The application discloses an improved semi-
additive process based on customized ultra-thin
copper foil flexible
copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin
copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment,
pattern size pre-compensation,
laser drilling and black shadow process hole metallization, pattern transfer and selective
electroplating thickening, film stripping and flash
etching forming. The micro-
etching amount is cooperatively controlled throughout the process, and combined with optimized
plasma cleaning and high hole filling
electroplating, the fine circuit production with a minimum
line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side
etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong
heat resistance and uniform micro-hole filling, is suitable for high-density
interconnection and high-end
consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.