465results about How to "High thermal conductivity" patented technology

LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.

A device and associated method of heat removal from electronic optoelectronic and photonic devices via incorporation of extremely high thermally conducting channels or embedded layers made of single-layer graphene (SLG), bi-layer graphene (BLG), or few-layer graphene (FLG).

Optically transparent films can comprise a coating of nanodiamonds to introduce desirable properties, such as hardness, good thermal conductivity and an increased dielectric constant. In general, transparent conductive films can be formed with desirable property enhancing nanoparticles included in a transparent conductive layer and/or in a coating layer. Property enhancing nanoparticles can be formed from materials having a large hardness parameter, a large thermal conductivity and/or a large dielectric constant. Suitable polymers are incorporated as a binder in the layers with the property enhancing nanoparticles. The coatings with property enhancing nanoparticles can be solution coated and corresponding solutions are described.

The invention discloses a power generation system using exhausting and cooling waste heat in an internal combustion engine at the same time and a control method therefor. The control method comprises the steps as follows: transferring waste heat in the cooling liquid of the internal combustion engine to an organic working medium by using a preheater in an organic Rankine cycle loop; transferring waste heat taken away by the exhaust gas of the internal combustion engine to the working medium of the organic Rankine cycle loop by using a heat-conducting oil loop; evaporating and gasifying the working medium; transforming enthalpy change in a high-enthalpy expansion process into useful work for outputting by using a single-screw expansion machine; driving a power generator to generate power; taking the tail gas temperature of an exhaust pipe outlet as feedback quantity for realizing the flow closed-loop control of the heat-conducting oil; taking the inlet working medium temperature of the single-screw expansion machine as feedback quantity for realizing the flow closed-loop control of the organic working medium; and taking the outlet working medium temperature of a condenser as feedback quantity for realizing the closed-loop control of the fan motor of the condenser. According to the invention, the flow quantities of the working mediums of the organic Rankine cycle loop and the heat-conducting oil loop are adjusted by using the segmented PI (Proportion Integration) control, so that the waste heat in the internal combustion engine is made the best of, the heat efficiency of the internal combustion engine is improved, and the hazard of the exhaust gas on the environment is reduced.

A recessed light apparatus for being installed at a ceiling includes a light source unit, a heat sink for dissipating heat generated from the light source unit, and a thermal insulating member coupled between the heat sink and the light source unit to define an upper space above the heat insulating member and a bottom space below the thermal insulating member. In case of fire, the heat insulating member prevents flame or fire spreading from the bottom space to the upper space.

A bedding component includes a top portion having a gel foam, a middle portion having a foam layer with at least one gel disc, and a bottom portion having a foam core.

The present invention discloses an aerogel modified inorganic insulation mortar. The aerogel composite fiber insulation material comprises and is complex processed by silicate cement, silicon dioxide aerogel particles, expanded vitreous microbeads, silica fume, redispersible latex powder, polypropylene fibers, cellulose ethers, and wood fiber. Compared with the existing inorganic insulation mortar, the aerogel modified inorganic insulation mortar has better insulation and construction performance, and can replace the existing inorganic insulation system and be widely applied in the energy saving field of building interior and exterior walls.

The invention provides high thermal conductive silicone grease. The high thermal conductive silicone grease is composed of 2%-50% of silicone oil and 50%-98% of additives. The prepared thermal conductive silicone grease is high in thermal conductive coefficient, strong in thermal transfer capability, capable of improving the reliability of electronic products and prolonging the service life of the electronic products and simple in preparation technology. The defects that in the prior art, the thermal conductive coefficient of thermal dissipation silicone grease is small, and the relative thermal conductive capacity is poorer are overcome.

