290 results about "Aluminum substrate" patented technology

The invention discloses an aluminum substrate UV matt finish paint and a preparation process thereof, and relates to the technical field of paints.The aluminum substrate UV matt finish paint is prepared from, by mass, 10%-20% of modified polyurethane acrylate, 25%-32% of high-functionality aliphatic polyurethane acrylate, 18%-30% of special modified epoxy acrylate resin, 0.5%-2% of dispersing agent, 0.1%-0.5% of defoaming agent, 1%-3% of anti-settling powder and the balance water. The paint is prepared from the following components in percentage by weight: 10 to 15 percent of magnesium silicate mineral, 1 to 10 percent of matting powder, 0.2 to 1 percent of 1-hydroxycyclohexyl phenyl ketone, 0.5 to 3 percent of trimethylbenzoyl-diphenyl phosphine oxide, 1 to 3 percent of acrylate flatting agent, 0.2 to 1.2 percent of polyurea modified polyurethane rheological agent and 5 to 15 percent of trimethylolpropane triacrylate. According to the UV matte finishing paint disclosed by the invention, through compounding of ternary resin and enhancement of nano silicon dioxide, a rigid and tough cross-linked network is constructed, a paint film is free of cracks when being bent at 180 degrees, the adhesive force reaches grade 0, and a coating is resistant to acid and alkali etching liquid and free of corrosion by cooperating with a silane coupling agent and a light stabilization system, and the color difference is delta Elt after the UV matte finishing paint is subjected to high temperature of 260 DEG C; and 1.5, the anti-yellowing performance is excellent.

The invention provides an aluminum substrate drilling tool wear prediction method based on reinforcement learning, and the method comprises the steps: collecting working condition parameters, such as main shaft rotation speed, feeding speed, cutting depth, material type and historical vibration energy, through the deployment of an industrial sensor network, and achieving data standardization through feature extraction and normalization processing; a dynamic cognitive map with process meaning is constructed by adopting semantic analysis and a map generation strategy, key semantic nodes are identified by utilizing a map attention network, reinforcement learning is driven through a structured reward function, and self-adaptive optimization of a wear prediction strategy is realized; according to the method, abnormal detection and working condition abrupt change increment updating are supported, map consistency optimization is achieved by fusing expert experience, the tool wear prediction precision and the environment adaptability can be improved, and the intelligent sensing and dynamic response capacity to the complex manufacturing process can be enhanced.

The invention belongs to the technical field of metal substrates, and particularly relates to a graphene composite high-thermal-conductivity aluminum substrate, a preparation method and application. The graphene composite high-thermal-conductivity aluminum substrate comprises a conductive copper foil layer, a graphene composite high-thermal-conductivity layer and an aluminum substrate layer, the graphene composite high heat conduction layer comprises an upper layer, a middle layer and a lower layer, and the upper layer is connected with the conductive copper foil layer and is a heat conduction adhesive layer; the middle layer is a graphene composite sheet layer and is a film layer formed by compounding and hot-pressing graphene and a polymer; the lower layer is connected with the aluminum substrate layer and is a graphene modified aluminum oxide film layer; graphene in the graphene composite sheet layer is arranged in a horizontal orientation manner; graphene in the aluminum oxide film layer is arranged in a vertical orientation manner. According to the graphene composite high-thermal-conductivity aluminum substrate and the preparation method thereof, the graphene is used for constructing a longitudinal efficient heat conduction path and balancing stress, and the obtained graphene composite high-thermal-conductivity aluminum substrate has ultrahigh heat conduction performance, ultralow warping rate and good reliability and can be used in high-performance electronic devices and circuit boards.

