good heat dissipation, which comprises a mounting shell, a lamp strip, a lamp strip, a lamp strip, a lamp strip, a lamp strip, a lamp strip, a lamp strip and a lamp strip, and is characterized in that the mounting shell is provided with a mounting cavity, and a supporting structure is arranged on the side wall of the mounting cavity; the aluminum substrate is provided with a plurality of sets of LED lamp beads, the aluminum substrate is arranged in the mounting cavity, the aluminum substrate is connected with the supporting structure, the aluminum substrate divides the mounting cavity into a light-emitting cavity and a heat dissipation cavity, the LED lamp beads are located in the light-emitting cavity, and the heat dissipation holes communicate with the heat dissipation cavity; the heat dissipation structure is arranged in the heat dissipation cavity, the heat dissipation structure comprises a connecting part and a plurality of heat dissipation fin parts, the connecting part is connected with the heat dissipation fin parts, the heat dissipation fin parts extend in the length direction of the installation shell, the heat dissipation fin parts are arranged at intervals in the width direction of the installation shell, and a heat dissipation flow channel is formed between every two adjacent heat dissipation fin parts; the heat dissipation flow channels are communicated with the heat dissipation holes; the heat conduction layer is located between the aluminum substrate and the heat dissipation structure, and the heat conduction layer is used for conducting heat of the aluminum substrate to the heat dissipation structure.

The invention discloses an aluminum substrate UV matt finish paint and a preparation process thereof, and relates to the technical field of paints.The aluminum substrate UV matt finish paint is prepared from, by mass, 10%-20% of modified polyurethane acrylate, 25%-32% of high-functionality aliphatic polyurethane acrylate, 18%-30% of special modified epoxy acrylate resin, 0.5%-2% of dispersing agent, 0.1%-0.5% of defoaming agent, 1%-3% of anti-settling powder and the balance water. The paint is prepared from the following components in percentage by weight: 10 to 15 percent of magnesium silicate mineral, 1 to 10 percent of matting powder, 0.2 to 1 percent of 1-hydroxycyclohexyl phenyl ketone, 0.5 to 3 percent of trimethylbenzoyl-diphenyl phosphine oxide, 1 to 3 percent of acrylate flatting agent, 0.2 to 1.2 percent of polyurea modified polyurethane rheological agent and 5 to 15 percent of trimethylolpropane triacrylate. According to the UV matte finishing paint disclosed by the invention, through compounding of ternary resin and enhancement of nano silicon dioxide, a rigid and tough cross-linked network is constructed, a paint film is free of cracks when being bent at 180 degrees, the adhesive force reaches grade 0, and a coating is resistant to acid and alkali etching liquid and free of corrosion by cooperating with a silane coupling agent and a light stabilization system, and the color difference is delta Elt after the UV matte finishing paint is subjected to high temperature of 260 DEG C; and 1.5, the anti-yellowing performance is excellent.

The utility model relates to the technical field of aluminum substrate processing, in particular to a lead positioning tool for solving skewing of a reflow soldering lead of a double-layer aluminum substrate. The lead positioning tool comprises a carrier, two long lead positioning clamps and a short lead positioning clamp, the carrier is horizontally arranged, the upper end face of the carrier is provided with an assembling groove matched with the double-layer aluminum substrate, the short lead positioning clamp is detachably installed at the upper end of the carrier, and the long lead positioning clamps are detachably installed at the lower end of the carrier. A plurality of groups of short lead channels vertically penetrating through the double-layer aluminum substrate are arranged on the double-layer aluminum substrate, the two long lead positioning clamps are detachably arranged at two ends of the upper part of the double-layer aluminum substrate respectively, and the long lead positioning clamps are respectively provided with long lead channels vertically penetrating through the long lead positioning clamps. The structure has the advantages that the structure design is simple and reasonable, the long lead of a product can be ensured to be in a vertical state after being welded with the double-layer aluminum substrate, the stress caused by lead deflection in the assembly process is avoided, and the lead distance is ensured to meet the design requirement.

The invention relates to a method for bonding a layer of elastomeric material (CE) to an aluminum substrate (SM), characterised in that it comprises the following steps: a) treating the surface (S) of the aluminum substrate (SM) in order to roughen it; b) treating the surface (S) by means of argon plasma; c) exposing said surface (S) to a plasma in the presence of a gaseous chemical precursor selected from the group consisting of epoxides, acrylics, olefins, alkynes and imides, until a deposit of chemical substances having a thickness of 5 nm to 110 nm is obtained; d) bringing the layer of elastomeric material (CE) into contact with the surface (S) of the aluminum substrate (SM); e) vulcanizing the layer of elastomeric material, said step c) being carried out at a low pressure, i.e. At a pressure of 10-2 mbar to 10-5 mbar.