The invention provides an insulating heat-conducting metal-to-metal adhesive and a manufacturing method thereof. The insulating heat-conducting metal-to-metal adhesive is mainly composed of a micro-droplet-shaped mixture and an insulating substrate material, wherein the micro-droplet-shaped mixture is uniformly distributed in the insulating substrate material and is completely coated by the external insulating substrate material. The manufacturing method for the insulating heat-conducting metal-to-metal adhesive comprises the following steps: subjecting a selected low-melting-point metal or alloy to heating, stirring and oxidation so as to prepare a liquid mixture heat-conducting filling material; and fully mixing the liquid mixture heat-conducting filling material with the insulating substrate material with stirring so as to form the insulating heat-conducting metal-to-metal adhesive. The invention has the following beneficial effects: the insulating heat-conducting metal-to-metal adhesive inherits high heat conductivity and phase change endothermicity of liquid metal; the micro-droplet-shaped mixture is completely coated by the insulating substrate material with insulating properties, so insulating properties of the insulating heat-conducting metal-to-metal adhesive are guaranteed; and the adhesive can better meet demands of novel electronic products for both space compaction and electrically isolated electronic cooling.

The invention is a kind of heat reservoir of heat storage pump air conditioner device, which is made up of bleak lead and olefin compound phase change heat storage material, a spiral plate pipe heat exchanger whose surface has petal fins and cylinder container. The spiral plate heat exchanger is set in the cylinder container, the black lead and the olefin compound phase change material are filled in the container space out of the spiral plate heat exchanger, the cooling media flows in the pipes of the exchanger, and carries on heat exchanging with compound phase change heat storage material through the pipe walls and the fins, it realizes the storage and the release of the heat quantity. The black lead and the olefin compound phase change heat storage material are the standard phase change material; it maintains solid state when carrying on phase change, it has no liquid leakage problem. The heat conducting efficiency is high.

An optically pumped semiconductor (OPS) structure includes a multilayer gain-structure surmounting a mirror structure. One surface of a diamond heat spreader is attached to the mirror structure via a contact bond. The opposite surface of the heat spreader is bonded to a metal heat sink. In one example, the OPS-structure also has a diamond window contact bonded to the gain-structure.

Conducting layers and resin-made insulating layers are alternately laminated to form a laminated circuit portion, and a metal substrate is installed so as to be in contact with an insulating layer, which is the lowermost layer. The conducting layers, the insulating layers, and the metal substrate are thermal compression bonded. In order to connect the uppermost conducting layer on which electronic component is placed with the lowermost insulating layer, a conducting layer is formed on the inner surface by copper plating to install a heat dissipating via into which a resin is filled. A conducting layer, which is the uppermost layer, is subjected to gold plating, with nickel plating undercoated. An electronic component for driving a motor is placed on the uppermost conducting layer, by which the metal substrate can be used as a motor drive circuit substrate for an electric power steering system.

The invention provides a heating solidification type dual-component epoxy pouring sealant which comprises an A component and a B component. The A component comprises the following ingredients of, by weight, 70-130 parts of an epoxy resin, 150-280 parts of a first inorganic filler, 0-25 parts of a dilution agent, 0-15 parts of a toughening agent, 0-3 parts of an organosilicon antifoaming agent and 0-3 parts of pigment; and the B component comprises the following ingredients of, by weight, 70-150 parts of acid anhydride, 150-280 parts of a second inorganic filler and 0-15 parts of a wetting dispersing agent. The preparation method of the sealant includes respectively preparing the A component and the B component, then, respectively heating the A component and the B component, and evenly mixing the A component and the B component to obtain the heating solidification type dual-component epoxy pouring sealant. The heating solidification type dual-component epoxy pouring sealant is good in comprehensive performance and fluidity and long in storage period.

The invention discloses an aluminium nitride ceramic substrate, and a preparation method thereof. The aluminium nitride ceramic substrate is prepared from an aluminium nitride ceramic tape casting slurry. The aluminium nitride ceramic tape casting slurry comprises aluminium nitride powder, a sintering air, a dispersant, a solvent, a plasticizer, a binder, and a defoaming agent. The preparation method comprises following steps: 1, primary ball milling is carried out; 2, secondary ball milling is carried out; 3, vacuum defoaming is carried out; 4, an obtained mixed slurry obtained via step 3 is subjected to tape casting, is subjected to heating on a film band, is cooled naturally, and is peeled off from the film band so as to obtain aluminium nitride tape casting sheets; 5, the aluminium nitride tape casting sheets are overlapped so as to obtain an aluminium nitride green body; 6, additive removing is carried out so as to obtain an aluminium nitride blank; and 7, sintering is carried out so as to obtain aluminium nitride ceramic. According to the preparation method, aluminium nitride is obtained via tape casting of a benzene-free, ketone-free, nontoxic organic solvent, and the sintering aid is added, so that the aluminium nitride ceramic substrate can be obtained via sintering at a relatively low temperature.