The utility model discloses a kind of fixed-length segmentation device for aluminum substrate processing, it is related to aluminum substrate processing technical field, including pedestal, the inside both sides of the pedestal are provided with trajectory groove, and trajectory groove is obliquely arranged, the inside rear side of the pedestal is provided with a group of left-right symmetrical sliding grooves, the rear side of the pedestal is fixedly connected with driving mechanism.The utility model is provided with driving mechanism, servo motor is used to drive screw rod to rotate, sliding block drives connecting frame to move upward simultaneously, then guide wheel is rolled in moving groove and trajectory groove and moves upward simultaneously, secondly, guide wheel front end is rolled in connecting groove and drives operating platform to lift upward simultaneously, in this process, mounting bracket moves along with the track of connecting frame, for this, the upward movement of operating platform is cut by segmentation knife from front to back in the middle position of aluminum substrate, so as to be favorable to equidistance fixed-length segmentation of aluminum substrate, secondly, multiple aluminum substrates can be segmented simultaneously, and the flexibility of equipment use is enhanced.

The application discloses a UV light-cured coating composition, a preparation method thereof and application thereof on an aluminum base. The UV light-cured coating composition comprises a UV light-cured primer and a UV light-cured topcoat. The UV light-cured primer is composed of polyurethane acrylate resin, first acrylate monomer, photoinitiator, adhesion promoter and wetting and leveling agent in a specific ratio, and can be directly cured on the surface of an aluminum base without pre-treatment to form a coating layer with excellent adhesion. The formula of the UV light-cured topcoat is optimized, so that when the topcoat is used in combination with the primer, the combination of the topcoat and the primer is effectively promoted, and the coating layer has excellent insulation performance. The UV light-cured coating composition provided by the application can form a composite coating layer with strong adhesion, excellent insulation performance and high stability on the surface of the aluminum base without pre-treatment such as laser texturing or chemical passivation.

The utility model relates to a drilling dust removal mechanism for aluminum substrate machining, which comprises a machining table, an air suction pipeline is arranged at the upper end of the machining table, one end of the air suction pipeline is communicated with a fixed air suction pipe head, a rotating groove is formed in the middle of the air suction pipe head, and a through hole is formed in one side of the middle of the air suction pipe head in a penetrating manner; a top plate is fixedly connected to the upper end of the rotating gear ring, a plurality of guide sliding grooves are evenly formed in the periphery of the middle of the top plate, a plurality of moving grooves are evenly formed in the periphery of the middle of the rotating gear ring, sliding rods are slidably clamped to the middles of the moving grooves, baffles are fixedly installed on one sides of the upper portions of the middles of the sliding rods, and the upper ends of the sliding rods are slidably clamped to the middles of the corresponding guide sliding grooves. A protection cover is fixedly installed on one side of the air suction pipe head, a fixing plate is fixedly installed on one side of the middle of the protection cover, and a gear is rotationally installed at one end of the fixing plate and meshed with the rotating gear ring. When in use, the dust removal device can dynamically adapt to a processing scene, so that the dust removal efficiency and the energy consumption are optimized, and the energy-saving effect is achieved.

Compositions for reinforcing substrates, reinforced panels manufactured from those compositions, and methods of manufacture are disclosed. A composition may be composed of a base resin binder, a reinforcing fiber, a toughener, a heat curing agent, a cure accelerating agent, a sagging resistance agent, and a reinforcing agent. A coating of this composition can be applied upon a substrate, such as a steel or aluminum substrate. By heating the coating such that the coating cures upon the substrate, a reinforced substrate may be produced. The substrate may be sized and configured as a panel so that it could be used as an automotive panel. The low density and strong characteristics of the cured coating may allow for thin, lightweight automotive panels to be produced which provide higher milage. Such panels may also be effective at reducing vibration-generated noise that may otherwise result from a thin automotive panel.

The utility model discloses a die-casting aluminum straight barrel type waterproof heat dissipation controller which comprises a base, a surrounding plate is integrally formed around the top of the base, the top of the surrounding plate is fixedly connected with a surface cover, a plurality of heat dissipation ribs are arranged at the bottom of the base, heat dissipation steps are embedded in the tops of the heat dissipation ribs, and the heat dissipation steps are T-shaped. A socket hole and a binding post hole are respectively formed in the surface cover; according to the utility model, the base and the coaming are integrally formed and are matched with the surface cover for sealing, the socket hole and the binding post hole are matched with the sealing rubber ring and the annular waterproof gasket, the heat dissipation step is arranged in the base to facilitate the installation of the aluminum substrate, and the heat dissipation step is attached to the plurality of heat dissipation ribs, so that the heat conduction efficiency and the heat dissipation area are increased, and the heat dissipation efficiency is improved; the heat stability of the controller in the working process is guaranteed, the problems of poor heat dissipation and water inflow short circuit of a traditional controller are solved, and the controller is suitable for high-power and high-protection-requirement scenes such as electric vehicles and industrial motors.