The utility model discloses a liquid cooling plate with a heat dissipation structure, which comprises an aluminum substrate and an aluminum cover plate which are attached to each other, a groove is arranged on the substrate, a heat conduction copper plate is embedded in the groove, a passage for circulation of a cooling medium is arranged in the heat conduction copper plate, and a plurality of heat conduction sheets are uniformly distributed in the passage at equal angles to increase the heat conduction area; the top surface and the bottom surface of the heat-conducting copper plate are fixedly connected with a plurality of heat-conducting columns; the heat-conducting columns distributed up and down are respectively embedded in the substrate and the cover plate; according to the utility model, the copper insert with better heat-conducting property is inlaid on the aluminum liquid cooling plate body, components with larger heat productivity are arranged on the copper insert to accelerate heat dissipation, and the liquid cooling plate increases the heat-conducting area and effectively improves the heat dissipation efficiency through the heat-conducting fins in the heat-conducting copper plate and the heat-conducting columns arranged on the upper and lower surfaces of the heat-conducting copper plate.

The invention relates to the technical field of LED lamps, in particular to an intelligent LED linear high shed lamp and a control method thereof. The intelligent LED linear high shed lamp comprises a power source assembly, a light source assembly, a heat dissipation piece, a control circuit and a dial switch board, the power source assembly is connected with the heat dissipation piece, and the light source assembly is connected with the heat dissipation piece; the light source assembly comprises a lamp bead, an aluminum substrate and a lens, the lamp bead is installed on the aluminum substrate, a light source installation bin is arranged on the heat dissipation piece, the lens is connected with the heat dissipation piece through a buckle, and the aluminum substrate and the lamp bead are located in the light source installation bin; the heat dissipation piece further comprises a power source installation bin, the power source assembly is installed in the power source installation bin, a heat dissipation structure is arranged on the outer wall of the light source installation bin, a preset distance is formed between the light source assembly and the power source assembly, and a heat convection groove is formed between the light source installation bin and the power source installation bin. The heat dissipation effect of the LED lamp can be improved.

The low-temperature welding method comprises the steps that firstly, abrasive paper is adopted for polishing the surfaces of a copper substrate and an aluminum substrate, then a welding clamp is adopted for fixing the aluminum substrate, then an interconnection interface of the aluminum substrate is filled with proper Sn0. 3Ag0. 7Cu alloy powder, the aluminum substrate is placed on a constant-temperature table to be heated after being covered with the copper substrate, and the copper substrate and the aluminum substrate are welded at the same time. And simultaneously applying ultrasound and pressure to the copper substrate and the aluminum substrate, and continuously keeping the temperature and the pressure after the ultrasound is stopped until the experiment is finished. The prepared connector is free of zinc element, the copper-aluminum connector with the (Sn) + Al2Cu + AlCu ternary eutectic is formed and has good plasticity and toughness, the welding method is easy to operate, the welding temperature is low, the welding time is short, the production cost is reduced, and the production efficiency and the product reliability are greatly improved.

The invention discloses a long-life aluminum profile for a mold and a preparation process thereof, and relates to the technical field of aluminum alloys, a zirconium film is loaded on the surface of the aluminum profile, the zirconium film generates an oxide layer on the surface of an aluminum substrate through hydrolysis reaction, micropores in the surface of the aluminum substrate are filled, and the corrosion resistance of the aluminum profile is enhanced. However, the corrosion resistance of a single zirconium film is insufficient, and the corrosion resistance of the aluminum profile is further enhanced by coating the surface of the aluminum profile with the zirconium film with the anti-corrosion liquid. 3-epoxypropoxy propyl triethoxy silane is added into the zirconium conversion liquid, so that the surface of a zirconium film is provided with epoxy groups, the epoxy groups on the surface of the zirconium film and amino groups in the corrosion-resistant chitosan microcapsules form hydrogen bonds and coordinate bonds, the bonding strength of a corrosion-resistant coating is improved, and therefore the corrosion resistance of the aluminum profile for the mold is improved.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

The present invention discloses a cyclotron metal composite target for preparing targeted radionuclide drugs, which comprises an aluminum substrate whose shape matches the shape of the target position of the accelerator. A bismuth layer is attached to or embedded in the surface of the aluminum substrate, and the thickness of the bismuth layer is 10-20 μm. The present invention provides a cyclotron metal composite target for preparing targeted radionuclide drugs, which can reduce or even avoid the melting of the target, improve the heat conduction efficiency of the target, and avoid the pollution of the equipment and its products.