The invention discloses a large-diameter high-speed cutting and high-speed heavy load grinding resin wheel prepared from the following three components in percentage by weight: 60-72 percent of grinding materials, 18-25 percent of filling materials and 8-18 percent of resin, wherein the grinding materials in the wheel are film-coating calcined brown fused alumina, the filling materials comprise a heat conducting material and an active filling material, and the resin comprises a phenolic resin liquid and phenolic resin powder. The sand is produced by adopting the film-coating calcined brown fused alumina, which has good heat conduction property of metal plating, obviously strengthens the heat radiating effect of the wheel and prolongs the abrasive resistance and the service life of the wheel. In addition, the grinding materials have improved ball-milling flexibility after calcined, which enables the wheel to be durable and the property to be better. The wheel can be used for cutting hot-wire type steel with a diameter of over 100 mm or grinding the steel in a high-speed and heavy load way, and has long service life reaching 100-120min.

The invention discloses a particle dispersion toughening aluminum nitride ceramic substrate for the illumination packaging of a high-power LED (Light-Emitting Diode) and a preparation method thereof. The particle dispersion toughening aluminum nitride ceramic substrate comprises the following components in percentage by weight: 80%-95% of AIN (Aluminum Nitride) powder, 2%-8% of sintering auxiliary agents and 3%-12% of toughening phases, wherein the sintering auxiliary agents are one or mixtures of any combination of a rare-earth metal oxide, a weak base oxide and a rare-earth fluoride or a weak base fluoride; the toughening phases are one or mixtures of any combination of molybdenum, tungsten, niobium, molybdenum carbide, tungsten carbide and niobium carbide. According to the invention, the fracture toughness of The AIN substrate disclosed by the invention is effectively enhanced in fracture toughness through crack deflexion and bending, crack bridging and a residual stress toughening mechanism, can meet the requirements for high heat conductivity and excellent electric property due to good chemical compatibility of the added toughening phases and the aluminum nitride base body, enhances the comprehensive property of aluminum nitride and has excellent mechanical property, heat-conducting property and electrical property.

The present invention discloses composite phase change heat storage organic matter/expandable graphite material and its preparation process and corresponding heat storage device. Of the composite material, the organic matter absorbed into the micropores of the expandable graphite accounts for 40-90 wt%, and is saturated fatty acid or linear paraffin as the phase change heat storage material with phase change temperature of 60-75 deg.c, phase change latent heat of 70-180 J/g and heat conductivity coefficient of 1.12-4.52 W/m.K. The heat storage device is one container, which is made of high heat conductivity metal material, has filled and sealed composite phase change heat storage organic matter/expandable graphite material, and is provided with metal fins. The device is used to cool electronic element fast.

An integrated circuit for wireless communications includes substrate, at least one integrated antenna formed in or on the substrate, and a heat sink. At least one dielectric propagating layer is disposed between the integrated antenna and the heat sink which provides a thermal conductivity of at least 35 W/m·K and resistivity greater than 100 Ohm-cm at 25 C. The invention can be used to establish an on-chip or inter-chip wireless link over at least a 2.2 cm distance.

The invention belongs to the technical field of electronic encapsulating composite materials, and relates to a preparation method of a composite material of high-thermal-conductivity graphite whisker-oriented and reinforced metal. The composite material contains high-thermal-conductivity graphite whiskers of which the volume fraction is 20-80 percent. The preparation method of the composite material comprises the following production process steps: uniformly mixing metal powder, whiskers and paste comprising a bonding agent, a plasticizer and a solvent; pouring the mixture into a one-way extruding mold and extruding in an oriented manner to obtain strip-shaped or laminar sintered precursors; and removing the paste from the sintered precursors, putting the sintered precursors into a mold in an overlaying manner, sintering and curing to obtain the composite material. The one-dimensional oriented distribution degree of the whiskers in the composite material produced by adopting the method is high, and axial thermal conduction of the whiskers is facilitated. The obtained composite material has relatively high thermal conductivity and an adjustable thermal expansion coefficient, and is an ideal electronic encapsulating material.