The present invention relates to a high-voltage anodization method and an aluminum substrate anodized thereby and, more specifically, to a high-voltage anodization method using a phosphoric acid solution as an electrolyte, which enables stable anodization while applying a high voltage without causing a burning phenomenon on the surface of the aluminum substrate, and an aluminum substrate anodized thereby. The high-voltage anodization method according to the present invention improves a voltage ramping process in anodizing using phosphoric acid so that a high voltage of 190 V or higher can be applied while preventing surface burning of the aluminum substrate, thereby enabling stable anodization of the aluminum substrate. In addition, an anodized membrane manufactured using the aluminum substrate produced by the high-voltage anodization method of the present invention can stably form a hexagonal nanostructure having large pores of 150 nm or greater.

The application relates to the technical field of power connection device manufacturing, in particular to a manufacturing method of a track socket busbar, a composite busbar and a track socket, and aims to solve the problems that although a traditional silver plating process can delay copper-based oxidation, the silver layer is easy to wear and the cost is high, and although a micro-arc oxidation layer of an aluminum-based busbar has insulation, a porous structure is easy to absorb moisture, leading to a decrease in corrosion resistance. The application forms a silver-nickel alloy layer with metallurgical bonding through laser surface alloying, generates an in-situ ceramic insulation layer through micro-arc oxidation, and realizes stable compounding of copper-aluminum substrates by using a mechanical occlusion structure, so that the advantages of synchronously improving the electric conductivity and the corrosion resistance and solving the interface delamination problem are achieved.

This invention belongs to the field of aluminum-ion battery technology, specifically relating to an aluminum-ion battery based on a biomimetic CNT / Al composite metal anode. It comprises a positive electrode, a non-aqueous aluminum salt-based ionic liquid electrolyte, a separator, and a biomimetic CNT / Al composite metal anode. The biomimetic CNT / Al composite metal anode consists of an aluminum substrate and a three-dimensional continuous electron permeation network formed within the aluminum substrate. The aluminum substrate is a micro / nano-scale aluminum sheet, and the three-dimensional continuous electron permeation network is formed by carboxylated multi-walled carbon nanotubes. The three-dimensional continuous electron permeation network extends to the surface of the biomimetic CNT / Al composite metal anode. Compared with existing technologies, this invention solves the problem that existing technologies cannot simultaneously address the issues of ion mass transfer kinetics and interfacial mechanical stability during long-term cycling. This solution achieves long-term stable cycling of the aluminum-ion battery under harsh conditions by constructing a CNT / Al anode with a carbon nanotube (CNT)-like neural network structure.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

Compositions for reinforcing substrates, reinforced panels manufactured from those compositions, and methods of manufacture are disclosed. A composition may be composed of a base resin binder, a reinforcing fiber, a toughener, a heat curing agent, a cure accelerating agent, a sagging resistance agent, and a reinforcing agent. A coating of this composition can be applied upon a substrate, such as a steel or aluminum substrate. By heating the coating such that the coating cures upon the substrate, a reinforced substrate may be produced. The substrate may be sized and configured as a panel so that it could be used as an automotive panel. The low density and strong characteristics of the cured coating may allow for thin, lightweight automotive panels to be produced which provide higher milage. Such panels may also be effective at reducing vibration-generated noise that may otherwise result from a thin automotive panel.

The application discloses a preparation method of an aluminum oxide template, a membrane electrode and a preparation method thereof and a fuel cell. The preparation method of the aluminum oxide template is characterized by the following steps: an anodic oxidation method is performed on an aluminum substrate, and etching treatment is performed, so that a plurality of first holes and a plurality of second holes are formed on the obtained aluminum oxide template, and the aluminum oxide template containing at least two different holes is obtained. In the premise of maintaining the structural stability and the hole structure stability of the aluminum oxide template, the area proportion of the holes on the aluminum substrate is improved, the gap between the holes is reduced, the nanometer material array with smaller interval gaps can be formed by using the aluminum oxide template, the waste of nanometer materials caused by falling into the nanometer materials in the gaps is avoided, the deposition efficiency of the nanometer materials is improved, and the utilization rate of noble metals is improved.