The invention relates to the technical field of LED lamps, in particular to an LED glass lamp cup with an efficient heat dissipation structure, which comprises an aluminum cup and an aluminum base column fixedly connected to the top of the aluminum cup and communicated with the aluminum cup, the outer side of the aluminum cup is sleeved with a glass shell, an aluminum substrate is mounted in the aluminum cup through screws, and a plurality of LED lamp beads are fixedly mounted at the bottom of the aluminum substrate. A drainage assembly with the wind direction capable of being automatically adjusted is arranged in the aluminum base column. According to the invention, the flow guide assembly is driven to intermittently operate in the forward and reverse directions, the blowing direction is automatically adjusted, and the upper air inlet and the lower air inlet are combined to alternately extract external cold air, so that the flow direction of the cold air is changed, heat transferred on the heat dissipation fins is taken away, and the efficient heat dissipation effect is realized; and hot air is exhausted to reversely blow the annular filter screen, meanwhile, the wind wheel is promoted to carry the cleaning brush to rotate, secondary cleaning is conducted on the annular filter screen, and then the efficient self-cleaning effect on the annular filter screen is achieved.

[Problem] To improve the partial discharge resistance of an insulating substrate for an electronic circuit that uses an aluminum nitride sintered substrate. [Solution] Provided is an aluminum nitride sintered substrate containing zirconium-containing particles therein, wherein the aluminum nitride sintered substrate has a composition in which the Zr / Al molar ratio is 0.0017-0.0665, and the region from the end surface in the thickness direction to at least a depth of 10.0 μm is a zirconium-deficient surface layer in which the number density of the zirconium-containing particles in a cross section parallel to the thickness direction is 6.0 / 540μm2 or less.

The invention relates to the technical field of new energy automobile charging equipment, in particular to a high-power-density new energy automobile charger with efficient heat dissipation. The invention relates to a filter module which comprises a shell assembly, a circuit mainboard, a plurality of aluminum substrate assemblies and a filter plate assembly, the shell assembly comprises a shell side wall and a bottom plate, a plurality of cavities are defined, the aluminum substrate assemblies and the circuit mainboard are electrically connected and arranged on the shell side wall, and the filter plate assembly is arranged in the cavities and is separated from the aluminum substrate assemblies through the shell side wall. By optimizing the heat dissipation design and the structural layout, the heat dissipation efficiency and the power density of the charger are improved, and the stability and the reliability of the charger under a high load are ensured.

The utility model relates to the technical field of aluminum substrate processing, in particular to aluminum substrate withstand voltage test equipment, which comprises an operation table, an aluminum substrate adjusting component and a withstand voltage test component, the withstand voltage test component comprises a test frame, a first electric adjusting telescopic rod is mounted at the upper end of the test frame, and a second electric adjusting telescopic rod is mounted at the lower end of the test frame. A testing head is mounted at the lower end of the first electric adjusting telescopic rod and comprises a mounting seat, a pressure sensor is mounted on the upper side of the mounting seat, a magnetic suction head is arranged on the lower side of the mounting seat, an adsorption seat is arranged on the outer side of the magnetic suction head, and a first mounting plate is arranged on the lower side of the adsorption seat. According to the utility model, the image of the aluminum substrate is detected through the image probe, the test point position of the aluminum substrate is automatically adjusted through the aluminum substrate adjusting component according to the image analysis, the test accuracy is improved, the voltage-withstanding test component is disassembled through the limiting plate and the pressing plate, the test needle is replaced through the magnetic suction head and the adsorption seat, and the replacement convenience of the test needle is improved.

The invention provides an aluminum substrate drilling tool wear prediction method based on reinforcement learning, and the method comprises the steps: collecting working condition parameters, such as main shaft rotation speed, feeding speed, cutting depth, material type and historical vibration energy, through the deployment of an industrial sensor network, and achieving data standardization through feature extraction and normalization processing; a dynamic cognitive map with process meaning is constructed by adopting semantic analysis and a map generation strategy, key semantic nodes are identified by utilizing a map attention network, reinforcement learning is driven through a structured reward function, and self-adaptive optimization of a wear prediction strategy is realized; according to the method, abnormal detection and working condition abrupt change increment updating are supported, map consistency optimization is achieved by fusing expert experience, the tool wear prediction precision and the environment adaptability can be improved, and the intelligent sensing and dynamic response capacity to the complex manufacturing process can be enhanced.