The invention relates to a shape-stabilized phase change energy storage material for building and a preparation method thereof. The material provided by the invention comprises components of: by weight, 70-85% of a composite phase change energy storage material with its melting point being 18-30 DEG C and 15-30% of gesso. The composite phase change energy storage material with its melting point being 18-30 DEG C is composed of a porous matrix and a mixed fatty acid phase change material, wherein the mass ratio of the porous matrix to the mixed fatty acid phase change material is 1:4-1:6. At the temperature of 60-80 DEG C, the porous matrix is added in the molten lauric acid-capric acid mixed fatty acid to prepare a composite phase change material. Then, gesso is mixed with the composite phase change material to prepare a shape-stabilized fatty acid phase change energy storage material with a more stable adsorption property. The prepared shape-stabilized phase change energy storage material has good thermal conductivity, good adsorption stability and good material plasticity, will not cause seepage at high temperature, is easy to mix with a building material, and has a good application prospect.

The invention relates to a polyphenylene sulfide-based heat conducting composite material and a preparation method thereof, belongs to the field of high polymer materials and provides the polyphenylene sulfide-based heat conducting composite material. The composite material comprises polyphenylene sulfide, polyamide, a heat conducting filler M and a heat conducting filler N, wherein the polyphenylene sulfide and the polyamide form a dual continuous phase structure; the heat conducting filler M is distributed in the polyphenylene sulfide phase; the heat conducting filler N is distributed in the polyamide phase; two independent heat conducting nets are formed. The composite material comprises the following materials in parts by weight: 20-30 parts of the polyphenylene sulfide, 15-30 parts of the polyamide, and 10-50 parts of the heat conducting filler M and the heat conducting filler N; the heat conducting filler M is different from the heat conducting filler N. According to the invention, the heat conducting property of the polyphenylene sulfide-based heat conducting composite material is improved greatly; the heat conducting coefficient of the polyphenylene sulfide-based heat conducting composite material can reach to 8.14 W/(m. K) maximally; the tensile strength and the bending strength are hardly affected by the heat conducting fillers.

A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil that is coupled to a current source. One or more measurement devices are responsive to magnetic fields in close proximity to the device, allowing compensation by controlling current to the compensation coil. Thus, magnetic shielding may be provided by compensation fields that may be trapped within the shielded enclosure when the system is cooled below the critical temperature of the second material. Radiation shielding may be provided by cooling the shielded enclosure to a temperature that is approximately equal to the temperature of the device.

The invention relates to a method for preparing a highly heat-conductive copper-clad plate, which is realized by the following steps of: preparing gluewater; preparing a gluewater solution with the solid content of 60-90% by using a mixture of polyfunctional epoxy resin and polyurethane; taking an inorganic filler which adopts a mixture of aluminium nitride and aluminium oxide as the main contents, wherein aluminium nitride content accounts for 40-60 wt% of the total weight of the mixture, and aluminium oxide content accounts for 40-60 wt% of the total weight of the mixture; using the inorganic filler after being fully and uniformly mixed as the filler of the gluewater solution; using dicyandiamide as a curing agent, imidazole as an accelerating agent and acetone as a solvent to prepare the gluewater solution with the solid content of 60-80% and the gel time of 150-450 seconds for application; putting the gluewater solution into a glue mixer and then conveying the gluewater solution to a heating medium oil vertical gluing machine; and preparing a single-surface or double-surface copper-clad plate. The prepared copper-clad plate has high heat conductivity, capability of holding a higher installation density and excellent dimension stability, and can be used for preparing printed circuit boards with finer wiring and more layers.

A heat dissipating helmet provides a heat dissipating heat pipe portion. One or more high powered LEDs may be in thermal contact therewith providing a significant portion of a heat sink to remove heat from the LEDs to maintain them at a proper operating temperature during operation. The heat dissipating material may be also in contact with air flow as the helmet moves through space thereby allowing convection to assist in removing heat from the helmet.

