41 results about "Photoacid" patented technology

A resist composition comprising an acid compound, a photoacid generator of iodonium salt type and / or a photo-decomposable quencher of iodonium salt type, and a base polymer has a high sensitivity, reduced edge roughness or size variation, improved resolution and satisfactory storage stability.

The present invention provides a chemically amplified negative resist composition and a resist pattern formation method that improve resolution during pattern formation and enable the creation of resist patterns with good LER and pattern fidelity. [Solution] (A) A chemically amplified negative resist composition comprising a photoacid generator consisting of an onium salt represented by the following formula (A), and a base polymer containing a polymer with repeating units of a specific structure. TIFF2026090781000379.tif29102

A photoresist composition comprising one or more non-solvent base-insoluble base materials present in a combined amount greater than 50 wt% based on the total solids of the photoresist composition; a non-polymeric ionic photoacid generator compound comprising an anion and an iodonium or sulfonium cation, wherein the anion is represented by formula (1); a photodecomposable quencher, a basic quencher, or a combination thereof; and a solvent, wherein Ar 1 is a monocyclic or polycyclic C 3‑60 aromatic group; L 1 is a single bond or one or more divalent linking groups, wherein L 1 contains no fluorine; Z 1 comprises an anion stabilizing group, wherein Z 1 is configured to form an intramolecular non-covalent bond with a sulfonate anion group to form a ring having 5 to 8 atoms; and the remaining substituents are as defined herein. (1)

The application provides a method for realizing color continuous gradient transition by using DLP light curing 3D printing, and belongs to the technical field of additive manufacturing. The steps comprise: providing a dual-wavelength DLP light curing printing device, adjusting a printing focal plane, segmenting and slicing a three-dimensional digital model, setting dual-wavelength exposure parameters, preparing a photosensitive resin slurry containing components such as pH responsive dyes and photoacid generators, completing layer-by-layer printing through reciprocating dynamic switching of visible light curing forming and ultraviolet light color regulation, and obtaining a target workpiece after post-processing. The method realizes high-resolution, continuous gradient integrated forming of multi-color materials through single-light-machine dual-wavelength (365nm ultraviolet light and 460nm visible light) ultra-high-speed dynamic switching combined with a specific formula of photosensitive resin slurry.

Resin composition comprising at least three components (a), (b) and (c); wherein component (a) is a polymer having a structure represented by the following formula (1), component (b) comprises thermal crosslinking agent (b1) and thermal crosslinking agent (b2), and component (c) is a photosensitizer, wherein R1 and R2 are independently selected from groups containing at least one atom other than hydrogen; and R3 and R4 are independently selected from a hydrogen atom or an organic group having 1 to 20 carbon atoms, and n is an integer selected from 1 to 10, wherein the thermal crosslinking agent (b1) is selected from a low-temperature thermal crosslinking compound having a thermal crosslinking temperature of 120 to 180 °C, and from a structure represented by the following formula (2), wherein R8 is selected from an organic group containing 2 to 30 carbon atoms;R9 is selected from an organic group containing 1 to 10 carbon atoms; s is an integer selected from 1 to 4, p is an integer selected from 1 to 16, and s + p > 2, wherein the thermal crosslinking agent (b2) is selected from a thermal crosslinking compound with a thermal crosslinking temperature of 180 to 400 °C and from a structure containing an acrylic acid with one or more structures represented by the following formula (5), wherein R10 is selected from an organic group containing 2 to 25 carbon atoms, and z is an integer selected from 1 to 10, wherein the photosensitizer of component (c) is a photoacid former.

The present invention aims to provide a radiosensitive linear composition, a hardened film, a method for manufacturing the same, a semiconductor element, a display element, and a polymer that can produce a film with excellent adhesion. A radiosensitive linear composition comprises: a polymer containing a structural unit (I) having a base represented by formula (1), a photoacid generator, and an orthoester compound. In formula (1), R... 1 It can be a hydrogen atom, a halogen atom, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms. R 2 and R 3 Each of the following can be independently a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group with 1 to 6 carbon atoms, an alkyl group with 1 to 10 carbon atoms, or a phenyl group. "*" indicates a bond.

A photoacid generator compound comprising an anion and an iodonium or sulfonium cation, wherein the anion is represented by Formula (1): (1) wherein, in Formula (1), ring Cy1 is a C3-15 monoalicyclic group or a C6-15 polyalicyclic group,; each L1 is independently a single bond or one or more linking groups, wherein L1 is free of fluorine; each X1 is independently -O-, -S-, -N(R2)-, -C(O)-, -S(O)R2-, or -S(O2)R2-, wherein R2 is independently chosen from substituted or unsubstituted C1-20 alkyl, substituted or unsubstituted C1-20 heteroalkyl, substituted or unsubstituted C6-30 aryl, or substituted or unsubstituted C3-30 heteroaryl; each Z1 independently comprises an anion stabilizing group, wherein at least one Z1 is configured to form an intramolecular non-covalent bond with the sulfonate anion group to form a ring having from 5 to 8 ring atoms, wherein the remaining substituents are as provided herein.