The utility model discloses a connecting structure of an aluminum-based bus duct with copper-clad end parts, and relates to the technical field of busbars. The copper-aluminum eutectic conducting bar comprises a copper-aluminum eutectic conducting bar body, the copper-aluminum eutectic conducting bar body comprises an aluminum alloy base body layer A, the end portions of the upper side face and the lower side face of the aluminum alloy base body layer A are covered with copper connecting layers A, and the copper-aluminum eutectic layer A is arranged between the aluminum alloy base body layer A and the copper connecting layers A. The copper-aluminum eutectic conducting bar further comprises a connector which comprises a plurality of copper-aluminum eutectic connecting pieces. The copper-aluminum eutectic conducting bar is clamped by the connector and tightly abuts against the copper-aluminum eutectic connecting piece. The beneficial effects of the utility model lie in that the utility model combines the advantages of low density and low cost of aluminum and the characteristics of high conductivity and corrosion resistance of copper, and only the end part of the aluminum substrate is coated with copper, so that the overall cost is reduced, the excellent performance of key parts is ensured, the perfect balance between the performance and the cost is realized, and the copper-aluminum eutectic technology is adopted. The problems that interface bonding is not firm, resistance is large, and corrosion is prone to occurring when aluminum and copper are directly connected are effectively solved.

The utility model provides a super capacitor with a full-tab welding type structure, which relates to the technical field of capacitor design, and comprises a cover plate assembly, the cover plate assembly comprises an upper plastic, an aluminum substrate, a lower plastic and an adapter sheet which are sequentially arranged from top to bottom, the periphery of the aluminum substrate abuts against the top of a shell and is fixed through laser welding, and the adapter sheet is arranged on the top of the shell. The adapter plate and the upper current collector are fixed through laser welding, and the positive pole lug and the negative pole lug of the roll core assembly are respectively fixed with the lower current collector and the upper current collector through laser welding. And through the cylindrical structure, the internal connection completely adopts laser welding, the internal resistance can reach below 1 milliohm, and the blank of the domestic low-internal-resistance super capacitor is filled. Compared with an ox horn type supercapacitor, the supercapacitor provided by the utility model has the advantages that the overcurrent capability is higher, the internal resistance is lower, the overall vibration resistance is better due to the adoption of laser welding fixation, and the condition of liquid leakage is not easy to occur.

The invention discloses a reflow soldering curve measuring method. The method comprises the steps that S1, a temperature measuring plate is manufactured; the temperature measuring plate comprises an aluminum substrate, a device is fixedly arranged above the aluminum substrate by smearing silver adhesive, a thermocouple is arranged on the device, the front end of the thermocouple is fixedly arranged on a device body through conductive adhesive, and a wire body on the thermocouple is fixed through high-temperature-resistant adhesive tape. One end, far away from the thermocouple, of the wire body is connected to a furnace temperature measuring instrument, and the surface temperature of the device is detected and recorded in the measuring process; s2, measuring a curve; and S3, data management. The invention belongs to the field of reflow soldering curve measuring methods, and particularly relates to a reflow soldering curve measuring method. According to the method, by designing and combining existing test methods, furnace temperature curves of reflow corresponding to devices of different packaging types are innovated on the basis of IPC-JEDEC J-STD-020F-2022 Moisture Reflow Sensitivity for Non-Hermetic Surface Mount Devices (SMDs), and the accuracy rate of selecting the reflow curve during a pretreatment test is improved.

The invention discloses a high-thermal-conductivity insulating aluminum substrate and a preparation method thereof, and belongs to the technical field of insulating materials. The high-thermal-conductivity insulating aluminum substrate comprises an aluminum substrate and a thermal conductive coating uniformly coated on the surface of the aluminum substrate; the preparation method of the heat-conducting coating comprises the following steps: adding the modified boron nitride into the epoxy resin, uniformly mixing, adding the epoxy curing agent, the flatting agent, the anti-settling agent, the defoaming agent and the acetone, and uniformly mixing and stirring to obtain the heat-conducting coating. The modified boron nitride is added into the heat-conducting coating, so that the flexibility and corrosion resistance of the heat-conducting coating are remarkably improved, the service life of the heat-conducting coating is prolonged, and the aluminum substrate is well protected.