A heat dissipating device includes a heat sink (10), a heat pipe (20), a heat reservoir (30) thermally connecting with the heat sink through the heat pipe, and a fan (40) generating an airflow through the heat sink. The heat pipe includes an evaporating portion (202) attached to the heat sink and a condensing portion (204) attached to the heat reservoir. The heat reservoir is made of metal containing working medium, such as water, therein. The heat reservoir stores or releases heat based on the amount of heat generated by the CPU to realize a compensation to the increase or decrease of temperature of the CPU, whereby the change rate of the temperature of the CPU from idle to busy condition and vice versa can be more stable.

The invention relates to the use of Dispersion Ceramic Micro-Encapsulated (DCM) nuclear fuel as a meltdown-proof, accident-tolerant fuel to replace uranium dioxide fuel in existing light water reactors (LWRs). The safety qualities of the DCM fuel are obtained by the combination of three strong barriers to fission product release (ceramic coatings around the fuel kernels), highly dense inert ceramic matrix around the coated fuel particles and metallic or ceramic cladding around the fuel pellets.

The invention belongs to the technical field of solid waste treatment and resource recovery, and relates to an apparatus for pyrolyzing solid wastes through molten salt, and a method thereof. The method uses the molten salt as a pyrolysis medium, the solid wastes are immersed in the molten salt and are effectively dissociated and decomposed under preset pyrolysis conditions, and various resource substances can be recovered. Pyrolysis products of organic components in the solid wastes are recycled as energy and resource substances. The method has the advantages of short process flow and simple operation. The apparatus allows the above raw material to be sent into or moved out of a molten salt reactor through a pyrolysis basket, and comprises a gas inlet, a gas outlet, and a feeding and discharging gate. The method uses the high heat accumulation capability and high heat conduction rate of the molten salt, effectively improves the decomposition rate of organic matters and the energy utilization rate, traps or converts acidic gases and harmful substances by using the characteristic of reaction of the molten salt with the acidic gases and the harmful substances, reduces secondary pollution to environment, and improves the cleanliness and resource of products.

A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a disk having relatively high thermal conductivity and heat spreading characteristics. The heat-conducting medium also includes a first recessed surface and an opposing second recessed surface. Extending from within each recessed surface is an array of heat conducting bristles to provide a plurality of contact points to the heat source and heat sink to aid in the transfer of heat. The recessed surfaces may be defined by a rim positioned circumferentially about the disk. The presence of the rim about each recessed surface acts to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles. A method for manufacturing the heat-conducting medium is also provided.

The present invention provides a cubic boron nitride sintered body, which achieves both of superior chipping resistance and wear resistance. In accordance with a first aspect of the present invention, a cubic boron nitride (cBN) sintered body contains cubic boron nitride particles and a bonding material used for bonding the cBN particles to one another. This sintered body is constituted by cBN particles in a range from 70 vol% to 98 vol% and a residual bonding material made from a Co compound, an Al compound and WC and a solid solution of these. Moreover, the cBN particles in the sintered body contain 0.03 wt% or less of Mg and 0.001 wt% or more to 0.05 wt% or less of Li. In accordance with a second aspect of the present invention, the cubic boron nitride sintered body has a composition in which the bonding material of the first aspect is changed to an Al compound.

The invention discloses a silicon nitride-modified phase-change and energy-storage microcapsule, comprising a shell material and a cladded core material, wherein the shell material comprises the following raw materials in parts by weight: 50-100 parts of high-molecular polymers and 1-20 parts of silicon nitride powder which is evenly dispersed into the high-molecular polymers; the core material comprises 50-100 parts of organic phase-change and energy-storage materials and 1-20 parts of silicon nitride powder which is evenly dispersed into the organic phase-change and energy-storage materials. The invention also provides a preparation method of the phase-change energy-storage microcapsule. The thermal conductivity of the phase-change and energy-storage material is improved, overheat and overcold degrees in the phase-change process are inhibited, and meanwhile, the thermal endurance and the abrasive resistance, the thermal shock resistance, the fatigue resistance and the like also are improved. The silicon nitride-modified phase-change and energy-storage microcapsule is relatively simple in preparation technology, available in raw materials, strong in controllability, and applicable to the industrial large-scale production, an existing industrial processing technology can be fully utilized, and the performance of the phase-change and energy-storage microcapsule is improved.