The invention relates to the technical field of multi-layer metal substrate production, in particular to a high-thermal-stability low-warpage PCB aluminum base layer and a preparation method thereof.The preparation method comprises the following steps that 1, an adhesive and a curing agent are mixed and dispersed for 20-40 min, then stirring is conducted for 20-30 min at the speed of 600-700 r / min, standing and exhaust treatment are conducted, and a glue solution is obtained; and (3) pretreating the surface of an aluminum plate, drying the aluminum plate, laminating the dried aluminum plate and the semi-cured adhesive film obtained in the step (2) on a roller press, laminating a copper foil on one side of the semi-cured adhesive film, and finally laminating the copper foil on a plate vulcameter to obtain the PCB aluminum base layer. The PCB aluminum base layer provided by the invention has better heat-conducting property, warping resistance and lower thermal expansion coefficient.

The application relates to the technical field of intelligent household appliances, and discloses a method for heat dissipation of an air conditioner, which comprises the following steps: determining whether freezing phenomenon exists at a drain outlet according to the change condition of the light reflectivity at the drain outlet; in the case that freezing phenomenon exists, starting a semiconductor heat dissipation fin and increasing the rotating speed of a circulating pump body; and in the case that freezing phenomenon does not exist, adjusting the rotating speed of the circulating pump body according to the temperature of an aluminum base plate. Heat is efficiently guided to the outdoor unit chassis through a heat conduction medium in a heat conduction pipeline to perform ice removal or defrosting, the clogging problem caused by the icing or frosting of the drain outlet is avoided, the utilization rate of energy is improved, the flow rate of the heat conduction medium in the heat conduction pipeline is adjusted based on the overall temperature of the heating component, the heat conduction efficiency of the heat conduction pipeline is matched with the overall temperature of the heating component, and the electric control box of the air conditioner can be timely heat dissipated. The application further discloses a device for heat dissipation of an air conditioner, an air conditioner and a storage medium.

The application discloses a preparation method of a high-strength aluminum nitride substrate and relates to the technical field of aluminum nitride substrate preparation. The method comprises the following steps: preparing modified aluminum nitride powder; adding a non-oxygen composite sintering aid composed of fluorides and borides to the modified aluminum nitride powder to obtain a mixture; the adding amount of the composite sintering aid is 0.5wt%-5wt% of the total mass of the modified aluminum nitride powder; the mixture, a binder and a dispersant are mixed in a planetary ball mill to obtain a uniform slurry; the slurry is subjected to flow casting to form a green porcelain embryo, and then, glue removal treatment is performed under the protection of flowing inert gas to remove the binder; the green porcelain embryo after glue removal is placed in an atmosphere sintering furnace to perform a multi-stage temperature rising sintering procedure to form a ceramic body; and the sintered ceramic body is subjected to heat treatment and then cooled to obtain the aluminum nitride substrate. The application reduces the lattice thermal resistance of the aluminum nitride substrate and improves the mechanical strength of the aluminum nitride substrate.

The utility model discloses a kind of diffuse reflection lamps and lanterns of preventing wire interference, including lamp shell, diffuse reflection cover, and the aluminum substrate with lamp pearl, diffuse reflection cover is set in lamp shell, at least one side of lamp shell bottom is equipped with aluminum substrate, further include wire, power supply, two baffle and two end cap, two baffle is used to cover in diffuse reflection cover both ends, two end cap is used to cover in lamp shell both ends, the bottom both sides of baffle are equipped with threading hole respectively, the both sides of baffle outer side are equipped with wire channel respectively, the end of aluminum substrate extends into threading hole, one end of wire is connected with the end of aluminum substrate, the other end is sequentially connected with power supply after passing through threading hole and wire channel. Its advantage is that one end of wire is connected with the end of aluminum substrate, the other end is sequentially connected with power supply after passing through threading hole and wire channel, baffle keeps wire outside diffuse reflection cover, wire is not in diffuse reflection cover, shadow cannot be generated in diffuse reflection cover, prevent wire from the interference of light, so that illumination effect is better.