In one aspect, compositions and methods for making networks from solidified aqueous build materials are described herein. In some embodiments, a composition described herein comprises an aqueous build material, a photoinitiator, and a photoacid. In some cases, the aqueous build material comprises aqueous silk fibroin. Further, in some embodiments, the composition or method includes the use of a biocompatible, light-absorbing additive material configured to control light penetration. The aqueous build material is solidified upon application of an illumination beam or electric signal to desired locations of a bath comprising the aqueous build material.

A method according to the present disclosure includes providing a substrate, depositing an underlayer over the substrate, depositing a photoresist layer over the underlayer, exposing a portion of the photoresist layer and a portion of the underlayer to a radiation source according to a pattern, baking the photoresist layer and underlayer, and developing the exposed portion of the photoresist layer to transfer the pattern to the photoresist layer. The underlayer includes a polymer backbone, a polarity switchable group, a cross-linkable group bonded to the polymer backbone, and photoacid generator. The polarity switchable group includes a first end group bonded to the polymer backbone, a second end group including fluorine, and an acid labile group bonded between the first end group and the second end group. The exposing decomposes the photoacid generator to generate an acidity moiety that detaches the second end group from the polymer backbone during the baking.

The present disclosure relates to: a photoacid generator comprising an anion having a novel structure having a specific polar functional group such as a sulfonate group, a photoresist composition comprising the same, and a method for forming a photoresist pattern.

The present invention is onium salt type monomer, wherein the onium salt type monomer is represented by the following general formula (A). This provides: an onium salt type monomer used as a monomeric photo-acid generator, which is a material for a polymer contained in a chemically amplified resist composition that has excellent solvent solubility, high sensitivity, high contrast, and excellent lithography performance in photolithography using high-energy beams; a monomeric photo-acid generator consisting of the onium salt type monomer; a polymer containing a repeating unit derived from the monomeric photo-acid generator; a chemically amplified resist composition containing a base polymer that contains the polymer; and a patterning process using the chemically amplified resist composition.

To provide a photosensitive resin composition that can form resin patterns with high resolution. [Solution] A photosensitive resin composition comprising (A) component: a resin having a phenolic hydroxyl group, (B) component: a compound having a methylol group or an alkoxyalkyl group, and (C) component: a photoacid generator, wherein (B) component contains a compound having a group represented by the following general formula (b1). JPEG2026109799000016.jpg38149 [In formula (b1), R b Each of these independently represents an alkyl group, and * represents a bond.

This invention provides a photosensitive resin composition, a photoresist curable film, and their applications. The photosensitive resin composition comprises an alkali-soluble resin, a photosensitive compound, and a crosslinking agent. The crosslinking agent has a structure as shown in the following formula. Through the design of a specific crosslinking agent structure and its compounding with other components, the photosensitive resin composition, during exposure, achieves enhanced dissolution inhibition in non-exposed areas due to the shielding of some hydroxyl and carboxyl groups by tert-butyloxycarbonyl groups. In exposed areas, the photoacid-generating agent decomposes and catalyzes the departure of tert-butyloxycarbonyl groups, exposing active groups and achieving alkali solubility. After photolithography and development, the film exhibits higher film retention and better contrast.

Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition containing a compound (A) represented by a specific formula, a photoacid generator (B) different from the compound (A), and a resin (C); a resist film formed using the actinic-ray-sensitive or radiation-sensitive resin composition; a pattern formation method using the actinic-ray-sensitive or radiation-sensitive resin composition; a method for producing an electronic device; and the compound (A).

This invention relates to the field of organic chemical synthesis technology, specifically to a method for synthesizing oxime ester-type photoacid-producing compounds. The method includes: etherifying phenol with 1,3-dihalopropane in an alkaline environment and an organic solvent, followed by post-treatment to obtain 1,3-diphenoxypropane; then, in an organic solvent, reacting it with a trifluoroacetylation reagent under Lewis acid catalysis to undergo a Friedel-Crafts acylation reaction, followed by quenching and post-treatment to obtain a bis(trifluoroacetyl) product; oximating the bis(trifluoroacetyl) product with an oximeation reagent in an organic solvent, followed by post-treatment to obtain a bis(oxime) product; and then subjecting the obtained bis(oxime) product to a sulfonation reaction with a propylsulfonation reagent in an alkaline environment and an organic solvent, followed by washing with water, distillation, and recrystallization purification to obtain the target oxime ester-type photoacid-producing compound. This method solves the problems of complex processes, difficult purification, limited raw materials, high costs, and difficulty in meeting the needs of industrial production in traditional oxime ester-type photoacid-producing agent synthesis methods.