The present invention discloses a preparation method of a copper-clad aluminum reflective bus bar and a photovoltaic module. The bus bar body includes a base layer and a tin layer. The base layer includes an aluminum substrate and a copper layer wrapped on the outer surface of the aluminum substrate. The light incident surface of the bus bar body is a serrated structure. Its preparation process is as follows: Step 1, wrap a copper strip on the surface of an aluminum core; Step 2, weld the butt joint of the copper strip by argon arc welding to form a wrapped structure; Step 3, roll the copper-clad aluminum substrate in Step 2 through a rolling mill for reflective pattern rolling to form serrated reflective patterns on one of its surfaces; Step 4: heat-treat the product after rolling in Step 3; Step 5, coat the surface of the product after heat treatment in Step 4 with a soldering flux; Step 6, tin-plate by hot dip plating process; Step 7, cool and wind up. Through the design of the reflective surface pattern, the present invention realizes the improvement of the overall power of the photovoltaic module by increasing the effective utilization rate of light per unit area of the photovoltaic module.

The utility model relates to the field of PCB detection, in particular to a withstand voltage detection device for a PCB. Comprising a detection table, and a calibration plate of an L-shaped structure is arranged at one corner of a detection area; the annular outer edge of the detection area is also provided with a fastener; the fastening piece comprises a mounting plate, a fastening plate and a fastening rod; a testing structure is arranged on the back plate and comprises a rotating motor, a rotating shaft, a guide rod, a mounting seat and a testing needle; the rotating motor is mounted on the back plate through a bracket; an output shaft of the rotating motor is connected with the rotating shaft; the guide rod is arranged on the back plate and is parallel to the rotating shaft; the mounting seat penetrates through the rotating shaft and is in threaded connection with the rotating shaft; meanwhile, the mounting seat also penetrates through the guide rod, and the mounting seat and the guide rod are in sliding connection; the test needles are installed on the installation seat and used for carrying out electrified withstand voltage test operation on the aluminum substrate, and the distance between the two test needles is adjustable. The device is simple in operation, facilitates the fixation of the PCB, can be suitable for the withstand voltage detection of various PCBs with various specifications, and is more practical.

The invention relates to the technical field of food packaging, in particular to a bacteriostatic aluminum foil material for a meal box and a preparation method thereof. The material is subjected to aluminum foil surface activation, then is sequentially impregnated in a sol impregnation liquid and an outer layer coating liquid, is subjected to dip coating, and finally is subjected to ultraviolet curing to obtain a multi-layer composite structure. The middle layer is made of an aminated organic silicon material and is firmly combined with the aluminum base material and the outer layer resin through chemical bonds, so that the adhesive force of the coating is remarkably improved. The outer coating is added with a phenyl triazole modified layered double hydroxide loaded nano-silver antibacterial agent, so that slow release and efficient broad-spectrum antibacterial property of silver ions are realized, the thermal stability is improved, and reliable performance under a high-temperature condition is ensured. The multilayer design and multiple antibacterial mechanisms have a synergistic effect, the problems of poor antibacterial durability, insufficient adhesive force, low heat resistance and the like of a traditional lunch box aluminum foil material are effectively solved, meanwhile, food safety is considered, and the aluminum foil material is suitable for the field of modern high-requirement food packaging.

The invention belongs to the technical field of catalytic materials, and particularly relates to a nickel-iron-cobalt entropy alloy nanowire three-dimensional interconnection grid film and a preparation method and application thereof. The preparation method comprises the following steps: taking an aluminum sheet containing copper impurities as a substrate, and preparing a three-dimensional ordered porous aluminum oxide template through anodic oxidation; then, the nickel-iron-cobalt entropy alloy nanowire is prepared in a pore channel limited range through direct current co-electrodeposition; the nickel-iron-cobalt entropy alloy nanowire three-dimensional interconnection grid film is obtained after the aluminum substrate and the 3D-AAO template are removed, the material is based on the mixed entropy effect and structural integrated design and can be directly used as a self-supporting electrode for efficiently and stably electrolyzing water for oxygen evolution, the three-dimensional grid structure and the self-supporting characteristic of the material promote electrolyte transmission and gas product desorption, and the oxygen evolution efficiency is improved. The mass transfer efficiency is improved, the use of a traditional binder is avoided, and the electrode stability is enhanced; the problems that an existing medium-entropy alloy catalyst is high in synthesis energy consumption, the catalytic activity is poor under the industrial-grade large-current working condition, active substances fall off in the reaction and the like are solved.