53results about How to "Minimize dissolution" patented technology

A direct displacement plating process provides a uniform, adherent coating of a relatively stable metal (e.g., nickel) on a highly reactive metal (e.g., aluminum) that is normally covered with a recalcitrant oxide layer. The displacement reaction proceeds, preferably in a nonaqueous solvent, as the oxide layer is dissolved by a fluoride activator. Halide anions are used to provide high solubility, to serve as an anhydrous source of stable metal ions, and to control the rate of the displacement reaction. A low concentration of activator species and little or no solution agitation are used to cause depletion of the activator species within pores in the surface oxide so that attack of the reactive metal substrate is minimized. Used in conjunction with electroless nickel deposition to thicken the displacement coating, this process can be used to render aluminum pads on IC chips solderable without the need for expensive masks and vacuum deposition operations. Such coatings can also be used to preserve or restore wire bondability, or for corrosion protection of aluminum and other reactive structural metals and alloys. A thin layer of immersion gold can be used to protect the thickened coating from oxidation. The solderable aluminum IC chip pads provide the basis for a maskless bumping process for flip chip attachment.

Sulfonate salts have the formula: HOCH₂CH₂CF₂CF₂SO₃⁻M⁺ wherein M⁺ is a Li, Na, K, ammonium or tetramethylammonium ion. Onium salts, oxime sulfonates and sulfonyloxyimides derived from these salts are effective photoacid generators in chemically amplified resist compositions.

A process for producing a pentacyl-type crystalline zeolite is provided which comprises the steps of (i) preparing a mixture of a silicon compound, water and tetrapropyl ammonium hydroxide, (ii) conducting a hydrothermal reaction of the mixture to obtain a reaction mixture containing zeolite crystals, (iii) separating zeolite crystals from the reaction mixture to collect a remaining solution, (iv) calcinating the resulting zeolite crystals, (v) treating the calcinated zeolite crystals with a solution such as ammonia water and (vi) recycling the solution collected in step (iii) to step (i), wherein in the mixture prepared in step (i) a molar ratio of hydroxide ion to silicon is from about 0.1 to about 0.4 and a molar ratio of potassium to silicon is about 0.1 or less. With this process, a zeolite catalyst having good performance can be produced with good reproducibility.

Cellulose contained in plant fiber material is hydrolyzed with the use of a pseudo-molten cluster acid as a hydrolysis catalyst to produce saccharide, most of which is glucose. After the glucose is produced, the saccharide is precipitated with the use of an organic solvent, and the saccharide including a solidified saccharide during the hydrolysis and the precipitated saccharide is separated from residues and the cluster acid.

A cleansing or a surface-conditioning composition comprising a mixture of (i) and (ii) in water: i) a surfactant selected from the group consisting of anionic, non-ionic, zwitterionic, cationic, and mixtures thereof; and ii) a hydrophobic benefit agent in a particulate form having a mean particle size in the range of 1-1,000 micron, and a specific gravity of ≧1, not encapsulated within a film or a capsule-like enclosure, the particulate hydrophobic benefit agent comprising: a) a physically-modified form of the hydrophobic benefit agent; and b) a deposition-aid material bonded to the surface of the physically-modified benefit agent, wherein the bonding between the benefit agent and the deposition-aid material is achieved prior to addition to i), wherein said deposition-aid material is not a surfactant having a weight average molecular weight of less than 5,000 Dalton.

A slag composition containing steelmaking slag and from about 0.3 to about 10 weight percent of reducing agent. The steelmaking slag contains from about 20 to about 55 weight percent of calcium oxide, from about 8 to about 50 weight percent of ferrous oxide, from about 4 to about 20 weight percent of magnesium oxide, from about 8 to about 30 weight percent of silicon oxide, from 0.5 to about 10 weight per cent aluminum oxide, and from about 0.5 to about 10 weight percent of manganese oxide. The reducing agent contains from about 15 to about 70 weight percent of calcium carbide and from about 10 to about 50 weight percent silicon carbide, wherein the ratio of calcium carbide to silicon carbide is between 0.7 and 7.