The invention belongs to the technical field of aluminum substrate production, and particularly relates to a thermoelectric separation aluminum substrate producing and processing device which comprises two device side frames, and rotating joints are rotationally installed on the two device side frames in a penetrating mode. In the grinding treatment period, slurry conforming to the specification can pass through a movable screen, a discharging manual valve is opened, the slurry can be discharged into a forming mold on the lower portion, primary machining of a thermoelectric separation aluminum piece plate is completed, meanwhile, a double-shaft driving motor can drive a second bevel gear to rotate, and the second bevel gear is driven to rotate; a first bevel gear drives a vertical transmission rod to rotate, a transverse U-shaped frame can be driven to move left and right in a reciprocating mode under meshing transmission of a first sector gear and a rack, then a forming die can move left and right in a reciprocating mode, grinding and uniform discharging are integrated, slurry can be evenly laid in the forming die, and the forming die is uniform in grinding and uniform in discharging. Local over-thickness or over-thickness is avoided, compactness and no defect are ensured, and the performance and the stability of a finished product are improved.

The utility model discloses novel aluminum substrate electroplating oxidation equipment, and relates to the technical field of electroplating oxidation equipment, the novel aluminum substrate electroplating oxidation equipment comprises an electroplating pool, the surface of the electroplating pool is fixedly connected with two first portal frames, the surfaces of the two first portal frames are both fixedly connected with second portal frames, and the second portal frames are fixedly connected with second portal frames. Outer shafts are rotationally connected to the inner walls of the two portal frames, a motor is fixedly mounted on the surface of one portal frame II, and an output shaft of the motor is fixedly connected with the outer shafts, so that the aluminum substrate can be simply and conveniently mounted and fixed when the aluminum substrate needs to be electroplated through the structure; according to the aluminum substrate electroplating device, the aluminum substrate can descend into the electroplating pool to be electroplated, electroplating liquid in the electroplating pool can be stirred in the rotating process, the concentration difference between a cathode and an anode can be reduced through stirring of the electroplating liquid, the brightness of a plating layer is improved, and local overheating of the aluminum substrate in the electroplating process is avoided.

The invention relates to the technical field of lamps, and particularly discloses a punching aluminum plate lamp structure which comprises a mounting plate and a lampshade. The mounting plate is used for being detachably connected with a lamp mounting frame. The aluminum substrate is arranged on the surface, close to the lampshade, of the mounting plate and is arranged in the lampshade; the lamp beads are mounted on the surface, close to the lampshade, of the aluminum substrate; the auxiliary heat dissipation mechanism is arranged in the lampshade, and the auxiliary heat dissipation mechanism comprises a heat conduction limiting ring which is arranged on the surface of the aluminum substrate and is coaxial with the aluminum substrate; the multiple limiting rods are arranged, and the multiple limiting rods are arranged in an annular array with the circle center of the heat conduction limiting ring as the axis; the top ends of the limiting rods are sleeved with the limiting pipes in a sliding mode; the bottom face of the supporting ring is connected with the top ends of the limiting pipes and coaxially connected with the inner wall of the top end of the lampshade. Therefore, the installation efficiency is improved through the installation plate structure, the heat dissipation efficiency of the lamp is improved through the aluminum substrate, and the service life of the lamp is prolonged.