To provide: a novel photoacid generator comprising a sulfonylimide salt compound that has high photosensitivity to the i-line and exhibits excellent storage stability in a blend with a cationically polymerizable compound such as an epoxy compound; and an energy ray-curable composition, a chemically amplified positive photoresist composition, and a chemically amplified negative photoresist composition each comprising the photoacid generator.SOLUTION: The present invention provides a photoacid generator comprising a sulfonylimide salt compound represented by the general formula (1) in the figure. (In the formula (1), X+ represents a sulfonium cation represented by the following general formula (5).)SELECTED DRAWING: None

A polymerizable composition containing a polymerizable compound, the polymerizable composition containing a photoacid generator and an acid component.

To provide a photosensitive resin composition that can form resin patterns with high resolution. [Solution] A photosensitive resin composition comprising (A) component: a resin having a phenolic hydroxyl group, (B) component: a compound having a methylol group or an alkoxyalkyl group, and (C) component: a photoacid generator, wherein (A) component contains a resin having structural units derived from hydroxystyrene.

The application discloses a photoresist and application thereof. The photoresist comprises the following raw materials in parts by mass: 10 parts of resin, 0.1-1 parts of photoacid and 0.1-1 parts of phenyltrimethoxysilane. The resin is an A-B type block copolymer, wherein the A block is a poly-p-hydroxystyrene segment, and the B block is a copolymer segment of tert-butyl methacrylate and methacrylic acid. The photoresist can be used to prepare a photoresist layer which is ultra-thin and has ultra-high uniformity, and meets the requirement of fine pattern processing. The application also provides the application of the photoresist.

An object of the present invention is to provide a photosensitive resin composition with which it is possible to obtain a cured product having high transparency, high resolution, and excellent flexibility. The photosensitive resin composition of the present invention contains (a) a polysiloxane having a fluorene structure, and (b) a photoacid generator and / or a photoradical generator.

Provided is a thick film chemically amplified positive type resist composition. A thick film chemically amplified positive type resist composition comprising an alkali-soluble resin (A) having a certain structure, a photoacid generator (B), and a solvent (C).

To provide: a new photoacid generator containing a sulfonylimide salt compound that exhibits high photosensitivity to i-line and excellent storage stability in a formulation with a cationically polymerizable compound such as an epoxy compound; and an energy-ray-curable composition, a chemically amplified positive photoresist composition, and a chemically amplified negative photoresist composition that contain the photoacid generator.SOLUTION: The invention provides a photoacid generator containing a sulfonylimide salt compound represented by the general formula (1) in the figure. (In the formula (1), X+ represents a sulfonium cation represented by the following general formula (4).)SELECTED DRAWING: None

This invention discloses the preparation and application of a temperature-sensitive waterborne pressure-sensitive adhesive. The preparation method of the temperature-sensitive waterborne pressure-sensitive adhesive is as follows: a water-soluble RAFT chain transfer agent and a reactive emulsifier are dissolved in water, and then an acrylate mixed monomer is added and stirred to obtain a first emulsion; under an inert atmosphere, the first emulsion is heated, and a water-soluble initiator is added dropwise, resulting in a second emulsion after reaction; the second emulsion is then mixed and dispersed with a temperature-sensitive monomer, a water-dispersible photoacid generator, a waterborne blocked isocyanate, and a water-soluble photoinitiator to obtain the temperature-sensitive waterborne pressure-sensitive adhesive. This temperature-sensitive waterborne pressure-sensitive adhesive is applied in the process protection of flexible OLED screens. This invention achieves active and reversible control of the peel force of the temporary protective film from "firmly adhered" to "easily peelable," perfectly balancing the high adhesion requirements and low stress requirements during screen process protection, fundamentally reducing the risk of damage to flexible screens, and has good application prospects.

This surface protection composition can form a protective film able to be washed with water after at least one type of treatment selected from between irradiation with light and heating. The surface protection composition contains: a polymer (A) having a crosslinkable group; an acid generator (B) including at least one type of selected from among a photo-acid generator and a thermal acid generator; and an acid-dissociable crosslinking agent (C) which reacts with the crosslinkable group in the polymer (A) and can form an acid-dissociable crosslinked structure.