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.

A cleansing or a surface-conditioning composition comprising a mixture of (i) and (ii) in water: i) a surfactant selected from the group consisting of anionic, non-ionic, zwitterionic, cationic, and mixtures thereof, and ii) a hydrophobic benefit agent in a particulate form having a mean particle size in the range of 1-1,000 micron, and a specific gravity of ≧1, not encapsulated within a film or a capsule-like enclosure, the particulate hydrophobic benefit agent comprising: a) a physically-modified form of the hydrophobic benefit agent; and b) a deposition-aid material bonded to the surface of the physically-modified benefit agent material, wherein the bonding between the two said materials is achieved prior to addition to i), wherein said deposition-aid material is not a surfactant having a weight average molecular weight of less than 5,000 Dalton.

A method for suppressing mercury dissolution during pressure oxidation of precious metal-containing materials in the presence of halogens and halides is provided. Pressure oxidation is performed under controlled oxidative conditions to maintain the mercury predominantly in the solid residue.

Methods of manufacturing a ceramic sheet and a gas sensing element are disclosed. At least ceramic powder, a binder and a plasticizer are blended and mixed in slurry. The slurry is formed into unfired green sheets, on which paste is printed. Each of the unfired green sheets has porosity greater than 5%. In the manufacturing methods, the unfired green sheets are pressurized with a pressure of 10 MPa at a temperature above 60° C., after which the paste is printed on surfaces of the unfired green sheets. In the method of manufacturing the gas sensing element, a shielding layer, a porous diffusion resistance layer and the unfired green sheets for a sensing layer, a reference gas airspace forming layer and a heating layer are stacked to form a stacked ceramic body, whish is fired to obtain the gas sensing element.

The invention relates to a technique for producing a high quality Si single crystal ingot with a high productivity by the Czochralski method. The technique of the invention can control the magnetic field strength of an oxygen dissolution region different from that of a solid-liquid interface region in order to control the oxygen concentration at a desired value.

[Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained.

[Means for Solving the Problems] In the present invention, a premixed master alloy having a higher proportion of the high-melting metal particles in solder is first prepared, then the premixed master alloy is put into molten solder to disperse the high-melting metal particles. Aa a result, the high-melting metal particles can be uniformly dispersed in solder in a short length of time. Accordingly, a solder preform which is obtained by the process for producing a solder preform according to the present invention can maintain a predetermined clearance between portions being soldered, and a sufficient bonding strength is obtained.

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.

A cleansing or a surface-conditioning composition comprising a mixture of (i) and (ii) in water: i) a surfactant selected from the group consisting of anionic, non-ionic, zwitterionic, cationic, and mixtures thereof; and ii) a hydrophobic benefit agent in a particulate form having a mean particle size in the range of 1-1,000 micron, and a specific gravity of ≧1, not encapsulated within a film or a capsule-like enclosure, the particulate hydrophobic benefit agent comprising: a) a physically-modified form of the hydrophobic benefit agent; and b) a deposition-aid material bonded to the surface of the physically-modified benefit agent material, wherein the bonding between the two said materials is achieved prior to addition to i), wherein said deposition-aid material is not a surfactant having a weight average molecular weight of less than 5,000 Dalton.

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A modular hydraulic unit houses the elongate bladder and hydraulic fluid in contact with an exterior surface of the bladder. When pressurized process fluid is in the elongate bladder, hydraulic controls can selectively reduce pressure on the bladder to cause expansion, and then selectively increase hydraulic pressure to assist with a dispense action.

A method for producing water resistant cathodes is discussed. The method uses mixing cathode powder with solid carbon dioxide to create a mixture and heating the mixture to a temperature. The heating occurs for a time sufficient to cause lithium carbonate coatings to form on the powder. A method for coating lithium-containing cathode surfaces is also discussed. This method uses simultaneously sublimating solid CO₂ and condensing atmospheric water vapor onto surfaces. Afterwards allowing the lithium to react with the sublimated CO₂ for a time sufficient to create a lithium carbonate film on the surface.