The invention discloses a micro-nano composite bi-pass aluminum oxide film with heterogeneous wettability as well as a preparation method and application of the micro-nano composite bi-pass aluminum oxide film. The preparation method comprises the following steps: carrying out single-side protection on a super-amphiphilic micro-nano composite aluminum oxide film, and then removing the aluminum oxide film on the unprotected side; etching to remove the unreacted aluminum substrate and aluminum oxide barrier layer to obtain a bi-pass aluminum oxide film; then hydroxylation modification is carried out to obtain a hydroxylated alumina membrane, and finally interface wettability adjustment is carried out to prepare the heterogeneous wettability micro-nano composite bi-pass alumina membrane. The prepared micro-nano composite bi-pass aluminum oxide film has a self-assembled micron hole in one side, a three-dimensional interpenetrating nano hole in a bulk phase and a nano hole structure in the other side, and the intrinsic wettability of the micro-nano composite bi-pass aluminum oxide film is a super-amphiphilic interface. And finally, accurate wettability regulation and control and heterogeneous wettability construction are realized through chemical and physical wettability modification strategies, the super-amphiphilic through-hole aluminum oxide can be changed into a Janus aluminum oxide film, and the film has an asymmetric conical structure gradient.

This invention discloses a paint remover for steel-aluminum composite materials, belonging to the field of metal material surface treatment technology. It comprises the following components in weight percentages: 5%-8% alkaline substance; 5%-10% lipase component; 10%-16% solvent; 5%-10% surfactant; 6%-13% co-solvent; 5%-8% corrosion inhibitor; and water as the balance. The paint remover is prepared from alkaline substance, lipase component, solvent, surfactant, co-solvent, corrosion inhibitor, and water. It is used for removing paint from steel-aluminum composite materials. On one hand, the alkaline substance saponifies some groups in the paint, dissolving them in the solvent and water. On the other hand, heating and steaming the paint film reduces its strength and adhesion to the metal. Then, utilizing the wetting, penetration, and affinity effects of the surfactant, the catalytic effect of the lipase component, and the protective effect of the corrosion inhibitor on the steel-aluminum substrate, the goal of removing paint quickly without corroding the substrate is achieved.

This utility model discloses an aluminum substrate structure for a parallel grinding wheel, including an aluminum substrate, a grinding wheel, a limiting groove, a third connecting plate, an internal rotating component, a limiting component, a second connecting plate, and an internal rotating groove. The grinding wheel is fitted onto the aluminum substrate. The first connecting plate is disposed on one side of the aluminum substrate. A third connecting plate is disposed on the opposite side of the aluminum substrate away from the first connecting plate. The third connecting plate and the first connecting plate are located at the middle position of the aluminum substrate. The third connecting plate and the first connecting plate have a connecting slot. This utility model, by providing a replaceable internal rotating component within the aluminum substrate, and a limiting groove, a third connecting plate, and a limiting component for inserting and fixing the internal rotating component, allows the internal rotating component to engage with the limiting groove and be fixed within the aluminum substrate during use. The limiting component then allows for disassembly and fixation of the internal rotating component, facilitating future replacement of the internal rotating component.

The utility model discloses an ETX-D type LED railway signal bulb with an LED as a light source. The ETX-D type LED railway signal bulb with the LED as the light source comprises a shell, an LED point light source chip aluminum substrate, a circuit board, a resistance module board and a wire inlet bolt terminal, the LED point light source chip aluminum substrate, the resistor module board and the wire inlet bolt terminal are all electrically connected with the circuit board. The LED point light source chip aluminum substrate comprises an aluminum substrate and high-power LED chips which are arranged on the aluminum substrate and serve as a main light source and an auxiliary light source. A voltage input circuit, a rectification filter circuit, a voltage stabilization constant current circuit, a control circuit, a current detection circuit and a current compensation circuit which are electrically connected in sequence are integrated on the circuit board, and the LED point light source chip is electrically connected with the control circuit; and the resistor module board adopts a resistor compensation module and is electrically connected with the current compensation circuit. By adopting the arrangement, the current of the LED bulb can reach the current when an incandescent bulb works, and the LED bulb can adapt to an original lighting unit without changing an original lighting system circuit.

This invention relates to the field of thermally insulated aluminum materials, and discloses a thermally insulated aluminum material and its preparation method. The aluminum material consists of a 6061 aluminum substrate and a composite thermally insulated coating layer. The coating layer uses 40-45 parts by weight of bisphenol A type epoxy resin as the matrix, and is formulated with modified silica, coupling agent-modified adamantane, polyethyleneimine-modified hollow glass microspheres, and other modified fillers and additives. The aluminum material is prepared by roughening the substrate through grinding, coating it with the coating, and curing at room temperature for 45-55 minutes. This aluminum material exhibits significantly reduced thermal conductivity, coating adhesion reaching grade 0, excellent aging resistance and water resistance, and a simple preparation process with mild reaction conditions and readily available raw materials. The components work synergistically, making it suitable for industrial mass production and applicable to various thermally insulated aluminum material applications such as construction, automotive, and chemical industries.