The application discloses a simulation method and device for photolithography. The simulation method comprises the following steps: obtaining simulation parameters, wherein the simulation parameters comprise optical parameters, post-baking parameters and etching parameters; performing exposure treatment on photoresist arranged on a substrate based on the optical parameters to obtain photoacid distribution information in the photoresist; performing post-baking treatment on the photoresist after the exposure treatment based on the post-baking parameters, and obtaining initial-state inhibitor concentration initial distribution information based on the photoacid distribution information; in the case that the photoresist is a negative photoresist, determining equilibrium-state inhibitor concentration distribution information based on the initial-state inhibitor concentration distribution information; performing development treatment on the photoresist, generating a first 3D topography of the photoresist based on the equilibrium-state inhibitor concentration distribution information; and performing etching on the photoresist based on the first 3D topography and the etching parameters to obtain etched photoresist and a second 3D topography of the substrate. The simulation precision of photolithography can be greatly improved.

This invention discloses a cationic two-photon photoresist based on a ternary polymer and its patterning method. The cationic two-photon photoresist comprises 6-30 wt% of a ternary polymer film-forming resin, 0-9 wt% of an active monomer, 0.5-5 wt% of a photoacid-type initiator, and 65-89.5 wt% of a solvent. The ternary polymer film-forming resin has the structural formula shown in Formula (I), and is synthesized via free radical polymerization using styrene, adamantyl methyl methacrylate (as shown in Formula (II)), and glycidyl methacrylate as reactive monomers, with the addition of an initiator. This invention improves the adhesion and etching resistance of the cationic photoresist by introducing groups such as phenyl, hydroxyl, and adamantane into the polymer, thereby increasing the pattern resolution to meet the requirements of patterned manufacturing. Furthermore, the introduction of small molecule monomers into the photoresist system increases the degree of crosslinking, giving the photoresist stronger mechanical properties.

This invention relates to the field of biomedical technology, specifically to the application of an organic photosensitive acid generator in the preparation of antitumor drugs. In this invention, an organic photoresponsive molecular system is constructed. The organic photosensitive acid generator possesses the synergistic effect of photoacid therapy (PAT) and photodynamic therapy (PDT), enhancing the efficacy of photoactivated therapy and improving the reliability and effectiveness of tumor treatment. Under ultraviolet light irradiation of a specific wavelength, the organic photosensitive acid generator produces a large amount of H₂. + Reactive oxygen species (ROS) can damage the DNA, proteins, and lipids of tumor cells, thereby inducing cell death.

A method for enhancing a depth of focus window during a photolithography process includes applying a photoresist layer including a photoacid generator on a material layer disposed on a substrate, exposing a first portion of the photoresist layer not protected by a photomask to a light radiation in a photolithography exposure process, providing thermal energy to the photoresist layer in a post-exposure bake process, applying an electric field or a magnetic field while the post-exposure bake process is being performed, and dynamically changing a frequency of the generated electric field while the thermal energy is being provided to the photoresist layer.

This invention discloses a photosensitive nanocrystalline material and its preparation method, belonging to the field of photoresist manufacturing technology. To address the problems of low light absorption efficiency, insufficient resolution, and complex preparation of existing photoresist materials, this invention uses an Hf / Zr mixed metal alkoxide precursor and prepares it through steps including anhydrous hydrolysis, two-phase reaction, surface modification, and photosensitive addition. Specifically, it includes: (i) reacting ultrapure water with the first ligand A at low temperature to form a 1.5-3 nm metal oxide nanocrystalline sol; (ii) growing crystals through an alkaline reaction in the two-phase system; (iii) surface modification with bridging ligand B and the second ligand C; and (iv) adding a photoacid generator and a free radical photoinitiator, filtering with a filter membrane, and pre-baking to form a film. This material is suitable for negative lithography processes, with an EUV absorption efficiency >85% and an LWR <2 nm. The method of this invention is simple to operate, has a yield >85%, significantly improves material stability and resolution, and is suitable for sub-10 nm semiconductor lithography.

This invention relates to a composition comprising D-based a T b The resin, epoxy-functionalized organosiloxane crosslinking agent, photoacid generator, and adhesion promoter of formula 1: where a and b represent D respectively. a and T b mole fraction; based on D a T b The resin is functionalized with the following: C1-C6 alkyl groups; aryl groups; and epoxy-functionalized segments; and the b:a ratio is in the range of 0.5:1 to 20:1; wherein each R is C3-C6 alkyl group. 12 -alkyl anhydride groups; the sum of m and n is in the range of 1 to 4; and -D H x - is a monovalent or divalent group of the compound of formula 2. The compositions of the present invention are capable of forming a thin, cured coating with excellent physical properties on a substrate.