The invention discloses a high-luminous-efficiency LED lighting device and a manufacturing method thereof, and relates to the technical field of lighting, the high-luminous-efficiency LED lighting device comprises a shell, a heat dissipation module used for avoiding light attenuation acceleration is arranged in the shell, the heat dissipation module comprises a ceramic heat dissipation plate and an aluminum substrate which are arranged in the shell, and concave-convex textures are arranged on the heat dissipation surface of the ceramic heat dissipation plate; the aluminum substrate is provided with a multi-channel assembly used for preventing the overall lighting effect from being reduced, and the opening of the shell is provided with an anti-glare assembly used for restraining glare under low light loss. Convection heat transfer is enhanced through concave-convex textures on the surface of the ceramic heat dissipation plate so as to delay light attenuation, the multi-channel assembly independently adjusts driving current through a power management system so as to achieve spectrum refined reconstruction, and the anti-dazzle assembly achieves dazzle suppression under low light loss through microstructure textures on the light-emitting face of a lens and light diffusion particles filled in the center area.

This invention relates to the field of semiconductor device technology and discloses an aluminum-based copper-plated electrode for integrated circuits and its preparation method. The electrode includes an aluminum substrate. A first copper plating layer and a first aluminum plating layer are disposed on the surface of the aluminum substrate, forming a first composite coating layer. The first copper plating layer and the first aluminum plating layer are separated. A second copper plating layer and a second aluminum plating layer are disposed on the upper surface of the first copper plating layer and the first aluminum plating layer, forming a second composite coating layer. The first copper plating layer and the second copper plating layer correspond to each other, and the first aluminum plating layer and the second aluminum plating layer correspond to each other. This aluminum-based copper-plated electrode for integrated circuits and its preparation method, through the oblique corrugated structure design of the aluminum substrate surface and the design of the blocky composite coating layers arranged perpendicularly to each other of the same material, disperse and release the interlayer shear stress caused by the thermal expansion difference between aluminum and copper, thus solving the problem of coating delamination and peeling.

A non-sintering technique is used to prepare a fluorescent thin film for laser lighting. This fluorescent film comprises a 0.5–2 mm thick aluminum substrate with a visible light reflectance greater than 95%, and a 100–500 μm thick emitting layer on the aluminum substrate. The emitting layer is obtained by mixing a fluorescent material and a fixative at 40–80 °C using a non-sintering technique. Under blue light excitation at 450 nm, the light emitted by the emitting layer mixes with unabsorbed blue light to produce white light with a color temperature range of 3000 K–4500 K and an Ra value of 90–98. The fluorescent thin film for laser lighting prepared by this invention has a simple overall structure and a convenient preparation process; the nitride red fluorescent material is not sintered, thus greatly preserving its luminescent properties; and the preparation process does not use water, which would decompose the nitride red fluorescent material; the fluorescent film is directly coupled to a highly thermally conductive aluminum plate, thereby enabling the fluorescent film to be used in laser lighting.

The utility model relates to a bypass switching system, include: the first bypass switching unit and second bypass switching unit of series connection, the first bypass switching unit includes: first aluminum baseplate, first connection copper row, be used for controlling the first control unit of bypass switching of first battery to first radiator of heat dissipation of first aluminum baseplate, second bypass switching unit includes: second aluminum baseplate, second connection copper row, be used for controlling the second control unit of bypass switching of second battery to second radiator of heat dissipation of second aluminum baseplate, first radiator installs in the first side of first aluminum baseplate, second radiator installs in the third side of second aluminum baseplate, first negative pole connection copper row still with second level connection copper row of second bypass switching unit is connected, adopt the utility model, bypass switching system passes through the assembly mode of aluminum baseplate, radiator, copper row, supports through the big current at the same time, has further improved the heat dissipation effect.